SILABS SI2704-A10-GM

Si2704/05/06/07-A10
EMI M ITIGATING 2.1 X 5 W C LASS D A UDIO A M P L I F I E R
Features
Programmable 7 band parametric EQ,
dynamic range compressor, tone control
Crossbar input mixer with scaling
Digital tone and alert generation
128 dB volume control in 0.5 dB steps
Multiple low power operating modes
Over-current and over-temperature
detection w/ auto recovery
Pop and click free operation
Standard 2-wire control w/ 2 addresses
System flexibility w/ 3 multi-function pins
Dual supply voltage: 2.7–3.6 V main
and 4.0–6.6 V power stage
Available in 4x4 24-pin Power QFN and
7x7 48-pin Power eTQFP package
Both Pb-free/RoHS compliant
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Ordering Information:
See page 37.
Pin Assignments
GNDL
SCLK
4
15
GNDR
SDIO
5
14
OUTNR
CLKO
6
13
OUTPR
MFP
2-Wire Control
Rev. 0.6 8/10
VIO
VPP
4.0 – 6.6 V
Supply
Power
PWM
RF
CH 2
Top Down View
24-Pin QFN Package
42
41
VPPR
NC
43
NC
44
RSTB
45
12
NC
OUTSEL/MFP2
XTLO
MFP1
XTLI
AUXOR
11
GND
46
10
VDD
47
9
AUXOL
MFP3
NC
48
8
NC
7
40
39
38
37
NC
1
36
DFS
2
35
VPPL
DCLK
3
34
OUTPL
DIN
4
33
NC
GND
VIO
5
32
OUTNL
GND
6
31
GNDL
SCLK
7
30
GNDR
SDIO
8
29
OUTNR
CLKO
9
28
GND
NC
10
27
OUTPR
26
VPPR
25
NC
NC
11
NC
12
GND PAD
(Back Paddle)
Top Down View
48-Pin eTQFP Package
13
14
15
16
17
18
19
20
21
22
23
24
NC
1.62 – 3.6 V
Supply
Feedback
VPPL
16
GND PAD
(Back Paddle)
NC
I2S
I S/AAD
Mixer
ASRC
Tone Gen.
Cross-over Filter
Volume Control
Tone Control
7-Band EQ
DRC
RST
3
VOL/MFP1
DSP
2
XTLO
OUTNL
VIO
OUTSEL/MFP2
Stage
XTLI
OUTPL
17
GND
PWM
VDD
18
2
AUXOR
CLKO
LF
CH 1
19
AUXOL
Power
Clock
Generation
20
SLEEP/MFP3
LDO
21
NC
VDD
2.7 – 3.6 V
Supply
22
DIN
Functional Block Diagram
Si270x Digital Class-D Amplifier
23
1
Description
The Si2704/05/06/07 EMI mitigating 2.1 digital audio processing Class D
amplifier integrates a power stage, PWM DAC, and digital audio processing
(DAP) for simplified, low cost, power efficient system designs in consumer
audio electronics. The digital input amplifier features delta-sigma PWM and
innovative EMI mitigation technology for producing high-quality audio while
effectively managing PWM switching noise for enhanced EMI compliance and
AM/FM radio co-existence, while also being GSM/iPhone friendly.
24
DCLK
NC
Active/wireless speakers
TVs and monitors
TV sound bars
NC
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PMP/MP3 docking stations
Portable consumer audio electronics
Table top and portable radios
NC
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DFS
Si2704/05/06/07
Applications
NC
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Digital input Delta-Sigma PWM
Patent-pending EMI mitigation
AM radio band noise-free notch
GSM/iPhone friendly
Wideband PWM carrier spreading
Power stage slew rate control
Power stage feedback for PSR/THD
2x 5 W @ 3  BTL; 2x 3 W @ 8  BTL
88% efficiency with >50 dB PSRR
95 dB dynamic range and <0.1% THD
Stereo PWM DAC line analog outputs
Master/slave I2S w/ 3 inputs & 1 output
Automatic digital audio rate detection
Standard audio rates from 32–192 kHz
Audio activity detector w/ auto-standby
Operates from external XTAL or clock
Buffered master/regulator clock output
NC
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Stage
MFP Control
System Control
Over Current
Over Temp
PWM DAC
AUXOL/R
Copyright © 2010 by Silicon Laboratories
Si2704/05/06/07-A10
This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Si2704/05/06/07-A10
2
Rev. 0.6
Si2704/05/06/07-A10
TABLE O F C ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3. Typical System Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1. PWM Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1.1. PWM Switching Rate Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1.2. EMI Mitigation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2.1. Active Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.2. Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.3. Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2.4. Power Down Mode and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19
20
20
20
4.3. Chip Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3.1. Multi-Function Pins (MFPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3.2. Output Mode Configuration (Si2705/07 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.4. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.4.1. Reference Clock Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.4.2. Reference Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.5. Digital Audio I2S Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.5.1. Auto-Rate Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.2. Audio Activity Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.3. Digital Audio Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.4. Audio data formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.5. I2S Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24
24
24
24
24
4.6. Digital Audio Processing (DAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.6.1. Parametric Equalization (Si2706/07 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.2. Tone Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.3. De-Emphasis (Si2706/07 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.4. Crossover Filter (Si2706/07 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.5. Digital Volume Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.6. Dynamic Range Compression (Si2706/07 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.7. Hard Signal Limiter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.8. DC Notch Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.9. Tone and Alert Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
27
27
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28
28
29
30
30
30
4.7. Fault Detection and Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.8. Power Supply and Grounding Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.9. Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
4.10. Programming with Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5. Commands and Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.1. 24-Pin QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.2. 48-Pin eTQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Rev. 0.6
3
Si2704/05/06/07-A10
8.1. 24-Pin QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.2. 48-Pin eTQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9. Package Markings (Top Marks) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.1. Si2707 Top Mark (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.2. Top Mark Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.3. Si2707 Top Mark (eTQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9.4. Top Mark Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
10. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
4
Rev. 0.6
Si2704/05/06/07-A10
1. Electrical Specifications
Table 1. Recommended Operating Conditions1
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Power Output Supply Voltage
VPP
4.02
—
6.6
V
Main Supply Voltage
VDD
2.7
3.3
3.6
V
Interface (I/O) Supply Voltage
VIO
1.62
—
3.6
V
Load Impedance
RL
—
3–8
—
Ω
Ambient Temperature
TA
–20
25
85
°C
Junction Temperature
TJ
—
—
135
°C
Case Delta from Junction
JC
Temperature delta between junction and top center of package
—
—
5
°C/W
Delta from Junction to Ambient3
JA
QFN package
—
25
—
°C/W
eTQFP
—
30
—
°C/W
Notes:
1. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at VDD = 3.3 V and 25 °C unless otherwise stated. Parameters are tested in production unless
otherwise stated.
2. Operation with VPP as low as 3 V is possible at reduced performance.
3. The JA is layout-dependent; therefore, PCB layout must provide adequate heat-sink capability. The.JA is specified,
assuming adequate ground plane as in “AN470: 270x Layout Guidelines.”
Table 2. Absolute Maximum Ratings1
Parameter
Symbol
Value
Unit
Power Output Supply Voltage
VPP
–0.5 to 7.0
V
Main Supply Voltage
VDD
–0.5 to 3.9
V
Interface (I/O) Supply Voltage
VIO
–0.5 to 3.9
V
Input Current2
IIN
10
mA
Input Voltage2
VIN
–0.3 to (VIO + 0.3)
V
Operating Temperature
TA
–20 to +85
°C
Junction Temperature
TJ
150
°C
Storage Temperature
TA
–55 to +150
°C
Notes:
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond
recommended operating conditions for extended periods may affect device reliability.
2. For input pins SCLK, SDIO, DCLK, DFS, DIN, RST, OUTSEL, MFPx.
Rev. 0.6
5
Si2704/05/06/07-A10
Table 3. DC Characteristics—Supplies and Interfaces
(VDD = 2.7 to 3.6 V, VIO = 1.62 to 3.6 V, VPP = 4 to 6.6 V, TA = –20 to +85 °C)
Parameter
Start Up Time
Active Mode Quiescent
Supply Current
Symbol
Test Condition
Min
Typ
Max
Unit
TONSB
From Standby Mode
with CLKO enabled
—
—
2
ms
From Standby Mode
with CLKO disabled
—
—
20
ms
TON_SLP
From Sleep Mode
—
—
20
ms
TON_PD
From Power Down Mode
—
—
200
ms
IPQ
From VPP, No load, Both Channels Active, Spread Mode PWM
—
50
—
mA
From VPP, No load, Both Channels Active, Normal Mode PWM
—
45
—
mA
From VDD
—
54
—
mA
IDQ
Standby Mode Supply
Current
Sleep Mode Supply
Current
Power Down Mode Supply
Current
2
IIOQ
From VIO, I S Slave Mode,
CLKO Disabled
—
1.3
—
mA
IPSTB
Standby Mode
—
0.1
—
mA
IDSTB
Standby Mode
with CLKO enabled
—
8
—
mA
Standby Mode
with CLKO disabled
—
4
—
mA
IIOSTB
Standby Mode
—
2
—
mA
IPSLP
SLEEP asserted
—
0.1
—
mA
IDSLP
SLEEP asserted
—
2
—
mA
IIOSLP
SLEEP asserted
—
1.5
—
mA
IPPD
—
0.1
—
mA
IDPD
—
2
—
mA
IIOPD
—
0.3
—
mA
Input pins SCLK, SDIO, DCLK, DFS, DIN, RST, OUTSEL, MFPx
High Level Input Voltage
VIH
0.7 x VIO
—
—
V
Low Level Input Voltage
VIL
—
—
0.3 x VIO
V
High Level Input Current
IIH
VIN = VIO = 3.6 V
–10
—
10
μA
Low Level Input Current
IIL
VIN = 0 V, VIO = 3.6 V
–10
—
10
μA
High Level Output Voltage
VOH
IOUT = 500 μA
0.8 x VIO
—
—
V
Low Level Output Voltage
VOL
IOUT = –500 μA
—
—
0.2 x VIO
V
High Level Output Current
IOH
0.8 x VIO
—
6
—
mA
Low Level Output Current
IOL
0.2 x VIO
—
6
—
mA
Output pins MFPx, CLKO*
*Note: Valid for the configuration where MFPx is configured as an output or general purpose output.
