MOTOROLA MC74HC534ADW

SEMICONDUCTOR TECHNICAL DATA
High–Performance Silicon–Gate CMOS
The MC54/74HC534A is identical in pinout to the LS534. The device
inputs are compatible with standard CMOS outputs; with pullup resistors,
they are compatible with LSTTL outputs.
Data meeting the setup time is clocked, in inverted form, to the outputs
with the rising edge of the Clock. The Output Enable input does not affect the
states of the flip–flops, but when Output Enable is high, the outputs are
forced to the high impedance state. Thus, data may be stored even when the
outputs are not enabled.
The HC534A is identical in function to the HC564 which has the data
inputs on the opposite side of the package from the outputs to facilitate PC
board layout.
This device is similar in function to the HC374A, which has noninverting
outputs.
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
20
1
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
20
1
1
ORDERING INFORMATION
•
•
•
•
•
•
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 282 FETs or 68.5 Equivalent Gates
MC54HCXXXAJ
MC74HCXXXAN
MC74HCXXXADW
D0
D1
D2
DATA
INPUTS
D3
D4
D5
D6
D7
CLOCK
2
4
5
7
6
8
9
13
14
17
12
15
16
18
19
11
OUTPUT
ENABLE
Q0
1
1
20
VCC
2
19
Q7
D0
3
18
D7
D1
4
17
D6
Q1
5
16
Q6
Q0
Q2
6
15
Q5
Q1
D2
7
14
D5
Q2
D3
8
13
D4
Q3
9
12
Q4
10
11
CLOCK
Q3
Q4
INVERTING
OUTPUTS
GND
Q5
Q6
FUNCTION TABLE
Q7
Inputs
Output
Enable
OUTPUT ENABLE
L
L
L
H
PIN 20 = VCC
PIN 10 = GND
10/95
3–1
REV 6
Output
Clock
D
Q
L,H,
X
H
L
X
X
L
H
No Change
Z
X = Don’t Care
Z = High Impedance
 Motorola, Inc. 1995
Ceramic
Plastic
SOIC
PIN ASSIGNMENT
LOGIC DIAGRAM
3
DW SUFFIX
SOIC PACKAGE
CASE 751D–04
20
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MC54/74HC534A
MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
V
Vin
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 35
mA
ICC
DC Supply Current, VCC and GND Pins
± 75
mA
PD
Power Dissipation in Still Air, Plastic or Ceramic DIP†
SOIC Package†
750
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
260
300
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25_C
85_C
125_C
Unit
VIH
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
0.5
1.35
1.8
0.5
1.35
1.8
0.5
1.35
1.8
V
Minimum High–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or VIL
|Iout|
6.0 mA
|Iout|
7.8 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
V
Vin = VIH or VIL
|Iout|
20 µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH or VIL
|Iout|
6.0 mA
|Iout|
7.8 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
V
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
VOH
VOL
Iin
MOTOROLA
Maximum Low–Level Output
Voltage
Maximum Input Leakage Current
3–2
High–Speed CMOS Logic Data
DL129 — Rev 6
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MC54/74HC534A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
VCC
V
– 55 to
25_C
Output in High–Impedance State
Vin = VIL or VIH
Vout = VCC or GND
6.0
± 0.5
± 5.0
± 10
µA
Vin = VCC or GND
|Iout| = 0 µA
6.0
4.0
40
160
µA
Symbol
Parameter
Test Conditions
IOZ
Maximum Three–State Leakage
Current
ICC
Maximum Quiescent Supply
Current (per Package)
85_C
125_C
Unit
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
Symbol
Parameter
Fig.
