STMICROELECTRONICS FC106

FC106

Fibre Channel Transceiver 1.0625 GBaud
PRELIMINARY DATA
FEATURES
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Serial Link Transceiver
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Receive
Byte
Clock
Direct support for 1.0625 GBaud Fibre
Channel (ANSI X3.230-1994) rates
Fibre Channel 10-bit Interface (ANSI
TR/X3.18-199X)
Direct interfaces to optical tranceivers
Plesiochronous mode operation
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Parallel Interface
serializer and deserializer
implementing the Fibre Channel FC0
and FC1 layers
DESER IALIZER
CLOCK RECOVERY
BYTE AND WORD
ALIGNEMENT
8 bit / 10 bit
ENCODER
(optional)
SERIALI ZER
AND CLOCK
FREQUENCY
MULTIPLICATION
FC 106
1.0625 Gbaud
Serial data over copper
or optical cables
APPLICATIONS
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September 98
10 bits
8 bit / 10 bit
DECODER
(optional)
transmitter and receiver clock
frequencies may differ by up to 100 ppm
Integrated Fibre Channel 8b/10b
encode/decode (optional use through
JTAG)
Byte and word synchronization of
incoming serial stream
Supports any DC-balanced encoding
scheme
Internal Loop-Back for Self-Test
Random Pattern Auto-Test
Optional integrated impedance
adaptation to transmission line
characteristics (50 or 75 ohms)
TTL compatible parallel I/O’s
JTAG Test Access Port
0.35µ CMOS Technology for low cost
and low power
PQFP package available in two sizes:
14x14 mm (FC106/14) or 10x10 mm
(FC106/10)
REFCLK
Revision 1.2
Fibre Channel Arbitrated Loop
Fibre Channel fabric
Transmission schemes encoding
bytes as 10-bit characters to form a
DC-balanced stream
High performance backplane
interconnect
FC106
Table of Contents
1
General Description - - - - - - - - - - - - - - - - - - - - - - 4
2
Interface Diagram - - - - - - - - - - - - - - - - - - - - - - - 6
3
Functional Description - - - - - - - - - - - - - - - - - - - - 7
3.1 Block diagram - - - - - - - - - - - - - - - - - - - - - - - 8
3.2 Input latches - - - - - - - - - - - - - - - - - - - - - - - - 8
3.3 8bit/10bit Encoder/Decoder - - - - - - - - - - - - - - - - - 9
3.4 DLL clock generator - - - - - - - - - - - - - - - - - - - - 9
3.5 Serializer functional description and reference clock - - - - - 9
3.6 Serializer latches and XOR-tree - - - - - - - - - - - - - - 10
3.7 Serial input multiplexer - - - - - - - - - - - - - - - - - - 10
3.8 Deserializer functional description - - - - - - - - - - - - - 10
3.9 Bit alignment - - - - - - - - - - - - - - - - - - - - - - - 11
3.10 Byte and word alignment
- - - - - - - - - - - - - - - - 12
3.11 Clock recovery - - - - - - - - - - - - - - - - - - - - - 12
3.12 Serial input-output buffer
- - - - - - - - - - - - - - - - 13
3.13 I/O impedance control - - - - - - - - - - - - - - - - - - 14
3.14 Self-test - - - - - - - - - - - - - - - - - - - - - - - - - 15
4
Serial I/O Electrical Model
- - - - - - - - - - - - - - - - - 16
5
Electrical Specifications - - - - - - - - - - - - - - - - - - 17
5.1 Absolute maximum ratings - - - - - - - - - - - - - - - - 17
5.2 Operating conditions - - - - - - - - - - - - - - - - - - - 17
5.3 DC characteristics - - - - - - - - - - - - - - - - - - - - 18
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FC106
6
Timing Specifications - - - - - - - - - - - - - - - - - - - - 20
6.1 Transmit interface timing and latency - - - - - - - - - - - 20
6.2 Receive interface timing - - - - - - - - - - - - - - - - - 21
6.2.1 Receive clock timing and latency - - - - - - - - - - - 21
6.2.2 Receive interface timing - - - - - - - - - - - - - - - 23
6.3 Serial Input/output AC characteristics - - - - - - - - - - - 24
7
FC106 Pin Description - - - - - - - - - - - - - - - - - - - 25
7.1 Pin summary - - - - - - - - - - - - - - - - - - - - - - - 25
7.2 Pin functions - - - - - - - - - - - - - - - - - - - - - - - 26
8
Package Specifications - - - - - - - - - - - - - - - - - - - 29
8.1 FC106 64-pin PQFP pinout - - - - - - - - - - - - - - - - 29
8.2 FC106 64-pin Quad Flat-pack package dimensions - - - - 30
8.2.1 FC106/14: 14x14 mm package dimensions - - - - - - 30
8.2.2 FC106/10: 10x10 mm package dimensions - - - - - - 31
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FC106
1
General Description
The FC106 Fibre Channel transceiver chip implements the lower layer protocols of the ANSI
X3.230-1994 Fibre Channel standard. The Fibre Channel standard specifies the mapping of
various upper layer protocols (ULP) such as SCSI, IP and HiPPI to a common lower layer
protocol, together with appropriate electrical and optical high performance specifications.
Fibre Channel provides a channel over which concurrent communication of a variety of
ULP’s may exist on a single interconnect between workstations, mainframes and
supercomputers, and provides a connection to mass storage devices and other peripherals.
