FREESCALE K40P104M100SF2

Freescale Semiconductor
Data Sheet: Product Preview
K40 Sub-Family Data Sheet
Document Number: K40P104M100SF2
Rev. 1, 11/2010
K40P104M100SF2
Supports the following:
MK40N512VLL100, MK40N512V.L100
• Human-machine interface
– Segment LCD controller supporting up to 40
frontplanes and 8 backplanes, or 44 frontplanes and
4 backplanes
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
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Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on nonFlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
• Clocks
– 1 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Hardware random-number generator
– 128-bit unique identification (ID) number per chip
• Analog modules
– 16-bit SAR ADC with PGA (x64)
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timers
– Two-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB full-/low-speed On-the-Go controller with onchip transceiver
– Controller Area Network (CAN) module
– SPI modules
– I2C modules
– UART modules
– Secure Digital host controller (SDHC)
– I2S
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2010 Freescale Semiconductor, Inc.
Preliminary
Table of Contents
1 Ordering parts...........................................................................4
6.1 Core modules....................................................................19
1.1 Determining valid orderable parts......................................4
6.1.1
Debug trace timing specifications.........................19
2 Part identification......................................................................4
6.1.2
JTAG electricals....................................................20
2.1 Description.........................................................................4
6.2 System modules................................................................23
2.2 Format...............................................................................4
6.3 Clock modules...................................................................23
2.3 Fields.................................................................................4
6.3.1
MCG Specifications...............................................23
2.4 Example............................................................................5
6.3.2
Oscillator Electrical Characteristics.......................25
3 Terminology and guidelines......................................................5
6.3.2.1
Oscillator DC Electrical Specifications 25
3.1 Definition: Operating requirement......................................5
6.3.2.2
Oscillator frequency specifications......26
6.3.3
32kHz Oscillator Electrical Characteristics............27
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3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
6.3.3.1
3.4 Definition: Rating...............................................................7
32kHz Oscillator DC Electrical
Specifications......................................27
3.5 Result of exceeding a rating..............................................7
6.3.3.2
3.6 Relationship between ratings and operating
32kHz Oscillator Frequency
Specifications......................................27
requirements......................................................................7
6.4 Memories and memory interfaces.....................................28
3.7 Guidelines for ratings and operating requirements............8
6.4.1
3.8 Definition: Typical value.....................................................8
Flash (FTFL) Electrical Characteristics.................28
6.4.1.1
3.9 Typical Value Conditions...................................................9
and Erase............................................28
4 Ratings......................................................................................9
6.4.1.2
4.1 Thermal handling ratings...................................................9
Flash Timing Parameters —
Commands..........................................28
4.2 Moisture handling ratings..................................................10
6.4.1.3
4.3 ESD handling ratings.........................................................10
Flash (FTFL) Current and Power
Parameters..........................................29
4.4 Voltage and current operating ratings...............................10
6.4.1.4
5 General.....................................................................................11
5.1 Nonswitching electrical specifications...............................11
Flash Timing Parameters — Program
6.4.2
Reliability Characteristics....................29
EzPort Switching Specifications............................29
6.5 Security and integrity modules..........................................30
5.1.1
Voltage and Current Operating Requirements......11
5.1.2
LVD and POR operating requirements.................12
5.1.3
Voltage and current operating behaviors..............13
6.6.1.1
16-bit ADC operating conditions..........31
5.1.4
Power mode transition operating behaviors..........13
6.6.1.2
16-bit ADC electrical characteristics....33
5.1.5
Power consumption operating behaviors..............14
6.6.1.3
16-bit ADC with PGA operating
5.1.5.1
6.6 Analog...............................................................................30
6.6.1
ADC electrical specifications.................................31
Diagram: Typical IDD_RUN operating
conditions............................................36
behavior...............................................16
6.6.1.4
16-bit ADC with PGA characteristics...37
5.1.6
EMC radiated emissions operating behaviors.......17
6.6.2
CMP and 6-bit DAC electrical specifications.........38
5.1.7
Designing with radiated emissions in mind...........18
6.6.3
12-bit DAC electrical characteristics.....................39
5.1.8
Capacitance attributes..........................................18
6.6.3.1
12-bit DAC operating requirements.....39
5.2 Switching electrical specifications.....................................18
6.6.3.2
12-bit DAC operating behaviors..........40
5.3 Thermal specifications.......................................................18
6.6.4
Voltage Reference Electrical Specifications..........42
5.3.1
Thermal operating requirements...........................18
6.7 Timers................................................................................43
5.3.2
Thermal attributes.................................................19
6.8 Communication interfaces.................................................43
6 Peripheral operating requirements and behaviors....................19
6.8.1
USB electrical specifications.................................44
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
2
Preliminary
Freescale Semiconductor, Inc.