6
Rev. 0.6
Si2704/05/06/07-A10
Table 4. DC Characteristics—Class D Amplifier
(VDD = 2.7 to 3.6 V, VIO = 1.62 to 3.6 V, VPP = 4 to 6.6 V, TA = –20 to +85 °C)
Parameter
Output Voltage Offset
Total Drain-Source On-State
Resistance (Total Bridge)*
Symbol
Test Condition
Min
Typ
Max
Unit
VOS
Differential Output
—
±10
—
mV
RDSON
VPP = 6.6 V, IO= 1A
—
648
—
mΩ
*Note: Excludes package bond wire resistance.
Table 5. AC Characteristics—Class D Amplifier
(VDD = 2.7 to 3.6 V, VIO = 1.62 to 3.6 V, VPP = 6.6 V, RL = 8 Ω, VOL = 0 dBFS, TA = –20 to +85 °C, unless otherwise noted.)
Parameter
1
Continuous Output Power
Total Harmonic Distortion + Noise
Signal to Noise Ratio/Dynamic
Range
Symbol
Test Condition
Min
Typ
Max
Unit
PO
THD+N = 10%, f = 1 kHz,
RL = 8 Ω
—
2.7
—
W
THD+N = 1%, f= 1 kHz,
RL = 8 Ω
—
1.9
—
W
THD+N = 10%, f = 1 kHz,
RL = 4 Ω
—
4.7
—
W
THD+N = 1%, f= 1 kHz,
RL = 4 Ω
—
3.4
—
W
THD+N = 10%, f = 1 kHz,
RL = 3 Ω
—
5.0
—
W
THD+N
PO=1 W, f = 1 kHz
—
0.1
—
%
SNR
Normal mode PWM,
f = 1 kHz, A-weighted
—
95
—
dB
Normal mode PWM,
f = 1 kHz, Unweighted
—
92
—
dB
Spread mode PWM,
f = 1 kHz, A-weighted
—
90
—
dB
Spread mode PWM,
f = 1 kHz, Unweighted
—
87
—
dB
f = 1 kHz,
Relative to Normal Mode
—
24
—
dB
f = 1 kHz,
Measured in ±10 kHz band
around selected frequency
—
35
—
dB
Spread Mode Common Mode PWM
Carrier Peak Attenuation2
Common Mode AM Band Noise
Notch Attenuation3
Notes:
1. Measured at filter output. Power measured at the chip output is greater.
2. Guaranteed by characterization.
3. Measured relative to the integrated noise floor in Spread mode. Guaranteed by characterization.
4. Does not include filter efficiency losses.
Rev. 0.6
7
Si2704/05/06/07-A10
Table 5. AC Characteristics—Class D Amplifier (Continued)
(VDD = 2.7 to 3.6 V, VIO = 1.62 to 3.6 V, VPP = 6.6 V, RL = 8 Ω, VOL = 0 dBFS, TA = –20 to +85 °C, unless otherwise noted.)
Power Supply Rejection Ratio
PO = –3 dBFS, f = 1 kHz;
200 mVPP, fr = 400 Hz
supply ripple
—
50
—
dB
f = 1 kHz
—
–92
—
dB
η
f = 1 kHz, half rate PWM and
10 ns slew rate
—
88
—
%
PRF
Half Rate PWM
—
480
—
kHz
Full Rate PWM
—
960
—
kHz
PSRR
Crosstalk
Efficiency
4
Output Pulse Repetition Frequency
Notes:
1. Measured at filter output. Power measured at the chip output is greater.
2. Guaranteed by characterization.
3. Measured relative to the integrated noise floor in Spread mode. Guaranteed by characterization.
4. Does not include filter efficiency losses.
Table 6. AC Characteristics—PWM Digital to Analog Converter
(VDD = 2.7 to 3.6 V, VIO = 1.62 to 3.6 V, VOL = 0 dBFS, TA = -20 to +85 °C, unless otherwise noted).
Parameter
Total Harmonic Distortion + Noise
Symbol
Test Condition
Min
Typ
Max
Unit
THD+N
f = 1 kHz
—
0.02
—
%
SNR
f = 1 kHz, A-weighted
—
88
—
dB
f = 1 kHz, Unweighted
—
85
—
dB
Vout
—
1
—
VP-P
Voutcm
—
0.8
—
V
Signal to Noise Ratio/Dynamic Range
Output Voltage Swing
Output Voltage Common Mode Bias
Output Load— Resistance
Rload
AC coupled
5
—
50
kΩ
Output Load— Capacitance
Cload
AC coupling capacitor
0.1
—
1
µF
Table 7. I2S Digital Audio Interface Characteristics
(VIO = 1.62 to 3.6 V, TA = –20 to +85 °C, unless otherwise noted).
Parameter
Min
Typ
Max
Unit
tCYC:DCLK
70
—
—
ns
DCLK Input Pulse Width High
tHI:DCLK
0.4 x
tCYC:DCLK
—
0.6 x
tCYC:DCLK
ns
DCLK Input Pulse Width Low
tLO:DCLK
0.4 x
tCYC:DCLK
—
0.6 x
tCYC:DCLK
ns
DFS Setup Time to DCLK↑
tSU:DCLK
10
—
—
ns
DFS Hold Time after DCLK↑
tHD:DCLK
5
—
—
ns
DOUT Output Delay
TPD:DCLK
0
—
35
ns
Capacitive Loading
CB
—
—
15
pF
DCLK Input Cycle Time
8
Symbol
Test Condition
Rev. 0.6
Si2704/05/06/07-A10
Figure 1. Digital Audio Timing Parameters
Table 8. 2-Wire Control Interface Characteristics
(VIO = 1.62 to 3.6 V, TA = –20 to +85 °C, unless otherwise noted).
Parameter
Symbol
Test
Condition
Min
Typ
Max
Unit
SCLK Frequency
fSCL
0
—
400
kHz
SCLK Low Time
tLOW
1.3
—
—
µs
SCLK High Time
tHIGH
0.6
—
—
µs
SCLK Input from SDIO Setup ↓
(START)
tSU:STA
0.6
—
—
µs
SCLK Input to SDIO ↓ Hold (START)
tHD:STA
0.6
—
—
µs
SDIO Input to SCLK ↑ Setup
tSU:DAT
100
—
—
ns
SDIO Input to SCLK ↓ Hold
tHD:DAT
0
—
900
ns
SDIO output delay
TPD:DAT
300
—
900
ns
SCLK input to SDIO ↑ Setup (STOP)
tSU:STO
0.6
—
—
µs
STOP to START Time
tBUF
1.3
—
—
µs
SDIO Output Fall Time
tf:OUT
—
—
250
ns
SDIO Input, SCLK Rise/Fall Time
tf:IN
tr:IN
—
—
300
ns
Capacitive Loading
Cb
—
—
50
pF
Pulse Width Rejected by Input Filter
tSP
—
—
50
ns
Rev. 0.6
9
Si2704/05/06/07-A10
Table 9. 2-Wire Control Interface Address Selection
CLKO Startup Voltage (Pin
Connection)
2-Wire
Device Address
GND
1001010 (0x94)
VIO (Default)
0011011 (0x36)
Table 10. Reset Timing Characteristics
(VIO = 1.62 to 3.6 V, TA = -20 to +85 °C, unless otherwise noted).
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
CLKO Setup Time to RST↑
tSRST
100
—
—
μs
CLKO Hold Time after RST↑
THRST
30
—
—
ns
tH R S T
tSR ST
70%
RST
30%
70%
C LK O
30%
Figure 2. Reset Timing Parameters for Configuration Mode Select
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Rev. 0.6
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SCLK
70%
SDIO
70%
tSU:STA tHD:STA
tLOW
START
tr:IN
tHIGH
tr:IN
tf:IN
tSP
tSU:STO
tBUF
30%
30%
tHD:DAT tSU:DAT
tf:IN,
tf:OUT
tPD:DAT
STOP
START
Figure 3. 2-Wire Control Interface Read and Write Timing Parameters
SCLK
SDIO
(Write)
Command
7-0
A6-A0, 0
START
SDIO
(Read)
ADDRESS + R/W
ACK
ADDRESS + R/W
ACK
Status
7-0
A6-A0, 1
START
DATA
Arg1
7-0
ACK
DATA
DATA
ACK
STOP
ACK
STOP
Response
7-0
ACK
DATA
Figure 4. 2-Wire Control Interface Read and Write Timing Diagram
Rev. 0.6
11
Si2704/05/06/07-A10
Table 11. Reference Clock and Crystal Characteristics
(VDD = 2.7 to 3.6 V, VIO = 1.62 to 3.6 V, TA = –20 to +85 °C, unless otherwise noted).
