STMICROELECTRONICS VNQ830M13TR

VNQ830M
®
QUAD CHANNEL HIGH SIDE DRIVER
TYPE
VNQ830M
RDS(on)
60 mΩ (*)
IOUT
6 A (*)
VCC
36 V
(*) Per each channel
CMOS COMPATIBLE INPUTS
OPEN DRAIN STATUS OUTPUTS
■ ON STATE OPEN LOAD DETECTION
■ OFF STATE OPEN LOAD DETECTION
■ SHORTED LOAD PROTECTION
■ UNDERVOLTAGE AND OVERVOLTAGE
SHUTDOWN
■ LOSS OF GROUND PROTECTION
■ VERY LOW STAND-BY CURRENT
■
■
■
REVERSE BATTERY PROTECTION (**)
DESCRIPTION
The VNQ830M is a quad HSD formed by
assembling two VND830M chips in the same SO28 package. The VND830M is a monolithic device
made by using| STMicroelectronics VIPower M03 Technology. The VNQ830M is intended for
driving any type of multiple loads with one side
connected to ground.
Active V CC pin voltage clamp protects the device
SO-28 (DOUBLE ISLAND)
ORDER CODES
PACKAGE
SO-28
TUBE
T&R
VNQ830M
VNQ830M13TR
against low energy spikes (see ISO7637 transient
compatibility table). Active current limitation
combined with thermal shutdown and automatic
restart protects the device against overload.
The device detects open load condition both in on
and off state. The openload threshold is aimed at
detecting the 5W/12V standard bulb as an
openload fault in the on state. Output shorted to
VCC is detected in the off state. Device
automatically turns off in case of ground pin
disconnection.
ABSOLUTE MAXIMUM RATING
Symbol
VCC
- VCC
- IGND
IOUT
- IOUT
IIN
ISTAT
VESD
Ptot
EMAX
Tj
Tstg
Parameter
DC Supply Voltage
Reverse DC Supply Voltage
DC Reverse Ground Pin Current
DC Output Current
Reverse DC Output Current
DC Input Current
DC Status Current
Electrostatic Discharge (Human Body Model: R=1.5KΩ; C=100pF)
Value
41
- 0.3
- 200
Internally Limited
-6
+/- 10
+/- 10
Unit
V
V
mA
A
A
mA
mA
- INPUT
4000
V
- STATUS
4000
V
- OUTPUT
5000
V
- VCC
Power Dissipation Tpins=25°C
Maximum Switching Energy
5000
6.25
V
W
77
mJ
Internally Limited
- 55 to 150
°C
°C
(L=1mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=10.5A)
Junction Operating Temperature
Storage Temperature
(**) See application schematic at page 9
January 2003
1/20
VNQ830M
BLOCK DIAGRAM
VCC1,2
Vcc
OVERVOLTAGE
CLAMP
UNDERVOLTAGE
GND1,2
CLAMP 1
OUTPUT1
INPUT1
DRIVER 1
CLAMP 2
STATUS1
CURRENT LIMITER 1
LOGIC
DRIVER 2
OUTPUT2
OVERTEMP. 1
OPENLOAD ON 1
CURRENT LIMITER 2
INPUT2
OPENLOAD OFF 1
OPENLOAD ON 2
STATUS2
OPENLOAD OFF 2
OVERTEMP. 2
VCC3,4
Vcc
CLAMP
OVERVOLTAGE
UNDERVOLTAGE
GND3,4
CLAMP 3
OUTPUT3
INPUT3
DRIVER 3
CLAMP 4
STATUS3
CURRENT LIMITER 3
OVERTEMP. 3
LOGIC
DRIVER 4
OUTPUT4
OPENLOAD ON 3
CURRENT LIMITER 4
