FSUSB63 — 3:1 High-Speed USB 2.0 Switch / Multiplexer Description Features Switch Type USB Break-Before-Make Time RON CON Bandwidth VCC VCNTRL Operating Temperature ICCSLP ICCACT Package Top Mark Ordering Information 3:1 USB Switch USB 2.0 High-Speed & Full-Speed Compliant 126µs 6Ω Typical 6pF Typical 830MHz 2.7 to 4.4V 0 to VCC -40°C to 85°C <1µA 7.5µA Typical 12- Lead UMLP 1.80 x 1.80 x 0.55mm, 0.40mm pitch KG FSUSB63UMX The FSUSB63 is a bi-directional, low-power, High-Speed (HS) USB 2.0 3:1 Multiplexer (MUX). It is optimized for switching among three high-speed (480Mbps) sources or any combination of high-speed and full-speed (12Mbps) USB sources, such as an application processor, to one USB 2.0 connector. The FSUSB63 has a break-before-make time to force reenumeration by the host when switching between different HS USB 2.0 controllers and thus requires minimal software changes. The FSUSB63 is compliant with the requirements of USB 2.0 and features extremely low on capacitance (CON). The wide bandwidth exceeds the requirement to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk also minimizes interference. Applications Related Resources Cell Phone, Digital Camera, Notebook LCD Monitor, TV, and Set-Top Box Netbook, Mobile Internet Device (MID) For samples and questions, please contact: [email protected]. FSUSB63 Demonstration Board Typical Application Figure 1. Analog Symbol © 2010 Fairchild Semiconductor Corporation FSUSB63 • Rev. 1.0.4 www.fairchildsemi.com FSUSB63 – 3:1 High-Speed USB 2.0 Switch / Multiplexer July 2012 FSUSB63 – 3:1 High-Speed USB 2.0 Switch / Multiplexer Physical Dimensions 1.80 0.10 C A (11X) 2.10 B 0.563 0.588 2X 1 1.80 0.40 2.10 PIN#1 IDENT 0.10 C TOP VIEW 0.55 MAX. 0.10 C (12X) 0.20 2X RECOMMENDED LAND PATTERN 0.152 0.45 0.35 0.08 C 0.05 0.00 0.10 SEATING C PLANE SIDE VIEW 0.10 0.10 DETAIL A SCALE : 2X NOTES: 0.35 (11X) 0.45 3 A. PACKAGE DOES NOT FULLY CONFORM TO JEDEC STANDARD. B. DIMENSIONS ARE IN MILLIMETERS. 6 0.40 DETAIL A C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 1 PIN#1 IDENT 12 9 BOTTOM VIEW D. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN ONLY. 0.25 0.15 (12X) 0.10 C A B 0.05 C E. DRAWING FILENAME: MKT-UMLP12Arev4. PACKAGE EDGE LEAD OPTION 1 SCALE : 2X LEAD OPTION 2 SCALE : 2X Figure 18. 12-Lead, Ultrathin Molded Leadless Package (UMLP) Ordering Information Part Number Top Mark FSUSB63UMX KG Operating Temperature Range Package 12-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.8mm x 1.8mm x 0.55mm, 0.4mm pitch -40 to +85°C Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2010 Fairchild Semiconductor Corporation FSUSB63 • Rev. 1.0.4 www.fairchildsemi.com 10 FSUSB63 – 3:1 High-Speed USB 2.0 Switch / Multiplexer © 2010 Fairchild Semiconductor Corporation FSUSB63 • Rev. 1.0.4 www.fairchildsemi.com 11