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
2
—
49
MHz
–1000
—
1000
ppm
—
—
50
psrms
Reference Clock, Pin XTLI
Supported Frequencies1
Frequency Tolerance
Jitter Tolerance2
Integrated from 20 Hz to
1 MHz
High Level Input Voltage
VIH
0.7xVI0
—
—
V
Low Level Input Voltage
VIL
—
—
0.3xVI0
V
High Level Input Current
IIH
VIN = VI0 = 3.6 V
–10
—
10
μA
Low Level Input Current
IIL
VIN = 0 V
VI0 = 3.6 V
–10
—
10
μA
Crystal Oscillator Frequency3
12.288
—
24.576
MHz
Crystal Frequency Tolerance
–1000
—
1000
ppm
4
—
20
pF
—
—
100

Frequency Range4
120
—
24576
kHz
Load Capacitance
—
—
10
pF
Crystal oscillator, Pins XTLI, XTLO
Internal Crystal Load Capacitance
Crystal Motion Resistance
for 24.576 MHz Crystal
Reference Clock Output, Pin CLKO
Notes:
1. Supported reference clock frequencies at XTLI include 2.048, 2.822, 3.072, 4.096, 4.234, 4.608, 5.645, 6.144, 8.192,
8.467, 9.216, 11.290, 11.2896, 12, 12.288, 16.368, 16.934, 18.432, 22.579, 24.576, 32.768, 32.869, 36.864, 45.158,
and 49.152 MHz.
2. Required to achieve specified performance.
3. Supported crystal frequencies at XTLI include 12.288, 18.432, and 24.576 MHz.
4. 120 kHz, 240 kHz, 480 kHz, 960 kHz, 1.92 MHz, 4.096 MHz, 6.144 MHz, 8.192 MHz, 12.288 MHz, 16.384 MHz, and
24.576 MHz are available at CLKO.
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Si2704/05/06/07-A10
2. Typical Application Schematic
VPP
4.0 to 6.6 V
VDD
2.7 to 3.6 V
C9
0.1 uF
C11
220 uF
C10
0.1 uF
C7
0.1 uF
VIO
1.62 to 3.6 V
Optional
12
19
R
VP
PL
VP
P
3
23
L1
C8
0.1 uF
21
X1
22
XTLI
XTLO
C1
C15
OUTPL
18
OUTNL
17
C5
C16
15
OUTPR
13
5
OUTNR
6
C2
L2
L3
14
AUXOL
C3
C17
R3
25
7
CLKO
GNDR
4
AUXOR
SDIO
16
R2
2
8
SCLK
1
9
DIN
GNDL
U1
Si2705/07
OUTSEL
DCLK
24
11
DFS
20
8
RSTB
R1
C6
SLEEP/MFP3
C18
AUXOL
R4
C4
L4
C12
C13
Figure 5. Typical Application Schematic
Table 12. Typical Application Schematic Bill of Materials
Component
Inductor Filter
Ferrite Bead Filter
C1, C2, C3, C4
0.68 µF, ceramic
1000 pF, ceramic
C15, C16, C17, C18
0.33 µF, ceramic
1000 pF, ceramic
C5, C6
0.47 µF, Film
100 pF, ceramic
L1, L2, L3, L4
10 µH, 1.5 A, inductor
TDK MPZ2012S601A,
ferrite bead
Note: When using the ferrite bead output filter with AM radio, shielded cable is
recommended.
Rev. 0.6
13
Si2704/05/06/07-A10
3. Typical System Configurations
2.7–3.6 V
Supply
VDD/VIO
VPP
4.0–6.6 V
Supply
XTLI
OUTPL
XTLO
Dock
Dock
I/F
LF
OUTNL
CLKO
Stereo
ADC
Line
In
Si270x
Digital Audio
Amplifier
2
IS
OUTPR
RF
OUTNR
User I/F
System MCU
2-Wire
HPDET
OUTSEL
AUXOL
MFP
AUXOR
Figure 6. Basic PMP Dock System Configuration
2.7–3.6 V
Supply
VDD/VIO
VPP
4.0–6.6 V
Supply
XTLI
XTLO
OUTPL
CLKO
Digital Media
Controller
Dock
Dock
I/F
Radio Tuner
Si473x-D
I2S DI2
User I/F
System MCU
LF
Filter
RF
I2S DO
I2S DIN
Si270x
Digital Audio
Amplifier
Stereo
ADC
Line
In
Filter
OUTNL
OUTPR
OUTNR
2-Wire
AUXOL
AUXOR
MFP
HPDET
Figure 7. PMP Dock with Radio and Digital Media Controller System Configuration
14
Rev. 0.6
Si2704/05/06/07-A10
External Subwoofer
XTLI
Digital
Media
Controler
2
IS
AUXOL
XTLO
Midrange
Amplifier
Si270x
L
L Midrange
R
R Midrange
I2C adress 0x36
System
MCU
2-Wire
OUTSEL
CLKO
XTLI
Tweeter
Amplifier
Si270x
Radio
L
L Tweeter
R
R Tweeter
OUTSEL
I2S
HPDET
AUXOL
I2C adress 0x94
Headphone
AUXOR
Figure 8. Stereo 2-Way Speaker System Configuration
External Subwoofer
AUXOL
XTLI
XTLO
Analog
Audio 1
From
PMP
dock
2
XTLI
Si270x
Digital Audio
Amplifier
Receiver & Mux
Audio Processor
DVI/PC
Audio
1
CLKO
Analog
Audio 2
Digital
Audio
Si270x
Digital Audio
Amplifier
1
2
XTLI
Si270x
Digital Audio
Amplifier
Delay Control
1
2
XTLI
Si270x
Digital Audio
Amplifier
1
2
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
Figure 9. TV Sound Bar System Configuration
Rev. 0.6
15
Si2704/05/06/07-A10
4. Functional Description
Si270x Digital Class-D Amplifier
VDD
2.7 – 3.6 V
Supply
LDO
Power
Clock
Generation
CLKO
LF
CH 1
PWM
Stage
DSP
I2S
1.62 – 3.6 V
Supply
MFP
2-Wire Control
VIO
I2S/AAD
Mixer
ASRC
Tone Gen.
Cross-over Filter
Volume Control
Tone Control
7-Band EQ
DRC
Feedback
VPP
4.0 – 6.6 V
Supply
Power
PWM
RF
CH 2
Stage
MFP Control
System Control
Over Current
Over Temp
PWM DAC
AUXOL/R
Figure 10. Functional Block Diagram
The Si2704/05/06/07 EMI mitigating 2.1 x 5 W Class D audio amplifier integrates a stereo power stage, PWM DAC,
and digital signal processor (DSP) to enable simplified, low cost, power efficient system designs in consumer audio
electronics. The digital input amplifier features delta-sigma PWM for high quality audio while innovative EMI
mitigation technology manages PWM switching noise to suppress peak emissions more than 20 dB while providing
co-existence with AM/FM radio tuners.
The power stage is capable of driving two 3 Ω bridge-tied speakers with 5 W per channel at 10% THD+N from
6.6 V power supplies. It can also drive 8 Ω bridge-tied speakers at 3 W per channel with 88% efficiency. The power
stage feedback systems improve power supply rejection and harmonic distortion performance.
The Si270x connects up to three synchronous I2S digital sources as either master or slave, two of which can be
configured as input or output. The I2S input is converted to a common sample rate for digital audio processing
using an asynchronous sample rate converter (ASRC) and a digital crossbar mixer linearly combines any of the six
inputs into the three audio processing channels
Integrated digital audio processing enables the amplifier to compensate for speaker and enclosure acoustic
characteristics. A programmable 7-biquad parametric equalizer for each main channel allows notching out of
mechanical resonances and pre-compensation of the speaker frequency response, while programmable dynamic
range compression protects from overdriving speakers and increases the average output power without increasing
apparent distortion. Tone control enables ±18 dB of treble and bass boost/cut, while output volume is digitally
controlled in 0.5 dB steps from –100 to +28 dB via the I2C-Compliant 2-Wire interface or an analog potentiometer
connected to the integrated ADC. Two independent tone generators enable mixing of multi-tone alarms and alerts
into the audio channels.
The auxiliary audio processing channel (Aux Channel) with optional sub-mixing and low pass filtering generates
mono line level analog audio output for driving an external active subwoofer or center speaker. The main channel
L/R outputs may also be connected to the PWM DAC for driving a headphone amplifier.
A low jitter PLL generates internal system clocks referenced in master mode to an external crystal, or alternatively,
in slave mode to either the I2S data clock (DCLK) or the audio master clock (MCLK). A buffered clock (CLKO) can
be output by the device to synchronously drive companion audio devices, additional amplifiers, and switching
regulators.
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Rev. 0.6
Si2704/05/06/07-A10
4.1. PWM Processing
The Si270x is designed to operate using a bridge-tied-load (BTL) output configuration where both sides of the
speaker are actively driven by the amplifier.
4.1.1. PWM Switching Rate Control
The output PWM switching frequency can be programmed via 2-wire control to be half rate (480 kHz) or full rate
(960 kHz). The different rates can be configured by setting property PWM_FREQ.
Full Rate PWM provides better audio performance and AM radio co-existence, while Half Rate PWM provides
lower switching losses and lower switching energy harmonics at high frequencies. For each configuration, the
switching frequency can be offset slightly for FM band frequency planning flexibility.
4.1.2. EMI Mitigation
By nature, the switching characteristic of Class D amplifiers that provides high power efficiency also creates
harmonic spurs at multiples of the PWM switching rate that can radiate as EMI. Common mode PWM switching
from ground to the supply translates into a radiated pattern with large energy components at the fundamental and
odd harmonics of the switching frequency. Fast pulse edge transitions and differential mode ripple currents flowing
through inductor windings further contribute to radiated interference. To simplify design for EMI compliance and
radio receiver co-existence, the Si270x features EMI mitigation modes for managing the PWM switching noise,
including pulse edge slew rate control, common mode switching noise spectral shifting, and common mode
switching noise spectral spreading/shaping.
