EMIF04-MMC02F2 ® 4 LINES EMI FILTER INCLUDING ESD PROTECTION IPAD™ MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required: ■ MultiMedia Card for mobile phones, Personal Digital Assistant, Digital Camera, MP3 players... DESCRIPTION The EMIF04-MMC02 is a highly integrated devices designed to suppress EMI/RFI noise for MultiMedia Card port. The EMIF04 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. Flip-Chip (11 Bumps) Table 1: Order Code Part Number EMIF04-MMC02F2 BENEFITS ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ Lead free package ■ Very low PCB space consuming: 1.57 mm x 2.07 mm ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reducing of parasitic elements through integration & wafer level packaging. Marking FH Figure 1: Pin Configuration (ball side) COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 15kV (air discharge) 8kV (contact discharge) 3 2 1 I1 O1 I2 VD2 O2 B I3 VD1 O3 C I4 GND O4 D A Figure 2: Configuration VD2 R20 VD1 R10 R1 O1 (Data) I1 R2 I2 R3 I3 O2 (CLK) O3 (CMD) O4 I4 R4 Cline = 20pF max. GND TM: IPAD is a trademark of STMicroelectronics. April 2005 REV. 2 1/7 EMIF04-MMC02F2 Table 2: Absolute Ratings (Tamb = 25°C)) Symbol Parameter and test conditions Value Unit PR DC power per resistor 70 mW Tj Maximum junction temperature 125 °C Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C Table 3: Electrical Characteristics (Tamb = 25°C) Symbol Parameter VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input & Output Cline Input capacitance per line Symbol Test conditions VBR IR = 1 mA IRM VRM = 3V Cline @ 0V Min. Typ. Max. 6 Unit V 100 500 nA 20 pF R1,R2,R3,R4 Tolerance ± 5% 47 Ω R10 Tolerance ± 5% 13 kΩ R20 Tolerance ± 5% 56 kΩ 2/7 EMIF04-MMC02F2 Figure 3: S21 (dB) attenuation measurement and Aplac simulation Figure 4: Crosstalk measurements Xtalk measurements C3/B1 EMIF04-MMC02F2: Aplac vs measurement (C3/C1 line) 0.00 dB - 5.00 0.00 dB -10.00 Simulation - 10.00 -20.00 Measurement - 15.00 -30.00 - 20.00 -40.00 - 25.00 - 30.00 -50.00 - 35.00 -60.00 - 40.00 -70.00 - 45.00 -80.00 1.0M - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz 300.0M 1.0G 3.0G Figure 5: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout) 3.0M 10.0M 30.0M 100.0M 300.0M f/Hz 1.0G 3.0G Figure 6: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and on one output (Vout) V(in) V(in) V(out) V(out) Figure 7: Junction capacitance versus reverse voltage applied (typical values) C(pF) 20 F=1MHz Vosc=30mVRMS Tj=25°C 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VR(V) 3/7 EMIF04-MMC02F2 Figure 8: Aplac model device structure B2 C2 R20 R10 R1 A2 A3 R2 B1 B3 R3 C3 C1 R4 D1 D3 MODEL = demif04 MODEL = demif04 MODEL = demif04_gnd DEMIF04 BV = 7 IBV = 1m CJO = Cz M = 0.3333 RS = 1 VJ = 0.6 TT = 100n 120pH 100m D2 DEMIF04 gnd BV = 7 IBV = 1m CJO = Cz_gnd M = 0.3333 RS = 1 VJ = 0.6 TT = 100n Figure 9: Aplac model connections D2 Cins Rins Rins A3 Cins A2 Lbump Cins Rins Rins Cins Rbump B3 Cins B1 Rins Rins Lhole C3 C1 cap_hole Cins Rins Rhole Rins D3 Cins D1 Rins 4/7 Cins Cins Rins Cins R1 47 opt R2 47 R3 47 R4 47 R10 13k R20 56k Cz 15pF opt Cz_gnd 45pF opt Ls 450pH opt Rs 300m Rbump 50m Lbump 50pH lhole 940pH opt Rhole 100m cap_hole 0.15pF Cins 200fF Rins 10Meg EMIF04-MMC02F2 Figure 10: Order Code EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm = 3: Leadfree Pitch = 400µm, Bump = 250µm Figure 11: FLIP-CHIP Package Mechanical Data 650µm ± 65 315µm ± 50 2.07mm ± 50µm 500µm ± 50 500µm ± 50 1.57mm ± 50µm Figure 12: Foot Print Recommendations Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) 545 E Solder stencil opening : 330µm x x z y ww 100 230 Solder mask opening recommendation : 340µm min for 315µm copper pad diameter 400 545 Copper pad Diameter : 250µm recommended , 300µm max Figure 13: Marking All dimensions in µm 5/7 EMIF04-MMC02F2 Figure 14: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location 1.75 +/- 0.1 Ø 1.5 +/- 0.1 4 +/- 0.1 3.5 +/- 0.1 ST E xxz yww ST E xxz yww ST E xxz yww 8 +/- 0.3 0.73 +/- 0.05 4 +/- 0.1 User direction of unreeling All dimensions in mm Table 4: Ordering Information Ordering code Marking Package Weight Base qty Delivery mode EMIF04-MMC02F22 FH Flip-Chip 4.5 mg 5000 Tape & reel 7” Note: More packing informations are available in the application note AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" Table 5: Revision History 6/7 Date Revision 14-Oct-2004 1 First issue. Description of Changes 06-Apr-2005 2 Minor layout update. No content change. EMIF04-MMC02F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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