The FC106 implements the Fibre Channel electrical transceiver physical layer specification
for 1.0625 Gbit/s. At this frequency, the Fibre Channel delivers 100 MByte/s of data
bandwidth over a twin coaxial or twin optical fibre cable. This bandwidth equals or exceeds
most bus bandwidths. The FC106 chip performs the high speed serialization and
deserialization function that makes bus-bandwidth, serial communication possible. This chip
can drive electrical cables directly or it can interface with suitable optical modules. Figure 1.1
shows the different connections.
Figure 1.1
FC106 chip connections
1.0625 Gb/s
System 1
System 2
Serial Data over copper
or optical cables
REFCLK (2)
REFCLK (1)
FC106
Channel
Controller
I/O Bus
FC106
10 bits
Controll er
Fibre
10 bits
I/O Bus
Fibre
Channel
The parallel interface on the FC106 is compatible with the 10-Bit Interface Specification
(ANSI TR/X3.18-1998) which defines a common, standard signaling interface between the
Fibre Channel Physical and Protocol layers. In addition, the FC106 can be used for all other
proprietary serial links transmitting data as 10-bit encoded characters.
The FC106 incorporates an impedance adaptor circuit (set by the pins ZC+, ZC-) to ensure
high quality adaptation to the transmission line characteristic impedance.This feature is
optional and the user can keep external adaptation for compatibility reasons.
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FC106
The FC106 integrates a loop-back path for system-level test purposes. It also includes a
self-test capability in which random patterns are transmitted through the internal loop-back
path and compared after reception.
The FC106 is implemented in a standard digital 0.35µ CMOS process. Its typical power
consumption is 0.4 Watts (not including the power required to drive the TTL parallel output
port, which is in the 0.1 Watt range for output capacitive loads of 10 pF per pin).
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FC106
2
Interface Diagram
Figure 2.1
Interface diagram
TTTTT
T
C R MD D R A E
K S S I OS T N
Test
10
FC
Protocol
Device
TX[0:9]
transmitter
COM_DET
RBC[0:1]
2
RX[0:9]
10
FC106
receiver
REFCLK
[106.25 MHz]
EWRAP
EN_CDET
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FC106
3
Functional Description
The FC106 provides all required signals in the 10-Bit Interface Specification for Fibre
Channel. It also provides 10 pins for additional functions (these pins are marked in the
following by *). The additional functions are:
• impedance control (ZC+*, ZC-*)
• production test through JTAG (TCK(*)-TRSTN(*)-TMS (*)-TDI(*)-TDO (*)- TEST ENABLE (*))
• self-test of the chip (AT*)
• reset pin (RS) (but note that another reset is automatically generated in the chip during
power on).
In addition to implementing the Fibre Channel standard, the FC106 is adaptable through the
JTAG path to the transmission of any sequence of 10-bit encoded characters at rates varying
between 1 and 1.1 Gbaud.
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FC106
3.1
Block diagram
Figure 3.1
TCK(*)
TRSTN(*)
TMS(*)
Block diagram
SERIALIZER
JTAG
CONTROL
TDI(*)
TDO(*)
TEST ENABLE(*)
ENC
TX-
TX [0:9]
XOR
Tree
transmitter
TX+
8b/10b
encoder
ZC+(*)
DLL clock generator
ZC
setting
RCB[0:1]
ZC-(*)
Clock Recovery
AT (*)
RS (*)
REFCLK
Bit
Alignment
Word
Alignment
8b/10b
decoder
SELF
TEST
RXrece iver
RX+
ENC
DESERIALIZER
RX[0:9]
EN_CDET
3.2
COM_DET
(*)Test signals not
included in FCS
10-bit interface
EWRAP
Input latches
The transmitter accepts 10-bit wide TTL parallel data at inputs TX[0:9]. The user-provided
reference clock signal REFCLK is also used as the transmit byte clock. The TX[0:9] and
REFCLK signals must be properly aligned, as shown in Section 6.1: Transmit interface
timing and latency on page 20.
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FC106
3.3
8bit/10bit Encoder/Decoder
In normal operation mode, the FC106 accepts 10-bit pre-encoded data, and provides to the
application, 10-bit encoded data (as specified in the ANSI 10-bit Interface Specification).
In addition, the FC106 contains an 8b/10b encoder/decoder, which can be inserted into the
data flow. The selection of this mode is made through the JTAG path. In this mode, the
FC106 accepts and delivers bytes on 9 bits (8 bits of data on TX/RX[0:7] and 1 bit on TX/
RX[8] which is used to differentiate control characters). The timings of the parallel I/O ports
are identical in both modes: using the 8b/10b encoder/decoder increases the transmission
latency by 2 byte clock periods (equivalent to a 4 meter increase of the cable length).
3.4
DLL clock generator
The Delay Locked Loop (DLL) block generates the internal clocks. These are required by the
transmitter section to perform its function, and by the receiver block to generate the
reference clocks which are used to recover the serial data input frequency. These clocks are
based on the user supplied reference byte clock REFCLK. This clock is multiplied by 10 to
generate the required serial output data rate. No external components are required to
operate the DLL Clock Generator.
3.5
Serializer functional description and reference
clock
The FC106 serializer performs the serialization of 10-bit pre-encoded parallel data at
signaling rates up to 1.0625 Gb/s. System design is simplified by the integration into the chip
of a block performing clock multiplication from the parallel data clock.