4.1.2.1. Slew Rate Control
Output pulse edge slew rate can be programmed via 2-Wire control for 10 ns or 20 ns (property
PWM_OUTPUT_SLEW_RATE). While faster transition times are favorable for higher efficiency, slower transition
times are favorable for EMI attenuation.
4.1.2.2. Spectral Shifting
The frequency locations for the PWM common mode switching energy can be shifted to facilitate frequency
planning. This spectral shifting is useful for example in radios to avoid radiating interference at frequencies where
the radio is being tuned.
When spectral shifting is programmed for Integer Mode PWM, the common mode switching energy and harmonics
are located at FC x (2n–1) for all positive integers n, where Fc is the PWM switching frequency. Alternatively, when
programmed for Fractional Mode PWM, the common mode switching energy and harmonics are shifted down in
frequency by 50%, and are located at FC x (2n–1)/2.
The spectral shifting mode can be programmed dynamically by setting property PWM_CONFIG during normal
operation without adversely affecting the internal audio processing or the amplified audio signal integrity.
Rev. 0.6
17
Si2704/05/06/07-A10
Figure 11. PWM CM Spectrum for Integer Mode PWM
Figure 12. PWM CM Spectrum for Fractional Mode PWM
4.1.2.3. Spectral Spreading
Spread mode PWM can be used to spread PWM common mode switching energy resulting in a peak energy
suppression greater than 20 dB at all frequencies. This Spectral Shaping feature is useful for mitigating EMI
radiation and eliminating inductors for filter-less applications. Spread Mode PWM can be programmed dynamically
by setting property PWM_CONFIG during normal operation without adversely affecting the internal audio
processing or the differential output signal integrity.
4.1.2.4. Spectral Shaping Noise-Free Notch for AM Radio (Si2705/07 only)
When using Spread Mode PWM with full rate PWM switching (960 kHz), a tunable noise-free notch can be
programmed via 2-Wire control to shape the switching noise and create a narrow frequency band in the AM radio
spectrum in which the PWM common mode switching energy is not allowed to spread. This noise-free notch is
18
Rev. 0.6
Si2704/05/06/07-A10
nominally 20 kHz wide and tunable in 5 kHz increments from 520 to 1710 kHz, virtually equalizing the noise level
across the band. The noise-free notch can be dynamically tuned during normal operation without adversely
affecting the internal audio processing or the differential output signal integrity.
Spread Mode PWM with the tunable noise-free notch is useful for systems in which the Si2705/07 needs to co-exist
with an AM radio receiver. In normal AM radio operation, the system MCU programs the noise-free notch
frequency in the Si2705/07 to the same frequency as the AM radio to inhibit PWM switching noise from interfering
with radio reception. Because Spread Mode PWM is also engaged, switching noise outside of the noise-free notch
band is also suppressed for mitigating broadband EMI radiation
The noise-free notch can be placed at different frequencies by programming property PWM_AM_TUNE_FREQ.
More information on the complete range of programming parameters and settings available for optimized operation
can be found in the “AN469: Si270x Programming Guide”.
Figure 13. PWM CM Spectrum for Spread Mode PWM with Noise-Free Notch
4.2. Operating Modes
The Si2704/05/06/07 features four operating modes: one active mode (Active) and three low power modes
(Standby, Sleep and Power Down). The low power modes differ on power consumption and wake up times,
providing the flexibility to meet system design requirements. See Table 3, “DC Characteristics—Supplies and
Interfaces,” on page 6 for additional information on startup times and power consumption.
Figure 14 illustrates the device state diagram highlighting the key operating modes and the allowed transitions.
For more information concerning operating modes and their programming requirements, refer to “AN469: Si270x
Programming Guide”.
4.2.1. Active Mode
Active mode is the normal operational mode in which the chip accepts digital I2S data at the input, drives an audio
output and is programmable via a 2-Wire interface bus.
Active Mode is initiated by setting the ACTIVE argument of the ACTIVATE command via the 2-Wire interface. To
avoid clicks and pops in the audio output, mute is de-asserted after entering Active Mode.
Rev. 0.6
19
Si2704/05/06/07-A10
RESET
Assert
RESET
Release
RESET
Power Down
Mode
POWER_DOWN
POWER_UP
POWER_DOWN
POWER_DOWN
Standby
Mode
Sleep
Mode
ACTIVATE
ACTIVATE
[ SLEEP / STANDBY ]
[ ACTIVE / STANDBY / AAD ]
ACTIVATE
[ SLEEP / ACTIVE ]
Active
Mode
Figure 14. Operating Modes
4.2.2. Standby Mode
Standby Mode is a reduced power state where the register states are preserved and the 2-Wire interface is fully
operational, allowing for new parameters and configuration settings to be programmed even though the amplifier
output is powered down. This state has the shortest wake-up time relative to the other low power modes. If the
buffered reference clock output (CLKO) is enabled, the timing generation circuitry remains active.
Standby Mode is initiated by setting the STANDBY argument of the ACTIVATE command via the 2-Wire interface.
Standby Mode can also be initiated by setting the AAD argument of the ACTIVATE command, which additionally
enables the Audio Activity Detector. See "4.5.2. Audio Activity Detector" on page 24 for additional information
about this setting.
To avoid clicks and pops in the audio output, mute is first asserted before entering Standby Mode.
4.2.3. Sleep Mode
Sleep Mode is the lowest power consumption state in which the chip parameters and configurations are retained.
However, chip parameter and configuration settings cannot be programmed and the buffered reference clock
output (CLKO) is disabled in this mode. The time to activate the chip is shorter from the Sleep Mode than when
activating from the Power Down Mode.
Sleep mode is initiated by setting the SLEEP argument of the ACTIVATE command.
4.2.4. Power Down Mode and Reset
Asserting the RST pin low disables the analog and digital circuitry, resets the registers to their default settings, and
disables the 2-Wire bus. The RST pin should always be asserted low when power to the device is ramped up, and
released once the power supply voltages have stabilized.
After RST is released high, the chip comes up in Power Down Mode with the registers set to their default values.
The 2-Wire interface remains active but only responds to the POWER_UP command that puts the device into
20
Rev. 0.6
Si2704/05/06/07-A10
Standby Mode so that the high power outputs are prevented from being enabled prior to the registers being
configured. Any other command sent to the device is acknowledged on the bus but ignored by the device. This
mode has the highest wake-up time and lowest power consumption of the three low power modes.
A POWER_DOWN command causes a transition to Power Down Mode, disabling the outputs and resetting all
parameter registers to default values.
4.3. Chip Configuration
The Si270x can be programmed via the 2-Wire interface for several operating configurations.
4.3.1. Multi-Function Pins (MFPs)
Three multi-function pins (MFPs) support a wide range of system configurations while minimizing pin count. These
MFPs are programmed via the 2-Wire interface. Table 13 outlines all available signals, and Table 14 shows the
signal configuration options available on each MFP with the default in bold.
Table 13. Multi-Function Signal Definitions
Signal Name
Functional Description
OUTSEL
Tri-level output mode select
INT
Interrupt flag
2
DIN2
I S data input 2
DIN3
I2S data input 3
DOUT
I2S data output
GPO1–3
General purpose output
The MFPs default to High-Z state. MFP1 can be programmed to be signal INT or GPO1. MFP2 can be
programmed to be signal OUTSEL, DIN2, DOUT2 or GPO2. MFP3 can be programmed to be signal DIN3, DOUT
or GPO3. Table 14 summarizes the MFP configuration options with the default functionality shown in bold.
Table 14. MFP Configuration Options
Pin Name
Pin Number
Signal Options
MFP1
#10 (QFN)
#13 (eTQFP)
High-Z, INT, GPO1
MFP2
#11 (QFN)
#14 (eTQFP)
High-Z, OUTSEL, DIN2, DOUT, GPO2
MFP3
#7 (QFN)
#10 (eTQFP)
High-Z, DIN3, DOUT, GPO3
The Si270x can receive digital I2S audio signal from up to three different sources with the default configuration
being only one input. For cases where more than one signal input is desired or alternatively a signal output is
desired, the MFPs should be programmed to an appropriate configuration with additional DINx/DOUT signals.
Three general purpose output (GPO) pins are also available. The GPOs can be programmed to output logic 1,
logic 0, or a Hi-Z state. These pins can be used for example to control multiplexer switches in the application via
the 2-Wire bus.
MFP pin function is established using the MFP_PIN_CFG command. Refer to the “AN469: Si270x Programming
Guide” for more information on the options and settings requested for operation of the multi function pins.
Rev. 0.6
21
Si2704/05/06/07-A10
4.3.2. Output Mode Configuration (Si2705/07 only)
The Si2705/07 can be programmed via 2-Wire or configured using the OUTSEL MFP to operate in three different
output modes: 2.1 mode, 2.0 mode and aux out mode, with the 2.0 mode being the default. If OUTSEL is not
configured as OUTSEL, these output modes can instead be programmed by setting the argument
OUTSEL_MODE of the ACTIVATE command. Refer to the “AN469: Si270x Programming Guide” for more
information on the options and settings requested for the different operation modes.
OUTSEL is a three-level input with decoding to configure the analog audio signal output at AUXOL/R pins as
shown in Table 15.
Table 15. OUTSEL MFP Decoding
Description
OUTSEL
Output
Configuration
H-Bridge Amplifier
Aux Channel
Analog Output
(mono aux out)
Main Channel
Analog Output
(stereo aux out)
GND
Aux Out Mode
disable
disable
enable
VIO/2
2.0 Mode
enable
disable
disable
VIO
2.1 Mode
enable
enable
disable
For stereo implementations, the 2.0 mode is selected enabling the main channel stereo power stage outputs. This
is the default mode when OUTSEL is not externally driven, or when OUTSEL is driven to mid-level between VIO
and GND.