INPUT4
OPENLOAD OFF 3
OPENLOAD ON 4
STATUS4
OPENLOAD OFF 4
OVERTEMP. 4
2/20
VNQ830M
CURRENT AND VOLTAGE CONVENTIONS
IS1,2
IS3,4
VCC1,2
VCC1,2
VCC3,4
VCC3,4
IIN1
ISTAT1
VIN1
IIN2
VSTAT1
ISTAT2
VIN2
IIN3
VSTAT2
ISTAT3
VIN3
IIN4
VSTAT3
VIN4 ISTAT4
VSTAT4
INPUT1
STATUS1
IOUT1
OUTPUT1
STATUS2
OUTPUT2
INPUT4
VOUT2
IOUT3
INPUT3
STATUS3
VOUT1
IOUT2
INPUT2
OUTPUT3
IOUT4
OUTPUT4
STATUS4
GND1,2
VOUT3
VOUT4
GND3,4
IGND3,4
IGND1,2
CONNECTION DIAGRAM (TOP VIEW)
VCC1,2
1
28
VCC1,2
GND 1,2
OUTPUT1
INPUT1
OUTPUT1
STATUS1
OUTPUT1
STATUS2
OUTPUT2
INPUT2
OUTPUT2
VCC1,2
OUTPUT2
VCC3,4
OUTPUT3
GND 3,4
OUTPUT3
INPUT3
OUTPUT3
STATUS3
OUTPUT4
STATUS4
OUTPUT4
INPUT4
VCC3,4
OUTPUT4
14
15
VCC3,4
3/20
VNQ830M
THERMAL DATA (Per island)
Symbol
Rthj-lead
Parameter
Thermal Resistance Junction-lead per chip
Value
20
Unit
°C/W
Rthj-amb
Thermal Resistance Junction-ambient
60 (*)
°C/W
Rthj-amb
Thermal Resistance Junction-ambient (two chips ON)
46 (*)
°C/W
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins.
Horizontal mounting and no artificial air flow.
ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40°C< Tj <150°C, unless otherwise specified)
POWER OUTPUT (Per each channel)
Symbol
VCC (**)
VUSD (**)
VOV (**)
Ron
Parameter
Operating Supply Voltage
Undervoltage Shut-down
Overvoltage Shut-down
On State Resistance
Test Conditions
Min
5.5
3
36
Typ
13
4
Max
36
5.5
IOUT=2A; Tj=25°C
60
Unit
V
V
V
mΩ
IOUT=2A; VCC>8V
12
120
40
mΩ
µA
12
25
µA
5
7
50
0
5
3
mA
µA
µA
µA
µA
Off State; VCC=13V; VIN=VOUT=0V
IS (**)
Supply Current
Off State; VCC=13V; VIN=VOUT=0V; Tj =25°C
On State; VCC=13V; VIN=5V; IOUT=0A
IL(off1)
IL(off2)
IL(off3)
IL(off4)
Off State Output Current
Off State Output Current
Off State Output Current
Off State Output Current
VIN=VOUT=0V
VIN=0V; VOUT=3.5V
VIN=VOUT=0V; VCC=13V; Tj =125°C
VIN=VOUT=0V; VCC=13V; Tj =25°C
0
-75
SWITCHING (Per each Channel) (VCC =13V)
Symbol
td(on)
td(off)
Parameter
Turn-on Delay Time
Turn-off Delay Time
Test Conditions
RL=6.5Ω from VIN rising edge to VOUT=1.3V
RL=6.5Ω from VIN falling edge to VOUT=11.7V
dVOUT/dt(on) Turn-on Voltage Slope
RL=6.5Ω from VOUT=1.3V to VOUT=10.4V
dVOUT/dt(off) Turn-off Voltage Slope
RL=6.5Ω from VOUT=11.7V to VOUT=1.3V
Min
Typ
Max
30
30
See
relative
diagram
See
relative
diagram
Unit
µs
µs
V/µs
V/µs
LOGIC INPUT (Per each channel)
Symbol
VIL
IIL
VIH
IIH
VI(hyst)
VICL
(**) Per island
4/20
1
Parameter
Input Low Level
Low Level Input Current
Input High Level
High Level Input Current
Input Hysteresis Voltage
Input Clamp Voltage
Test Conditions
VIN=1.25V
