MOTOROLA MC14016BD

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 632
The MC14016B quad bilateral switch is constructed with MOS P–channel
and N–channel enhancement mode devices in a single monolithic structure.
Each MC14016B consists of four independent switches capable of
controlling either digital or analog signals. The quad bilateral switch is used
in signal gating, chopper, modulator, demodulator and CMOS logic
implementation.
P SUFFIX
PLASTIC
CASE 646
•
•
•
•
•
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Linearized Transfer Characteristics
Low Noise — 12 nV/√Cycle, f ≥ 1.0 kHz typical
Pin–for–Pin Replacements for CD4016B, CD4066B (Note improved
transfer characteristic design causes more parasitic coupling
capacitance than CD4016)
• For Lower RON, Use The HC4016 High–Speed CMOS Device or The
MC14066B
• This Device Has Inputs and Outputs Which Do Not Have ESD
Protection. Antistatic Precautions Must Be Taken.
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D SUFFIX
SOIC
CASE 751A
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Vin, Vout
lin
Parameter
DC Supply Voltage
Input or Output Voltage (DC or Transient)
Value
Unit
– 0.5 to + 18.0
V
– 0.5 to VDD + 0.5
V
Input Current (DC or Transient),
per Control Pin
± 10
mA
Isw
PD
Switch Through Current
± 25
mA
Tstg
TL
Storage Temperature
Power Dissipation, per Package†
500
mW
– 65 to + 150
_C
260
_C
Lead Temperature (8–Second Soldering)
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
BLOCK DIAGRAM
CONTROL 1
IN 1
CONTROL 2
IN 2
CONTROL 3
IN 3
CONTROL 4
IN 4
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
LOGIC DIAGRAM
(1/4 OF DEVICE SHOWN)
13
2
OUT 1
1
5
3
OUT 2
4
6
9
OUT 3
8
12
10
OUT 4
11
VDD = PIN 14
VSS = PIN 7
Control
Switch
0 = VSS
Off
1 = VDD
On
OUT
CONTROL
LOGIC DIAGRAM RESTRICTIONS
VSS ≤ Vin ≤ VDD
VSS ≤ Vout ≤ VDD
IN
REV 3
1/94
MOTOROLA
Motorola, Inc. 1995
CMOS LOGIC DATA
MC14016B
65
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Input Voltage
Control Input
Min
Typ #
Max
Min
Max
Unit
VIL
5.0
10
15
—
—
—
—
—
—
—
—
—
1.5
1.5
1.5
0.9
0.9
0.9
—
—
—
—
—
—
Vdc
VIH
5.0
10
15
—
—
—
—
—
—
3.0
8.0
13
2.0
6.0
11
—
—
—
—
—
—
—
—
—
Vdc
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
5.0
5.0
5.0
0.2
—
—
—
—
—
—
—
—
—
—
—
—
5.0
10
15
—
—
—
0.25
0.5
1.0
—
—
—
0.0005
0.0010
0.0015
0.25
0.5
1.0
—
—
—
7.5
15
30
5.0
—
—
—
600
600
600
—
—
—
—
—
300
300
280
660
660
660
—
—
—
—
—
840
840
840
7.5
—
—
—
360
360
360
—
—
—
240
240
180
400
400
400
—
—
—
520
520
520
10
—
—
—
600
600
600
—
—
—
260
310
310
660
660
660
—
—
—
840
840
840
15
—
—
—
360
360
360
—
—
—
260
260
300
400
400
400
—