In 2.1 mode, with OUTSEL driven high to VIO, the main channel stereo power stage is enabled to drive stereo
bridge-tied loads while a PWM DAC produces mono analog audio from the auxiliary channel to drive a subwoofer
or central channel analog input amplifier.
To drive an external stereo analog amplifier (e.g., for headphones) the PWM DAC can be configured to output the
main stereo channel. In this case, OUTSEL is driven low to GND.
To avoid unwanted audible pop noises on the output, the Si270x implements circuitry to minimize the output
transients that occur while charging and discharging the PWM DAC ac coupling capacitor (see C10 and C11 in the
typical application schematic on page 13). The click and pop noise reduction circuit controls the charging and
discharging currents on the capacitors to prevent sudden changes in the output bias level and the consequent
glitches in the output voltage.
Left
channel
PW M
Aux
channel
PW M
R ight
channel
PW M
O U TSEL
1
MUX
Left
2
2
Stereo PW M D AC
AU XO L
MUX
1
R ight
AU XO R
Figure 15. MUX OUTSEL Configuration
OUTSEL can be driven by a headphone plug detection circuit as shown in Figure 16. The ratio between the two
resistors in the diagram configures the outputs for a 2.0 (with R1=R2) or a 2.1 application (with R2>>R1). In this
application example, OUTSEL may be used for enabling and disabling the external amplifiers.
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Rev. 0.6
Si2704/05/06/07-A10
R1
Audio Left
OUTSEL
Audio Right
R2
Figure 16. Headphone Plug Detection Application Schematic
4.4. Clocking
A low jitter on-chip PLL synchronizes to an external clock reference and generates all necessary internal clocks.
Three options are available for the external reference: a crystal, a reference clock or the digital I2S audio bit clock.
In addition, a buffered user-programmable output clock can be generated on the CLKO pin for use as a clock
reference for external circuits.
4.4.1. Reference Clock Input
Using an external crystal, the on-chip crystal oscillator generates a precise, low jitter internal clock reference for the
best audio performance.
For system design flexibility, the device also supports the options to use either an external reference clock or the
I2S bit clock as the PLL reference. Noise performance of the amplifier is a direct function of the jitter characteristics
of the external source.
The source of the external reference is programmed using the CLOCK_SOURCE property through the 2-Wire
interface.
4.4.1.1. Crystal Oscillator Operation
When a crystal is connected between XTLI and XTLO pins and the chip is configured properly all the timing for the
chip is derived from the on-chip crystal oscillator.
A range of crystals are supported and the device needs to be programmed to the selected frequency using the
CLOCK_REF_FREQ property. The crystal oscillator provides the best audio performance.
4.4.1.2. External Reference Clock Operation
In this mode, the device operates in slave clock mode and the reference clock is provided by an external clock
source on pin XTLI. A wide range of input clock frequencies are supported in this mode ranging from 2.048 to
49 MHz. Refer to Table 11 on page 12 or to the “AN469: Si270x Programming Guide” for more information on the
complete range of frequencies and settings required for operation on this mode.
4.4.1.3. I2S Reference Clock Operation
The device can operate in slave clock mode using the DCLK signal from the I2S bus as a timing reference. In this
mode the device needs to be programmed for one of the supported I2S clock rates and pin XTLI should be
connected to ground.
4.4.2. Reference Clock Output
The Si2704/05/06/07 may provide a buffered output clock to be used as reference for external circuits when the
chip is programmed for either Active or Standby mode. The clock output frequency and synchronization source is
programmable.
The Si270x supports a number of reference clock frequencies that are related to the PWM switching rate. These
CLKO output frequencies can be especially useful for synchronizing the amplifier to switching power supplies.
Refer to the “AN469: Si270x Programming Guide” for more information on the settings requested for operation.
Rev. 0.6
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Si2704/05/06/07-A10
4.5. Digital Audio I2S Interface
The Si270x receives digital audio data using its I2S interface. I2S inputs DIN2 and DIN3 can be configured as either
an input or output while DIN is restricted to input only, and all three can be configured to operate in either master or
slave mode. Only one output is supported at a time. All data ports operate synchronously from a single bit-clock
and frame-clock signal. During normal operation, the crossbar mixer outputs are independently programmed to be
a linear combination of any of the channels from the configured inputs with a scaling range from –1 to +1 for each
channel with 8-bit precision.
4.5.1. Auto-Rate Detection
The Si270x features an auto-rate detector. It actively monitors the I2S bit and frame clock inputs during operation,
detects rate changes, and makes the necessary adjustments to various clock system parameters to ensure correct
operation of the amplifier.
4.5.2. Audio Activity Detector
The device has an audio activity detector (AAD) that monitors the presence of audio at the input. In normal
operation, if the input audio level falls below a programmable threshold for a programmable period of time, it
causes the device to enter the low power Standby Mode. When the input audio level subsequently increases above
the threshold, the device returns to normal Active Mode.
4.5.3. Digital Audio Output
The Si270x provides a bypass mode that routes I2S audio input directly to the I2S output port. The output port in
turn can be connected to an off-chip device such as a DAC, DSP or digital media controller.
4.5.4. Audio data formats
The digital audio interface supports 3 different audio data formats: I2S, Left-Justified and DSP Mode.
In I2S mode, the MSB is captured on the second rising edge of DCLK following each DFS transition. The remaining
bits of the word are sent in order, down to the LSB. The left channel is transferred first when the DFS is low, and the
right channel is transferred when the DFS is high. Figure 17 shows a diagram for the I2S digital audio format.
In Left-Justified mode, the MSB is captured on the first rising edge of DCLK following each DFS transition. The
remaining bits of the word are sent in order, down to the LSB. The left channel is transferred first when the DFS is
high, and the right channel is transferred when the DFS is low. Figure 18 shows a diagram for the Left-Justified
digital audio format.
In DSP mode, the DFS becomes a pulse, one DCLK period wide. The left channel is transferred first, followed
immediately by the right channel. There are two options in transferring the digital audio data in DSP mode: the
MSB of the left channel can be transferred on the first rising edge of DCLK following the DFS pulse or on the
second rising edge. Figure 19 shows a diagram for the DSP digital audio format.
In all audio formats, depending on the word size, DCLK frequency and sample rates, there may be unused DCLK
cycles after the LSB of each word before the next DFS transition and MSB of the next word. In this event, for power
saving, in I2S slave mode DCLK sent to the Si270x can be programmed to remain low until the next DFS transition
appears.
The device supports both rising edge and falling edge DCLK. The number of audio bits in each audio sample
defaults to 24 bits and can be configured to 16, 20, 24 or 32 bits. The leading edge and the data format are
selected using the DIGITAL_AUDIO_CONFIG property.
4.5.5. I2S Master Mode
In master mode, the Si270x is configured for 32-bit word per audio sample, rising edge DCLK, and I2S mode data
format.
24
Rev. 0.6
Si2704/05/06/07-A10
(IFALL = 1)
(IFALL = 0)
INVERTED
DCLK
DCLK
DFS
LEFT CHANNEL
I2S 0x00
RIGHT CHANNEL
1 DCLK
DIN
1 DCLK
n-1
n
n-2
2
1
MSB
0
n
LSB
MSB
n-2
n-1
2
1
0
LSB
Figure 17. I2S Digital Audio Format
(IFALL = 1)
INVERTED
DCLK
(IFALL = 0)
DCLK
DFS
LEFT CHANNEL
RIGHT CHANNEL
Left-Justified
0x03
DOUT
n
n-1
n-2
2
1
MSB
0
n
LSB
MSB
n-1
n-2
2
1
0
LSB
Figure 18. Left-Justified Digital Audio Format
DCLK
(IFALL = 0)
DFS
RIGHT CHANNEL
LEFT CHANNEL
DSP 0x06
DOUT
(MSB at 1st rising edge)
n
n-1
n-2
2
1
MSB
DOUT
(MSB at 2 rising edge)
nd
n-1
LSB
MSB
1
0
n
LSB
MSB
n-2
2
n
n-1
n-2
1
0
LSB
LEFT CHANNEL
1 DCLK
DSP 0x04
0
n
RIGHT CHANNEL
2
MSB
n-1
n-2
2
1
0
LSB
Figure 19. DSP Digital Audio Format
Rev. 0.6
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Si2704/05/06/07-A10
4.6. Digital Audio Processing (DAP)
The Si270x implements programmable digital audio processing which features volume control, dynamic range
compressor (DRC), and audio filtering such as tone control, parametric equalization, crossover, and de-emphasis.
The three channel digital audio processing chain for the Si2707 is shown in Figure 20.
I2S
Input 1
I2S
Input 2
I2S
Input 3
Crossbar Mixer
32.0
44.1kHz
48.0
L
L+R
2
R
Asynchronous Sample Rate Converter
48.0 kHz
ß L1
ßR1
ß L2
ßR2
Tone1
Tone2
7 Bi-Quad Parametric EQ
ßM 1
ßM 2
2 Bi-Quad EQ
Treble/Bass Shelving Filters
De-Emphasis
HP Cross Over Filter
LP X-over
Volume Master
Volume Balance
Volume Aux
Dynamic Range Compression
DC Notch Filter
Limiter
Left
channel
Right
channel
Aux
channel
Figure 20. Signal Processing Chain
As outlined in "4.5. Digital Audio I2S Interface " on page 24, the crossbar mixer combines the selected audio
sources and outputs the corresponding Left and Right main channels and an Aux Channel containing any linear
combination of the inputs. The Aux Channel can either be disabled completely, configured as a mono low pass
subwoofer channel, or as a mono full bandwidth center channel according to system requirement.
To make all downstream audio processing independent of the input I2S clock frequencies, an asynchronous
sample rate converter (ASRC) normalizes the input rate to 48 kHz.