Min
Typ
1
3.25
VIN=3.25V
IIN=1mA
IIN=-1mA
Max
1.25
10
0.5
6
6.8
-0.7
8
Unit
V
µA
V
µA
V
V
V
VNQ830M
ELECTRICAL CHARACTERISTICS (continued)
VCC - OUTPUT DIODE
Symbol
VF
Parameter
Forward on Voltage
Test Conditions
-IOUT=2A; Tj=150°C
Min
Typ
Max
0.6
Unit
V
STATUS PIN (Per each channel)
Symbol
VSTAT
ILSTAT
CSTAT
VSCL
Parameter
Test Conditions
Status Low Output Voltage ISTAT=1.6mA
Status Leakage Current
Normal Operation; VSTAT=5V
Status Pin Input
Normal Operation; VSTAT=5V
Capacitance
ISTAT=1mA
Status Clamp Voltage
ISTAT=-1mA
Min
6
Typ
6.8
Max
0.5
10
Unit
V
µA
100
pF
8
V
-0.7
V
PROTECTIONS (Per each channel)
Symbol
TTSD
TR
Thyst
tSDL
Parameter
Shut-down Temperature
Reset Temperature
Thermal Hysteresis
Status Delay in Overload
Conditions
Ilim
Current limitation
Vdemag
Turn-off Output Clamp
Voltage
Test Conditions
Min
150
135
7
Typ
175
10.5
5.5V<VCC<36V
IOUT=2A; L=6mH
Unit
°C
°C
°C
20
µs
15
A
15
A
15
Tj>TTSD
6
Max
200
VCC-41 VCC-48 VCC-55
V
OPENLOAD DETECTION (per each channel)
Symbol
IOL
tDOL(on)
VOL
tDOL(off)
Parameter
Openload ON State
Detection Threshold
Openload ON State
Detection Delay
Openload OFF State
Voltage Detection
Threshold
Openload Detection Delay
at Turn Off
Test Conditions
VIN=5V
Min
Typ
Max
Unit
0.6
0.9
1.2
A
200
µs
3.5
V
1000
µs
IOUT=0A
VIN=0V
1.5
OPEN LOAD STATUS TIMING (with external pull-up)
IOUT < IOL
VOUT > VOL
VINn
2.5
OVER TEMP STATUS TIMING
Tj > TTSD
VINn
VSTATn
VSTATn
tSDL
tDOL(off)
tSDL
tDOL(on)
5/20
2
VNQ830M
Switching time Waveforms
VOUTn
90%
80%
dVOUT/dt(off)
dVOUT/dt(on)
10%
t
VINn
td(on)
td(off)
t
TRUTH TABLE
CONDITIONS
Normal Operation
Current Limitation
Overtemperature
Undervoltage
Overvoltage
Output Voltage > VOL
Output Current < IOL
6/20
INPUT
L
H
L
H
H
L
H
L
H
L
H
L
H
L
H
OUTPUT
L
H
L
X
X
L
L
L
L
L
L
H
H
L
H
STATUS
H
H
H
(Tj < TTSD) H
(Tj > TTSD) L
H
L
X
X
H
H
L
H
H
L
VNQ830M
ELECTRICAL TRANSIENT REQUIREMENTS ON VCC PIN
ISO T/R 7637/1
Test Pulse
I
II
TEST LEVELS
III
IV
1
2
3a
3b
4
5
-25 V
+25 V
-25 V
+25 V
-4 V
+26.5 V
-50 V
+50 V
-50 V
+50 V
-5 V
+46.5 V
-75 V
+75 V
-100 V
+75 V
-6 V
+66.5 V
-100 V
+100 V
-150 V
+100 V
-7 V
+86.5 V
ISO T/R 7637/1
Test Pulse
1
2
3a
3b
4
5
CLASS
C
E
I
C
C
C
C
C
C
TEST LEVELS RESULTS
II
III
C
C
C
C
C
C
C
C
C
C
E
E
Delays and
Impedance
2 ms 10 Ω
0.2 ms 10 Ω
0.1 µs 50 Ω
0.1 µs 50 Ω
100 ms, 0.01 Ω
400 ms, 2 Ω
IV
C
C
C
C
C
E
CONTENTS
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device is not performed as designed after exposure and cannot be
returned to proper operation without replacing the device.
