SEMICONDUCTOR TECHNICAL DATA L SUFFIX CERAMIC CASE 726 CMOS MSI (Low–Power Complementary MOS) The MC14513B BCD–to–seven segment latch/decoder/driver is constructed with complementary MOS (CMOS) enhancement mode devices and NPN bipolar output drivers in a single monolithic structure. The circuit provides the functions of a 4–bit storage latch, an 8421 BCD–to–seven segment decoder, and has output drive capability. Lamp test (LT), blanking (BI), and latch enable (LE) inputs are used to test the display, to turn–off or pulse modulate the brightness of the display, and to store a BCD code, respectively. The Ripple Blanking Input (RBI) and Ripple Blanking Output (RBO) can be used to suppress either leading or trailing zeroes. It can be used with seven–segment light emitting diodes (LED), incandescent, fluorescent, gas discharge, or liquid crystal readouts either directly or indirectly. Applications include instrument (e.g., counter, DVM, etc.) display driver, computer/calculator display driver, cockpit display driver, and various clock, watch, and timer uses. • • • • • • • • • • • P SUFFIX PLASTIC CASE 707 ORDERING INFORMATION MC14XXXBCP MC14XXXBCL TA = – 55° to 125°C for all packages. PIN ASSIGNMENT Low Logic Circuit Power Dissipation High–current Sourcing Outputs (Up to 25 mA) Latch Storage of Binary Input Blanking Input Lamp Test Provision Readout Blanking on all Illegal Input Combinations Lamp Intensity Modulation Capability Time Share (Multiplexing) Capability Adds Ripple Blanking In, Ripple Blanking Out to MC14511B Supply Voltage Range = 3.0 V to 18 V Capable of Driving Two Low–Power TTL Loads, One Low–power Schottky TTL Load to Two HTL Loads Over the Rated Temperature Range. ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ B 1 18 VDD C 2 17 f LT 3 16 g BI 4 15 a LE 5 14 b D 6 13 c A 7 12 d RBI VSS 8 11 e 9 10 RBO DC Supply Voltage Symbol Value a g f e b c d DISPLAY 0 1 2 MAXIMUM RATINGS* (Voltages Referenced to VSS) Rating Plastic Ceramic 3 4 5 6 7 8 9 TRUTH TABLE Unit Inputs RBI LE BI LT Outputs D C B A RBO a b c d e f g Display VDD – 0.5 to + 18 V X X X 0 X X X X + 1 1 1 1 1 1 1 8 Vin – 0.5 to VDD + 0.5 V X X 0 1 X X X X + 0 0 0 0 0 0 0 Blank DC Current Drain per Input Pin I 10 mA 1 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 0 Blank 0 Operating Temperature Range TA – 55 to + 125 °C Power Dissipation, per Package† PD 500 mW Storage Temperature Range Tstg – 65 to + 150 _C X X X X X 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 0 1 1 0 0 1 0 1 0 1 0 0 0 0 0 0 1 1 0 1 1 1 1 1 0 1 0 1 1 1 0 1 1 0 1 0 1 0 0 0 0 0 0 1 1 0 1 1 1 1 1 2 3 4 5 Maximum Continuous Output Drive Current (Source) per Output IOHmax 25 mA Maximum Continuous Output Power (Source) per Output ‡ POHmax 50 mW X X X X X 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 1 1 1 1 1 0 0 0 1 1 0 0 1 0 1 0 1 0 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 0 1 1 1 0 1 0 1 1 0 1 0 1 0 0 1 0 1 1 0 1 0 1 1 0 6 7 8 9 Blank X X X X X 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 1 1 1 1 1 0 0 1 1 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Blank Blank Blank Blank Blank X 1 1 1 X X X X † Input Voltage, All Inputs ‡POHmax = IOH (VDD – VOH) * Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C * * X = Don’t Care †RBO = RBI (D C B A), indicated by other rows of table *Depends upon the BCD code previously applied when LE = 0 REV 3 1/94 MC14513B Motorola, Inc. 1995 376 MOTOROLA CMOS LOGIC DATA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) – 55_C 25_C 125_C VDD Vdc Min Max Min Typ # Max Min Max 5.0 10 15 — — — 0.05 0.05 0.05 — — — 0 0 0 0.05 0.05 0.05 — — — 0.05 0.05 0.05 5.0 10 15 4.1 9.1 14.1 — — — 4.1 9.1 14.1 5.0 10 15 — — — 4.1 9.1 14.1 — — — 5.0 10 15 — — — 0.05 0.05 0.05 — — — 0 0 0 0.05 0.05 0.05 — — — 0.05 0.05 0.05 5.0 10 15 4.95 9.95 14.95 — — — 4.95 9.95 14.95 5.0 10 15 — — — 4.95 9.95 14.95 — — — 5.0 10 15 — — — 1.5 3.0 4.0 — — — 2.25 4.50 6.75 1.5 3.0 4.0 — — — 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 — — — 3.5 7.0 11 2.75 5.50 8.25 — — — 3.5 7.0 11 — — — 5.0 4.1 — 3.9 — 3.4 — — — — — — — 4.1 — 3.9 — 3.4 — 4.57 4.24 4.12 3.94 3.70 3.54 — — — — — — 4.1 — 3.5 — 3.0 — — — — — — — (IOH = 0 mA) (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA) 10 9.1 — 9.0 — 8.6 — — — — — — — 9.1 — 9.0 — 8.6 — 9.58 9.26 9.17 9.04 8.90 8.75 — — — — — — 9.1 — 8.6 — 8.2 — — — — — — — Vdc (IOH = 0 mA) (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA) 15 14.1 — 14 — 13.6 — — — — — — — 14.1 — 14 — 13.6 — 14.59 14.27 14.18 14.07 13.95 13.80 — — — — — — 14.1 — 13.6 — 13.2 — — — — — — — Vdc Characteristic Symbol Output Voltage — Segment Outputs “0” Level Vin = VDD or 0 VOL “1” Level VOH Output Voltage — RBO Output “0” Level Vin = VDD or 0 VOL “1” Level VOH Vin = 0 or VDD Vin = 0 or VDD Input Voltage # “0” Level (VO = 3.8 or 0.5 Vdc) (VO = 8.8 or 1.0 Vdc) (VO = 13.8 or 1.5 Vdc) VIL (VO = 0.5 or 3.8 Vdc) “1” Level (VO = 1.0 or 8.8 Vdc) (VO = 1.5 or 13.8 Vdc) VIH Output Drive Voltage — Segments (IOH = 0 mA) Source (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA) VOH Unit Vdc Vdc Vdc Vdc Vdc Vdc Vdc (continued) This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high-impedance circuit. A destructive high current mode may occur if Vin and Vout is not constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Due to the sourcing capability of this circuit, damage can occur to the device if VDD is applied, and the outputs are shorted to VSS and are at a logical 1 (See Maximum Ratings). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). MOTOROLA CMOS LOGIC DATA MC14513B 377 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS — continued (Voltages Referenced to VSS) Characteristic Symbol Output Drive Current — RBO Output (VOH = 2.5 V) Source (VOH = 9.5 V) (VOH = 13.5 V) IOH (VOL = 0.4 V) (VOL = 0.5 V) (VOL = 1.5 V) – 55_C 25_C 125_C VDD Vdc Min Max Min Typ # Max Min Max 5.0 10 15 – 0.40 – 0.21 – 0.81 — — — – 0.32 – 0.17 – 0.66 – 0.64 – 0.34 – 1.30 — — — – 0.22 – 0.12 – 0.46 — — — 5.0 10 15 0.18 0.47 1.80 — — — 0.15 0.38 1.50 0.29 0.75 2.90 — — — 0.10 0.26 1.0 — — — 5.0 10 15 0.64 1.6 4.2 — — — 0.51 1.3 3.4 0.88 2.25 8.8 — — — 0.36 0.9 2.4 — — — Unit mAdc Sink IOL Output Drive Current — Segments (VOL = 0.4 V) Sink (VOL = 0.5 V) (VOL = 1.5 V) IOL Input Current Iin 15 — ± 0.1 — ± 0.00001 ± 0.1 — ± 1.0 µAdc Input Capacitance Cin — — — — 5.0 7.5 — — pF Quiescent Current (Per Package) Vin = 0 or VDD, Iout = 0 µA IDD 5.0 10 15 — — — 5.0 10 20 — — — 