MOTOROLA MC74HC241A

SEMICONDUCTOR TECHNICAL DATA
" ! "
"
High–Performance Silicon–Gate CMOS
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
20
1
The MC54/74HC241A is identical in pinout to the LS241. The device
inputs are compatible with standard CMOS outputs; with pullup resistors,
they are compatible with LSTTL outputs.
This octal noninverting buffer/line driver/line receiver is designed to be
used with 3–state memory address drivers, clock drivers, and other
sub–oriented systems. The device has noninverted outputs and two output
enables. Enable A is active–low and Enable B is active–high.
The HC241A is similar in function to the HC244A and HC240A.
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
20
1
DW SUFFIX
SOIC PACKAGE
CASE 751D–04
20
•
•
•
•
•
•
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 134 FETs or 33.5 Equivalent Gates
1
ORDERING INFORMATION
MC54HCXXXAJ
MC74HCXXXAN
MC74HCXXXADW
Ceramic
Plastic
SOIC
PIN ASSIGNMENT
LOGIC DIAGRAM
A1
A2
A3
A4
DATA
INPUTS
B1
B2
B3
B4
OUTPUT
ENABLES
2
18
4
16
6
14
8
12
11
9
13
7
15
5
17
3
1
ENABLE A
19
ENABLE B
1
20
VCC
A1
2
19
ENABLE B
YB4
3
18
YA1
A2
4
17
B4
YB3
5
16
YA2
YA1
YA2
A3
6
15
B3
YB2
7
14
YA3
A4
8
13
B2
YB1
9
12
YA4
GND
10
11
B1
YA3
YA4
YB1
NONINVERTING
OUTPUTS
YB2
FUNCTION TABLE
YB3
Inputs
YB4
PIN 20 = VCC
PIN 10 = GND
Enable
A
A
L
L
H
L
H
X
Output
Inputs
Output
YA
Enable
B
B
YB
L
H
Z
Z = high impedance
10/95
 Motorola, Inc. 1995
ENABLE A
1
REV 6
H
H
L
L
H
X
L
H
Z
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MC54/74HC241A
MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
V
Vin
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 35
mA
ICC
DC Supply Current, VCC and GND Pins
± 75
mA
PD
Power Dissipation in Still Air, Plastic or Ceramic DIP†
SOIC Package†
750
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
260
300
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25_C
85_C
125_C
Unit
VIH
Minimum High–Level Input
Voltage
Vout = VCC – 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
0.5
1.35
1.8
0.5
1.35
1.8
0.5
1.35
1.8
V
Minimum High–Level Output
Voltage
Vin = VIH
|Iout|
20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
4.5
6.0
3.98
5.48
3.84
5.34
3.70
5.20
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
6.0
± 0.1
± 1.0
± 1.0
VOH
Vin = VIH
VOL
Maximum Low–Level Output
Voltage
MOTOROLA
Maximum Input Leakage Current
6.0 mA
7.8 mA
Vin = VIL
|Iout|
20 µA
Vin = VIL
Iin
|Iout|
|Iout|
|Iout|
|Iout|
Vin = VCC or GND
2
6.0 mA
7.8 mA
V
µA
High–Speed CMOS Logic Data
DL129 — Rev 6
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MC54/74HC241A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25_C
85_C
125_C
Unit
IOZ
Maximum Three–State
Leakage Current
Output in High–Impedance State
Vin = VIL or VIH
Vout = VCC or GND
6.0
± 0.5
± 5.0
± 10
µA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 µA
6.0
4
40
160
µA
NOTE: Information on typical parametric values along with high frequency or heavy load considerations, can be found in Chapter 2 of the Motorola
High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
– 55 to
25_C
85_C
125_C
Unit
tPLH,
tPHL
Maximum Propagation Delay, A to YA or B to YB
(Figures 1 and 3)
2.0
4.5
6.0
90
18
15
115
23
20
135
27
23
ns
tPLZ,
tPHZ
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
2.0
4.5
6.0
110
22
19
140
28
24
165
33
28
ns
tPZL,
tPZH
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
2.0
4.5
6.0
110
22
19
140
28
24
165
33
28
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
Maximum Input Capacitance
—
10
10
10
pF
Maximum Three–State Output Capacitance (Output in
High–Impedance State)
—
15
15
15
pF
Cin
Cout
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Transceiver Channel)*
34
pF
* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
MC54/74HC241A
SWITCHING WAVEFORMS
VCC
ENABLE A
50%
GND
tr
tf
DATA INPUT
A OR B
VCC
VCC
90%
50%
10%
ENABLE B
50%
GND
GND
tPLH
tPZL
tPHL
90%
50%
10%
OUTPUT
YA OR YB
OUTPUT Y
tPZH
OUTPUT Y
10%
VOL
90%
VOH
HIGH
IMPEDANCE
tPHZ
50%
Figure 1.