7/20
VNQ830M
Figure 1: Waveforms
NORMAL OPERATION
INPUTn
LOAD VOLTAGEn
STATUSn
UNDERVOLTAGE
VUSDhyst
VCC
VUSD
INPUTn
LOAD VOLTAGEn
STATUS
undefined
OVERVOLTAGE
VCC<VOV
VCC>VOV
VCC
INPUTn
LOAD VOLTAGEn
STATUSn
OPEN LOAD with external pull-up
INPUTn
LOAD VOLTAGEn
STATUSn
OPEN LOAD without external pull-up
INPUTn
VOUT>VOL
LOAD VOLTAGEn
VOL
STATUSn
Tj
TTSD
TR
OVERTEMPERATURE
INPUTn
LOAD CURRENTn
STATUSn
8/20
1
VNQ830M
APPLICATION SCHEMATIC
+5V +5V
+5V
VCC1,2
VCC3,4
Rprot
STATUS1
Rprot
INPUT1
Dld
Rprot
STATUS2
Rprot
INPUT2
Rprot
STATUS3
µC
OUTPUT1
OUTPUT2
OUTPUT3
Rprot
INPUT3
Rprot
STATUS4
OUTPUT4
Rprot
INPUT4
GND1,2
GND3,4
RGND
DGND
VGND
+5V +5V
Note: Channels 3 & 4 have the same internal circuit as channel 1 & 2.
GND PROTECTION
REVERSE BATTERY
NETWORK
AGAINST
Solution 1: Resistor in the ground line (RGND only). This
can be used with any type of load.
The following is an indication on how to dimension the
RGND resistor.
1) RGND ≤ 600mV / 2(IS(on)max).
2) RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can
be found in the absolute maximum rating section of the
device’s datasheet.
Power Dissipation in RGND (when VCC<0: during reverse
battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different
HSD. Please note that the value of this resistor should be
calculated with formula (1) where IS(on)max becomes the
sum of the maximum on-state currents of the different
devices.
Please note that if the microprocessor ground is not
common with the device ground then the RGND will
produce a shift (IS(on)max * RGND) in the input thresholds
and the status output values. This shift will vary
depending on how many devices are ON in the case of
several high side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor
or several devices have to share the same resistor then
the ST suggests to utilize Solution 2.
9/20
VNQ830M
Solution 2: A diode (DGND) in the ground line.
A resistor (RGND=1kΩ) should be inserted in parallel to
DGND if the device will be driving an inductive load.
This small signal diode can be safely shared amongst
several different HSD. Also in this case, the presence of
the ground network will produce a shift (j600mV) in the
input threshold and the status output values if the
microprocessor ground is not common with the device
ground. This shift will not vary if more than one HSD
shares the same diode/resistor network.
LOAD DUMP PROTECTION
Dld is necessary (Voltage Transient Suppressor) if the
load dump peak voltage exceeds VCC max DC rating. The
same applies if the device will be subject to transients on
the VCC line that are greater than the ones shown in the
ISO T/R 7637/1 table.
10/20
µC I/Os PROTECTION:
If a ground protection network is used and negative
transients are present on the VCC line, the control pins will
be pulled negative. ST suggests to insert a resistor (Rprot)
in line to prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the
leakage current of µC and the current required by the
HSD I/Os (Input levels compatibility) with the latch-up limit
of µC I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V
5kΩ ≤ Rprot ≤ 65kΩ.
Recommended Rprot value is 10kΩ.
VNQ830M
OPEN LOAD DETECTION IN OFF STATE
2) no misdetection when load is disconnected: in this
case the VOUT has to be higher than VOLmax; this
results in the following condition RPU<(VPU–VOLmax)/
IL(off2).
Because Is(OFF) may significantly increase if Vout is pulled
high (up to several mA), the pull-up resistor RPU should
be connected to a supply that is switched OFF when the
module is in standby.
The values of VOLmin, VOLmax and IL(off2) are available in
the Electrical Characteristics section.
Off state open load detection requires an external pull-up
resistor (RPU) connected between OUTPUT pin and a
positive supply voltage (VPU) like the +5V line used to
supply the microprocessor.
