AM82731-025 . .. .. .. .. RF & MICROWAVE TRANSISTORS S-BAND RADAR APPLICATIONS LOW PARASITIC, DOUBLE LEVEL METAL DESIGN REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED 3:1 VSWR @ 1 dB OVERDRIVE LOW RF THERMAL RESISTANCE INPUT/OUTPUT IMPEDANCE MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE POUT = 25 W MIN. WITH 6.2 dB GAIN .400 x .400 2LFL (S036) hermetically sealed ORDER CODE AM82731-025 BRANDING 82731-25 DESCRIPTION The AM82731-025 device is a high power silicon bipolar NPN transistor specifically designed for S-Band radar pulsed output and driver applications. PIN CONNECTION This device is capable of operation over a wide range of pulse widths, duty cycles, and temperatures and can withstand a 3:1 output VSWR with a +1dB input over drive. Low RF thermal resistance, refractory/gold metallization, and automatic wire bonding techniques ensure high reliability and product consistency (including phase characteristics). The AM82731-025 is supplied in the Hermetic Metal/Ceramic package with internal Input/Output impedance matching circuitry, and is intended for military and other high reliability applications. 1. Collector 2. Base 3. Emitter 4. Base ABSOLUTE MAXIMUM RATINGS (T case = 25 ° C) Symbol PDISS Ic VCC TJ T STG Parameter Value Unit 100 W Device Current* 4 A Collector-Supply Voltage* 46 V Junction Temperature (Pulsed RF Operation) 250 °C − 65 to +200 °C 2.0 °C/W Power Dissipation* (TC ≤ 50°C) Storage Temperature THERMAL DATA RTH(j-c) Junction-Case Thermal Resistance* *Applies only to rated RF amplifier operation August 1992 1/4 AM82731-025 ELECTRICAL SPECIFICATIONS (T case = 25 ° C) STATIC Valu e Symbol Test Conditions Min. Typ. Max. Unit BV CBO IC = 15mA IE = 0mA 55 — — V BV EBO IE = 2mA IC = 0mA 3.5 — — V BV CER IC = 15mA RBE = 10Ω 55 — — V ICES VCE = 0V VBE = 40V — — 10 mA hFE VCE = 5V IC = 1.5A 30 — — — DYNAMIC Valu e Symbol Test Conditions Typ. Max. Unit POUT ηc f = 2.7 — 3.1GHz PIN = 6.0W VCC = 40V 25 30 — W f = 2.7 — 3.1GHz PIN = 6.0W VCC = 40V 30 36 — % GPB f = 2.7 — 3.1GHz PIN = 6.0W VCC = 40V 6.2 7.0 — dB Note: Pul se Widt h Duty Cycle = = 100 µ Sec 10% TYPICAL PERFORMANCE TYPICAL BROADBAND PERFORMANCE 2/4 Min. AM82731-025 IMPEDANCE DATA TYPICAL INPUT IMPEDANCES ZIN TYPICAL COLLECTOR LOAD IMPEDANCES ZCL FREQ. ZIN(Ω) ZCL(Ω) L = 2.7 GHz 12.0 + j 3.0 15.0 − j 4.0 • = 2.8 GHz 9.5 + j 2.5 17.0 − j 3.0 M = 2.9 GHz 6.5 + j 0.0 15.5 − j 3.0 • = 3.0 GHz 6.0 −j 1.5 14.5 − j 3.0 H = 3.1 GHz 5.0 −j 3.0 11.0 − j 3.0 PIN = 6.0 W VCC = 40 V Normalized to 50 ohms TEST CIRCUIT All dimensions are in inches. Sustrate material: .025 thick Al2O3 (Er = 9.6) C1 C2 : 22 pF Chip Capacitor : 1500 pF RF Feedthrough L1 L2 : No. 26 Wire, 2 Turn, 0.08 Inch I.D. : No. 26 Wire, 2 Turn, 0.08 Inch I.D. 3/4 AM82731-025 PACKAGE MECHANICAL DATA Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 4/4