—
—
520
520
520
—
Iin
Input Capacitance
Control
Switch Input
Switch Output
Feed Through
—
Cin
Quiescent Current
(Per Package)
2,3
IDD
4,5,6
RON
(Vin = + 7.5 Vdc)
(Vin = – 7.5 Vdc) VSS = – 7.5 Vdc
(Vin = ± 0.25 Vdc)
(Vin = + 10 Vdc)
(Vin = + 0.25 Vdc) VSS = 0 Vdc
(Vin = + 5.6 Vdc)
(Vin = + 15 Vdc)
(Vin = + 0.25 Vdc) VSS = 0 Vdc
(Vin = + 9.3 Vdc)
—
Input/Output Leakage Current
(VC = VSS)
(Vin = + 7.5, Vout = – 7.5 Vdc)
(Vin = – 7.5, Vout = + 7.5 Vdc)
—
125_C
Max
1
∆ “ON” Resistance
Between any 2 circuits in a common
package
(VC = VDD)
(Vin = ± 5.0 Vdc, VSS = – 5.0 Vdc)
(Vin = ± 7.5 Vdc, VSS = – 7.5 Vdc)
25_C
Min
Symbol
Input Current Control
“ON” Resistance
(VC = VDD, RL = 10 kΩ)
(Vin = + 5.0 Vdc)
(Vin = – 5.0 Vdc) VSS = – 5.0 Vdc
(Vin = ± 0.25 Vdc)
– 55_C
VDD
Vdc
Figure
pF
µAdc
Ohms
∆RON
Ohms
5.0
7.5
—
—
—
—
—
—
15
10
—
—
—
—
—
—
µAdc
—
7.5
7.5
—
—
± 0.1
± 0.1
—
—
± 0.0015
± 0.0015
± 0.1
± 0.1
—
—
± 1.0
± 1.0
NOTE: All unused inputs must be returned to VDD or VSS as appropriate for the circuit application.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** For voltage drops across the switch (∆V switch) > 600 mV ( > 300 mV at high temperature), excessive V DD current may be drawn; i.e., the
current out of the switch may contain both V DD and switch input components. The reliability of the device will be unaffected unless the Maximum
Ratings are exceeded. (See first page of this data sheet.) Reference Figure 14.
MC14016B
66
MOTOROLA CMOS LOGIC DATA
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v
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+
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+
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ELECTRICAL CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
VDD
Vdc
Min
Typ #
Max
Unit
tPLH,
tPHL
5.0
10
15
—
—
—
15
7.0
6.0
45
15
12
ns
tPHZ,
tPLZ,
tPZH,
tPZL
5.0
10
15
—
—
—
34
20
15
90
45
35
—
5.0
10
15
—
—
—
30
50
100
—
—
—
mV
—
—
5.0
—
– 80
—
dB
10,11
—
5.0
10
15
—
—
—
24
25
30
—
—
—
nV/√Cycle
5.0
10
15
—
—
—
12
12
15
—
—
—
—
0.16
—
Figure
Symbol
Propagation Delay Time (VSS = 0 Vdc)
Vin to Vout
(VC = VDD, RL = 10 kΩ)
7
Control to Output
(Vin
10 Vdc, RL = 10 kΩ)
8
Crosstalk, Control to Output (VSS = 0 Vdc)
(VC = VDD, Rin = 10 kΩ, Rout = 10 kΩ,
f = 1.0 kHz)
9
Crosstalk between any two switches (VSS = 0 Vdc)
(RL = 1.0 kΩ, f = 1.0 MHz,
V
crosstalk
20 log10 out1)
Vout2
Noise Voltage (VSS = 0 Vdc)
(VC = VDD, f = 100 Hz)
(VC = VDD, f = 100 kHz)
ns
Second Harmonic Distortion (VSS = – 5.0 Vdc)
(Vin = 1.77 Vdc, RMS Centered @ 0.0 Vdc,
RL = 10 kΩ, f = 1.0 kHz)
—
—
5.0
Insertion Loss (VC = VDD, Vin = 1.77 Vdc,