It accepts 10-bit encoded parallel data words which are clocked into the device at 1/10 of the
signaling rate. For Fibre Channel use, data should be encoded for transmission using the
8B/10B block code described in the Fibre Channel specification. The FC106 serializes the
input data and transmits it at a signaling rate of 10 times the frequency of the REFCLK input.
The device includes a Delay-Locked-Loop based clock multiplier that generates the
1.0625 Gbaud clocks. This DLL is fully monolithic and requires no external components. Its
acquisition time, at power-up, is less than 16 microseconds.
The FC106 loads parallel data on the rising edge of REFCLK. The delay through the FC106
from loading the code-group to the transmission of the first bit of the code-group on the TX+,
TX- pair, is 17.4 ns with an extra 9.4 ns if the 8b10b encoding function is enabled.
A loop-back-mode signal EWRAP is provided allowing internal dynamic self-test of the chip.
When EWRAP is low, the output of the transmitter is sent to the TX+ and TX- output pins,
and the input of the receiver is driven by the signals entered through the RX+ and RX- pins.
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FC106
When EWRAP is high, the output of the transmitter is sent directly to the input of the
receiver.
3.6
Serializer latches and XOR-tree
The parallel data words TX[0:9] are individually sampled using the clocks provided by the
DLL Clock Generator. The outputs of these serializer latches are merged through an
Exclusive-OR tree, in order to generate the output data bit streams.
3.7
Serial input multiplexer
The Input Multiplexer supports the internal loopback of the high speed serial signal for test
purposes.
In normal operation, EWRAP is set low. The serial output data stream is placed at TX+/TXoutputs, and the serial data accepted at RX+/RX- is transmitted to the deserializer block.
When wrap-mode is activated by setting EWRAP high, the serial data generated by the
serializer block is internally wrapped to the input of the deserializer block.
3.8
Deserializer functional description
The FC106 deserializer operates at signaling rates up to 1.0625 Gb/s, as specified in the
Fibre Channel standard. It extracts the clock and retimes the data from the serial bit stream.
The serial bit stream should be encoded as 10-bit characters (for example the 8B/10B code
for Fibre Channel) which provide a transition density greater than 10%. The retimed serial bit
stream is converted into a 10-bit parallel output word. The FC106 has internal DLL based
clock recovery circuit which requires no external components.
When the DLL of the serializer clock multiplier is locked to the expected data rate (defined by
REFCLK), the retiming acquisition time (to lock to the incoming serial data stream) is less
than 3 microseconds.
The FC106 provides byte and data word alignment using a comma symbol recognition
mechanism.
The 7-bit comma symbol is defined in Fibre Channel specification as a [0:6]= 0011111. This
pattern is only contained within special characters known as K28.1, K28.5 and K28.7
defined specifically for synchronization by Fibre Channel.
Serial data is received on the RX+ and RX- pins. The DLL clock recovery circuit will lock to
the data stream if the clock to be recovered is within 0.01% of the expected data rate. For
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FC106
example, if the REFCLK used is 106.25 MHz, then the incoming data serial signaling rate
must be 1.0625 ± 0.0001 Gb/s.
The FC106 provides 2 TTL recovered clocks RBC[0] and RBC[1], which are both driven at a
frequency of one twentieth of the serial signaling rate. These clocks are generated by the
clock recovery DLL, which is phase locked to the serial data. RBC[1] is 180° out of phase
with RBC[0]. If serial data is not present, or does not meet the required transition density or
signaling rate, the RBC frequencies will be half of the expected recovered clock frequency
(defined by REFCLK). This function replaces the optional LCK_REF signal that is specified
in the Fibre Channel 10-bit interface. When no data is present, phase adjustments are
required for switching between a locking to incoming data and locking to REFCLK. The
specification on output clocks RBC[0:1] is maintained during these adjustments.The clock
periods are not truncated.
The serial data is retimed and deserialized. Parallel data is loaded into the output register,
and therefore accessible on the output data port. For Fibre Channel use, bytes 1 and 3 of the
receive data word will be accessible on the rising edge of RBC[0], and bytes 0 and 2 on the
rising edge of RBC[1].
Word synchronization is enabled in the FC106 by connecting the EN_CDET pin to V dd.
When EN_CDET is set high, the FC106 examines serial data for the presence of a positive
disparity comma symbol (0011111). Improper alignment occurs when a comma symbol
straddles a 10-bit boundary or is not aligned within the 10-bit transmission character. Proper
alignment is reached by shifting the boundary of the parallel output.
At power up the FC106 will not be in synchronization and data alignment is not established.
The COM_DET output signal is then set low. When a comma symbol is detected, COM_DET
is set high (if EN_CDET is already set high). COM_DET will go high only during a cycle in
which RBC[1] is rising (see Section 6.2.2: Receive interface timing on page 23 for precise
timing).
Note that if EN_CDET is set low, but a comma is detected while the input stream is already
word-aligned, COM_DET will be set high again.
3.9
Bit alignment
The alignment block aligns the incoming data bit stream and the reference clocks generated
by the DLL Clock Generator. It compensates for clock frequency dispersions between the
crystals generating the respective reference clocks REFCLK of the transmitting and
receiving chips.
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FC106
3.10 Byte and word alignment
The word alignment function is performed under control of the EN_CDET signal.
