BF3506TV FULL 50-60Hz RECTIFICATION BRIDGE MAIN PRODUCT CHARACTERISTICS . . . IF(AV) 35A VRRM 600V VF (max) 1.3V PRELIMINARY DATASHEET + FEATURES AND BENEFITS - COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES, TRANSISTORS AND PASSIVE COMPONENTS. EXCELLENT THERMAL TRANSFER JUNCTION TI HEATSINK UL PENDING + - DESCRIPTION The Bridges series from SGS-THOMSON has been designed to allow a better standardization of packages on boards principally designed with ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advantage in these industry package products. Screw version ISOTOP (Plastic) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (per diode unless specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V VRSM Non repetitive peak reverse voltage 600 V 35 A Surge non repetitive forward current 50Hz JEDEC method 300 A Fusing 660 A2.s - 65 to + 150 °C Max. operating junction temperature 150 °C Total power dissipation 50 W IF(AV) total IFSM I2.t Tstg Tj Pmax total Average forward current Tc=80°C Sinus Storage temperature range TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics. November 1995 Ed : 1 1/3 BF3506TV THERMAL RESISTANCE Symbol Rth (j-c) total Parameter Value Unit 0.5 °C/W Junction to case ELECTRICAL CHARACTERISTICS (Per diode) STATIC CHARACTERISTICS Symbol Parameter IR * Reverse leakage current VF ** Forward voltage drop Test Conditions VR = 0.8 VRRM δ < 2% tp = 5ms IF = 35 A δ < 2% tp = 380µs Min. Typ. Max. Unit Tj = 25°C 10 µA Tj = 125°C 0.2 mA Tj = 25°C 1.4 V Tj = 125°C 1.3 V Pulse test : * tp = 5 ms, duty cycle < 2 % ** tp = 380 µs, duty cycle < 2 % For one diode: Pcond = 1.02 x IF(AV) + 0.008 x I2F(RMS) and Tj = Pcond x 4 x Rth(j-c) + Tc 2/3 BF3506TV PACKAGE DATA (millimeter) ISOTOP (Plastic) REF. DIMENSIONS Millimeters M A G O/ J O B O/ I O/ I D H E F C K screw H M 4 P L Cooling method : C Marking : Type number Weight : 28 g. (without screws) Inches Min. Max. Min. Max. A 11.80 12.20 0.465 0.480 B 8.90 9.10 0.350 0.358 C 1.95 2.05 0.077 0.081 D 0.75 0.85 0.029 0.034 E 12.60 12.80 0.496 0.504 F G 25.10 31.50 25.50 31.70 0.988 1.240 1.004 1.248 H I 4.00 4.10 4.30 0.157 0.161 0.169 J 4.10 4.30 0.161 0.169 K 14.90 15.10 0.586 0.595 L 30.10 30.30 1.185 1.193 M 37.80 38.20 1.488 1.504 O P 7.80 5.50 8.20 0.307 0.216 0.323 Electrical isolation : 2500V(RMS) Capacitance : < 45 pF Inductance : < 5 nH - Recommended torque value : 1.3 N.m (MAX 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws recommended for mounting the package on the heatsink and the 4 screws given with the screw version). - The screws supplied with the package are adapted for mounting on a board (or other types of terminals) with a thickness of 0.6 mm min and 2.2 mm max. Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 3/3