STMICROELECTRONICS TMMBAT41

TMMBAT 41
®
SMALL SIGNAL SCHOTTKY DIODE
DESCRIPTION
General purpose metal to silicon diode featuring
very low turn-on voltage and fast switching.
This device has integrated protection against excessive voltage such as electrostatic discharges.
MINIMELF
(Glass)
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
100
V
Forward Continuous Current
Ti = 25 °C
100
mA
IFRM
Repetitive Peak Forward Current
tp ≤ 1s
δ ≤ 0.5
350
mA
IFSM
Surge non Repetitive Forward Current
tp = 10ms
750
mA
Ptot
Power Dissipation
Ti = 95 °C
100
mW
Tstg
Tj
Storage and Junction Temperature Range
- 65 to + 150
- 65 to + 125
°C
°C
TL
Maximum Temperature for Soldering during 15s
260
°C
Value
Unit
300
°C/W
VRRM
IF
Repetitive Peak Reverse Voltage
Unit
THERMAL RESISTANCE
Symbol
Rth(j-l)
Test Conditions
Junction-leads
ELECTRICAL CHARACTERISTICS
STATIC CHARACTERISTICS
Symbol
Test Conditions
VBR
Tj = 25°C
IR = 100µA
VF*
Tj = 25°C
IF = 1mA
Tj = 25°C
IF = 200mA
IR*
Min.
Typ.
Max.
100
Unit
V
0.4
0.45
V
1
VR = 50V
Tj = 25°C
0.1
µA
20
Tj = 100°C
DYNAMIC CHARACTERISTICS
Symbol
C
Test Conditions
Tj = 25°C
VR = 1V
f = 1MHz
Min.
Typ.
2
Max.
Unit
pF
* Pulse test: tp ≤ 300µs δ < 2%.
August 1999 Ed: 1A
1/4
TMMBAT 41
Figure 1. Forward current versus forward
voltage at different temperatures (typical
values).
Figure 2. Forward current versus forward
voltage (typical values).
Figure 3. Reverse current versus junction
temperature.
Figure 4. Reverse current versus continuous
reverse voltage (typical values).
2/4
TMMBAT 41
Figure 5. Capacitance C versus reverse
applied voltage VR (typical values).
3/4
TMMBAT 41
PACKAGE MECHANICAL DATA
MINIMELF Glass
DIMENSIONS
REF.
A
/B
O
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
3.30
3.40
3.6
0.130
0.134
0.142
B
1.59
1.60
1.62
0.063
0.063
0.064
C
0.40
0.45
0.50
0.016
0.018
0.020
D
1.50
0.059
C
C
FOOT PRINT DIMENSIONS (Millimeter)
2
2.5
5
Marking: ring at cathode end.
Weight: 0.05g
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval
of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
4/4