The external resistor has to be selected according to the
following requirements:
1) no false open load indication when load is connected:
in this case we have to avoid VOUT to be higher than
VOlmin; this results in the following condition
VOUT=(VPU/(RL+RPU))RL<VOlmin.
Open Load detection in off state
V batt.
VPU
VCC
RPU
INPUT
DRIVER
+
LOGIC
IL(off2)
OUT
+
R
STATUS
VOL
RL
GROUND
11/20
VNQ830M
High Level Input Current
Off State Output Current
Iih (uA)
IL(off1) (uA)
5
2.5
4.5
2.25
Off state
Vcc=36V
Vin=Vout=0V
2
1.75
Vin=3.25V
4
3.5
1.5
3
1.25
2.5
1
2
0.75
1.5
0.5
1
0.25
0.5
0
0
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Input Clamp Voltage
Status Leakage Current
Vicl (V)
Ilstat (uA)
8
0.05
7.8
Iin=1mA
7.6
0.04
7.4
Vstat=5V
0.03
7.2
7
6.8
0.02
6.6
6.4
0.01
6.2
6
0
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
Tc (°C)
50
75
100
125
150
175
Tc (°C)
Status Low Output Voltage
Status Clamp Voltage
Vscl (V)
Vstat (V)
8
0.8
7.8
0.7
Istat=1mA
Istat=1.6mA
7.6
0.6
7.4
0.5
7.2
7
0.4
6.8
0.3
6.6
0.2
6.4
0.1
6.2
6
0
-50
-25
0
25
50
75
Tc (°C)
12/20
100
125
150
175
-50
-25
0
25
50
75
Tc (°C)
100
125
150
175
VNQ830M
On State Resistance Vs Tcase
On State Resistance Vs VCC
Ron (mOhm)
Ron (mOhm)
160
120
Tc=150°C
110
140
Iout=2A
Vcc=8V; 13V & 36V
120
100
90
80
100
70
80
60
Tc=25°C
50
60
40
40
Tc= - 40°C
30
20
20
Iout=5A
10
0
0
-50
-25
0
25
50
75
100
125
150
175
5
10
15
20
Tc (°C)
25
30
35
40
Vcc (V)
Openload On State Detection Threshold
Input High Level
Iol (mA)
Vih (V)
1250
3.6
1200
3.4
Vcc=13V
Vin=5V
1150
3.2
1100
3
1050
2.8
1000
950
2.6
900
2.4
850
2.2
800
2
750
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
100
125
150
175
Tc (°C)
Tc (°C)
Input Low Level
Input Hysteresis Voltage
Vil (V)
Vhyst (V)
2.6
1.5
1.4
2.4
1.3
2.2
1.2
2
1.1
1.8
1
0.9
1.6
0.8
1.4
0.7
1.2
0.6
1
0.5
-50
-25
0
25
50
75
Tc (°C)
100
125
150
175
-50
-25
0
25
50
75
Tc (°C)
13/20
VNQ830M
Overvoltage Shutdown
Openload Off State Voltage Detection Threshold
Vov (V)
Vol (V)
50
5
48
4.5
46
4
44
3.5
Vin=0V
42
3
40
2.5
38
2
36
1.5
34
1
32
0.5
30
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
dVout/dt(on) (V/ms)
dVout/dt(off) (V/ms)
600
125
150
175
100
125
150
175
550
Vcc=13V
Rl=6.5Ohm
Ri=6.5Ohm
500
500
450
400
400
300
350
200
300
100
250
200
0
-50
-25
0
25
50
75
100
125
150
175
ILIM Vs Tcase
Ilim (A)
20
18
Vcc=13V
16
14
12
10
8
6
4
2
0
-50
-25
0
25
50
75
Tc (°C)
-50
-25
0
25
50
75
Tc (°C)
Tc (ºC)
14/20
100
Turn-off Voltage Slope
800
600
75
Tc (°C)
Turn-on Voltage Slope
700
50
100
125
150
175
VNQ830M
Maximum turn off current versus load inductance
ILMAX (A)
100
10
A
B
C
1
0.1
1
10
100
L(mH)
A = Single Pulse at TJstart=150ºC
B= Repetitive pulse at TJstart=100ºC
C= Repetitive Pulse at TJstart=125ºC
Conditions:
VCC=13.5V
Values are generated with RL=0Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
VIN, IL
Demagnetization
Demagnetization
Demagnetization
t
15/20
VNQ830M
SO-28 DOUBLE ISLAND THERMAL DATA
SO-28 Double island PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.5cm2, 3cm2, 6cm2).
