STPS15L45CB ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCTS CHARACTERISTICS IF(AV) 2 x 7.5 A VRRM 45 V Tj (max) 150 °C VF (max) 0.46 V A1 K A2 K FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW FORWARD VOLTAGE DROP AVALANCHE CAPABILITY SPECIFIED ■ ■ ■ A2 ■ A1 ■ DPAK DESCRIPTION Dual center tab Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Package in DPAK, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) Parameter Value 45 Unit V RMS forward current 10 A Average forward current Per diode 7.5 Per device 15 Repetitive peak reverse voltage Tc = 140°C δ = 0.5 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A IRRM Peak repetitive reverse current tp=2 µs square F=1kHz 1 A PARM Repetitive peak avalanche power tp = 1µs 3700 W - 65 to + 175 °C Tstg Tj dV/dt * : Storage temperature range Tj = 25°C Maximum operating junction temperature * Critical rate of rise reverse voltage 150 °C 10000 V/µs dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed : 2A 1/4 STPS15L45CB THERMAL RESISTANCES Symbol Rth(j-c) Junction to case Rth(c) Parameter Value 4 2.4 0.7 Per diode Total Coupling Unit °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameter Tests Conditions IR * Reverse leakage current Tj = 25°C VR = VRRM Min. Typ. Max. 1 Unit mA 23 45 mA 0.52 V Tj = 125°C VF * Forward voltage drop Tj = 25°C IF = 7.5 A Tj = 125°C IF = 7.5 A Tj = 25°C IF = 12 A Tj = 125°C IF = 12 A Tj = 25°C IF = 15 A Tj = 125°C IF = 15 A 0.40 0.46 0.60 0.49 0.57 0.64 0.53 0.63 Pulse test : * tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.29 x IF(AV) + 0.023 IF2(RMS) Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (δ = 0.5). IF(av)(A) PF(av)(W) 5.5 9 5.0 δ = 0.5 δ = 0.2 4.5 8 δ = 0.1 4.0 Rth(j-a)=Rth(j-c) 7 δ = 0.05 δ=1 3.5 6 3.0 5 2.5 4 Rth(j-a)=70°C/W 2.0 3 1.5 T 0.5 1 IF(av)(A) δ=tp/T 0.0 0 1 2 3 4 5 T 2 1.0 6 7 8 δ=tp/T tp 0 9 10 Fig. 3: Normalized avalanche power derating versus pulse duration. 0 25 50 75 100 125 150 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 Tamb(°C) tp 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 2/4 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 0 25 50 75 100 125 150 STPS15L45CB Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IM(A) 100 1.0 90 0.9 80 0.8 70 0.7 60 0.6 δ = 0.5 50 0.5 Tc=25°C 40 Tc=75°C 30 Tc=125°C 20 0.4 δ = 0.2 0.3 δ = 0.1 T 0.2 IM Single pulse 10 t 0.1 t(s) δ=0.5 0 tp(s) δ=tp/T 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 1.E-03 1.E-02 tp 1.E-01 1.E+00 Fig. 8 Junction capacitance versus reverse voltage applied (typical values). IR(mA) C(nF) 1.E+02 10.0 Tj=150°C F=1MHz Vosc=30mV Tj=25°C Tj=125°C 1.E+01 Tj=100°C 1.E+00 1.0 Tj=75°C Tj=50°C 1.E-01 Tj=25°C VR(V) VR(V) 1.E-02 0.1 0 5 10 15 20 25 30 35 40 45 Fig. 9: Forward voltage drop versus forward current. 1 10 100 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35µm). IFM(A) Rth(j-a)(°C/W) 100 100 Tj=125°C (Maximum values) 90 80 70 Tj=125°C (Typical values) 60 10 50 40 Tj=25°C (Maximum values) 30 20 VFM(V) 10 1 S(cm²) 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 2 4 6 8 10 12 14 16 18 20 3/4 STPS15L45CB PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. Millimeters Inches A A1 A2 B B2 C C2 D E G H L2 L4 V2 Min. Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0° 8° Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0° 8° FOOTPRINT (dimensions in mm) 6.7 6.7 3 3 1.6 1.6 2.3 ■ 2.3 Ordering type Marking Package Weight Base qty Delivery mode STPS15L45CB S15L45C DPAK 0.30 g 75 Tube STPS15L45CB-TR S15L45C DPAK 0.30 g 2500 Tape & reel EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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