6.8.2
USB DCD Electrical Specifications.......................44
6.9.1
General Switching Specifications..........................51
6.8.3
USB Voltage Regulator Electrical Specifications. .44
6.9.2
TSI Electrical Specifications..................................52
6.8.4
DSPI Switching Specifications for Low-speed
6.9.3
LCD electrical characteristics................................52
Operation..............................................................45
6.8.5
DSPI Switching Specifications (High-speed
7 Dimensions...............................................................................53
7.1 Obtaining package dimensions.........................................54
8 Pinout........................................................................................54
6.8.6
SDHC Specifications.............................................48
8.1 K40 Signal Multiplexing and Pin Assignments..................54
6.8.7
I2S Switching Specifications.................................49
8.2 K40 Pinouts.......................................................................58
6.9 Human-machine interfaces (HMI)......................................51
9 Revision History........................................................................59
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mode)....................................................................46
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
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Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to www.freescale.com and perform a part number search for
the following device numbers: PK40 and MK40.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## M FFF T PP CCC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Description
Values
Q
Qualification status
• M = Fully qualified, general market flow
• P = Prequalification
K##
Kinetis family
• K40
M
Flash memory type
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
4
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
Field
Description
Values
Program flash memory size
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
T
Temperature range (°C)
• V = –40 to 105
PP
Package identifier
•
•
•
•
•
•
•
•
•
•
•
•
•
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
FX = 64 QFN (9 mm x 9 mm)
LH = 64 LQFP (10 mm x 10 mm)
LK = 80 LQFP (12 mm x 12 mm)
MB = 81 MAPBGA (8 mm x 8 mm)
LL = 100 LQFP (14 mm x 14 mm)
ML = 104 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
MF = 196 MAPBGA (15 mm x 15 mm)
MJ = 256 MAPBGA (17 mm x 17 mm)
CCC
Maximum CPU frequency (MHz)
•
•
•
•
•
50 = 50 MHz
72 = 72 MHz
100 = 100 MHz
120 = 120 MHz
150 = 150 MHz
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
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FFF
2.4 Example
This is an example part number:
MK40X256VMD100
3 Terminology and guidelines
3.1 Definition: Operating requirement
An operating requirement is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
5
Terminology and guidelines
3.1.1 Example
This is an example of an operating requirement, which you must meet for the
accompanying operating behaviors to be guaranteed:
Symbol
1.0 V core supply volt‐
age
Min.
0.9
Max.
Unit
1.1
V
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VDD
Description
3.2 Definition: Operating behavior
An operating behavior is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
3.2.1 Example
This is an example of an operating behavior, which is guaranteed if you meet the
accompanying operating requirements:
Symbol
IWP
Description
Min.
Digital I/O weak pullup/ 10
pulldown current
Max.
130
Unit
µA
3.3 Definition: Attribute
An attribute is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
3.3.1 Example
This is an example of an attribute:
Symbol
CIN_D
Description
Min.
Input capacitance: digi‐ —
tal pins
Max.
Unit
7
pF
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
6
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
3.4 Definition: Rating
A rating is a minimum or maximum value of a technical characteristic that, if exceeded,
may cause permanent chip failure:
• Operating ratings apply during operation of the chip.
• Handling ratings apply when the chip is not powered.
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3.4.1 Example
This is an example of an operating rating:
Symbol
VDD
Description
Min.
1.0 V core supply volt‐
age
–0.3
Max.
1.2
Unit
V
3.5 Result of exceeding a rating
Failures in time (ppm)
40
30
20
10
0
The likelihood of permanent chip failure increases rapidly as
soon as a characteristic begins to exceed one of its operating ratings.
Operating rating
Measured characteristic
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
7
Terminology and guidelines
3.6 Relationship between ratings and operating requirements
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- Probable permanent failure
- No permanent failure
- Possible decreased life
- Possible incorrect operation
- No permanent failure
- Correct operation
- No permanent failure
- Possible decreased life
- Possible incorrect operation
- Probable permanent failure
Handling range
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- No permanent failure
–∞
∞
3.7 Guidelines for ratings and operating requirements
Follow these guidelines for ratings and operating requirements:
• Never exceed any of the chip’s ratings.
• During normal operation, don’t exceed any of the chip’s operating requirements.
• If you must exceed an operating requirement at times other than during normal
operation (for example, during power sequencing), limit the duration as much as
possible.
