AGILENT HDMP-2634

Agilent HDMP-2634
2.5/1.25 GBd Serdes Circuit
Data Sheet
Description
This data sheet describes the
HDMP-2634 Serdes device for
2.5 GBd serial data rates.
The HDMP-2634 Serdes is a silicon
bipolar integrated circuit in a metallized QFP package. It provides a
low-cost physical layer solution for
2.5 GBd serial link interfaces including a complete Serialize/Deserialize
(Serdes) function with transmit and
receive sections in a single device.
The HDMP-2634 is also capable of
operating on 1.25 GBd serial links.
Input pins TX_RATE and RX_RATE
select the data rates on the transmit
and receive sides, respectively.
As shown in Figure 1, the transmitter section accepts 10-bit wide parallel SSTL_2 data (TX[0:9]) and a
125 MHz SSTL_2 byte clock (TBC)
and serializes them into a highspeed serial stream. The parallel
data is expected to be “8B/10B”
encoded data or equivalent. At the
source, TX[0:9] and TBC switch
synchronously with respect to a 125
MHz clock internal to the sender.
New data are emitted on both edges
of TBC; this is called Double Data
Rate (DDR). The HDMP-2634 finds
a sampling window between the
two edges of TBC to latch TX[0:9]
data into the input register of the
transmitter section when
TX_RATE=1. If TX_RATE=0, the
user must ensure no data transitions on the falling edge of TBC
and this edge is used to latch in
parallel data resulting in a 1.25
GBd serial stream.
The transmitter section’s PLL
locks to the 125 MHz TBC. This
clock is then multiplied by 20 to
generate the 2500 MHz serial
clock for the high-speed serial
outputs. The high-speed outputs
are capable of interfacing directly
to copper cables or PCB traces
for electrical transmission or to
a separate fiber optic module
for optical transmission. The
high-speed outputs include usercontrollable skin-loss equalization
to improve performance when
driving copper lines.
The receiver section accepts a
serial electrical data stream at
1.25 or 2.5 GBd and recovers
10-bit wide parallel data. The
receiver PLL locks onto the incoming serial signal and recovers the
Features
• 10-bit wide parallel Tx, Rx busses
• 125 MHz TBC and RBC[0:1]
• Option to set Tx and Rx serial
data rates separately
• Parallel data I/O, clocks and
control compatible with SSTL_2
• Differential PECL or LVTTL REFCLK
at 125 MHz
• Double data rate transfers
• Source synchronous clocking of
transmit data
• Source centered or source
synchronous clocking of
receive data
• Dual or single receive byte
clocks
• Parallel loopback mode
• Differential BLL serial I/O with
on-chip source termination
• 14 mm, 64-pin MQFP package
• Single +3.3 V power supply
Applications
• Gigabit ethernet channel
aggregation trunks
• Fast serial backplanes
• Clusters
Ordering Information
Part Number
Parallel I/O
HDMP-2634
SSTL_2
high-speed incoming clock and
data. The serial data is converted
back into 10-bit parallel data,
optionally recognizing the first
seven bits of the K28.5+ comma
character to establish byte alignment. If K28.5+ detection is enabled, the receiver section is able
to detect comma characters at
1.25 GBd or 2.5 GBd depending
on the value of the RX_RATE pin.
The recovered parallel data is
presented at SSTL_2 compatible
outputs RX[0:9], along with a
pair of 125 MHz SSTL_2 clocks,
RBC[0] and RBC[1], that are 180
degrees out of phase from one
another and which represent the
remote clock. Rising edges of
RBC[0] and RBC[1] may be used
to latch RX[0:9] data at the destination. Alternatively, both edges
of either RBC[1] or RBC[0] may
be used to latch Rx data (DDR).
The preceding applies when
RX_RATE=1 and RBC_SYNC=0.
For short distances, there may be
a need to have ASICs communicate directly using parallel Tx and
Rx lines without the serdes intermediary. To enable this, the Tx
and Rx parallel timing schemes
must be symmetrical. When
RBC_SYNC=1 and RX_RATE=1
such symmetry is obtained. In
this mode, the RX[0:9] lines
switch simultaneously with the
rising and falling edges of
RBC[1] or RBC[0] just as the
TX[0:9] lines switch simultaneously with TBC.
If RX_RATE=0 and RBC_SYNC=1
then the RX[0:9] lines switch
with the rising edges of RBC[1]
just as the TX[0:9] lines switch
with the rising edges of TBC. If
RBC_SYNC=0 then RX[0:9] data
may be latched on the rising
edges of RBC[1] and RBC[0]. In
this latter mode, the RBC[0:1]
clocks operate at a 62.5 MHz rate.
2
In summary, by setting
RBC_SYNC=0 the timing of
transmit and receive parallel data
with respect to TBC and
RBC[0:1] may be arranged so
that the upstream protocol device
can generate and latch data very
simply. This is the source centered mode of operation (case A
and C in Table 1, page 8). Alternatively, setting RBC_SYNC=1
provides for timing symmetry
between Tx and Rx parallel lines
at both 1.25 GBd and 2.5 GBd
rates. This is the source synchronous mode of opertion (case B
and D in Table 1, page 8).
Note when EN_CDET=1, the first
transition of byte 0 of a comma
will either coincide with the rising
edge of RBC[1] or precede it.
This applies regardless of the
RX_RATE setting.
Table 1 summarizes the behavior
of the Rx parallel section under
all values of RX_RATE and
RBC_SYNC. For test purposes,
the transceiver provides for
on-chip parallel to parallel local
loopback functionality controlled
through the EWRAP pin. Additionally, the byte alignment feature via detection of the first
seven bits of the K28.5+ character may be disabled. This may be
useful in proprietary applications
which use alternative methods to
align the parallel data.
characters for link management
purposes. Other encoding
schemes will also work as long as
they provide DC balance and a
sufficient number of transitions.