When EN_CDET is high, the word alignment function is operational. If an improperly aligned
comma is encountered, the internal data is shifted to realign the comma character at the
deserializer output (RX[0:9]). In this process, up to three characters prior to the comma
character may be corrupted.
3.11 Clock recovery
The clock recovery block generates the two receiver byte clocks RBC[0:1] at half the
frequency corresponding to the RX+/RX- byte data rate. These two byte clocks are 180° out
of phase with each other. They are alternatively used to clock the 10-bit parallel output data.
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FC106
3.12 Serial input-output buffer
Figure 3.2 shows a simplified schematic of the serial I/O.
Figure 3.2
Schematic diagram of serial I/O
Vdd
Vdd
Dout-
Dout+
V ss
Transmitting Chip
Vss
TX+
Rout
Rs
TXRs
See Section 3.13 for
configuration control
versus line impedance
0.01µF(optional)
0.01µF
Rc
Receiving Chip
1.5 KΩ
RX+
RX1.5 KΩ
Rin
1.5 KΩ
1.5 KΩ
TO DESERIALIZER
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FC106
3.13 I/O impedance control
The ZC block sets the internal RX+/RX- and the TX+/TX- matching impedance. Table 3.1
details the different settings.
Table 3.1
ZC block settings
ZC+
ZC-
ADD Rs ADD Rc
+/-1%
+/-1%
transmitter
LINE = 50Ω
External Rc
R > 1.5KΩ
Rs = 0Ω
Rc = 100Ω
Rout = 100Ω
Case 1: 50Ω line
Rs = 0Ω
OPEN OPEN 0 Ω
or Vdd or Vdd
100 Ω
OPEN 0 Ω
or Vdd
NONE
receiver
transmitter
LINE = 50Ω
Vss
No external Rc
Use internal Rc
R > 1.5KΩ
Rs = 0Ω
Rin = 100Ω
Rout = 100Ω
Case 2: 50Ω line
Rs = 0Ω
receiver
transmitter-
R > 1.5KΩ
Rs = 25Ω
Rc = 150Ω
Rout = 100Ω
Case 3: 75Ω line
LINE = 75Ω
External Rc
OPEN OPEN 25 Ω
or Vdd or Vdd
LINE = 75Ω
External Rc
OPEN Vss
or Vdd
150 Ω
receiver
Rs = 25Ω
transmitter
R > 1.5KΩ
Rs = 0Ω
Rc = 150Ω
Rout = 150Ω
Case 4: 75Ω line
Rs = 0Ω
0Ω
150 Ω
0Ω
NONE
receiver
transmitter
Rs = 0Ω
LINE = 75Ω
Vss
No external Rc
Use internal Rc
R > 1.5KΩ
Rs = 0Ω
Rin = 150Ω
Rout = 150Ω
Case 5: 75Ω line
Vss
receiver
Case 3 and 4 are identical applications: Case 3 allows better on board compatibility with other
FC parts that request 25Ω series resistors. Exact value of Rout and Rin are detailed in Section
5.3: DC characteristics on page 18.
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Revision 1.2
FC106
3.14 Self-test
The self-test block generates its own internal clock (the frequency of which can be digitally
tuned through the JTAG port), and pseudo-random patterns. This data is encoded,
serialized, deserialized (through the loop-back test path, or through an external connection
between TX+/TX- and RX+/RX-) and decoded. The recovered data is checked; the errors
and the number of transmitted bytes are internally counted. The contents of these counters
are accessible through the JTAG path. This block is activated by the AT signal.
In normal operation, AT is tied to Vdd and the self-test block is disabled.
During production tests, AT is forced to Vss, allowing full speed dynamic tests, even at wafer
level.
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FC106
4
Serial I/O Electrical Model
This simplified model is given for typical board simulation, within 15% precision. The
termination at the receiving end can be either internal or external, following Section 3.13.
Figure 4.1
Serial I/O electrical schematic diagram
Vdd
Vss
Tr = Tf = 0.2nS
Vdd
Tr
Tf
R1
1pF
1pF
V ss
Simplified serial
R1
transmitter model
Rout
Zc = 40 Ω
Td = 0.15nS
Simplified QFP64
Zc = 40Ω
Td = 0.15nS
package model
Your board and/or
cable/connector model
0.01µF(optional)
0.01µF(optional)
Rc
Zc = 60Ω
Td = 0.15nS
Zc = 60Ω
Td = 0.15nS
0.5pF
Simplified QFP64
package model
0.5pF
Simplified serial
Rin
receiver model
1.5KΩ
1.5KΩ
1.5KΩ 1.5KΩ
TO DESERIALIZER
50Ω CONFIGURATI ON
75Ω CONFIGURA TION
PARAMETER VALUES
R1
100Ω
150Ω
FOR TYPICAL
Rout
200Ω
300Ω
SIMULATIO N
Rc
100Ω if external termination
150Ω if external termination
Rin
100Ω if internal termination
150Ω if internal termination
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FC106
5
Electrical Specifications
5.1
Absolute maximum ratings
Table 5.1
Absolute maximum ratings
Symbol
Parameter
Units
Min
Max
Vdd
Supply Voltage
V
0
4
V
Serial signal input low level
V
-0.5
Serial signal input high level
V
Vdd+0.5
ZC+, ZC-
V
Vdd+0.5
TTL input signals
V
5.5
Maximum assembly temperature (for
10 seconds maximum)
°C
260
Storage temperature
°C
V
INL
INH
T°C
MAX
-65
150
Note
Stresses greater those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not guaranteed. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. During
overload conditions ( VIN>Vdd or VIN<V ss) the voltage on pins with respect to ground
(Vss) must not exceed the values defined by the Absolute Maximum Ratings.