Refer to the “AN469: Si270x Programming Guide” for more information on the complete range of programming
parameters and settings requested for operation of the digital audio processing features.
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4.6.1. Parametric Equalization (Si2706/07 only)
The Si2706/07 includes 16 fully programmable parametric equalizer filters. Seven of these filters are implemented
in each of the Left/Right main channels and the remaining two are used for the Aux Channel. The filters are
implemented using a biquad form and can be programmed to shape the frequency response of each channel
independently. The filters implement the configuration presented on Figure 21 which can be represented by the
following equation:
y[n]=b0x[n]+b1x[n-1]+b2x[n-2]+a1y[n-1]+a2y[n-2];
Where x[n] is the input sample and y[n] is the output sample.
0
-1
1
1
-1
-1
2
2
-1
Figure 21. Biquad Filter Configuration
The five coefficients for each biquad are programmed via the 2-Wire interface by using the command
SET_EQ_BIQUAD_FILTER_COEFF.
4.6.2. Tone Control
The Si270x implements tone control in the form of two second order shelving filters for bass and treble. Each filter
has programmable cut-off frequency and boost/cut gain. Cut-off frequency can be adjusted from 5 to 20 kHz by
setting properties BASS_CORNER_FREQ (for bass) and TREBLE_CORNER_FREQ (for treble). Gain can be
adjusted from –18 to +18 dB in 1 dB steps by setting properties BASS_BOOST_CUT (for bass) and
TREBLE_BOOST_CUT (for treble). Figure 22 shows the characteristics of the bass and treble shelving filters.
Gain
Gain
BASS
Shelving Filter
TREBLE
Shelving Filter
Boost
Boost
1
1
Cut
Cut
Cutoff
Freq
Cutoff
Freq
Frequency
Frequency
Figure 22. Generic Bass/Treble Shelving Filter Characteristics
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4.6.3. De-Emphasis (Si2706/07 only)
The Si2706/07 features a de-emphasis filtering option in order to be able to process recorded audio that for noise
reasons has been subject to 50/15 µs pre-emphasis. The 50/15 µs filter implemented has corner frequencies at
3.183 kHz and 10.610 kHz.
4.6.4. Crossover Filter (Si2706/07 only)
The Si2706/07 features a programmable frequency 12 dB/octave Linkwitz-Riley type crossover filter that provides
separation of the low and high frequency content of the audio signal. The filter high-pass output is used to drive the
Left/Right main channel and the low-pass output feeds the Aux Channel to be used in 2.1 Mode with an external
subwoofer power driver. The cutoff frequency can be programmed from 80 to 320 Hz in 40 Hz steps via the 2-Wire
interface by setting the CROSSOVER_FREQ property. The same property can also be used to disable and bypass
the crossover filter.
4.6.5. Digital Volume Controls
The volume control maintains a master volume for all the channels, including the Left/Right main channels and the
Aux Channel. The channel volume can be set in 0.5 dB gain/attenuation steps ranging from –100 dB (mute level)
to +28 dB using the VOLUME_MASTER property.
To prevent audible artifacts due to volume transitions, the slope of the change in volume can be programmed by
configuring the VOLUME_RAMP property. The default configuration is 0.1 dB/ms (dB per millisecond) and
programming can be done in 0.1 dB/ms steps and ranging from 0.1 to 6.3 dB/ms.
The device also provides balance control between the Left and Right channels through the use of the
VOLUME_BALANCE property. This property specifies the audio gain/attenuation division in terms of percent split
between the two channels.
The Aux Channel volume control specifies the percentage of gain/attenuation levels relative to the master volume
using the VOLUME_AUX_CHANNEL property.
Mute is implemented using the VOLUME_MUTE. Un-muting returns the volume setting to the value stored in the
volume registers at the programmed volume transition slope rate. During the mute condition, the PWM outputs
switch at a 50% duty cycle.
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4.6.6. Dynamic Range Compression (Si2706/07 only)
The Si2706/07 features dynamic range compression (DRC) with programmable linear gain, compression
threshold, compression ratio, look ahead time, attack rate, and release rate.
DRC increases the net output power without clipping by decreasing the peak amplitudes of audio signals and
increasing the rms content of the lower amplitude audio signal. Audio signals below the threshold are increased by
the linear gain and audio signals above the threshold are compressed by a pre-defined compression ratio.
Figure 23 shows a plot of dynamic range compression audio processing with the DRC_THRESHOLD parameter
set at –40 dBFS, DRC_GAIN parameter at +20 dB relative to an uncompressed transfer function and
DRC_SLOPE set for a 2:1 compression ratio. For input signals below the compression threshold of –40 dBFS, the
output signal is increased by 20 dB relative to the input signal. For input signals above the compression threshold
the input signal is increased by 1 dB for every 2 dB increase in audio input level.
Figure 23. Dynamic Range Compression Example
In this example, the input dynamic range of 90 dB is reduced to an output dynamic range of 70 dB.
Figure 24 shows the time domain response of the dynamic range compression. The DRC_ATTACK_TIME
parameter sets how quickly the gain compression responds to changes in the input level, and the
DRC_RELEASE_TIME parameter sets how quickly the gain compression returns to linear gain once the audio
input level drops below the compression threshold.
DRC_LOOKAHEAD_TIME allows setting the look ahead time that permits the DRC circuit to adjust the
compression to sudden level changes thus preventing the clipping of the fast changing signal. Refer to “AN503:
Si270x Class-D Amplifier—Dynamic Range Compressor Use” for additional information.
Rev. 0.6
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Si2704/05/06/07-A10
Figure 24. Time Domain Characteristics of the Audio Dynamic Range Controller
4.6.7. Hard Signal Limiter
The device implements a hard limiter to avoid exceeding the maximum modulation rate of the amplifier. The hard
limiter is always enabled.
4.6.8. DC Notch Filter
A dc notch filter with a 5 Hz corner frequency is implemented as the final function in the signal processing chain to
remove any dc component from the output signal. Each channel has a separate dc notch filter.
4.6.9. Tone and Alert Generation
The Si270x includes two independent tone generators with programmable frequencies and on/off times.
The output of both tone generators is fed to a mixer which combines the tones with the I2S inputs. The tones’
amplitudes can be adjusted by programming the mixer coefficients using the SET_AUDIO_INPUT_MIXER
command.
This feature allows customization of audible alarms and alerts. Programmable frequencies range from 100 Hz to
20 kHz in 100 Hz steps and on/off times range from 0 to 65 seconds in 1 ms steps and are set via the 2-Wire
interface using the properties TONE_ONE_FREQ, TONE_ONE_ON_TIME, TONE_ONE_OFF_TIME, and
TONE_ONE_AMPLITUDE
for
the
first
tone
and
TONE_TWO_FREQ,
TONE_TWO_ON_TIME,
TONE_TWO_OFF_TIME, and TONE_TWO_AMPLITUDE for the second tone.
4.7. Fault Detection and Response
To help protect the H-bridge driver and external loads, the output stage has fault detection circuitry that allows the
device to respond to over-current and over-temperature events.
The over-temperature circuitry monitors the temperature of the device and if the temperature exceeds 135 ºC a
thermal error is issued, and the output stage is shut down by transitioning the device to Standby Mode.
The over-current protection circuit constantly monitors the current of the output stage and triggers a fault alarm if
an over-current condition is detected from three different events: a short circuit across the speaker terminals, a
short circuit of any of the outputs to ground and a short circuit of any of the outputs to the supply voltage. In each
case, the detector issues a fault if the 2.5 A current threshold is exceeded. In response to this fault the device
power stage is shut down by transitioning the device to Standby Mode.
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4.8. Power Supply and Grounding Considerations
Careful attention should be given to the power and ground routing to allow for optimal performance of the Si270x.
The low voltage supplies, VDD and VIO, should be decoupled with 0.1 µF capacitors soldered as close to the device
as possible so that parasitic inductances are minimized. For the power stage supplies VPPL and VPPR, each should
be bypassed with a 0.1 µF in ceramic capacitor, located as close to the device as possible, in parallel with a 220 µF
electrolytic capacitor. This allows for optimal filtering in the full frequency spectrum. For detailed information on
board layout considerations and examples refer to “AN470: Si270x Layout Guidelines.”
4.9. Control Interface
An I2C-compatible 2-Wire serial port slave interface allows an external controller to send commands, configure
properties, and receive responses from the Si270x. Commands may only be sent after VIO and VDD supplies are
applied and the RST pin has been released high.
The CLKO pin serves as a configuration boot-strap to select one of two unique addresses to which the Si270x
responds. During reset, if CLKO is pulled low using a 2.2 k resistor connected to ground, then the 7 bit device
address is 1001010 (0x94). If CLKO is left floating, a 22 k internal pull-up within the Si270x causes the 2-Wire to
select a device address of 0011011 (0x36).
A 2-wire transaction begins with the START condition, which occurs when SDIO falls while SCLK is high. Next, the
2-wire master drives an 8-bit control word serially on SDIO which is captured by the device on rising edges of
SCLK. The control word consists of a 7 bit device address followed by a read/write bit (read = 1, write = 0). If the
address matches, the Si270x acknowledges the control word by driving SDIO low on the next falling edge of SCLK.
For write operations, the 2-Wire master sends an eight bit data byte on SDIO following the control word, which is
captured by the device on rising edges of SCLK. The Si270x acknowledges each data byte by driving SDIO low for
one cycle, on the next falling edge of SCLK. The 2-Wire master may write up to eight data bytes during a single
2-wire transaction. The first byte is a command, and the next seven bytes are arguments.