VSS = – 5.0 Vdc, RMS centered = 0.0 Vdc, f = 1.0 MHz)
V
Iloss
20 log10 out)
Vin
(RL = 1.0 kΩ)
(RL = 10 kΩ)
(RL = 100 kΩ)
(RL = 1.0 MΩ)
12
—
5.0
Bandwidth (– 3.0 dB)
(VC = VDD, Vin = 1.77 Vdc, VSS = – 5.0 Vdc,
RMS centered @ 0.0 Vdc)
(RL = 1.0 kΩ)
(RL = 10 kΩ)
(RL = 100 kΩ)
(RL = 1.0 MΩ)
dB
—
—
—
—
12,13
BW
—
—
2.3
0.2
0.1
0.05
—
—
—
—
5.0
MHz
—
—
—
—
OFF Channel Feedthrough Attenuation
(VSS = – 5.0 Vdc)
Vout
–50 dB)
(VC = VSS, 20 log10
Vin
(RL = 1.0 kΩ)
(RL = 10 kΩ)
(RL = 100 kΩ)
(RL = 1.0 MΩ)
%
54
40
38
37
—
—
—
—
5.0
kHz
—
—
—
—
1250
140
18
2.0
—
—
—
—
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
PIN ASSIGNMENT
MOTOROLA CMOS LOGIC DATA
IN 1
1
14
VDD
OUT 1
2
13
CONTROL 1
OUT 2
3
12
CONTROL 4
IN 2
4
11
IN 4
CONTROL 2
5
10
OUT 4
CONTROL 3
6
9
OUT 3
VSS
7
8
IN 3
MC14016B
67
VC
IS
Vin
Vout
VIL: VC is raised from VSS until VC = VIL.
VIL: at VC = VIL: IS = ±10 µA with Vin = VSS, Vout = VDD or Vin = VDD, Vout = VSS.
VIH: When VC = VIH to VDD, the switch is ON and the RON specifications are met.
Figure 1. Input Voltage Test Circuit
10,000
PD , POWER DISSIPATION (µW)
VDD = 15 Vdc
VDD
ID
PULSE
GENERATOR
TO ALL
4 CIRCUITS
VDD
Vout
10 k
CONTROL
INPUT
fc
VSS
TA = 25°C
5.0 Vdc
1000
100
10
1.0
5.0 k 10 k
Vin
PD = VDD x ID
10 Vdc
Figure 2. Quiescent Power Dissipation
Test Circuit
100 k
1.0 M
fc, FREQUENCY (Hz)
10 M
50 M
Figure 3. Typical Power Dissipation per Circuit
(1/4 of device shown)
TYPICAL RON versus INPUT VOLTAGE
700
RL = 10 kΩ
TA = 25°C
600
R ON, “ON” RESISTANCE (OHMS)
R ON, “ON” RESISTANCE (OHMS)
700
500
400
VC = VDD = 5.0 Vdc
VSS = – 5.0 Vdc
300
200
100
0
– 10 – 8.0
VC = VDD = 7.5 Vdc
VSS = – 7.5 Vdc
500
400
VC = VDD = 10 Vdc
300
200
VC = VDD = 15 Vdc
100
0
– 4.0
0
4.0
Vin, INPUT VOLTAGE (Vdc)
Figure 4. VSS = – 5.0 V and – 7.5 V
MC14016B
68
VSS = 0 Vdc
RL = 10 kΩ
TA = 25°C
600
8.0
10
0
2.0
6.0
10
14
Vin, INPUT VOLTAGE (Vdc)
18
20
Figure 5. VSS = 0 V
MOTOROLA CMOS LOGIC DATA
Vout
RL
CL
Vin
Vout
20 ns
RL
20 ns
90%
50%
Vin
VC
tPLH
Figure 6. RON Characteristics
Test Circuit
10%
tPHL
VSS
50%
Vout
Vin
VDD
Figure 7. Propagation Delay Test Circuit
and Waveforms
Vout
VC
RL
CL
VX
Vin
20 ns
50%
VC
10%
tPZL
10 k
VC
15 pF
Vin
tPLZ
1k
90%
Vout
Vout
VSS
tPHZ
Vin = VDD
90%
Vx = VSS
tPZH
Vout
VDD
90%
10%
10%
Vin = VSS
Vx = VDD
Figure 8. Turn–On Delay Time Test Circuit
and Waveforms
Figure 9. Crosstalk Test Circuit
35
OUT
VC = VDD
IN
QUAN–TECH
MODEL
2283
OR EQUIV
NOISE VOLTAGE (nV/ CYCLE)
30
VDD = 15 Vdc
25
10 Vdc
20
5.0 Vdc
15
10
5.0
0
10
Figure 10. Noise Voltage Test Circuit
MOTOROLA CMOS LOGIC DATA
100
1.0 k
f, FREQUENCY (Hz)
10 k
100 k
Figure 11. Typical Noise Characteristics