0.005 0.010 0.015 5.0 10 20 — — — 150 300 600 µAdc Total Supply Current**† (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT 5.0 10 15 mAdc mAdc IT = (1.9 µA/kHz) f + IDD IT = (3.8 µA/kHz) f + IDD IT = (5.7 µA/kHz) f + IDD µAdc #Noise immunity specified for worst–case input combination. Noise Margin for both “1” and “0” level = 1.0 Vdc min @ VDD = 5.0 Vdc 2.0 Vdc min @ VDD = 10 Vdc 2.5 Vdc min @ VDD = 15 Vdc ** The formulas given are for the typical characteristics only at 25_C. ā †To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + 3.5 x 10–3 (CL – 50) VDDf where: IT is in µA (per package), CL in pF, VDD in Vdc, and f in kHz is input frequency. Input LE and RBI low, and Inputs D, BI and LT high. f in respect to a system clock. All outputs connected to respective CL loads. 20 ns 20 ns A, B, AND C 90% 50% 1 2f VDD 10% 50% DUTY CYCLE ANY OUTPUT VSS VOH 50% VOL Figure 1. Dynamic Power Dissipation Signal Waveforms MC14513B 378 MOTOROLA CMOS LOGIC DATA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C) Characteristic Output Rise Time — Segment Outputs Output Rise Time — RBO Output Symbol Typ Max 5.0 10 15 — — — 40 30 25 80 60 50 5.0 10 15 — — — 480 240 190 960 480 380 5.0 10 15 — — — 125 75 65 250 150 130 Output Fall Time — RBO Outputs tTHL = (3.25 ns/pF) CL + 107.5 ns tTHL = (1.35 ns/pF) CL + 67.5 ns tTHL = (0.95 ns/pF) CL + 62.5 ns tTHL 5.0 10 15 — — — 270 135 110 540 270 220 Propagation Delay Time — A, B, C, D Inputs* tPLH = (0.40 ns/pF) CL + 620 ns tPLH = (0.25 ns/pF) CL + 237.5 ns tPLH = (0.20 ns/pF) CL + 165 ns tPLH 5.0 10 15 — — — 640 250 175 1280 500 350 tPHL 5.0 10 15 — — — 720 290 200 1440 580 400 tPLH 5.0 10 15 — — — 600 200 150 750 300 220 5.0 10 15 — — — 485 200 160 970 400 320 5.0 10 15 — — — 313 125 90 625 250 180 Unit ns tTLH tTHL Propagation Delay Time — RBI and BI Inputs* tPLH = (1.05 ns/pF) CL + 547.5 ns tPLH = (0.45 ns/pF) CL + 177.5 ns tPLH = (0.30 ns/pF) CL + 135 ns Min tTLH Output Fall Time — Segment Outputs* tTHL = (1.5 ns/pF) CL + 50 ns tTHL = (0.75 ns/pF) CL + 37.5 ns tTHL = (0.55 ns/pF) CL + 37.5 ns tPHL = (1.3 ns/pF) CL + 655 ns tPHL = (0.60 ns/pF) CL + 260 ns tPHL = (0.35 ns/pF) CL + 182.5 ns All Types VDD Vdc ns ns ns ns ns ns tPHL = (0.85 ns/pF) CL + 442.5 ns tPHL = (0.45 ns/pF) CL + 177.5 ns tPHL = (0.35 ns/pF) CL + 142.5 ns tPHL Propagation Delay Time — LT Input* tPLH = (0.45 ns/pF) CL + 290.5 ns tPLH = (0.25 ns/pF) CL + 112.5 ns tPLH = (0.20 ns/pF) CL + 80 ns tPLH tPHL = (1.3 ns/pF) CL + 248 ns tPHL = (0.45 ns/pF) CL + 102.5 ns tPHL = (0.35 ns/pF) CL + 72.5 ns tPHL 5.0 10 15 — — — 313 125 90 625 250 180 ns Setup Time tsu 5.0 10 15 100 40 30 — — — — — — ns Hold Time th 5.0 10 15 60 40 30 — — — — — — ns tWL(LE) 5.0 10 15 520 220 130 260 110 65 — — — ns Latch Enable Pulse Width ns ns * The formulas given are for the typical characteristics only. MOTOROLA CMOS LOGIC DATA MC14513B 379 20 ns VDD 20 ns 90% 50% 10% INPUT C VSS tPHL tPLH VOH OUTPUT g VOL tTHL tTLH a. Data Propagation Delay: Inputs RBI, D and LE low, and Inputs A, B, BI and LT high. 20 ns 20 ns VDD 90% 50% 10% INPUT C tPLH VSS tPHL VOH 90% OUTPUT RBO 50% 10% tTLH VOL tTHL b. Inputs A, B, D and LE low, and Inputs RBI, BI and LT high. 20 ns VDD 90% 50% LE 10% VSS th tsu INPUT C VDD 50% VSS VOH