The HDMP-2634 incorporates the
following:
• SSTL_2 Parallel I/O
• High Speed Phase Locked
Loops
• Parallel to Serial Converter
• High Speed Serial Clock and
Data Recovery Circuitry
• Comma Character Recognition
per Fibre Channel
Specifications
• Byte Alignment Circuitry
• Serial to Parallel Converter
INPUT LATCH
The transmitter accepts 10-bit
wide single ended SSTL_2
parallel data at inputs TX[0:9].
The SSTL_2 TBC clock provided
by the sender of the transmit data
is used as the transmit byte clock.
The TX[0:9] and TBC signals
must be properly aligned as
shown in Figure 3. If
TX_RATE=1, TX[0:9] data are
latched between both edges of
TBC. If TX_RATE=0, TX[0:9]
data are latched on the falling
edge of TBC. The TX[0:9] and
TBC inputs are unterminated
SSTL_2 inputs per section 4.1 of
the SSTL_2 standard (Figure 11).
TX PLL/CLOCK GENERATOR
The HDMP-2634 accepts either a
differential PECL or a LVTTL
reference clock input at 125 MHz.
HDMP-2634 Block Diagram
The HDMP-2634 (Figure 2) is
designed to transmit and receive
10-bit wide parallel data over
high-speed serial communication
lines. The parallel data applied to
the transmitter is expected to be
encoded per the 8B/10B encoding scheme with special reserved
The Transmitter Phase Locked
Loop and Clock Generator block
is responsible for generating all
internal clocks needed by the
transmitter section to perform its
functions. These clocks are based
on the supplied transmit byte
clock (TBC). Incoming data must
be synchronous with TBC
(Figures 3a-3b). Use of TBC to
determine sampling points to
latch data obviates the need for
PLLs in the data source.
HDMP-2634
TRANSMITTER SECTION
TX_RATE
TBC
TX[0:9]
SO ±
PLL
ASIC
EWRAP
RBC[0:1]
PLL
RX[0:9]
SI ±
COM_DET
RX_RATE
REF_RATE
RBC_SYNC
RECEIVER SECTION
REFCLK[0:1]
EN_CDET
TX[0:9]
INPUT
LATCH
Figure 1. Typical application using HDMP-2634.
FRAME
MUX
OUTPUT
SELECT
SO ±
EWRAP
TBC
TXCAP0
TXCAP1
RXCAP0
RXCAP1
TX PLL
CLOCK
GENERATOR
INPUT
SELECT
TX CLOCKS
SI ±
REFCLK[0:1]
RX PLL
CLOCK
RECOVERY
TX_RATE
RX_RATE
RBC[0:1]
RX[0:9]
OUTPUT
DRIVER
RX CLOCKS
FRAME
DEMUX
AND
BYTE SYNC
COM_DET
Figure 2. Block diagram of HDMP-2634.
3
EN_CDET
INPUT
SAMPLER
REF_RATE
RBC_SYNC
FRAME MUX
RX PLL/CLOCK RECOVERY
The FRAME MUX accepts 10-bit
wide parallel data from the
INPUT LATCH. Using internally
generated high-speed clocks, this
parallel data is multiplexed into a
2.5 GBd serial data stream. The
data bits are transmitted sequentially from TX[0] to TX[9]. The
leftmost bit of K28.5+ is on
TX[0].
The Receiver Phase Locked Loop
and Clock Recovery block is responsible for frequency and
phase locking onto the incoming
serial data stream and recovering
the bit and byte clocks. An automatic locking feature allows the
Rx PLL to lock onto the input
data stream without external PLL
training controls. It does this by
continually frequency locking
onto the 125 MHz reference
clock, and then phase locking
onto the selected input data
stream. An internal signal detection circuit monitors the presence
of the input and invokes the
phase detection as the data
stream appears. Once bit locked,
the receiver generates the highspeed sampling clock for the
input sampler.
block to select the proper parallel
data edge out of the bit stream so
that the next comma character
starts at RX[0]. When a comma
character is detected and realignment of the receive byte clock
RBC[0:1] is necessary, these
clocks are stretched (never slivered) to the next correct alignment position. RBC[0:1] will be
aligned by the start of the next
ordered set (two-byte group)
after K28.5+ is detected. The
start of the next ordered set will
be aligned with the rising edge of
RBC[1], independent of the
RX_RATE pin setting. Per the
Fibre Channel encoding scheme,
comma characters must not be
transmitted in consecutive bytes
so that the receive byte clocks
may maintain their proper recovered frequencies.
INPUT SAMPLER
OUTPUT DRIVERS
The INPUT SAMPLER is responsible for converting the serial
input signal into a retimed bit
stream. To accomplish this, it
uses the high-speed serial clock
generated from the RX PLL/
CLOCK RECOVERY block. This
serial bit stream is sent to the
FRAME DEMUX AND BYTE
SYNC block.
The OUTPUT DRIVERS present
the 10-bit parallel recovered data
(RX[0:9]) properly aligned to the
receive byte clock (RBC[0:1]) as
shown in Figures 5a-5d and
Table 1. These output drivers
provide single ended SSTL_2
compatible signals.
