FSA850 Audio 3-Pole / 4-Pole MIC-GND Switch Description Features Switch Type VCC THD (MIC) ESD IEC 61000-4-2 (Air Gap) IEC 61000-4-2 (Contact) HBM (All Pins) GNDnA/GNDnB to GND Power to GND CDM Operating Temperature RON Maximum (GND1n) RON Maximum (SENSE) 3-Pole/4-Pole MIC - GND 2.3 to 4.5 V 0.001% Typical Applications 3.5 mm and 2.5 mm Audio Jacks Cellular Phones, Smart Phones MP3 and PMP (Portable Media Player) 15 kV 8 kV 3 kV 8 kV 10 kV 2 kV -40°C to 85°C 0.08 Ω 1Ω The FSA850 is a 3-pole or 4-pole audio jack microphone GND switch for accessories with General-Purpose Input / Output (GPIO) control signals. The FSA850 also has the ability to perform 4-pole cross-point switching to support Open Mobile Terminal Platform (OMTP) 4-pole headset plugs. The architecture is designed to replace discrete MOSFET solutions and allow common third-party headphones to be used for listening to music or playing video from mobile handsets, personal media players, and portable peripheral devices. Supports 4-Pole OMTP Cross Point Switching for GND Connection Integrates a MIC switch for 3- or 4-Pole Configuration Headset Plugs Reduces “Pop and Click” Caused by Microphone Bias Related Resources For samples and questions, please contact: [email protected]. Typical Application Figure 1. Typical Mobile Application © 2011 Fairchild Semiconductor Corporation FSA850 • Rev. 1.0.0 www.fairchildsemi.com FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch August 2012 FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch Physical Dimensions 0.03 C E 2X F A 0.80 B 1.20 PIN 1 AREA 0.40 D (Ø0.200) Cu Pad (Ø0.300) Solder Mask 0.40 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.378±0.018 0.208±0.021 0.625 0.547 0.05 C C SEATING PLANE D SIDE VIEWS 0.005 0.80 0.40 1.20 NOTES: A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. D C B A 0.40 C A B Ø0.260±0.02 12X C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. (Y)±0.018 F D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. 1 2 3 (X)±0.018 E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS). BOTTOM VIEW F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILENAME: MKT-UC012ACrev1. Figure 4. 12-Bump, Wafer-Level Chip Scale Package (WLCSP), 1.2mmx1.6mm, 0.4mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Ordering Information Part Number Operating Temperature Range Top Mark Package FSA850UCX -40 to +85°C M5 12-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x4 Array, 0.4mm Pitch, 250 µm Ball © 2011 Fairchild Semiconductor Corporation FSA850 • Rev. 1.0.0 D E X Y 1.16 mm 1.56 mm 0.18 mm 0.18 mm www.fairchildsemi.com 6 FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch © 2011 Fairchild Semiconductor Corporation FSA850 • Rev. 1.0.0 www.fairchildsemi.com 7