5.2
Operating conditions
Table 5.2
Operating conditions
Symbol
Parameter
Units
Min
Typ
Max
Vdd
Supply Voltage
V
3.0
3.3
3.6
Supply Ripple (DC to 3 GHz)
mV
T
A
Ambient temperature
°C
IDD
Supply current @ 25°C, 3.3 volts
mA
with parallel outputs loaded by 10pF
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Revision 1.2
100
0
25
150
70
FC106
5.3
DC characteristics
The following values apply to the analog signals TX+, TX-, RX+ and RXTable 5.3
DC characteristics for TX+, TX-, RX+ and RX-
Symbol
Parameter
Units
Min.
Typ
Max.
V
OLS50
Serial output low level, terminated differentially by an external 100 Ω resistor
( Zc+ = Zc- = “open” )
V
0.90
1.05
1.20
V
OHS50
Serial output high level, terminated differen- V
tially by an external 100 Ω resistor
( Zc+ = Zc- = “open” )
1.50
1.80
2.10
V
OLS75
Serial output low level, terminated differentially by an external 150 Ω resistor
( Zc+ = “open” - Zc- = “Vss” )
V
0.90
1.05
1.20
V
OHS75
Serial output high level, terminated differen- V
tially by an external 150 Ω resistor
( Zc+ = “open” - Zc- = “Vss” )
1.50
1.80
2.10
V
OD50
Serial output peak-to-peak differential voltage, terminated differentially by an external
100 Ω resistor ( Zc+ = Zc- = “open” )
V
1.20
1.50
1.80
V
OD75
Serial output peak-to-peak differential voltage, terminated differentially by an external
150 Ω resistor ( Zc+ =”open” - Zc- = “Vss” )
V
1.20
1.50
1.80
ROUT50
Internal differential output impedance. When Ω
50Ω line ( Zc+ = Zc- = “open” )
77
100
169
ROUT75
Internal differential output impedance. When Ω
75Ω line ( Zc+ =”open” - Zc- = “Vss” )
116
150
255
RIN50
Internal differential input impedance. When
enabled for 50Ω line ( Zc+ = Vss / Zc- =
“open” )
Ω
59
100
183
RIN75
Internal differential output impedance. When Ω
enabled for 75Ω line ( Zc+ = Zc- = Vss )
95
150
265
V
Serial input peak-to-peak differential voltage V
on RX+ and RX-
0.2
-
-
ISWS
Note
Values above are given with normal Zc setting. In accordance with Section 3.13, it
is still possible to stay with 50 Ω internal control and connect the part to 75 Ω
impedance line by adding 25 Ω series resistances.
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FC106
The following values apply to the logic signals.
Table 5.4
DC characteristics for logic signals
Symbol
Parameter
Conditions
Units
Min.
Typ
Max
V
Input “low” voltage level
Vdd=3.3V
V
-
-
0.8
Input “high” voltage level
Vdd=3.3V
V
2.0
-
5.5
Low level output voltage
Vdd=3.3V
V
V
IL
IH
VOL
0.4
Iol = 3mA
VOH
High level output voltage
Vdd=3.3V
V
2.4
Ioh = 3mA
I
IL
Input low current
Vdd=max
µA
125
µA
125
Vin=GND
I
IH
Input high current
Vdd=max
Vin=Vdd
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FC106
6
Timing Specifications
All AC measurements are made from the reference voltage level of the clock (1.4 volts), to
the valid input or output data levels.
6.1
Transmit interface timing and latency
Figure 6.1
Transmit interface timing and latency
REFCLK
1.4V
Tref
2.0V
VALID
DATA 1
TX[0:9]
VALID
DATA 2
VALID
DATA 3
1.4V
0.8V
Tsu_tx
bit 0 of parallel input (TX0 of DATA 1)
Th_tx
TX+
TELA
Table 6.1
Transmit interface timing characteristics
Parameter Description
Min
Typ
Fref=1/Tref
Reference clock frequency
100
106.25 110
MHz
F
Frequency tolerance (dispersion between
REFCLK of transmitter and receiver chips)
REFCLK Clock Rise Time (0.8 to 2V)
100
-
+ 100
ppm
0.6
-
2.4
nS
REFCLK Clock Fall Time (0.8 to 2V)
0.6
-
2.4
nS
REFCLK Jitter
REFCLK duty Cycle
Data set-up to a rising edge of REFCLK
Data hold after a rising edge of REFCLK
Parallel data rise and fall time (10 pF load)
Data Emission Latency (delay from the initial
10-bit word load to the serial transmission of bit 0)
40
0
1.5
0.6
-
-
40
60
3
1 REFCLK
cycle + 8 ns
pS
%
ns
ns
ns
tol
T
r
T
f
CLKJIT
DT
Tsu_tx
Th_tx
TX-Tr,Tf
TELA
20/32
September 98
Revision 1.2
Max
Units
FC106
6.2
Receive interface timing
6.2.1 Receive clock timing and latency
Figure 6.2
Receive clock timing
bit 0 of serial
data
TX+
Trbc1
1.4V
RBC[1]
Trbc_skew
RBC[0]
1.4V
Trbc0
Table 6.2
Receive clock timing characteristics
Parameter
Description
Min
Typ
Max
Units
Trbc0
RBC[0] frequency1
53.125
MHz
Trbc1
RBC[1] frequency1
53.125
MHz
Trbc_skew
RBC skew
8.9
-
9.9
ns
RBC[0,1] Tr, Tf
Receive clock rise and fall time
(10pF load)
-
2.5
-
ns
1. Exact frequency of RBC(0,1) depends upon the received data frequency. During byte alignment, the frequency of clocks RBC[0] and RBC[1] may vary by less than 1% of the specified
typical value. The clocks are guaranteed to be glitch free.