OUTPUT SELECT
The OUTPUT SELECT block
picks the serial data to drive on
to the serial output line. In
normal operation, the serialized
TX[0:9] data is placed at SO± . In
parallel loopback (EWRAP=1)
mode, the SO± pins are held
static at logic 1 and the internal
serial output signal going to the
INPUT SELECT block of the
receiver section is used to generate RX[0:9]. In addition, the
OUTPUT SELECT block allows
the user to control the amount of
pre-emphasis used on the SO±
pins. If pre-emphasis is used,
0→1 and 1→0 transitions on
SO± have greater amplitude than
0→0 and 1→1 transitions. This
increased amplitude is used to
offset the effects of skin loss and
dispersion on long PCB transmission lines. Pre-emphasis is controlled by the EQAMP pin (Table
2 and Figure 9).
INPUT SELECT
The INPUT SELECT block picks
the serial data that will be
parallelized to drive RX[0:9]. In
normal operation, serial data is
accepted at SI± . In parallel
loopback (EWRAP=1) mode, the
internal serial output signal from
the OUTPUT SELECT block of
the transmitter section is used to
generate RX[0:9].
4
FRAME DEMUX AND BYTE SYNC
The FRAME DEMUX AND BYTE
SYNC block is responsible for
restoring the 10-bit parallel data
from the high-speed serial bit
stream. This block is also
responsible for recognizing the
first seven bits of the K28.5+
positive disparity comma character (0011111xxx). When recognized, the FRAME DEMUX AND
BYTE SYNC block works with the
RX PLL/CLOCK RECOVERY
RECEIVER LOSS OF SIGNAL
The RECEIVER LOSS OF SIGNAL
block examines the peak-to-peak
differential amplitude at the SI±
input. When this amplitude is too
small, RX_LOS is set to 1, and
RX[0:9] are set to logic one
(1111111111). This prevents
generation of random data at
the RX[0:9] pins when the serial
input lines are disconnected.
When the signal at SI± is a valid
amplitude, RX_LOS is set to
logic 0, and the output of the
INPUT SELECT block is passed
through.
SSTL_2 COMPATIBILITY
The HDMP-2634 works with protocol (FC-1 or MAC) devices
whose VDDQ voltage is nominally
2.5 V. Note that the HDMP-2634
works with a single VCC supply of
3.3 V. Nonetheless, RX[0:9] and
RBC[0:1] generate output voltages that are compatible with
section 4.1 of the SSTL_2 standard and are not meant to be
terminated in 50 Ω. In addition,
the HDMP-2634 provides a
VREFR output pin which may be
used at the protocol IC in order
to differentially detect a high or a
low on RX[0:9]. Alternatively,
this voltage may be generated on
the PCB using a resistor divider
from VDDQ or V CC while ignoring
the VREFR output of the HDMP2634. The HDMP-2634 expects
SSTL_2 compatible signals at the
TX[0:9] and TBC pins. These
pins are unterminated per section
4.1 of the SSTL_2 standard
(Figure 11). The VREFT input
pin is used by the HDMP-2634 to
differentially detect a high or low
on TBC and TX[0:9]. VREFT may
be generated by the protocol
device or on the PCB using a
resistor divider from VDDQ or
VCC.
MULTI-RATE OPERATION
The HDMP-2630/2631 provide
hooks for initializing multi-rate
links. A possible algorithm operates as follows. In a point to point
link, each node sets its TX_RATE
input pin high to transmit at the
highest possible data rate. At the
same time, each node tries different values of RX_RATE to see at
which data rate intelligible data is
received. Once this data rate is
found, TX_RATE is set to enable
this rate. For example, suppose a
5
node that is capable of operating
at 1.25 GBd and 2.5 GBd rates is
establishing a link with a node
that is capable of only 2.5 GBd.
Both nodes will start emitting at
2.5 GBd because this is their
highest rate. The first node will
try receiving at 1.25 GBd rate. It
will not succeed and will therefore try 2.5 GBd reception, which
will succeed. The second node is
set to 2.5 GBd and has been receiving correct data. These two
nodes will settle to 2.5 GBd.
If the second node in the example
above operated at 1.25 GBd only,
then the first node would see
intelligible 1.25 GBd data and set
its TX_RATE=0, at which time
the second node would also start
seeing intelligible data. These
nodes would settle to 1.25 GBd.
If both nodes are 1.25/2.5 GBd
capable, then they will settle to
2.5 GBd. With this algorithm,
nodes need not have a common
lowest common denominator data
rate to interoperate.
HDMP-2634 Transmitter Section Timing Characteristics
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
tTXCT
TX[0:9] Input Data and TBC Clock Transition Range (TX_RATE = 1) ps
tTXCV
TX[0:9] Input Data and TBC Clock Valid Time (TX_RATE = 1)
ps
2400
tTXSETUP
TX[0:9] Setup Time to Falling Edge of TBC (TX_RATE = 0)
ps
1400
tTXHOLD
TX[0:9] Hold Time from Falling Edge of TBC (TX_RATE = 0)
ps
1400
t_txlat [1]
Transmitter Latency
Typ.
Max.
1600
0.8 ns +
8.5 bits
Note:
1. The transmitter latency, as shown in Figure 4, is defined as the time between the leading edge of a parallel data word and the leading edge of
the first transmitted serial output bit of that data word.
TXCT
TX[0:9]
TXCV
TXCV
TBC
8.00 ns
Figure 3a. Parallel transmitter section timing. TX_RATE = 1.
TX[0:9]
TXSETUP
TXHOLD
TBC
8.00 ns
Figure 3b. Parallel transmitter section timing. TX_RATE = 0.
6
10-BIT CHAR A
10-BIT CHAR B
SO±
TX[0]
TXLAT
TX[0..9]
10-BIT CHAR B
10-BIT CHAR C
TBC
Figure 4. Transmitter latency. TX[0] is first bit on SO±.