OUTPUT g VOL c. Setup and Hold Times: Input RBI and D low, Inputs A, B, BI and LT high. 20 ns 20 ns 90% 50% LE VDD 10% VSS tWL(LE) d. Pulse Width: Data DCBA strobed into latches. Figure 2. Dynamic Signal Waveforms MC14513B 380 MOTOROLA CMOS LOGIC DATA CONNECTIONS TO VARIOUS DISPLAY READOUTS LIGHT EMITTING DIODE (LED) READOUT VDD VDD COMMON ANODE LED COMMON CATHODE LED ≈ 1.7 V ≈ 1.7 V VSS VSS INCANDESCENT READOUT VDD VDD FLUORESCENT READOUT VDD ** DIRECT (LOW BRIGHTNESS) FILAMENT (SUPPLY) VSS VSS GAS DISCHARGE READOUT VDD APPROPRIATE VOLTAGE VSS OR APPROPRIATE VOLTAGE BELOW VSS. LIQUID CRYSTAL (LC) READOUT EXCITATION (SQUARE WAVE, VSS TO VDD) VDD 1/4 OF MC14070B VSS ** A filament pre–warm resistor is recommended to reduce filament thermal shock and increase the effective cold resistance of the filament. MOTOROLA CMOS LOGIC DATA VSS Direct dc drive of LC’s not recommended for life of LC readouts. MC14513B 381 LOGIC DIAGRAM BI 4 15 a A 7 14 b 13 c B 1 12 d 11 e 17 f C 2 16 g LT 30 10 RBO RBI 8 D 6 LE 5 TYPICAL APPLICATIONS FOR RIPPLE BLANKING LEADING EDGE ZERO SUPPRESSION DISPLAYS CONNECT TO a –– – –– g RBI VDD (1) D C RBO 1 B A a–– – –– g RBI D C MC14513B 382 0 0 0 (0) 0 B A 1 RBI D C MC14513B MC14513B INPUT CODE a–– – –– g RBO 0 0 0 (0) 0 a–– – –– g RBO B A 0 D C MC14513B 0 1 0 (5) a–– – –– g RBO RBI B A 0 D C MC14513B 1 0 0 0 (0) a–– – – –g RBO RBI B A 0 D C MC14513B 0 0 0 0 (1) 1 RBO RBI B A 0 MC14513B 0 0 1 1 (3) MOTOROLA CMOS LOGIC DATA TYPICAL APPLICATIONS FOR RIPPLE BLANKING (Cont) TRAILING EDGE ZERO SUPPRESSION DISPLAYS 0 a–– – –– g RBO RBI B A D C a –– – –– g 0 RBO D C 1 0 (5) 1 B A 0 RBO D C MC14513B MC14513B 0 a –– – ––g RBI 0 0 0 0 (0) MOTOROLA CMOS LOGIC DATA a–– – –– g RBI B A 0 RBO D C MC14513B 0 0 0 (1) a –– – ––g RBO RBI B A 1 D C MC14513B 1 0 0 1 (3) a –– – ––g RBO RBI B A 1 D C MC14513B 1 0 0 0 (0) 0 CONNECT TO RBI B A VDD (1) MC14513B 0 0 0 (0) 0 INPUT CODE MC14513B 383 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 726–04 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F FOR FULL LEADS. HALF LEADS OPTIONAL AT LEAD POSITIONS 1, 9, 10, AND 18. –A– 18 10 1 9 –B– OPTIONAL LEAD CONFIGURATION (1, 9, 10, 18) DIM A B C D F G J K L M N L C N –T– K SEATING PLANE F M G D 18 PL 0.25 (0.010) J M T A 18 PL 0.25 (0.010) S M P SUFFIX PLASTIC DIP PACKAGE CASE 707–02 ISSUE C 18 10 B 1 9 T B C N F H D K SEATING PLANE G M J MILLIMETERS MIN MAX 22.35 23.11 6.10 7.49 ––– 5.08 0.38 0.53 1.40 1.78 2.54 BSC 0.20 0.30 3.18 4.32 7.62 BSC 0_ 15_ 0.51 1.02 S NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. A L INCHES MIN MAX 0.880 0.910 0.240 0.295 ––– 0.200 0.015 0.021 0.055 0.070 0.100 BSC 0.008 0.012 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 22.22 23.24 6.10 6.60 3.56 4.57 0.36 0.56 1.27 1.78 2.54 BSC 1.02 1.52 0.20 0.30 2.92 3.43 7.62 BSC 0_ 15_ 0.51 1.02 INCHES MIN MAX 0.875 0.915 0.240 0.260 0.140 0.180 0.014 0.022 0.050 0.070 0.100 BSC 0.040 0.060 0.008 0.012 0.115 0.135 0.300 BSC 0_ 15 _ 0.020 0.040 Motorola reserves the right to make changes without further notice to any products herein. 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How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MC14513B 384 ◊ *MC14513B/D* MOTOROLA CMOS LOGIC DATA MC14513B/D