For read operations, after the Si270x has acknowledged the control byte, it drives a data byte on SDIO, changing
the state of SDIO on the falling edge of SCLK. The 2-wire master acknowledges each data byte by driving SDIO
low for one cycle on the next falling edge of SCLK. If a data byte is not acknowledged, the transaction ends. The
2-wire master may read up to 16 data bytes in a single 2-wire transaction. These bytes contain the response data
from the Si270x. A 2-wire transaction ends with the STOP condition, which occurs when SDIO rises while SCLK is
high. For details on timing specifications and diagrams, refer to Table 8 on page 9, Figure 3 on page 11, and
Figure 4 on page 11.
4.10. Programming with Commands
The Si270x provides a simple yet powerful software interface to program configuration and parameter settings. The
device is programmed using commands, arguments, properties, and responses. To perform an action, the user
writes a command byte and associated arguments causing the chip to execute the given command. Commands
control actions, such as powering up the device, shutting down the device, or configure the audio input source.
Arguments are specific to a given command and are used to modify the command. For example, for the
SET_AUDIO_INPUT_MIXER command, arguments are required to set the coefficients of the linear combination of
the sources. Properties are a special command argument used to modify the default chip operation and are
generally configured immediately after power up. Examples of properties include CLOCK_SOURCE and
DEEMPHASIS. A complete list of commands and properties is available in “5. Commands and Properties”.
Responses provide the user information and are returned after a command and associated arguments are sent. At
a minimum, all commands respond with a one-byte status reply indicating interrupt and clear-to-send status
information. Subsequent sections of this data sheet mention many of the commands and properties that are used
to alter different functions. More information on the complete list of programming modes of operation and
properties can be found in the “AN469: Si270x Programming Guide.”
Rev. 0.6
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Si2704/05/06/07-A10
5. Commands and Properties
Table 16 and Table 17 are the summary of commands and properties for the Si270x Class D Audio Amplifier
device.
Table 16. Class D Audio Amplifier Command Summary
Common Commands
Number
Name
Summary
0x01
POWER_UP
Power-up the device.
0x10
FUNC_INFO
Returns the Function revision information of the device.
0x12
SET_PROPERTY
Set the value of a property.
0x13
GET_PROPERTY
Retrieve a property’s value.
0x14
MFP_PIN_CFG
Configure MFP pins.
0x15
SET_AUDIO_INPUT_MIXER
Configure Audio input source.
0x16
OUTSEL
Select amplifier outputs.
0x21
SET_EQ_BIQUAD_FILTER_COEFF
Set Biquad Filter.
0x22
GET_INT_STATUS
Read interrupt status bit.
0x23
GET_FAULT_STATUS
Get the source of the fault condition.
0x24
GET_AUDIO_STATUS
Read back audio parameters.
0x31
ACTIVATE
Enable or disable audio processing & amplifier output operations.
0x32
POWER_DOWN
Power-down the device.
Table 17. Class D Audio Amplifier Property Summary
Category Number
Name
Summary
Interrupt
0x0001
INT_ENABLE
Configure Interrupt Source.
Clock
0x0101
REF_CLOCK_SOURCE
Select the reference source for PLL.
0x0102
REF_CLOCK_FREQ
Set the reference clock freq for the PLL in kHz units.
0x0103
CLOCK_OUT_FREQ
Configure output clock frequency.
0x0104
DIGITAL_AUDIO_SAMPLE_RATE
Set the digital audio sampling rate.
0x0201
DIGITAL_AUDIO_CONFIG
Sets the Digital Audio Input Format Configuration.
0x0301
AAD_CONFIG
Set Audio Activity Detector (AAD) Configuration.
0x0302
AAD_THRESHOLD
Set audio level threshold where the device will go into
standby if the audio input level falls below this threshold.
0x0303
AAD_DURATION
Set how long the signal has been below the threshold
in ms before going to standby state.
I2S
AAD
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Table 17. Class D Audio Amplifier Property Summary (Continued)
Category Number
Biquad
Filter
Volume
DRC
PWM
Programmable
Tone
Name
Summary
0x1901
CROSSOVER_FREQ
Set crossover freq between Main Channel and Aux
Channel.
0x2103
BASS_BOOST_CUT
Set bass shelving filter boost/cut for the Left and Right
Channel.
0x2104
BASS_CORNER_FREQ
Set bass shelving filter corner freq for the Left and
Right Channel.
0x2105
TREBLE_BOOST_CUT
Set treble shelving filter boost/cut for the Left and
Right Channel.
0x2106
TREBLE_CORNER_FREQ
Set treble shelving filter corner freq for the Left and
Right Channel.
0x2201
VOLUME_MUTE
Mute speaker output.
0x2202
VOLUME_MASTER
Set Master Volume.
0x2203
VOLUME_BALANCE
Set L and R Volume Balance from 0% to 100%.
0x2204
VOLUME_AUX_CHANNEL
Set Aux Channel Volume.
0x2205
VOLUME_RAMP
Set volume transition slope.
0x2301
DRC_CONFIG
Configure DRC.
0x2302
DRC_THRESHOLD
Set DRC threshold.
0x2303
DRC_SLOPE
Set the DRC slope. DRC slope is the inverse of DRC
compression ratio.
0x2304
DRC_GAIN
Set DRC gain.
0x2305
DRC_ATTACK_TIME
Set DRC attack time constant in ms units.
0x2306
DRC_RELEASE_TIME
Set DRC release time constant in ms units.
0x2307
DRC_LOOKAHEAD_SAMPLES
Sets the number of look-ahead samples.
0x2701
PWM_CONFIG
Set PWM Output Mode and Max Modulation Index.
0x2702
PWM_FREQ
Set PWM Freq in kHz units.
0x2703
PWM_AM_TUNE_FREQ
Set where the currently AM Tune Freq is to put the
notch when EMI mitigation mode is used.
0x2704
PWM_MAX_MODULATION_INDEX Set PWM maximum modulation index.
0x2705
PWM_OUTPUT_SLEW_RATE
Set output stage slew rate.
0x2901
TONE_ONE_AMPLITUDE
Set programmable tone generator amplitude.
0x2902
TONE_ONE_FREQ
Set programmable tone generator frequency.
0x2903
TONE_ONE_ON_TIME
Set programmable tone generator ON Time in ms.
0x2904
TONE_ONE_OFF_TIME
Set programmable tone generator OFF Time in ms.
0x2905
TONE_TWO_AMPLITUDE
Set programmable tone generator amplitude.
0x2906
TONE_TWO_FREQ
Set programmable tone generator frequency.
0x2907
TONE_TWO_ON_TIME
Set programmable tone generator ON Time in ms.
0x2908
TONE_TWO_OFF_TIME
Set programmable tone generator OFF Time in ms.
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6. Pin Descriptions
DFS
VDD
XTLI
XTLO
RST
VPPL
6.1. 24-Pin QFN Package
24
23
22
21
20
19
DCLK
1
18
OUTPL
DIN
2
17
OUTNL
VIO
3
16
GNDL
SCLK
4
15
GNDR
SDIO
5
14
OUTNR
CLKO
6
13
OUTPR
GND PAD
(Back Paddle)
8
9
10
11
12
AUXOL
MFP1
OUTSEL/MFP2
VPPR
MFP3
7
AUXOR
Top Down View
24-Pin QFN Package
Figure 25. Pin Configuration
Table 18. Pin Descriptions
Pin Number
Name
GND PAD
GND
Low voltage ground for VDD. Connect to PCB ground plane.
1
DCLK
I2S digital I/O data clock.
2
DIN
I2S digital data input port.
3
VIO
I/O supply voltage.
4
SCLK
Serial clock input for I2C-compliant 2-Wire control interface.
5
SDIO
Serial data input/output for I2C-compliant 2-Wire control interface.
6
CLKO
Buffered reference clock output. Configures 2-Wire address on RST.
7
MFP3
Multi-function pin 3.
8
AUXOL
PWMDAC left channel analog output on Si2705/07 (Reserved on Si2704/06).
9
AUXOR
PWMDAC right channel analog output on Si2705/07 (Reserved on Si2704/06).
34
Function
10
MFP1
11
OUTSEL/MFP2
Multi-function pin 1.
12
VPPR
13
OUTPR
Right channel power stage “P” output.
14
OUTNR
Right channel power stage “N” output.
15
GNDR
Right channel power stage ground.
16
GNDL
Left channel power stage ground.
17
OUTNL
18
OUTPL
19
VPPL
Left channel power stage supply voltage.
20
RST
Device reset (active low) input.
21
XTLO
Output select three-level control input: 2.0, 2.1 or line out mode.
Right channel power stage supply voltage.
Left channel power stage “N” output.
Left channel power stage “P” output.
External crystal output.
22
XTLI
Reference clock or external crystal input.
23
VDD
Low voltage supply voltage.
24
DFS
I2S digital I/O data frame synch.
Rev. 0.6
Si2704/05/06/07-A10
42
41
NC
43
NC
XTLO
44
RSTB
XTLI
45
NC
GND
46
NC
47
VDD
NC
48
NC
NC
6.2. 48-Pin eTQFP Package
40
39
38
37
NC
1
36
DFS
2
35
VPPL
DCLK
3
34
OUTPL
DIN
4
33
GND
VIO
5
32
OUTNL
31
GNDL
30
GNDR
OUTNR
NC
GND
6
SCLK
7
SDIO
8
29
CLKO
9
28
GND
NC
10
27
OUTPR
26
VPPR
25
NC
13
14
15
16
17
18
19
20
21
22
23
24
NC
SLEEP/MFP3
AUXOL
AUXOR
GND
VOL/MFP1
OUTSEL/MFP2
NC
NC
Top Down View
48-Pin eTQFP Package
NC
12
NC
11
NC
NC
NC
GND PAD
(Back Paddle)
Figure 26. Pin Configuration
Table 19. Pin Descriptions
Pin Number
Name
Function
1, 10, 11, 12, 13,
14, 15, 16, 23,
24, 25, 36, 37,
38, 39, 45, 46,
47, 48
NC
No connect. Connect to PCB ground plane.