HDMP-2634 Receiver Section Timing Characteristics
TA = 0°C to T C = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
f_lock
Frequency Lock at Powerup with REFCLK Active
µs
b_sync [1,2]
Bit Sync Time
bits
t_rxlat[3]
Receiver Latency
Min.
Typ.
Max.
500
200
2500
13.5 bits
+2.5 ns
Notes:
1. This is the recovery time for input phase jumps, per the Fibre Channel Specification X3.230-1994 FC-PH Standard, Sec 5.3.
2. Tested using C PLL = 0.1 µF.
3. The receiver latency, as shown in Figure 6, is defined as the time between the leading edge of the first received serial bit of a parallel data word
and the leading edge of the corresponding parallel output word.
7
Table 1. HDMP-2634 RX, RBC[0:1] Timing Dependence on RX_RATE and RBC_SYNC.
Input Settings
Case RX_RATE RBC_SYNC
Resulting Behaviors
SI Rate (GBd) RBC Rate (MHz) Timing Diagrams for RBC0, RBC1, RX[0:9]
A
1.25
0
0
62.5
RBC0
RBC1
RX[0:9]
B
0
1
1.25
125
RBC0
RBC1
RX[0:9]
C
1
0
2.5
125
RBC0
RBC1
RX[0:9]
D
1
1
2.5
125
RBC0
RBC1
RX[0:9]
Z0 = 50 Ω
SSTL_2 OUTPUT DRIVER
DELAY = 0.5 - 2.0 ns
Figure 5. Test conditions for SSTL_2 output driver.
8
MEASUREMENT POINT
CLOAD = 4-20 pF
–100 µA <= ILOAD <= 100 µA
16.00 ns
RBC0
RBC1
RXS
RXS
RXH
RXH
RX[0:9]
TA-B
Figure 5a. Receiver section timing – case A.
Case A of Table 1. (RX_RATE = 0, RBC_SYNC = 0)
TA = 0°C to T C = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
tRXS
RX[0:9] Setup Time to RBC1 or RBC0 (Data Valid Before)
ps
2700
tRXH
RX[0:9] Hold Time from RBC1 or RBC0 (Data Valid After)
ps
1500
tA-B
RBC1 Rising Edge to RBC0 Rising Edge Skew
ns
7.5
8.5
tDUTY
RBC[0:1] Duty Cycle
%
40
60
9
Typ.
Max.
8.00 ns
RBC0
RBC1
RXS
RXH
RX[0:9]
Figure 5b. Receiver section timing – case B.
Case B of Table 1. (RX_RATE = 0, RBC_SYNC = 1)
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
tRXS
RX[0:9] Setup Time to RBC1 or RBC0 (Data Valid Before)
ps
1500
tRXH
RX[0:9] Hold Time from RBC1 or RBC0 (Data Valid After)
ps
1700
Typ.
Max.
8.00 ns
RBC0
RBC1
RXS
RXS
RXH
RXH
RX[0:9]
TA-B
Figure 5c. Receiver section timing – case C.
Case C of Table 1. (RX_RATE = 1, RBC_SYNC = 0)
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
tRXS
RX[0:9] Setup Time to RBC1/0 (Data Valid Before)
ps
800
tRXH
RX[0:9] Hold Time from RBC1/0 (Data Valid After)
ps
1000
tA-B
RBC1 Rising Edge to RBC0 Rising Edge Skew
ns
3.8
4.2
tDUTY
RBC[0:1] Duty Cycle
%
40
60
10
Typ.
Max.
8.00 ns
RBC0
RBC1
RXCV
RXCT
RX[0:9]
Figure 5d. Receiver section timing – case D.
Case D of Table 1. (RX_RATE = 1, RBC_SYNC = 1)
TA = 0°C to T C = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
tRXCT
RX[0:9] Output Data and RBC Clock Transition Range
ps
tRXCV
RX[0:9] Output Data and RBC Clock Valid Time
ps
10-BIT CHAR B
Min.
Typ.
Max.
1500
2500
10-BIT CHAR C
SI±
RX[0]
RX[9]
RXLAT
RX[0:9]
RBC[0:1]
Figure 6. Receiver latency. First bit on SI± drives RX[0].
11
10-BIT CHAR A
10-BIT CHAR B
HDMP-2634 Absolute Maximum Ratings
Sustained operation at or beyond any of these conditions may result in long-term reliability degradation or permanent
damage, and is not recommended.
Symbol
Parameter
Units
Min.
Max.
VCC
Supply Voltage
V
–0.5
4.0
Tstg
Storage Temperature
°C
–65
150
TC
Case Temperature
°C
0
95
Tj
Junction Temperature
°C
0
125
VIN,PECL
LVPECL Input Voltage
V
–0.5
VCC + 0.5[1]
VIN,SSTL
SSTL_2 Input Voltage
V
–0.5
VCC + 0.5[1]
Note:
1. Must remain less than or equal to absolute maximum VCC voltage of 4.0 V.
HDMP-2634 Guaranteed Operating Rates
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Parallel Clock Rate (MHz)
Min.
Max.
Serial Baud Rate (GBd)
Min.
Max.
Serial Baud Rate (GBd)
Min.
Max.
124
1.24
2.48
126
1.26
2.52
HDMP-2634 Transceiver REFCLK and TBC Requirements
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
Typ.
Max.
f
Nominal Frequency
MHz
Ftol
Frequency Tolerance
ppm
–100
100
Symm
Symmetry (Duty Cycle)
%
40
60
Min.
125
HDMP-2634 DC Electrical Specifications
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
ICC, TRx[1]
PD, TRx [1]
Typ.
Max.