3.8 Definition: Typical value
A typical value is a specified value for a technical characteristic that:
• Lies within the range of values specified by the operating behavior
• Given the typical manufacturing process, is representative of that characteristic
during operation when you meet the typical-value conditions or other specified
conditions
Typical values are provided as design guidelines and are neither tested nor guaranteed.
3.8.1 Example 1
This is an example of an operating behavior that includes a typical value:
Symbol
IWP
Description
Digital I/O weak
pullup/pulldown
current
Min.
10
Typ.
70
Max.
130
Unit
µA
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
8
Preliminary
Freescale Semiconductor, Inc.
Ratings
3.8.2 Example 2
This is an example of a chart that shows typical values for various voltage and
temperature conditions:
5000
4500
4000
TJ
150 °C
3000
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IDD_STOP (μA)
3500
105 °C
2500
25 °C
2000
–40 °C
1500
1000
500
0
0.90
0.95
1.05
1.00
1.10
VDD (V)
3.9 Typical Value Conditions
Typical values assume you meet the following conditions (or other conditions as
specified):
Symbol
Description
Value
Unit
TA
Ambient temperature
25
°C
VDD
3.3 V supply voltage
3.3
V
4 Ratings
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
9
Ratings
4.1 Thermal handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
TSTG
Storage temperature
–55
150
°C
1
TSDR
Solder temperature, lead-free
—
260
°C
2
Solder temperature, leaded
—
245
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1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
Max.
Unit
Notes
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
VHBM
Electrostatic discharge voltage, human body model
-2000
+2000
V
1
VCDM
Electrostatic discharge voltage, charged-device model
-500
+500
V
2
Latch-up current at ambient temperature of 85°C
-100
+100
mA
ILAT
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
4.4 Voltage and current operating ratings
Symbol
Description
Min.
Max.
Unit
VDD
Digital supply voltage
–0.3
3.8
V
IDD
Digital supply current
—
185
mA
VDIO
Digital input voltage (except RESET, EXTAL, and XTAL)
–0.3
5.5
V
VAIO
Analog, RESET, EXTAL, and XTAL input voltage
–0.3
VDD + 0.3
V
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
10
Preliminary
Freescale Semiconductor, Inc.
General
Symbol
ID
Description
Min.
Max.
Unit
Instantaneous maximum current single pin limit (applies to all
port pins)
–25
25
mA
Analog supply voltage
VDD – 0.3
VDD + 0.3
V
IDDA
Analog supply current1
TBD
TBD
mA
VUSB_DP
USB_DP input voltage
–0.3
3.63
V
VUSB_DM
USB_DM input voltage
–0.3
3.63
V
VREGIN
USB regulator input
–0.3
6.0
V
VBAT
RTC battery supply voltage
–0.3
3.8
V
VRAM
VDD voltage required to retain RAM
1.2
—
V
TBD
—
V
VRFVBAT
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VDDA
VBAT voltage required to retain the VBAT register file
1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See
each module's specification for its supply current.
5 General
5.1 Nonswitching electrical specifications
5.1.1 Voltage and Current Operating Requirements
Table 1. Voltage and current operating requirements
Symbol
Description
Min.
Max.
Unit
VDD
Supply voltage
1.71
3.6
V
VDDA
Analog supply voltage
1.71
3.6
V
VDD – VDDA VDD-to-VDDA differential voltage
–0.1
0.1
V
VSS – VSSA VSS-to-VSSA differential voltage
–0.1
0.1
V
• 2.7 V ≤ VDD ≤ 3.6 V
0.7 × VDD
—
V
• 1.7 V ≤ VDD ≤ 2.7 V
0.75 × VDD
—
V
• 2.7 V ≤ VDD ≤ 3.6 V
—
0.35 × VDD
V
• 1.7 V ≤ VDD ≤ 2.7 V
—
0.3 × VDD
V
0.06 × VDD
—
V
VIH
VIL
VHYS
Notes
Input high voltage
Input low voltage
Input hysteresis
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
11
General
Table 1. Voltage and current operating requirements (continued)
Symbol
IIC
Description
Min.
Max.
Unit
DC injection current — single pin
Notes
1
• VIN > VDD
0
2
mA
• VIN < VSS
0
–0.2
mA
DC injection current — total MCU limit, includes sum
of all stressed pins
• VIN > VDD
1
• VIN < VSS
0
25
mA
0
–5
mA
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1. All functional non-supply pins are internally clamped to VSS and VDD. Input must be current limited to the value specified.
To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp
voltages, then use the larger of the two values. Power supply must maintain regulation within operating VDD range during
instantaneous and operating maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the
injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external
VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not
consuming power. Examples are: if no system clock is present, or if clock rate is very low (which would reduce overall
power consumption).
