ST1394 ® IPAD™ IEEE1394 ONE PORT CABLE TERMINATION NETWORK WITH ESD PROTECTION DIODES MAIN APPLICATIONS IEEE1394 line termination on: ■ ■ ■ ■ ■ TPB+ TPATpBias Desktops Notebooks Digital Camcorders External storage drive Set Top Box FEATURES ■ Line termination for 2 twisted pairs TPA and TPB ■ The device complies with IEEE1394 requirement for differential and common more impedance on TPA and TPB line ■ Monolithic device with complete termination for one IEEE1394 connection 139 TPBGND TPA- SOT23-6L (Plastic) Table 1: Order Code Part Number ST1394-01SC6 Marking 139 DESCRIPTION The ST1394-01SC6 is an integrated termination network that optimizes board layout of the PHY layer in IEEE1394 one port cable application. This monolithic device is tested, according to ESD requirement described in IEC61000-4-2 standard level 2. ST1394-01SC6 device ruggedness limits overvoltage at the 1394 tranceiver inputs and outputs below acceptable limits. The ST1394-01SC6 implements IEEE1394 recommendation for line termination of TPA and TPB differential lines. Excellent matching of the termination resistor will minimize common mode noise that is needed to improve communication speed. Figure 1: Pinout Configuration TPA+ TpBias R1 R2 GND TPAC TPB- R5 R4 TPB+ R3 BENEFITS ■ ■ ■ ■ ■ Resistor matching between TPA / TPB lines. Resistor matching between TPA+ / TPASingle chip devise versus 11 discretes No need for additional overvoltage protection device High level of integration Lines TPA+ TPA- TPB+ TPB- Rpd GND Zener Capacitance Names R1 R12 R3 R4 R5 C Cz Value 55Ω 55Ω 55Ω 55Ω 55Ω 250pF 5pF Tolerance Typ. Typ. Typ. Typ. 20% 20% Max. Matching Matching between 55Ω Resistor at ±1% max TM: IPAD is a trademark of STMicroelectronics. October 2004 REV. 2 1/6 ST1394 Table 2: Absolute Ratings (Tamb = 25°C) Symbol Parameter and test conditions Tstg Storage temperature range Tj Maximum junction temperature TL Lead solder temperature (10 second duration) Value Unit - 55 to + 150 °C + 150 °C 260 °C Table 3: Electrical Characteristics (Tamb = 25°C) Symbol Parameter Min. Typ. R1, R2, R3, R4 Bus termination resistors (note 1) CZ Zener capacitance Rpd Pull down resistor C 5 Bus termination impedance 102 Unit Ω 55 Capacitor in parallel with Rpd (R1+R2), (R3+R4) Max. pF 5 kΩ 250 pF 110 118 Ω Note 1: matching between 55Ω resistors is better than ± 1%. Figure 2: Functionnal Diagram TpBias 1µF TPA+ Twisted Pair A TPA55Ω 55Ω 250pF 55Ω 5kΩ 55Ω TPB+ TPB- Twisted Pair B 1MΩ Minimize this distance 0.01µF Outer shied 0.1µF termination APPLICATION INFORMATION The functional diagram here above presents a IEEE1394-a cable and shows how to connect the ST1394-01SC6 in order to correctly terminate and filter the TPA and TPB lines. 2/6 ST1394 TECHNICAL INFORMATION: Frequency behavior of data and strobe signals Figure 3: Measurement confitions RF test board +5V TRACKING GENERATOR Figure 4: Test Board Calibration kit board SPECTRUM ANALYSER 50Ω ST1394 50Ω Vg Vin Vout Figure 5: TPA line: comparison between Aplac model and device Figure 6: TPB line: comparison between Aplac model and device 0.00 dB 0.00 dB -5.00 -5.00 -10.00 -15.00 -20.00 -10.00 -25.00 -30.00 -35.00 -15.00 -40.00 -45.00 -20.00 100.0k 1.0M Line 1 10.0M 100.0M f/Hz SimLine 1 1.0G -50.00 100.0k 1.0M Line 2 10.0M 100.0M f/Hz SimLine 2 1.0G Note: For a convenience reason, frequency response have been carried out on both TPA and TPB lines as if TPA+ and TPA- or TPB+ and TPB- were respectively Inputs and Outputs lines 3/6 ST1394 Figure 7: Crosstalk between TPA and TPB lines 0.00 dB -25.00 -50.00 -75.00 -100.00 100.0k 1.0M 10.0M 100.0M f/Hz 1.0G Figure 8: CST1394 APLAC model Lbond 55 Rbond 55 Lpin Lbond Rbond Rpin Lframe Lpin 250p Ls 5k Lbond Rs=100m Lbond Rpin 55 Rbond Lpin 55 Rs Lpin=230p Rbond Ls Rpin=50m Rframepin Lpin Lpin Port10 Rs Lbond=420p Lgnd Rpin Rbond=50m Rpin Port9 Rgnd Ls Ls Rs LFrame=80p Rframepin=8.6m Rs Lgnd=50p Rgnd=50m Port11 Port12 4/6 Ls=1n Cdiode=4p ST1394 Figure 9: SOT23-6L Package Mechanical Data DIMENSIONS REF. A2 Min. A D Typ. Max. 0 A2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.02 C 0.09 0.20 0.004 0.008 D 2.80 3.05 0.110 0.120 E 1.50 1.75 0.059 0.069 e θ e Min. 0.90 E c Max. A L H Typ. Inches A1 b A1 Millimeters e 1.45 0.035 0.057 0.10 0.004 0 0.95 0.037 H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 θ 10° 10° Figure 10: SOT23-6L Foot print dimensions (in millimeters) 0.60 TPBIAS 1.20 TPA+ TPA- TPA+ TpBias TPB+ GND TPA- TPB- TPB+ TPB- AGND 1.10 AVDD 2.30 AVDD 3.50 AGND 0.95 Table 4: Ordering Information Ordering code Marking Package Weight Base qty Delivery mode ST1394-01SC6 139 SOT23-6L 16.7 mg 3000 Tape & reel Note: More informations are available in the application note: AN1783: “HOW TO MAKE FIRE-WIRE COMMUNICATION PORT SAFE?” Table 5: Revision History Date Revision Jul-2003 1A 28-Oct-2004 2 Description of Changes First issue. SOT23-6L package dimensions change for reference “D” from 3.0 millimeters (0.118 inches) to 3.05 millimeters (0.120 inches). 5/6 ST1394 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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