Transceiver Supply Current (total of all supplies)
mA
620
780
Transceiver Total Power Dissipation
mW
2050
2700
Note:
1. Measurement Conditions: Tested sending 2.5 GBd 27-1 PRBS sequence from a serial BERT with SO± outputs differentially terminated using a 100
Ω resistor.
HDMP-2634 PECL DC Electrical Specifications for REFCLK[0:1]
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
VIH,PECL
PECL Input High Voltage Level
V
2.10
2.60
VIL,PECL
PECL Input Low Voltage Level
V
1.30
1.80
12
Typ.
Max.
HDMP-2634 LVTTL DC Electrical Specifications for REFCLK[1]
TA = 0°C to T C = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
VIH,LVTTL
LVTTL Input High Voltage Level
V
2.00
VIL,LVTTL
LVTTL Input Low Voltage Level
V
Typ.
Max.
0.80
SSTL_2 I/O Parameters
HDMP-2634 Recommended DC Operating Conditions and DC Electrical Characteristics
TA = 0°C to T C = 85°C, VCC = 3.15 V to 3.45 V, VDDQ = 2.30 V to 2.70 V. VDDQ is the FC-1/MAC device I/O supply voltage.
SSTL_2 inputs can receive LVTTL signals successfully. SSTL_2 outputs do not output LVTTL compliant levels.
Symbol
Parameter
Units
Min.
Typ.
Max.
VREFT
SSTL_2 Input Reference Voltage
V
1.15
1.25
1.35
VIH
Input High Voltage
V
VREFT +0.35
VDDQ +0.30
VIL
Input Low Voltage
V
–0.30
VREFT –0.35
VREFR
SSTL_2 Output Reference Voltage
V
1.15
VOH
Output High Voltage
V
VREFR +0.38
VDDQ
VOL
Output Low Voltage
V
GND
VREFR –0.38
1.25
1.35
HDMP-2634 AC Electrical Specifications
TA = 0°C to T C = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Min.
Typ.
Max.
tr,REFCLK
REFCLK[0:1] PECL Input Rise Time, VIL,PECL to VIH,PECL
ns
1.5
tf,REFCLK
REFCLK[0:1] PECL Input Fall Time, VIH,PECL to VIL,PECL
ns
1.5
trd, HS_OUT
HS_OUT Differential Rise Time, 20% - 80%
ps
160
tfd, HS_OUT
HS_OUT Differential Fall Time, 20% - 80%
ps
160
tr,SSTL
SSTL Input Rise Time, VIL,SSTL to VIH,SSTL
ns
1.5
tf,SSTL
SSTL Input Fall Time, VIH,SSTL to VIL,SSTL
ns
1.5
VIP,HS_IN
HS_IN Input Peak-To-Peak Differential Voltage
mV
200
VOP,HS_OUT [1]
HS_OUT Output Pk-Pk Diff. Voltage (Z0 = 50 Ω, Fig. 9)
mV
800
1050
2000
VOP,HS_OUT [1]
HS_OUT Output Pk-Pk Diff. Voltage (Z0 = 75 Ω, Fig. 9)
mV
1100
1400
2000
2000
Note:
1. Output Differential Voltage defined as (SO+ – SO–). Measurement made with Tx pre-emphasis off (EQAMP tied to VCC with a 100 Ω resistor).
13
HDMP-2634 Transmitter Section Output Jitter Characteristics
TA = 0°C to TC = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Typ.
RJ[1]
Random Jitter at SO± (1 σ deviation of the 50% crossing point)
ps
6.2
DJ[2]
Deterministic Jitter at SO± (peak-to-peak), K28.5+/K28.5– Pattern
ps
22
DJ
Deterministic Jitter at SO± (peak-to-peak), CRPAT[3] Pattern
ps
31
Notes:
1. Defined by Fibre Channel Specification X3.230-1994 FC-PH, Annex A, Section A.4.4 (oscilloscope method) and tested using the setup shown in
Figure 8b.
2. Defined by Fibre Channel Specification X3.230-1994 FC-PH, Annex A, Section A.4.3 and tested using the setup shown in Figure 8a.
3. Defined in the Fibre Channel Technical Report ”Methodologies for Jitter Specification,“ Annex B, and tested using the setup shown in Figure 8a.
Figure 7a. Serial output eye diagram with nominal Tx pre-emphasis.
Figure 7b. Serial output random jitter with Tx pre-emphasis off.
14
DETERMINISTIC JITTER MEASUREMENT METHOD
HP 83480A
SCOPE
SERIAL BERT
HP 70004A
DISPLAY
HP 70842A
ERROR DETECTOR
CLOCK
IN
HP 70841A PATTERN
GENERATOR
CLOCK
OUT
DATA TRIGGER
OUT+
N/C
CLOCK
OUT
DATA
OUT–
CLOCK
IN
TRIGGER
FROM
PGEN CLOCK
OR TRIGGER
DATA
IN
HP 70311A
CLOCK SOURCE
CLOCK
OUT
MODULATION
2.5 GHz
RBC1 TBC
DIV 2
SI ±
HDMP-2634
2.5 GBd
SO ±
SERDES
DIV 10
REFCLK
125 MHz
10 bits
DIVIDE BY 20
RANDOM JITTER MEASUREMENT METHOD
HP 83480A
SCOPE
SERIAL BERT
HP 70004A
DISPLAY
HP 70842A
ERROR DETECTOR
CLOCK
IN
HP 70841A PATTERN
GENERATOR
CLOCK
OUT
DATA TRIGGER
OUT+
N/C
CLOCK
OUT
DATA
OUT–
CLOCK
IN
TRIGGER
FROM
PGEN CLOCK
OR TRIGGER
DATA
IN
HP 70311A
CLOCK SOURCE
CLOCK
OUT
STATIC
K28.7
0011111000
MODULATION
2.5 GHz
Tx[0:9]
DIV 2
TBC
DIV 10
HDMP-2634
2.5 GBd
SERDES
SO ±
REFCLK
125 MHz
DIVIDE BY 20
Figure 8a-b. Transmitter deterministic and random jitter measurement method.