Thermal calculation according to the PCB heatsink area
Chip 1
ON
OFF
ON
ON
Chip 2
OFF
ON
ON
ON
Tjchip1
RthA x Pdchip1 + Tamb
RthC x Pdchip2 + Tamb
RthB x (Pdchip1 + Pdchip2) + Tamb
(RthA x Pdchip1) + RthC x Pdchip2 + Tamb
Tjchip2
Note
RthC x Pdchip1 + Tamb
RthA x Pdchip2 + Tamb
RthB x (Pdchip1 + Pdchip2) + Tamb
Pdchip1=Pdchip2
(RthA x Pdchip2) + RthC x Pdchip1 + Tamb Pdchip1≠Pdchip2
RthA = Thermal resistance Junction to Ambient with one chip ON
RthB = Thermal resistance Junction to Ambient with both chips ON and Pdchip1=Pdchip2
RthC = Mutual thermal resistance
Rthj-amb Vs. PCB copper area in open box free air condition
RTHj_am b
(°C/W)
70
60
50
RthA
40
RthB
30
20
RthC
10
0
16/20
1
2
3
4
5
PCB Cu heatsink area (cm ^2)/island
6
7
VNQ830M
SO-28 Thermal Impedance Junction Ambient Single Pulse
Zth(°C/W )
100
0 , 5 cm^ 2 /i s l an d
3 cm ^ 2 / i s l an d
6 cm^ 2 /i s l an d
10
One channel ON
1
Two channels ON
on same chip
0.1
0.01
1E-04 0.001 0.01
0.1
1
10
100
1000
tim e (s )
Thermal fitting model of a four channels HSD
in SO-28
Pulse calculation formula
Z THδ = RTH ⋅ δ + Z THtp ( 1 – δ )
where
Tj_1
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd1
Tj_2
C13
R13
C14
R14
Pd2
R17
Tj_3
R18
C7
C8
C9
R7
R8
R9
C10
C11
C12
Pd3
Tj_4
C15
R15
R10
C16
R16
Pd4
T_amb
R11
R12
δ = tp ⁄ T
Thermal Parameter
Area/island (cm2)
R1=R7=R13=R15 (°C/W)
R2=R8=R14=R16 (°C/W)
R3=R9 (°C/W)
R4=R10 (°C/W)
R5=R11 (°C/W)
R6=R12 (°C/W)
C1=C7=C13=C15 (W.s/°C)
C2=C8=C14=C16 (W.s/°C)
C3=C9 (W.s/°C)
C4=C10 (W.s/°C)
C5=C11 (W.s/°C)
C6=C12 (W.s/°C)
R17=R18 (°C/W)
0.5
0.15
0.8
4.5
11
15
5
0.0006
2.10E-03
6.00E-03
0.2
1.5
5
150
6
13
8
17/20
VNQ830M
SO-28 MECHANICAL DATA
DIM.
mm.
MIN.
TYP
A
inch
MAX.
TYP.
MAX.
0.104
a1
0.10
0.30
0.004
0.012
b
0.35
0.49
0.013
0.019
b1
0.23
0.32
0.009
0.012
C
0.50
0.020
c1
45 (typ.)
D
17.7
E
10.00
e
18.1
0.697
10.65
0.393
1.27
e3
0.713
0.419
0.050
16.51
0.650
F
7.40
7.60
0.291
0.299
L
0.40
1.27
0.016
0.050
S
18/20
MIN.
2.65
8 (max.)
VNQ830M
SO-28 TUBE SHIPMENT (no suffix)
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
B
28
700
532
3.5
13.8
0.6
All dimensions are in mm.
A
TAPE AND REEL SHIPMENT (suffix “13TR”)
REEL DIMENSIONS
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
16
4
12
1.5
1.5
7.5
6.5
2
End
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
19/20
VNQ830M
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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20/20