VCC
V
– 55 to
25_C
85_C
125_C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
1, 4
2.0
4.5
6.0
6.0
30
35
5.0
24
28
4.0
20
24
MHz
tPLH
tPHL
Maximum Propagation Delay, Clock to Q
1, 4
2.0
4.5
6.0
125
25
21
155
31
26
190
38
32
ns
tPLZ
tPHZ
Maximum Propagation Delay, Output Enable to Q
2, 5
2.0
4.5
6.0
150
30
26
190
38
33
225
45
38
ns
tPZL
tPZH
Maximum Propagation Delay, Output Enable to Q
2, 5
2.0
4.5
6.0
150
30
26
190
38
33
225
45
38
ns
tTLH
tTHL
Maximum Output Transition Time, Any Output
1, 4
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
Maximum Input Capacitance
10
10
10
pF
Maximum Tri–State Output Capacitance (Output in Hi–Impedance State)
15
15
15
pF
Cin
COUT
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
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Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Flip–Flop)*
pF
34
2
* Used to determine the no–load dynamic power consumption: PD = CPD VCC f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
Symbol
Parameter
Fig.
VCC
Volts
– 55 to 25_C
Min
Max
85_C
Min
Max
125_C
Min
Max
Unit
tsu
Minimum Setup Time, Data to Clock
3
2.0
4.5
6.0
50
10
9.0
65
13
11
75
15
13
ns
th
Minimum Hold Time, Clock to Data
3
2.0
4.5
6.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
ns
tw
Minimum Pulse Width, Clock
1
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
Maximum Input Rise and Fall Times
1
2.0
4.5
6.0
tr, tf
High–Speed CMOS Logic Data
DL129 — Rev 6
3–3
1000
500
400
1000
500
400
1000
500
400
ns
MOTOROLA
MC54/74HC534A
SWITCHING WAVEFORMS
tr
90%
50%
CLOCK
tf
VCC
VCC
10%
OUTPUT
ENABLE
50%
GND
GND
tPZL
tPLZ
HIGH
IMPEDANCE
tW
1/fmax
tPLH
50%
Q
tPHL
90%
50%
10%
Q
Q
tTLH
10%
VOL
90%
VOH
tPZH tPHZ
50%
HIGH
IMPEDANCE
tTHL
Figure 1.
Figure 2.
VALID
VCC
50%
DATA
GND
th
tsu
VCC
CLOCK
50%
GND
Figure 3.
TEST CIRCUITS
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH
1 kΩ
OUTPUT
CL*
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 4.
Figure 5.
EXPANDED LOGIC DIAGRAM
D0
3
D1
4
D
D2
7
D
Q
C
Q
D3
8
D
C
Q
D4
13
D
C
Q
D5
14
D
C
Q
D6
17
D
C
Q
D7
18
D
C
Q
D
C
Q
C
CLOCK 11
OUTPUT 1
ENABLE
MOTOROLA
2
Q0
5
Q1
6
Q2
9
Q3
3–4
12
Q4
15
Q5
16
Q6
19
Q7
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC534A
OUTLINE DIMENSIONS
20
11
1
10
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
ISSUE E
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
B
A
L
C
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
N
H
G
D
J
K
M
MILLIMETERS
MIN
MAX
23.88
25.15
6.60
7.49
3.81
5.08
0.38
0.56
1.40
1.65
2.54 BSC
0.51
1.27
0.20
0.30
3.18
4.06
7.62 BSC
0_
15 _
0.25
1.02
INCHES
MIN
MAX
0.940
0.990
0.260
0.295
0.150
0.200
0.015
0.022
0.055
0.065
0.100 BSC
0.020
0.050
0.008
0.012
0.125
0.160
0.300 BSC
0_
15_
0.010
0.040
SEATING
PLANE
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
ISSUE E
–A–
20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
–T–
DIM
A
B
C
D
E
F
G
J
K
L
M
N
K
SEATING
PLANE
M
N
E
G
F
J
D
0.25 (0.010)
M
T A
11
–B–
10X
P
0.010 (0.25)
1
M
B
M
10
20X
D
0.010 (0.25)
M
T A
B
S
J
S
F
R X 45 _
C
–T–
18X
G
High–Speed CMOS Logic Data
DL129 — Rev 6
K
SEATING
PLANE
M
T B
M
M
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
–A–
20
20 PL
0.25 (0.010)
20 PL
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M
3–5
MOTOROLA
MC54/74HC534A
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
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CODELINE
*MC54/74HC534A/D*
3–6
MC54/74HC534A/D
High–Speed CMOS Logic Data
DL129 — Rev 6