HDMP-2634 Thermal Characteristics
TA = 0°C to T C = 85°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units
Typ.
Θjc[1]
Thermal Resistance, Junction to Case
°C/W
9.3
Note:
1. Based on independent package testing by Agilent. Θja for these devices is 38°C/W for the HDMP-2634. Θja is measured on a standard
3x3" FR4 PCB in a still air environment. To determine the actual junction temperature in a given application, use the following equation:
Tj = Tc + (Θjc x PD), where Tc is the case temperature measured on the top center of the package and P D is the power being dissipated.
15
HDMP-2634 Pin Input Capacitance
Symbol
Parameter
Units
Typ.
CINPUT
Input Capacitance on SSTL input pins
pF
1.6
(SO+) – (SO–)
MAXIMUM
OUTPUT LEVEL
STEADY-STATE
OUTPUT LEVEL
STEADY-STATE
OUTPUT LEVEL
MAXIMUM
OUTPUT LEVEL
EQAMP
SETTING
1.11 V
1.11 V
100 Ω to VCC
(NO PRE-EMPHASIS)
820 mV
1.28 V
FLOATING
(NOMINAL PRE-EMPHASIS)
570 mV
1.44 V
SHORTED TO GND
(MAXIMUM PRE-EMPHASIS)
ALL VALUES MEASURED IN A 50 Ω ENVIRONMENT WITH
VCC = 3.3 V AND TA = 25°C.
1 BIT
Figure 9. Tx pre-emphasis control using EQAMP pin.
HS_OUT
HS_IN
VCC
VCC_TXHS
Zo
VCC
Zo
VCC
+SO
Zo = 50 Ω
+SI
0.01 µF
+
–
–SO
+
–
Zo = 50 Ω
0.01 µF
GND
–SI
GND
ESD
ESD
PROTECTION
PROTECTION
GND_TXHS
GND
NOTE:
HS_IN INPUTS SHOULD NEVER BE CONNECTED TO GROUND AS PERMANENT DAMAGE TO THE DEVICE MAY RESULT.
Z0 = 75 Ω MAY ALSO BE USED.
Figure 10. HS_OUT and HS_IN simplified circuit schematic for HDMP-2634.
16
VCC (SERDES) = 3.3 V
VCC (SERDES)
VCC (MAC) = 2.5 V
R1
2.5 V FOR SSTL_2
VCC
VCC
0.1 µF
VDDQ
R2
VREFR
VREFT
RS = 50 Ω
UNTERMINATED
RX[0:9]
RS = 50 Ω
USE TERMINATION, IF NECESSARY, TO
DELIVER PROPER VOLTAGE SWINGS AT TX[0:9]
TX[0:9]
DATAIN
DATAOUT
VCC (MAC)
R1
VREFR
VREFT
R2
HDMP-2634
0.1 µF
MAC
NOTE: VREFR ON EACH DEVICE MAY BE USED TO DRIVE VREFT ON THE OTHER DEVICE INSTEAD OF USING
THE CONFIGURATION ABOVE. VREFR SHOULD BE BYPASSED WITH 0.1 µF IN THIS CASE. IF USED, R1 + R2
SHOULD BE 500-1000 Ω. 1% RESISTORS SHOULD BE USED FOR R1 AND R2. WHEN USING THE CONFIGURATION
ABOVE, VREFT TO THE MAC DEVICE SHOULD BE SET TO 1.25 V NOMINAL. USING THIS VALUE CENTERS VREFR
RELATIVE TO THE RX[0:9] OUTPUT SWINGS PROVIDED BY THE HDMP-2634.
Figure 11. I-SSTL2 and O-SSTL2 simplified circuit schematic.
I/O Type Definitions
I/O Type
Definition
I-SSTL2
Input SSTL_2. These inputs will receive LVTTL-compliant signals successfully.
O-SSTL2
Output SSTL_2. These outputs will not produce LVTTL-compliant signals.
HS_OUT
High Speed Output, ECL Compatible
HS_IN
High Speed Input
C
External Circuit Node
S
Power Supply or Ground
17
Table 2. Pin Definitions for HDMP-2634
Name
Pin
Type
Signal
EQAMP
56
C
Output Equalization Amplitude Control: Controls the relative amount of equalization
on the high-speed serial data outputs. Equalization is disabled by connecting a 100 Ω
resistor from EQAMP to VCC. The amount of equalization can be increased by either
increasing the value (above 100 Ω) of a resistor connected from EQAMP to VCC, or
decreasing the value of a resistor connected from EQAMP to GND. Maximum
equalization is obtained by connecting EQAMP directly to GND. See Figure 9.
EWRAP
19
I-SSTL2
Loop Enable: When high, the high speed serial output data is internally connected
directly to the receiver circuit, bypassing the high-speed input and output buffers.
The external high-speed data outputs SO± are set high and SI± inputs are ignored.
EN_CDET
24
I-SSTL2
Comma Detect Enable: When high, enables detection of comma character.
COM_DET
27
O-SSTL2
Comma Detect Indicator: When high, indicates that a comma character of positive
disparity (0011111xxx) has been detected on the high speed serial input line.