21/32
September 98
Revision 1.2
FC106
Figure 6.3
Receive clock latency
bit 0 of serial
data 1
TX+
RBC[1]
RBC[0]
RX[0:9]
DATA 1
TRLA
Table 6.3
Receive clock latency characteristics
Parameter
Description
Min
Typ
Max
Units
TRLA
Data Reception Latency: Serial (first bit at
receiver) to 10-bit parallel output sampled by
RBC[0,1].
-
-
5 RBC
ns
cycles
+ 4 ns
22/32
September 98
Revision 1.2
FC106
6.2.2 Receive interface timing
Figure 6.4
Receive interface timing
RBC[0]
1.4V
RBC[1]
1.4V
Tsu_rx0
Th_rx1
2.0V
COMMA
CHARACTER
RX[0:9]
VALID
DATA
0.8V
Tsu_rx1
Th_rx0
2.0V
COM_DET
0.8V
Tsu_com
Table 6.4
Th_com
Receive interface characteristics
Parameter
Description
Min
Typ
Max
Units
Tsu_rx1
Data valid before a rising edge of RBC[1]
3
-
-
ns
Th_rx1
Data valid after a rising edge of RBC[1]
1.5
-
-
ns
Tsu_rx0
Data valid before a rising edge of RBC[0]
3
-
-
ns
Th_rx0
Data valid after a rising edge of RBC[0]
1.5
-
-
ns
Tsu_com
Signal COM_DET valid before a rising edge of
RBC[1]
3
-
-
ns
23/32
September 98
Revision 1.2
FC106
Parameter
Description
Min
Typ
Max
Units
Th_com
Signal COM_DET valid after a rising edge of
RBC[1]
1.5
-
-
ns
COM_DET Tr, Tf
RX[0:9]
COM_DET rise and fall time (10pF load)
RX(n) rise and fall time (10pF load)
6.3
2.5
2.5
Serial Input/output AC characteristics
Table 6.5
Serial I/O AC characteristics
Parameter
Description
t
Serial output rise time, terminated by the FC106 receiver (20%-80%)
Serial output fall time, terminated by the FC106 receiver (20%-80%)
Differential skew between TX+ and TX-,
terminated by the FC106 receiver
t
t
ns
ns
RS
FS
SK
Min
24/32
September 98
Revision 1.2
Typ
Max
Units
200
-
ps
200
-
ps
-
25
ps
FC106
7
FC106 Pin Description
7.1
Pin summary
Table 7.1
Pin summary
Pin
Level
Description
AT*
CMOS
This signal places the chip in a self-test mode when tied low. It should be
tied to Vdd in any other state of the chip, as specified in the 10-Bit Interface
Specification standard.
COM_DET
CMOS
COM_DET is an indication that the data byte (byte 0 of word 0) associated
with the current RBC[1] contains a valid comma symbol.
EN_CDET
CMOS
EN_CDET enables the chip to perform the byte alignment function on
comma symbols. When EN_CDET is high, the byte alignment function is
operational.
When EN_CDET is low, the current byte alignment is maintained.
EWRAP
CMOS
RBC[0]
CMOS
EWRAP causes the chip to internally loop serialized transmit data to the
deserializer. EWRAP is active on high level.
RBC[0] is the 53.125 MHz receive byte clock that the protocol device will
use to register the bytes 1 and 3 of the received data word. This clock may
be stretched during byte alignment (never slivered or truncated).
RBC[1]
CMOS
REFCLK
CMOS
RX+, RX-
Special
RX[0:9]
CMOS
RX[0:9] is the 10-bit parallel received data presented by the chip to the
upper layer for further processing. The received data byte 0 containing the
comma symbol will be byte aligned to RBC[1], i.e. byte 0 is in phase with
RBC[1]. The order of reception on the serial input is RX[0] first, followed by
RX[1] through to RX[9].
TCK*,
TRSTN*,
TMS*, TDI*,
TDO*
TEST
ENABLE*
CMOS
These signals are compliant to the JTAG specification.
CMOS
Used during ATPG test, connected at Vss in normal operation.
TX+, TX-
Special
TX+ and TX- are the differential outputs for serialized data on the
transmitter.
RBC[1] is the 53.125 MHz receive byte clock that the protocol device will
use to register the bytes 0 and 2 of the received data word. RBC[1] is 180°
out of phase with RBC[0]. This clock may be stretched during byte alignment (never slivered or truncated).
REFCLK is the 106.25 MHz reference clock. The frequency tolerance for
this clock should meet ANSI X3.230-1994 Fibre Channel FC-PH specifications for a Fibre Channel use. See Section 6.1:Transmit interface timing
and latency on page 20.
