FAIRCHILD FDMS86200DC

DUAL COOL™ PACKAGE POWERTRENCH® MOSFETs
Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is
the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual
path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with
Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink
is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and
increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging technology proves to be a
clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS
compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages.
Features
• Top-side cooling, lower thermal resistance from junction to top
Bottom
Top
3.3 mm x 3.3 mm
&
5 mm x 6 mm
• Same land pattern as 5 mm x 6 mm and
3.3 mm x 3.3 mm PQFN – JEDEC standard
• Allows higher current and power dissipation
• Highest power density for DC-DC applications
• Use with or without a heat sink, reduces the
number of qualified components in the BOM
Maximum Power Dissipation
• Multiple suppliers without cross licensing
requirements
Capable of >60% Better Thermal Performance
• High degree of production commonality with
standard PQFN packaging
• 25 V - 150 V portfolio
Dual Cool Package
3.3mm x 3.3mm
Air Flow =
200LFM
Standard PQFN
Applications
No Air Flow
3.3mm x 3.3mm
• Point-of-load (POL) synchronous-buck conversion
0.0
• Servers
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Power Loss (W) TJ Max. = 90°C, Ta=50°C
• Telecommunications, routing and switching
• Heat path from top only
5mm x 6mm Package
Interconnect
QJA(°C/W)
(%) Improvement from Wire Package
PQFN Wire
27.1
-
PQFN Clip
23.8
13.9
Dual Cool Package
17.2
57.5
Environment: Minimum Pad, Heat Sink, 200LFM Forced Air
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1-Phase CCM with Heat Sink and Forced Air 200LFM
Top
Bottom
Junction Temperature (°C)
120.00
100.00
Dual Cool Package
80.00
60.00
Dual Cool Package
3.3mm x 3.3mm
40.00
PQFN
3.3mm x 3.3mm
20.00
Competitor Package
0.00
1
5
10
15 20
Load (A)
25
30
35
DirectFET
Board
Solderable Component
Area
Dual Cool Package
3.3mm x 3.3mm
Competitor
% Difference
Solderable Area
Total
Component Area (Max)
4.5mm2
The new
standard
11.56mm2
3mm2
33% less
19.16mm2
5mm x 6mm Package
Qg
Qgd
4.5V
(nC)
(nC)
3.3
22
4.4
RDS(ON) Max (m)
Product Number
SyncFET™
Technology
BVDSS
VGS
10V
8V
6V
FDMS8570SDC
Y
25
20
2.8
-
-
FDMS7650DC
N
30
20
0.99
-
-
1.55
42
9.7
FDMS3006SDC
Y
30
20
1.9
-
-
2.7
26
5.3
FDMS3008SDC
Y
30
20
2.6
-
-
3.3
21
4.3
FDMS3016DC
N
30
20
6
-
-
9
7.6
2.5
FDMS8320LDC
N
40
20
1.1
-
-
1.5
57
16
FDMS86500DC
N
60
20
2.3
3.3
-
-
76
15
FDMS86300DC
N
80
20
3.1
4
-
-
72
14
FDMS86101DC
N
100
20
7.5
-
12
-
31
7
FDMS86200DC
N
150
20
17
-
25
-
30
5.6
Qg
Qgd
10V
8V
6V
4.5V
(nC)
(nC)
3.3mm x 3.3mm Package
RDS(ON) Max (m)
Product Number
SyncFET
Technology
BVDSS
VGS
FDMC7660DC
N
30
20
-
-
-
-
-
-
FDMC86520DC
N
60
20
6.3
8.7
-
-
29
5.5
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