TX_RATE
14
I-SSTL2
Transmit Rate Set: If set to low, the HDMP-2634 reads TX[0:9] data on the falling
edge of TBC and serializes it. This corresponds to a 1.25 GBd serial stream. If set to
high, the HDMP-2634 reads TX[0:9] data between both edges of TBC and serializes it.
This corresponds to a 2.5 GBd serial stream.
RX_RATE
55
I-SSTL2
Receive Rate Set: If set to low, the HDMP-2634 samples the incoming serial
stream at 1.25 GBd and drives it on the RX[0:9] lines with the rising edge of RBC1. If
set to high, the HDMP-2634 samples the incoming serial stream at 2.5 GBd and
drives it on the RX[0:9] lines with the rising edges of RBC1 and RBC0. (Table 1.)
RBC_SYNC 10
I-SSTL2
Receive Byte Clock Synchronization Control: When RBC_SYNC=1, RX[0:9] data has
the same relation to RBC[0:1] as TX[0:9] data has to TBC. ASICs designed using this
mode have the option of avoiding a SERDES driven serial link and communicating
directly on parallel lines, for short distances.
RX_LOS
26
O-SSTL2
Loss of Signal at the Receiver Detect: Indicates a loss of signal on the high-speed
differential inputs, SI±, as in the case where the transmission cable becomes
disconnected.
If SI± >= 200 mV peak-to-peak differential, RX_LOS = logic 0.
If SI± < 200 mV and SI± > 75 mV, RX_LOS = undefined.
If SI± =< 75 mV, RX_LOS = logic 1, RX[0:9]=1111111111.
SO+
SO–
62
61
HS_OUT
Serial Data Outputs: High speed outputs. These lines are active when not in parallel
loop mode (EWRAP=0). When EWRAP is high, these outputs are held static at logic 1.
SI+
SI–
52
53
HS_IN
Serial Data Inputs: High speed inputs. Serial data is accepted from SI± inputs when
EWRAP is low.
TBC
01
I-SSTL2
Transmit Clock: Both edges of this input are used to determine the sampling window
for transmit parallel data. The transmitter section accepts this signal as the
frequency reference clock. It is multiplied by 20 to generate the outgoing serial bit
clock and other internal clocks.
RBC[1]
RBC[0]
30
31
O-SSTL2
Receive Byte Clocks: The receiver section recovers two receive byte clocks. These
two clocks are 180 degrees out of phase. See Table 1 for timing relationships.
REFCLK[1]
22
I-PECL
or
I-LVTTL
REFCLK[0]
23
I-PECL
Reference Clock: A 125 MHz clock supplied by the host system. It serves as the
reference clock for the receive portion of the transceiver. These pins may be driven
by a differential PECL clock source or a single ended LVTTL clock source. In the
LVTTL case, REFCLK[1] is to be driven and REFCLK[0] is to be bypassed to GND via a
0.1 µF capacitor.
18
Table 2. Pin Definitions for HDMP-2634, continued
Name
Pin
Type
Signal
TX[0]
TX[1]
TX[2]
TX[3]
TX[4]
TX[5]
TX[6]
TX[7]
TX[8]
TX[9]
02
03
04
06
07
08
09
11
12
13
I-SSTL2
Data Inputs: One 10-bit, encoded character to the SO± serial outputs. TX[0] is the first
bit transmitted. TX[0] is the least significant bit.
RX[0]
RX[1]
RX[2]
RX[3]
RX[4]
RX[5]
RX[6]
RX[7]
RX[8]
RX[9]
45
44
43
41
40
39
38
36
35
34
O-SSTL2
Data Outputs: One 10-bit encoded character from one of the SI± serial inputs. RX[0] is
the first bit received. When RX_LOS =1, there is a loss of input signal at SI±, and these
outputs are held static at logic 1. Refer to RX_LOS pin definition for more details.
TXCAP0
TXCAP1
17
16
C
Loop Filter Capacitor: A loop filter capacitor for the internal transmit PLL must be
connected across the TXCAP0 and TXCAP1 pins. (typical value is 0.1 µF)
RXCAP0
RXCAP1
48
49
C
Loop Filter Capacitor: A loop filter capacitor for the internal receive PLL must be
connected across the RXCAP0 and RXCAP1 pins. (typical value is 0.1 µF)
VCC
20
28
57
59
54
S
Logic Power Supply: Normally 3.3 volts. Used for internal PECL logic.
VCC_TXA
18
S
Analog Power Supply: Normally 3.3 volts. Used to provide a clean supply line for
transmit PLL and high speed analog cells.
VCC_RXA
50
S
Analog Power Supply: Normally 3.3 volts. Used to provide a clean supply line for
receive PLL and high speed analog cells.
VCC_TXHS
60
63
S
High Speed Supply: Normally 3.3 volts. Used only for the high speed transmit cell
(HS_OUT). Noise on this line should be minimized for best operation.
VREFT
05
S
Voltage Reference Input: Used with I-SSTL2 inputs to the HDMP-2634. (Figure 11.)
VREFR
47
S
Voltage Reference Output: Used with O-SSTL2 outputs from the HDMP-2634. (Figure 11.)
VCC_SSTL
37
42
S
SSTL I/O Supply Voltage for SSTL_2. Normally 3.3 V. All necessary voltages for
SSTL_2 operation are internally generated.
GND
21
25
58
S
Logic Ground: Normally 0 volts. This ground is used for internal PECL logic.
GND_TXA
15
S
Analog Ground: Normally 0 volts. Used to provide a clean ground plane for the PLL
and high-speed analog cells.
GND_RXA
51
S
Analog Ground: Normally 0 volts. Used to provide a clean ground plane for the
receiver PLL and high-speed analog cells.
