SEMICONDUCTOR TECHNICAL DATA The MC10H/100H602 is a 9–bit, dual supply TTL to ECL translator with latch. Devices in the Motorola 9–bit translator series utilize the 28–lead PLCC for optimal power pinning, signal flow–through and electrical performance. The H602 features D–type latches. Latching is controlled by Latch Enable (LEN), while the Master Reset input resets the latches. A post–latch logic enable is also provided (ENECL), allowing control of the output state without destroying latch data. All control inputs are ECL level. The 10H version is compatible with MECL 10H ECL logic levels. The 100H version is compatible with 100K levels. • • • • • • 9–Bit Ideal for Byte–Parity Applications Flow–Through Configuration Extra TTL and ECL Power/Ground Pins to Minimize Switching Noise Dual Supply 3.5 ns Max D to Q PNP TTL Inputs for Low Loading FN SUFFIX PLASTIC PACKAGE CASE 776–02 PIN NAMES LOGIC SYMBOL ENECL TTL D0 DQ EN Q0 D1 DQ EN Q1 D2 DQ EN Q2 D3 DQ EN Q3 D4 DQ EN Q4 D5 DQ EN Q5 D6 DQ EN PIN FUNCTION GND VCCE VCCO VCCT VEE D0 – D8 Q0 – Q8 ENECL LEN MR TTL Ground (0 V) ECL VCC (0 V) ECL VCC (0 V) — Outputs TTL Supply (+ 5.0 V) ECL Supply (– 5.2 / – 4.5 V) Data Inputs (TTL) Data Outputs (ECL) Enable Control (ECL) Latch Enable (ECL) Master Reset (ECL) TRUTH TABLE D LEN MR ENECL Q L H X X X L L H X X L L L H X H H H H L L H Q0 L L ECL Pinout: 28–Lead PLCC (Top View) D5 D4 VCCT D3 25 D7 D8 Q6 DQ EN Q7 DQ EN 23 22 21 20 19 D6 26 18 Q0 D7 27 17 Q1 D8 28 16 VCCE 15 VCCO GND MR 2 14 Q2 LEN 3 13 VCCO ENECL 4 12 Q3 Q8 LEN MR 5 6 7 8 9 10 11 Q8 Q7 VCCO Q6 VEE Q5 Q4 3/93 Motorola, Inc. 1996 24 D2 D1 D0 2–307 REV 5 MC10H602 MC100H602 DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 5.2 V ± 5% (10H version); VEE = – 4.2 V to – 5.5 V (100H version) 0°C S b l Symbol Min P Parameter 25°C Max Min 75°C Max Min Max U i Unit C di i Condition Power Supply Current IEE ECL ICCH ICCL TTL 10H 100H –125 –122 –125 –123 –125 –132 mA 48 50 48 50 48 50 mA AC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 5.2 V ± 5% (10H version); VEE = – 4.2 V to – 5.5 V (100H version) 0°C S b l Symbol P Parameter D LEN MR ENECL 25°C 75°C Min Max Min Max Min Max U i Unit 1.4 2.0 2.0 1.6 3.0 3.4 3.4 3.2 1.5 2.1 2.1 1.7 3.2 3.5 3.5 3.3 1.7 2.4 2.5 1.8 3.5 3.7 3.9 3.7 ns tPLH tPHL Propagation Delay to Output ts Set–Up Time, D to LEN 2.0 2.0 2.0 ns th Hold Time, D to LEN 1.0 1.0 1.0 ns tw(L) LEN Pulse Width, LOW 2.0 tR tF Output Rise/Fall Time 20% – 80% 0.5 2.0 1.5 2.0 0.5 1.5 0.5 Max Min C di i Condition ns 1.5 ns Max U i Unit 145 µA µA 10H ECL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 5.2 V ± 5% 0°C S b l Symbol P Parameter Min 25°C Max Min 225 75°C 145 C di i Condition IIH IIL Input HIGH Current Input LOW Current 0.5 VIH VIL Input HIGH Voltage Input LOW Voltage –1170 –1950 – 840 –1480 –1130 –1950 – 810 –1480 –1070 –1950 – 735 –1450 mV VOH VOL Output HIGH Voltage Output LOW Voltage –1020 –1950 – 840 –1630 – 980 –1950 – 810 –1630 – 920 –1950 – 735 –1600 mV 50 Ω to – 2.0 V Max U i Unit C di i Condition 145 µA µA 0.5 0.5 100H ECL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 4.2 V to – 5.5 V 0°C S b l Symbol P Parameter Min 25°C Max Min 75°C Max 225 Min IIH IIL Input HIGH Current Input LOW Current 0.5 145 VIH VIL Input HIGH Voltage Input LOW Voltage –1165 –1810 – 880 –1475 –1165 –1810 – 880 –1475 –1165 –1810 – 880 –1475 mV VOH VOL Output HIGH Voltage Output LOW Voltage –1025 –1810 – 880 –1620 –1025 –1810 – 880 –1620 –1025 –1810 – 880 –1620 mV 0.5 0.5 50 Ω to – 2.0 V TTL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 5.2 V ± 5% (10H version); VEE = – 4.2 V to – 5.5 V (100H version) 0°C S b l Symbol P Parameter VIH VIL Input HIGH Voltage Input LOW Voltage IIH Min 25°C Max 2.0 Min 75°C Max 2.0 Min Max U i Unit V V 2.0 C di i Condition 0.8 0.8 0.8 Input HIGH Current 20 100 20 100 20 100 µA VIN = 2.7 V VIN = 7.0 V IIL Input LOW Current – 0.6 – 0.6 – 0.6 mA VIN = 0.5 V VIK Input Clamp Voltage –1.2 –1.2 –1.2 V MOTOROLA 2–308 IIN = –18 mA MECL Data DL122 — Rev 6 MC10H602 MC100H602 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B T L–M M N S T L–M S S Y BRK –N– 0.007 (0.180) U M N S D Z –M– –L– W 28 D X G1 0.010 (0.250) T L–M S N S S V 1 VIEW D–D A 0.007 (0.180) R 0.007 (0.180) M T L–M S N S C M T L–M S N 0.007 (0.180) H Z M T L–M N S S S K1 E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) –T– T L–M S N S M T L–M S N S VIEW S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 0.007 (0.180) 2–309 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10_ 0.410 0.430 0.040 ––– MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10_ 10.42 10.92 1.02 ––– MOTOROLA MC10H602 MC100H602 Motorola reserves the right to make changes without further notice to any products herein. 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