RX+ and RX- are the differential inputs for serialized data on the receiver.
25/32
September 98
Revision 1.2
FC106
Pin
Level
Description
TX[0:9]
CMOS
ZC+1, ZC-*
CMOS
TX[0:9] is the 10-bit parallel transmit data presented to the chip for serialization and transmission onto the media. The order of transmission is TX[0]
through to TX[9].
These pins are used to control the input and output impedance in accordance with the configuration outlined in Section 3.13:I/O impedance control on page 14.
1. indicates signals that are not included in the Fibre Channel 10-Bit Interface Specification.
7.2
Pin functions
Table 7.2
Pin functions
Pin Name
Pin #
I/O
pull up/
Description in standard running conditions
down
Vss
1
-
-
Ground Pin
TX[0]
2
I
pd
Bit 0 of parallel transmit data (first bit sent)
TX[1]
3
I
pd
Bit 1 of parallel transmit data
TX[2]
4
I
pd
Bit 2 of parallel transmit data
Vdd
5
-
-
Power Pin
TX[3]
6
I
pd
Bit 3 of parallel transmit data
TX[4]
7
I
pd
Bit 4 of parallel transmit data
TX[5]
8
I
pd
Bit 5 of parallel transmit data
TX[6]
Vdd
9
10
I
-
pd
-
Bit 6 of parallel transmit data
Power Pin
TX[7]
11
I
pd
Bit 7 of parallel transmit data
TX[8]
TX[9]
12
13
I
I
pd
pd
Bit 8 of parallel transmit data
Bit 9 of parallel transmit data (last bit sent)
Vss
14
-
-
Ground Pin
Vss/RS
15
(I)
pd
Must be tied to GND during normal operation.
External
During power up, an internal circuit will
reset
automatically reset the chip. Nevertheless RS
allows a forced reset (when high), during normal
operation.
NC/TDI
16
(I)
pd
Not connected
NC/TCK
17
(I)
pd
Not connected
26/32
September 98
Revision 1.2
TEST
pins
JTAG
scan in
Test clock
pin for
JTAG
FC106
Pin Name
Pin #
I/O
pull up/
Description in standard running conditions
down
TEST
pins
Vdd/TRSTN
18
(I)
pu
Must be tied to Vdd.
Reset pin
for JTAG
EWRAP
19
I
pd
When tied to Vdd, causes the chip to internally
loop serialized transmit data to the deserializer.
Vdd/TMS
20
(I)
pu
Must be tied to Vdd.
Vss
21
-
-
Ground Pin
REFCLK
22
I
pd
Reference clock frequency 106.25 MHz
Vdd
23
I
-
Power Pin
EN_CDET
24
I
pu
Enables the chip to perform the byte alignment
function when HIGH.
TEST
ENABLE
25
I
pd
Must be tied to GND.
Tie to Vdd
for AT PG
NC/TDO
26
(O)
-
Not connected
JTAG scan
out
NC
Vdd/AT
27
28
(I)
pu
Not connected
Must be tied to Vdd.
Vdd
29
-
RBC[1]
30
O
-
Receive byte clock used by the protocol to
register byte 0 and 2 of the receive parallel data.
RBC[0]
31
O
-
Vss
32
-
-
Receive byte clock used by the protocol to
register byte 1 and 3 of the receive parallel data.
Ground Pin
Vss
33
-
-
Ground Pin
RX[9]
RX[8]
34
35
O
O
-
Bit 9 of parallel receive data (last bit received)
Bit 8 of parallel receive data
RX[7]
36
O
-
Bit 7 of parallel receive data
Vdd
37
-
-
Power Pin
RX[6]
38
O
-
Bit 6 of parallel receive data
RX[5]
39
O
-
Bit 5 of parallel receive data
RX[4]
40
O
-
Bit 4 of parallel receive data
RX[3]
Vdd
41
42
O
-
-
Bit 3 of parallel receive data
Power Pin
Power Pin
27/32
September 98
Revision 1.2
Test mode
select for
JTAG
Places the
chip in
auto test
mode
when
LOW.
FC106
Pin Name
Pin #
I/O
pull up/
Description in standard running conditions
down
RX[2]
43
O
-
Bit 2 of parallel receive data
RX[1]
44
O
-
Bit 1 of parallel receive data
RX[0]
Vss
45
46
O
-
-
Bit 0 of parallel receive data (first bit received).
Ground Pin
COM_DET
47
O
-
ZC-
48
1
pu
Goes high when detecting a comma symbol.
Data byte associated with RBC[1] contains valid
comma symbol.
Used for impedance adaptation (see
Section 3.13)
ZC+
49
1
pu
Used for impedance adaptation (see
Section 3.13)
Vdd
50
-
-
Power Pin
Vss
51
-
-
Ground Pin
RX-
52
I
-
Vdd
53
-
-
One of the differential inputs for serialized data
on the receiver. Serial input frequency must be
1.0625 ± 0.0001 Gb/s.
Power Pin
RX+
54
I
-
Vdd
55
-
-
One of the differential inputs for serialized data
on the receiver. Serial input frequency must be
1.0625 ± 0.0001 Gb/s.