2
DFS
I2S digital I/O data frame synch.
3
DCLK
I2S digital I/O data clock.
4
DIN
I2S digital data input port.
5
VIO
I/O supply voltage.
6, 20, 28, 33, 43
GND
Ground. Connect to PCB ground plane.
7
SCLK
Serial clock input for I2C-compliant 2-Wire control interface.
8
SDIO
Serial data input/output for I2C-compliant 2-Wire control interface.
9
CLKO
Buffered reference clock output. Configures 2-Wire address on RST.
17
MFP3
Multi-function pin 3.
18
AUXOL
PWMDAC left channel analog output on Si2705/07 (Reserved on
Si2704/06).
19
AUXOR
PWMDAC right channel analog output on Si2705/07 (Reserved on
Si2704/06).
21
MFP1
22
OUTSEL/MFP2
26
VPPR
27
OUTPR
Multi-function pin 1.
Output select three-level control input: 2.0, 2.1 or line out mode.
Right channel power stage supply voltage.
Right channel power stage “P” output.
Rev. 0.6
35
Si2704/05/06/07-A10
Table 19. Pin Descriptions (Continued)
36
Pin Number
Name
Function
29
OUTNR
30
GNDR
Right channel power stage ground.
31
GNDL
Left channel power stage ground.
32
OUTNL
Left channel power stage “N” output.
34
OUTPL
Left channel power stage “P” output.
35
VPPL
Left channel power stage supply voltage.
40
RST
Device reset (active low) input.
41
XTLO
External crystal output.
42
XTLI
Reference clock or external crystal input.
44
VDD
Low voltage supply voltage.
Right channel power stage “N” output.
Rev. 0.6
Si2704/05/06/07-A10
7. Ordering Guide
Part Number*
Description
Package Type
Operating
Temperature
Si2704-A10-GM
2.0 EMI Mitigating Class D Power Amplifier
4x4 QFN
Pb-Free
–20 to 85 °C
Si2704-A10-GQ
2.0 EMI Mitigating Class D Power Amplifier
7x7 eTQFP
Pb-Free
–20 to 85 °C
Si2705-A10-GM
2.1 EMI Mitigating Class D Power Amplifier with
tunable noise notch for AM radio
4x4 QFN
Pb-Free
–20 to 85 °C
Si2705-A10-GQ
2.1 EMI Mitigating Class D Power Amplifier with
tunable noise notch for AM radio
7x7 eTQFP
Pb-Free
–20 to 85 °C
Si2706-A10-GM
2.0 EMI Mitigating Class D Power Amplifier with
EQ/DRC
4x4 QFN
Pb-Free
–20 to 85 °C
Si2706-A10-GQ
2.0 EMI Mitigating Class D Power Amplifier with
EQ/DRC
7x7 eTQFP
Pb-Free
–20 to 85 °C
Si2707-A10-GM
2.1 EMI Mitigating Class D Power Amplifier with
tunable noise notch for AM radio with EQ/DRC
4x4 QFN
Pb-Free
–20 to 85 °C
Si2707-A10-GQ
2.1 EMI Mitigating Class D Power Amplifier with
tunable noise notch for AM radio with EQ/DRC
7x7 eTQFP
Pb-Free
–20 to 85 °C
*Note: Add an “R” at the end of the device part number to denote tape and reel option.
Rev. 0.6
37
Si2704/05/06/07-A10
8. Package Outline
8.1. 24-Pin QFN Package
Figure 27 illustrates the package details for 24-pin QFN package option for the Si2704/05/06/07. Table 20 lists the
values for the dimensions shown in the illustration.
Figure 27. 24-Pin QFN
Table 20. 24-Pin QFN Package Dimensions
Dimension
Min
Nom
Max
Dimension
Min
Nom
Max
A
0.80
0.85
0.90
E2
2.40
2.50
2.60
A1
0.00
0.02
0.05
L
0.20
0.25
0.30
b
0.18
0.25
0.30
aaa
—
—
0.10
bbb
—
—
0.10
ccc
—
—
0.08
D
D2
4.00 BSC
2.40
2.50
2.60
e
0.50 BSC
ddd
—
—
0.10
E
4.00 BSC
eee
—
—
0.10
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VGGD-8.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
38
Rev. 0.6
Si2704/05/06/07-A10
8.2. 48-Pin eTQFP Package
Figure 28 illustrates the package details for 48-pin eTQFP package option for the Si2704/05/06/07. Table 21 lists
the values for the dimensions shown in the illustration.
Figure 28. 48-Pin eTQFP
Rev. 0.6
39
Si2704/05/06/07-A10
Table 21. 48-Pin eTQFP Package Dimensions
Dimension
Min
Nom
Max
Dimension
Min
Nom
Max
A
—
—
1.20
E
9.00 BSC
A1
0.05
—
0.15
E1
7.00 BSC
A2
0.95
1.00
1.05
E2
3.71
3.81
3.91
b
0.17
0.22
0.27
L
0.45
0.60
0.75
c
0.09
—
0.20
aaa
—
—
0.20
D
9.00 BSC
bbb
—
—
0.20
D1
7.00 BSC
ccc
—
—
0.08
ddd
—
—
0.08
Θ
0°
3.5°
7°
D2
e
3.71
3.81
3.91
0.50 BSC
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1982.
3. This drawing conforms to JEDEC outline MS-026, variation ABC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
40
Rev. 0.6
Si2704/05/06/07-A10
9. Package Markings (Top Marks)
9.1. Si2707 Top Mark (QFN)
9.2. Top Mark Explanation
Mark Method
YAG Laser
Line 1 Marking
Part Number
04 = Si2704
05 = Si2705
06 = Si2706
07 = Si2707
Firmware Revision
10 = Firmware Revision 1.0
Die Revision
A = Revision A Die
TTTTT = Internal Code
Internal Tracking Code
Circle = 0.5 mm Diameter
(Bottom-Left Justified)
Pin 1 Identifier
YY = Year
WW = Work Week
Assigned by the Assembly House. Corresponds to the year
and work week of the mold date.
Line 2 Marking
Line 3 Marking
Rev. 0.6
41
Si2704/05/06/07-A10
9.3. Si2707 Top Mark (eTQFP)
9.4. Top Mark Explanation
Mark Method
YAG Laser
Line 1 Marking
Part Number
Si2704
Si2705
Si2706
Si2707
Firmware Revision
10 = Firmware Revision 1.0
Die Revision
A = Revision A Die
TTTTT = Internal Code
Internal Tracking Code
Circle = 0.5 mm Diameter
(Bottom-Left Justified)
Pin 1 Identifier
YY = Year
WW = Work Week
Assigned by the Assembly House. Corresponds to the year
and work week of the mold date.
Line 2 Marking
Line 3 Marking
42
Rev. 0.6
Si2704/05/06/07-A10
10. Additional Reference Resources










Si270x Evaluation Board User’s Guide
AN469: 270x Programming Guide
AN470: 270x Layout Guidelines
AN502: Si270x Class-D Amplifier—Analog Source Setup
AN503: Si270x Class-D Amplifier—Dynamic Range Compressor Use
AN504: Si270x Class-D Amplifier—Dynamic Bass Configuration
AN505: Si270x Class-D Amplifier—Measuring Output Power
AN509: Si270x Class-D Amplifier—Ferrite Bead Filter
AN510: Si270x Class-D Amplifier—Calculating Filter Loss
Si270x Customer Support Site:
http://www.silabs.com
This site contains all application notes, evaluation board schematics and layouts, and evaluation software. NDA
is required for access to some of these documents. To request access, send mysilabs user name and request
for access to [email protected].
Rev. 0.6
43
Si2704/05/06/07-A10
DOCUMENT CHANGE LIST
Revision 0.4 to Revision 0.5







Updated Table 3 on page 6.
Updated Table 4 on page 7.
Updated Table 5 on page 7.
Updated Table 6 on page 8.
Updated Table 11 on page 12.
Updated "2. Typical Application Schematic" on page
13.
Updated Figure 15 on page 22.
Added "4.5.5. I2S Master Mode" on page 24.
 Added note to "7. Ordering Guide" on page 37.
 Added "9. Package Markings (Top Marks)" on page
41.
 Added "9.3. Si2707 Top Mark (eTQFP)" on page 42.

Revision 0.5 to Revision 0.6









Updated eTQFP pin assignments on pages 1 and
35.
Updated eTQFP pin descriptions in Table 19 on
page 35.
Updated Table 1 on page 5.
Updated Table 3 on page 6.
Updated Table 4 on page 7.
Updated Table 5 on page 7.
Updated Table 11 on page 12.
Updated "2. Typical Application Schematic" on page
13.
Updated "3. Typical System Configurations" on page
14
Updated
Updated
Figure 6 on page 14.
Figure 9 on page 15.

Updated "4. Functional Description" on page 16.
 Updated "4.4.1.2. External Reference Clock
Operation" on page 23.
 Updated "5. Commands and Properties" on page 32.
Updated
Updated

44
Table 16 on page 32.
Table 17 on page 32.
Updated "10. Additional Reference Resources" on
page 43.
Rev. 0.6
Si2704/05/06/07-A10
NOTES:
Rev. 0.6
45
Si2704/05/06/07-A10
CONTACT INFORMATION
Silicon Laboratories Inc.
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Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
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Email: [email protected]
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The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to
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46
Rev. 0.6