19
Table 2. Pin Definitions for HDMP-2634, continued
Name
Pin
Type
Signal
GND_TXHS 64
S
High Speed Ground: Normally 0 volts. Used for HS_IN cell.
GND_SSTL 32
33
46
S
SSTL Ground: Normally 0 volts. Used for SSTL_2 I/O.
N/C
29
VCC
CB11
0.1 µF
No Connect. Any voltage between GND and VCC may be applied to this pin.
VCC
R1
VCC
VCC
L2
0Ω
(OPTIONAL)
CB9
0.1 µF
CB10
0.1 µF
1 µH
C4*
10 µF
CB8
0.1 µF
CB7
0.1 µF
+ C2*
10 µF
EQAMP
100 Ω
TX[2]
5
6
VREFT
TX[3]
52
51
50
49
VCC_RXA
RXCAP1
SI–
SI+
GND_RXA
RX_RATE
VCC
57
56
EQAMP
58
VCC
GND
VCC
61
60
59
63
62
55
54
53
RX[4]
RX[5]
RX[6]
VCC_SSTL
TX_RATE
GND_TXA
TXCAP1
RX[8]
RX[9]
GND_SSTL
47
46
45
44
43
VCC
42
41
40
CB6
0.1 µF
39
38
37
36
35
34
33
CB5
0.1 µF
GND_SSTL
RBC[0]
N/C
RBC[1]
48
29
30
31
32
28
20
21
22
18
19
VCC
RX[7]
17
CPLLT
0.1 µF
VCC
RX[3]
TX[8]
TX[9]
TXCAP0
VCC_TXA
EWRAP
VCC
14
15
16
TX[6]
RBC_SYNC
TX[7]
RX_LOS
COM_DET
13
VCC_SSTL
UI
HDMP-2634
26
27
10
11
12
TX[4]
TX[5]
GND
7
8
9
RX[1]
RX[2]
REFCLK[0]
EN_CDET
CB12
0.1 µF
GND_SSTL
RX[0]
TX[1]
4
CPLLR
0.1 µF
RXCAP0
VREFR
23
24
25
3
TBC
TX[0]
GND
REFCLK[1]
2
VCC_TXHS
SO+
SO–
VCC_TXHS
1
GND_TXHS
64
R2
0Ω
(OPTIONAL)
VCC
L1
1 µH
C1*
10 µF
+
CB1
0.1 µF
C3*
10 µF
CB2
0.1 µF
CB3
0.1 µF
CB4
0.1 µF
NOTES:
1. C1*-C4* FOR LOW-FREQUENCY BYPASS.
2. VENKEL PART NUMBER C0603X7R160-104KNE, OR SIMILAR, CAN BE USED FOR 0.1 µF CAPACITORS.
3. TDK P/N NL322522T-1R0J, OR SIMILAR, CAN BE USED FOR 1 µH INDUCTORS.
Figure 12. Recommended power supply filtering arrangement.
20
VCC_RXA
RXCAP1
SI+
GND_RXA
SI–
RX_RATE
VCC
EQAMP
GND
VCC
GND_TXHS
VCC_TXHS
SO+
SO–
VCC_TXHS
VCC
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
TBC
TX[0]
TX[1]
1
48
2
47
46
TX[2]
TX[3]
4
5
6
TX[4]
7
TX[5]
TX[6]
RBC_SYNC
TX[7]
8
9
VREFT
TX[8]
TX[9]
TX_RATE
GND_TXA
TXCAP1
3
10
11
12
HDMP-2634
xxxx-x Rz.zz
S
YYWW
45
RXCAP0
VREFR
GND_SSTL
RX[0]
44
43
RX[1]
RX[2]
42
41
40
VCC_SSTL
39
38
37
36
35
34
13
14
15
16
33
RBC[0]
GND_SSTL
N/C
RBC[1]
VCC
GND
RX_LOS
COM_DET
REFCLK[0]
EN_CDET
TXCAP0
VCC_TXA
EWRAP
VCC
GND
REFCLK[1]
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
xxxx-x = WAFER LOT NUMBER–BUILD NUMBER
Rz.zz = DIE REVISION
S = SUPPLIER CODE
YYWW = DATE CODE (YY = YEAR, WW = WORK WEEK)
COUNTRY = COUNTRY OF MANUFACTURE
(MARKED ON BACK OF DEVICE)
Figure 13. HDMP-2634 package layout and marking, top view.
21
RX[3]
RX[4]
RX[5]
RX[6]
VCC_SSTL
RX[7]
RX[8]
RX[9]
GND_SSTL
Package Information
Item
Details
Package Material
Metric Metal QFP
Lead Finish Material
85% Tin, 15% Lead
Lead Finish Thickness
200-800 micro-inches
Lead Skew
0.20 mm max.
Lead Coplanarity
(Seating Plane Method)
0.08 mm max.
Mechanical Dimensions of HDMP-2634
PIN #1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
2
3
4
5
6
7
8
9
48
47
46
45
44
43
42
41
40
TOP VIEW
E1
E
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
c
b
D1
L
D
A2
A
SEATING
PLANE
A1
22
0.25
GAUGE
PLANE
e
DIMENSIONAL
PARAMETER
(MILLIMETERS)
A
A1
A2
D/E
D1/E1
L
b
c
e
VALUE
2.35
0.25
2.00
17.20
13.80
0.88
0.37
0.20
0.80
TOLERANCE
MAX.
MAX. ± 0.10 ± 0.25 ± 0.05 ± 0.15 + 0.08/ MAX. BASIC
– 0.03
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2000 Agilent Technologies, Inc.
December 14, 2000
5980-2107E