Power Pin
Vss
56
-
-
Ground Pin
Vdd
57
-
-
Power Pin
Vss
58
-
-
Ground Pin
Vdd
59
-
-
Power Pin
Vdd
60
-
-
Power Pin
TX-
61
O
-
One of the differential outputs for serialized data
on the transmitter. Serial output rate depends on
REFCLK.
TX+
62
O
-
Vdd
63
-
-
One of the differential outputs for serialized data
on the transmitter. Serial output rate depends on
REFCLK.
Power Pin
NC
64
-
-
Not connected
28/32
September 98
Revision 1.2
TEST
pins
FC106
8
Package Specifications
The FC106 is available in two sizes of 64-pin plastic quad flat-pack: the FC106/14 measures
14x14 mm and the FC106/10 measures 10x10 mm.
FC106 64-pin PQFP pinout
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
ZC+
Vdd
Vss
RX-
Vdd
RX+
Vdd
Vss
Vdd
Vss
Vdd
Vdd
TX-
TX+
Vdd
Pinout for 64-pin PQFP (both 14x14 mm and 10x10 mm sizes)
NC
Figure 8.1
49
1
48
ZC-
TX0
2
47
COM_DET
TX1
3
46
Vss
TX2
4
45
RX0
Vdd
5
44
RX1
TX3
6
43
RX2
TX4
7
42
Vdd
TX5
8
41
RX3
TX6
9
40
RX4
Vdd
10
39
RX5
TX7
11
38
RX6
TX8
12
37
Vdd
TX9
13
36
RX7
Vss
14
35
RX8
34
RX9
33
Vss
29/32
September 98
Revision 1.2
28
29
30
31
32
RBC[1]
RBC[0]
Vss
AT (for testing purposes)
27
Vdd
Vss
26
Vdd
25
NC
24
NC
TEST
ENABLE
23
EN_CDET
22
REFCLK
21
Vss
20
Vdd
19
Vdd
TMS
18
EWRAP
TRSTN
17
16 TDI
TDO
JTAG PINS
RS (test mode)
NC+
NC
15
TCK
Vss
FC 106
Vss
Vdd
8.1
FC106
8.2
FC106 64-pin Quad Flat-pack package dimensions
8.2.1 FC106/14: 14x14 mm package dimensions
Figure 8.2
Data for 64-pin 14x14 mm PQFP
mm
inch
PQFP64
DIM
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
Body: 14 x 14 x 2.0 mm
A
A1
-
-
2.35
0.25
-
-
0.093
0.010
Footprint: 3.20 mm
A2
b
1.95
0.30
2.00
0.35
2.10
0.40
0.077
0.012
0.079
0.014
0.083
0.016
c
-
-
0.17
-
-
0.067
D
16.95
17.20
17.45
0.667
0.677
0.687
D1
D2
13.90
-
14.00
12.00
14.10
-
0.547
-
0.551
0.472
0.555
-
e
E
16.95
0.80
17.20
17.45
0.667
0.031
0.677
0.687
E1
13.90
14.00
14.10
0.547
0.550
0.555
E2
-
12.00
-
-
0.472
-
0.031
0.035
0.041
θ
Thermal resistance = 45°C/W (still air)
0°-7°
L
0.78
0.88
1.03
DD
D1
D1
A
A
D2
D3
A1
A1
48
48
49
49
33
33
32
32
0.10mm
0.1mm
Seating Plane
SeatingPlane
b
E1
E
E2
E1
E3
B
B
b
E
17
17
64
64
11
16
16
c
C
L
L
L1
ee
θ
K
PQFP64
PQFP64
30/32
September 98
Revision 1.2
A2
A2
FC106
8.2.2 FC106/10: 10x10 mm package dimensions
Figure 8.3
Data for 64-pin 10x10 mm PQFP
mm
inch
PQFP64
DIM
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
-
-
2.45
-
-
0.097
A1
0.25
-
0.50
0.010
-
0.020
A2
b
1.95
0.17
2.00
0.22
2.10
0.27
0.077
0.007
0.079
0.009
0.083
0.011
c
D
12.95
13.20
0.17
13.45
0.510
0.520
0.067
0.530
D1
9.90
10.00
10.10
0.390
0.394
0.398
D2
-
7.50
-
-
0.295
-
e
E
12.95
0.50
13.20
13.45
0.510
0.020
0.520
0.530
E1
E2
9.90
-
10.00
7.50
10.10
-
0.390
-
0.394
0.295
0.398
-
0.035
0.041
θ
Body: 10 x 10 x 2.0 mm
Footprint: 3.20mm
Thermal resistance = 45°C/W (still air)
0°-7°
L
0.78
0.88
1.03
0.031
DD
D1
D1
A
A
D2
D3
A1
A1
48
48
49
49
33
33
32
32
0.10mm
0.1mm
Seating Plane
SeatingPlane
b
E1
E
E2
E1
E3
B
B
b
E
17
17
64
64
11
16
16
c
C
L
L
L1
ee
θ
K
PQFP64
PQFP64
31/32
September 98
Revision 1.2
A2
A2
FC106
Information furnished is belived to be accurate and reliable. However, STMicroelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication
supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use
as critical components in life support devices or systems without express written approval of STMicroelectronics. This
circuit uses patents licensed by BULL S.A..
The ST logo is a trademark of STMicroelectronics.
 1998 STMicroelectronics - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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32/32
September 98
Document Number 42 1686
Revision 1.2
32