DUAL COOL™ PACKAGE POWERTRENCH® MOSFETs Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging technology proves to be a clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages. Features • Top-side cooling, lower thermal resistance from junction to top Bottom Top 3.3 mm x 3.3 mm & 5 mm x 6 mm • Same land pattern as 5 mm x 6 mm and 3.3 mm x 3.3 mm PQFN – JEDEC standard • Allows higher current and power dissipation • Highest power density for DC-DC applications • Use with or without a heat sink, reduces the number of qualified components in the BOM Maximum Power Dissipation • Multiple suppliers without cross licensing requirements Capable of >60% Better Thermal Performance • High degree of production commonality with standard PQFN packaging • 25 V - 150 V portfolio Dual Cool Package 3.3mm x 3.3mm Air Flow = 200LFM Standard PQFN Applications No Air Flow 3.3mm x 3.3mm • Point-of-load (POL) synchronous-buck conversion 0.0 • Servers 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Power Loss (W) TJ Max. = 90°C, Ta=50°C • Telecommunications, routing and switching • Heat path from top only 5mm x 6mm Package Interconnect QJA(°C/W) (%) Improvement from Wire Package PQFN Wire 27.1 - PQFN Clip 23.8 13.9 Dual Cool Package 17.2 57.5 Environment: Minimum Pad, Heat Sink, 200LFM Forced Air fairchildsemi.com for a complete listing of sales representatives and sales offices, visit: www.fairchildsemi.com/cf/sales_contacts to receive information on fairchild products, tradeshows, online seminars and other items, register here for updates: www.fairchildsemi.com/my_fairchild For data sheets, application notes, samples and more, please visit: www.fairchildsemi.com 1-Phase CCM with Heat Sink and Forced Air 200LFM Top Bottom Junction Temperature (°C) 120.00 100.00 Dual Cool Package 80.00 60.00 Dual Cool Package 3.3mm x 3.3mm 40.00 PQFN 3.3mm x 3.3mm 20.00 Competitor Package 0.00 1 5 10 15 20 Load (A) 25 30 35 DirectFET Board Solderable Component Area Dual Cool Package 3.3mm x 3.3mm Competitor % Difference Solderable Area Total Component Area (Max) 4.5mm2 The new standard 11.56mm2 3mm2 33% less 19.16mm2 5mm x 6mm Package Qg Qgd 4.5V (nC) (nC) 3.3 22 4.4 RDS(ON) Max (m) Product Number SyncFET™ Technology BVDSS VGS 10V 8V 6V FDMS8570SDC Y 25 20 2.8 - - FDMS7650DC N 30 20 0.99 - - 1.55 42 9.7 FDMS3006SDC Y 30 20 1.9 - - 2.7 26 5.3 FDMS3008SDC Y 30 20 2.6 - - 3.3 21 4.3 FDMS3016DC N 30 20 6 - - 9 7.6 2.5 FDMS8320LDC N 40 20 1.1 - - 1.5 57 16 FDMS86500DC N 60 20 2.3 3.3 - - 76 15 FDMS86300DC N 80 20 3.1 4 - - 72 14 FDMS86101DC N 100 20 7.5 - 12 - 31 7 FDMS86200DC N 150 20 17 - 25 - 30 5.6 Qg Qgd 10V 8V 6V 4.5V (nC) (nC) 3.3mm x 3.3mm Package RDS(ON) Max (m) Product Number SyncFET Technology BVDSS VGS FDMC7660DC N 30 20 - - - - - - FDMC86520DC N 60 20 6.3 8.7 - - 29 5.5 Trademarks, service marks, and registered trademarks are the property of Fairchild Semiconductor or their respective owners. For a listing of Fairchild Semiconductor trademarks and related information, please see: www.fairchildsemi.com/legal Lit. No. 100027-004 © 2013 Fairchild Semiconductor. All Rights Reserved.