BAT 45 SMALL SIGNAL SCHOTTKY DIODE DO 35 (Glass) DESCRIPTION Metal to silicon junction diode primarly intended for UHF mixers and ultrafast switching applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM Parameter Repetitive Peak Reverse Voltage Value Unit 15 V Forward Continuous Current Ta = 25 °C 30 mA IFSM Surge non Repetitive Forward Current tp ≤ 1s 60 mA Tstg Tj Storage and Junction Temperature Range - 65 to +150 - 65 to +125 °C °C TL Maximum Temperature for Soldering during 10s at 4mm from Case 230 °C Value Unit 400 °C/W IF THERMAL RESISTANCE Symbol Rth(j-a) Test Conditions Junction-ambient* * On infinite heatsink with 4mm lead length November 1994 1/4 BAT 45 ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS Symbol Test Conditions Min. Typ. Max. 15 V VBR T amb = 25°C IR = 10µA VF (1) T amb = 25°C IF = 1mA 0.38 T amb = 25°C IF = 10mA 0.5 T amb = 25°C IF = 30mA 1 T amb = 25°C VR = 6V IR (1) Unit V 0.1 µA Max. Unit DYNAMIC CHARACTERISTICS Symbol Test Conditions Min. Typ. C T amb = 25°C VR = 1V f = 1MHz 1.1 pF τ T amb = 25°C IF = 20mA Krakauer Method 100 ps F (2) T amb = 25°C f = 1GHz 7 dB 6 (1) Pulse test: tp ≤ 300µs δ < 2%. (2) Noise figure test : - diode is inserted in a tuned stripline circuit - local oscillator frequency 1GHz - local oscillator power 1mW - intermediate frequency amplifier, tuned on 300MHz, has a noise figure 1.5dB Matched batches available on request. Test conditions (forward voltage and/or capacitance) according to customer specification. 2/4 BAT 45 Figure 1. Forward current versus forward voltage at different temperatures (typical values). Figure 2. Forward current versus forward voltage (typical values). Figure 3. Reverse current versus junction temperature. Figure 4. Reverse current versus continuous reverse voltage (typical values). 3/4 BAT 45 PACKAGE MECHANICAL DATA DO 35 Glass B A note 1 B /C O E note 1 E /D O O /D note 2 DIMENSIONS REF. Millimeters Inches NOTES Min. Max. Min. Max. A 3.050 4.500 0.120 0.117 1 - The lead diameter ∅ D is not controlled over zone E B 12.7 ∅C 1.530 2.000 0.060 0.079 ∅D 2 - The minimum axial lengh within which the device may be placed with its leads bent at right angles is 0.59”(15 mm) 0.458 0.558 0.018 0.022 E 0.500 1.27 0.050 Marking: clear, ring at cathode end. Weight: 0.15g Cooling method: by convection and conduction Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - United Kingdom - U.S.A. 4/4