MC14016B
69
2.0
TYPICAL INSERTION LOSS (dB)
RL = 1 MΩ AND 100 kΩ
0
10 kΩ
– 2.0
1.0 kΩ
– 4.0
– 3.0 dB (RL = 1.0 MΩ )
– 6.0
– 3.0 dB (RL = 10 kΩ )
Vout
– 8.0
– 10
Vin
– 12
10 k
100 k
1.0 M
10 M
fin, INPUT FREQUENCY (Hz)
RL
VC
– 3.0 dB (RL = 1.0 kΩ )
100 M
Figure 12. Typical Insertion Loss/Bandwidth
Characteristics
+ 2.5 Vdc
0.0 Vdc
– 2.5 Vdc
Figure 13. Frequency Response Test Circuit
ON SWITCH
CONTROL
SECTION
OF IC
LOAD
V
SOURCE
Figure 14. ∆V Across Switch
MC14016B
70
MOTOROLA CMOS LOGIC DATA
APPLICATIONS INFORMATION
Figure A illustrates use of the Analog Switch. The 0–to–5 V
Digital Control signal is used to directly control a 5 V p–p analog signal.
The digital control logic levels are determined by V DD and
V SS. The V DD voltage is the logic high voltage; the V SS voltage is logic low. For the example, V DD = + 5 V logic high at
the control inputs; VSS = GND = 0 V logic low.
The maximum analog signal level is determined by VDD
and V SS. The analog voltage must not swing higher than
V DD or lower than VSS.
The example shows a 5 V p–p signal which allows no
margin at either peak. If voltage transients above V DD and/or
below V SS are anticipated on the analog channels, external
diodes (Dx) are recommended as shown in Figure B. These
diodes should be small signal types able to absorb the
maximum anticipated current surges during clipping.
The absolute maximum potential difference between V DD
and VSS is 18.0 V. Most parameters are specified up to 15 V
which is the recommended maximum difference between
V DD and V SS.
+5 V
VDD
+5 V
5 Vp–p
ANALOG SIGNAL
EXTERNAL
CMOS
DIGITAL
CIRCUITRY
VSS
SWITCH
IN
SWITCH
OUT
+ 5.0 V
5 Vp–p
ANALOG SIGNAL
+ 2.5 V
0–TO–5 V DIGITAL
GND
CONTROL SIGNALS
MC14016B
Figure A. Application Example
VDD
VDD
Dx
Dx
SWITCH
IN
SWITCH
OUT
Dx
VSS
Dx
VSS
Figure B. External Germanium or Schottky Clipping Diodes
MOTOROLA CMOS LOGIC DATA
MC14016B
71
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
14
9
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
–T–
L
K
SEATING
PLANE
F
G
D
N
M
J
14 PL
0.25 (0.010)
M
T A
S
14 PL
0.25 (0.010)
M
T B
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
1
7
B
A
F
L
C
J
N
H
MC14016B
72
G
D
SEATING
PLANE
K
M
S
DIM
A
B
C
D
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.245
0.280
0.155
0.200
0.015
0.020
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
M
F
–T–
0.25 (0.010)
M
K
D 14 PL
M
T B
S
M
R X 45 _
C
SEATING
PLANE
B
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
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MOTOROLA CMOS LOGIC DATA
◊
*MC14016B/D*
MC14016B
MC14016B/D
73