DIODES DMG8601UFG-7

DMG8601UFG
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
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Features
Mechanical Data
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Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 2)
ESD Protected Up To 2KV
"Green" Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
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NEW PRODUCT
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Case: DFN3030-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish - NiPdAu over Copper lead frame. Solderable
per MIL-STD-202, Method 208
Polarity: See Diagram
Marking Information: See Page 5
Ordering Information: See Page 5
Weight: 0.0172 grams (approximate)
5
6
7
8
8
7
6
5
2
3
4
D1/D2
G2
4
Top View
ESD PROTECTED TO 2kV
Maximum Ratings
S2
G1
S1
3
2
1
1
BOTTOM VIEW
Pin Configuration
Bottom View
TOP VIEW
Equivalent Circuit
@TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
Unit
V
V
IDM
Value
20
±12
6.1
5.2
27
Characteristic
Power Dissipation (Note 1)
Symbol
Value
Unit
PD
0.92
W
Thermal Resistance, Junction to Ambient @TA = 25°C
Operating and Storage Temperature Range
RθJA
TJ, TSTG
136
-55 to +150
°C/W
°C
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 1)
Steady
State
Pulsed Drain Current
TA = 25°C
TA = 70°C
ID
A
A
Thermal Characteristics
Notes:
1. Device mounted on FR-4 PCB with minimum recommended pad layout.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
DMG8601UFG
Document number: DS31788 Rev. 4 - 2
1 of 6
www.diodes.com
October 2009
© Diodes Incorporated
DMG8601UFG
Electrical Characteristics
@TA = 25°C unless otherwise specified
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
BVSGS
20
±12
-
1.0
±10
-
V
μA
μA
V
VGS = 0V, ID = 250μA
VDS = 20V, VGS = 0V
VGS = ±10V, VDS = 0V
VDS = 0V, IG = ±250μA
VGS(th)
0.35
-
0.95
V
RDS (ON)
-
17
20
25
23
27
34
mΩ
|Yfs|
VSD
-
10
0.7
1.0
S
V
VDS = VGS, ID = 250μA
VGS = 4.5V, ID = 6.5A
VGS = 2.5V, ID = 5.5A
VGS = 1.8V, ID = 3.5A
VDS = 10V, ID = 5A
VGS = 0V, IS = 1A
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
-
143
74
29
202
8.8
1.4
3.0
53
78
562
234
-
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
-
-
Test Condition
VDS = 10V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VGS = 4.5V, VDS = 10V,
ID = 6.5A
VDD = 10V, VGS = 4.5V,
RL = 10Ω, RG = 6Ω
4. Short duration pulse test used to minimize self-heating effect.
30
40
VGS = 8.0V
36
VGS = 4.5V
ID, DRAIN CURRENT (A)
28
VDS = 5V
25
VGS = 3.0V
32
ID, DRAIN CURRENT (A)
NEW PRODUCT
Characteristic
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = 25°C
Gate-Source Leakage
Gate-Source Breakdown Voltage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
VGS = 2.5V
24
20
16
12
20
15
10
VGS = 2.0V
8
TA = 150°C
5
TA = 125°C
0
TA = 85°C
T A = 25°C
4
TA = -55°C
0
0
0.5
1.0
1.5
2.0
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristic
DMG8601UFG
Document number: DS31788 Rev. 4 - 2
3.0
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0
0.5
1.0
1.5
2.0
2.5
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristic
3.0
October 2009
© Diodes Incorporated
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.05
0.04
0.03
VGS = 1.8V
0.02
VGS = 2.5V
VGS = 4.5V
0.01
0
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
VGS = 5.0V
ID = 10A
1.1
0.9
0.7
-25
0.03
T A = 150°C
TA = 125°C
TA = 85°C
0.02
TA = 25°C
TA = -55°C
0.01
0
0
RDSON, DRAIN-SOURCE ON-RESISTANCE (Ω)
RDSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
VGS = 2.5V
ID = 5.5A
0.5
-50
VGS = 4.5V
0.04
5
10
15
20
ID, DRAIN CURRENT (A)
25
30
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
1.5
1.3
0.05
30
1.7
0.05
0.04
VGS = 2.5V
ID = 5.5A
0.03
0.02
VGS = 5.0V
ID = 10A
0.01
0
-50
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
1.6
20
16
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
NEW PRODUCT
DMG8601UFG
1.2
TA = 25°C
12
0.8
ID = 1mA
ID = 250µA
0.4
8
4
0
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
DMG8601UFG
Document number: DS31788 Rev. 4 - 2
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0
0.2
0.4
0.6
0.8
1.0
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
October 2009
© Diodes Incorporated
DMG8601UFG
IGSS, LEAKAGE CURRENT (nA)
IDSS, LEAKAGE CURRENT (nA)
10,000
10,000
TA = 150°C
1,000
TA = 125°C
100
TA = 85°C
10
TA = 150°C
1,000
TA = 125°C
TA = 85°C
100
T A = 25°C
10
TA = -55°C
T A = 25°C
1
1
0
4
8
12
16
VDS, DRAIN-SOURCE VOLTAGE (V)
1
20
Fig. 9 Typical Leakage Current vs. Drain-Source Voltage
2
3
4
5
6
7
8
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 10 Gate-Source Leakage Current vs. Voltage
10,000
IGSS, LEAKAGE CURRENT (nA)
TA = 150°C
1,000
TA = 125°C
100
T A = 85°C
TA = 25°C
10
TA = -55°C
1
1
2
3
4
5
6
7
8
-VGS, GATE-SOURCE VOLTAGE (V)
Fig. 11 Gate-Source Leakage Current vs. Voltage
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
100,000
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RθJA(t) = r(t) * RθJA
RθJA = 136°C/W
D = 0.02
0.01
P(pk)
D = 0.01
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1/t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
DMG8601UFG
Document number: DS31788 Rev. 4 - 2
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 12 Transient Thermal Response
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10
100
1,000
October 2009
© Diodes Incorporated
DMG8601UFG
Ordering Information
(Note 5)
Part Number
DMG8601UFG-7
Notes:
Case
DFN3030-8
Packaging
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
NEW PRODUCT
Marking Information
YYWW
DFN3030-8
2N4 = Product marking code
YYWW = Date code marking
YY = Last digit of year (ex: 09 for 2009)
WW = Week code 01 to 52
2N4
Package Outline Dimensions
A
DFN3030-8
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15
⎯
⎯
b
0.29 0.39 0.34
D
2.90 3.10 3.00
D2 2.19 2.39 2.29
e
0.65
⎯
⎯
E
2.90 3.10 3.00
E2
1.64 1.84 1.74
L
0.30 0.60 0.45
All Dimensions in mm
A3 SEATING PLANE
A1
e
b
.2
R0
E
00
E2
L
D2
D
Suggested Pad Layout
Z
X1
X2
Dimensions Value (in mm)
Z
2.59
G
0.11
X1
2.49
X2
0.65
Y
0.39
C
0.65
G
Y
DMG8601UFG
Document number: DS31788 Rev. 4 - 2
C
5 of 6
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October 2009
© Diodes Incorporated
DMG8601UFG
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
www.diodes.com
DMG8601UFG
Document number: DS31788 Rev. 4 - 2
6 of 6
www.diodes.com
October 2009
© Diodes Incorporated