Figure 2.
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
HIGH
IMPEDANCE
50%
tTHL
tTLH
tPLZ
OUTPUT
DEVICE
UNDER
TEST
CL*
* Includes all probe and jig capacitance
1 kΩ
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
* Includes all probe and jig capacitance
Figure 3. Test Circuit
Figure 4. Test Circuit
PIN DESCRIPTIONS
INPUTS
Enable 8 (Pin 19)
A1, A2, A3, A4, B1, B2, B3, B4
(Pins 2, 4, 6, 8, 11, 13, 15, 17)
Output enable (active–high). When a high level is applied
to this pin, the outputs of the “B” devices are enabled and the
devices function as noninverting buffers. When a low level is
applied, the outputs assume the high–impedance state.
Data input pins. Data on these pins appear in noninverted
form on the corresponding Y outputs when the outputs are
enabled.
OUTPUTS
CONTROLS
YA1, YA2, YA3, YA4, YB1, YB2, YB3, YB4
(Pins 18, 16, 14, 12, 9, 7, 5, 3)
Enable A (Pin 1)
Output enable (active–low). When a low level is applied to
this pin, the outputs of the “A” devices are enabled and the
devices function as noninverting buffers. When a high level is
applied, the outputs assume the high–impedance state.
MOTOROLA
Device outputs. Depending upon the state of the output–
enable pins, these outputs are either noninverting outputs or
high–impedance outputs.
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC241A
LOGIC DETAIL
TO THREE OTHER
“A” BUFFERS
TO THREE OTHER
“B” BUFFERS
TWO OF 8 BUFFERS
DATA
INPUT
A
VCC
YA
DATA
INPUT
B
VCC
YB
ENABLE A
OUTPUT
ENABLES
ENABLE B
High–Speed CMOS Logic Data
DL129 — Rev 6
5
MOTOROLA
MC54/74HC241A
OUTLINE DIMENSIONS
20
11
1
10
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
ISSUE E
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
B
A
L
C
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
N
H
G
D
J
K
M
MILLIMETERS
MIN
MAX
23.88
25.15
6.60
7.49
3.81
5.08
0.38
0.56
1.40
1.65
2.54 BSC
0.51
1.27
0.20
0.30
3.18
4.06
7.62 BSC
0_
15 _
0.25
1.02
INCHES
MIN
MAX
0.940
0.990
0.260
0.295
0.150
0.200
0.015
0.022
0.055
0.065
0.100 BSC
0.020
0.050
0.008
0.012
0.125
0.160
0.300 BSC
0_
15_
0.010
0.040
SEATING
PLANE
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
ISSUE E
–A–
20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
–T–
K
SEATING
PLANE
M
N
E
G
F
J
D
M
T A
11
–B–
10X
P
0.010 (0.25)
1
M
B
M
10
20X
D
0.010 (0.25)
M
T A
B
S
J
S
F
R X 45 _
C
–T–
18X
G
K
SEATING
PLANE
M
T B
M
M
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
–A–
20
20 PL
0.25 (0.010)
20 PL
0.25 (0.010)
MOTOROLA
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M
6
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC241A
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High–Speed CMOS Logic Data
DL129 — Rev 6
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