5.1.2 LVD and POR operating requirements
Table 2. LVD and POR operating requirements
Symbol
Description
Min.
Typ.
Max.
Unit
VPOR
Falling VDD POR detect voltage
TBD
1.1
TBD
V
VLVDH
Falling low-voltage detect threshold — high
range (LVDV=01)
TBD
2.56
TBD
V
Low-voltage warning thresholds — high range
VLVW1
• Level 1 falling (LVWV=00)
TBD
2.70
TBD
V
VLVW2
• Level 2 falling (LVWV=01)
TBD
2.80
TBD
V
VLVW3
• Level 3 falling (LVWV=10)
TBD
2.90
TBD
V
VLVW4
• Level 4 falling (LVWV=11)
TBD
3.00
TBD
V
VHYS
Low-voltage inhibit reset/recover hysteresis —
high range
VLVDL
Falling low-voltage detect threshold — low range
(LVDV=00)
60
TBD
TBD
Notes
1
mV
TBD
V
Low-voltage warning thresholds — low range
1
VLVW1
• Level 1 falling (LVWV=00)
TBD
1.80
TBD
V
VLVW2
• Level 2 falling (LVWV=01)
TBD
1.90
TBD
V
VLVW3
• Level 3 falling (LVWV=10)
TBD
2.00
TBD
V
VLVW4
• Level 4 falling (LVWV=11)
TBD
2.10
TBD
V
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
12
Preliminary
Freescale Semiconductor, Inc.
General
Table 2. LVD and POR operating requirements (continued)
Symbol
Description
Min.
Typ.
Max.
40
Unit
VHYS
Low-voltage inhibit reset/recover hysteresis —
low range
VBG
Bandgap voltage reference
TBD
1.00
TBD
V
tLPO
Internal low power oscillator period
TBD
1000
TBD
μs
Notes
mV
factory trimmed
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1. Rising thresholds are falling threshold + VHYS
5.1.3 Voltage and current operating behaviors
Table 3. Voltage and current operating behaviors
Symbol
Min.
Max.
Unit
• 2.7 V ≤ VDD ≤ 3.6 V, IOH = -10mA
VDD – 0.5
—
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -3mA
VDD – 0.5
—
V
• 2.7 V ≤ VDD ≤ 3.6 V, IOH = -2mA
VDD – 0.5
—
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -0.6mA
VDD – 0.5
—
V
—
100
mA
• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 10mA
—
0.5
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 3mA
—
0.5
V
• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 2mA
—
0.5
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 0.6mA
—
0.5
V
Output low current total for all ports
—
100
mA
IIN
Input leakage current (per pin)
—
1
μA
IOZ
Hi-Z (off-state) leakage current (per pin)
—
1
μA
Internal weak pullup and pulldown resistors
30
50
kΩ
VOH
Description
Notes
Output high voltage — high drive strength
Output high voltage — low drive strength
IOHT
Output high current total for all ports
VOL
Output low voltage — high drive strength
Output low voltage — low drive strength
IOLT
RPU and
RPD
1
1. Measured at VIL max and VDD min
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
13
General
5.1.4 Power mode transition operating behaviors
In the table below, all specifications except tPOR, assume the following clock
configuration:
• CPU and system clocks = 100MHz
• Bus clock = 50 MHz
• Flash clock = 25 MHz
Table 4. Power mode transition operating behaviors
tPOR
Description
Min.
Max.
Unit
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Symbol
After a POR event, amount of time from the point VDD
reaches 1.8V to execution of the first instruction
across the operating temperature range of the chip.
—
300
μs
• RUN → VLLS1
—
4.1
μs
• VLLS1 → RUN
—
123.8
μs
• RUN → VLLS2
—
4.1
μs
• VLLS2 → RUN
—
49.3
μs
• RUN → VLLS3
—
4.1
μs
• VLLS3 → RUN
—
49.2
μs
• RUN → LLS
—
4.1
μs
• LLS → RUN
—
5.9
μs
• RUN → STOP
—
4.1
μs
• STOP → RUN
—
4.2
μs
• RUN → VLPS
—
4.1
μs
• VLPS → RUN
—
5.8
μs
Notes
1
RUN → VLLS1 → RUN
RUN → VLLS2 → RUN
RUN → VLLS3 → RUN
RUN → LLS → RUN
RUN → STOP → RUN
RUN → VLPS → RUN
1. Normal boot (FTFL_OPT[LPBOOT]=1)
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
14
Preliminary
Freescale Semiconductor, Inc.
General
5.1.5 Power consumption operating behaviors
Table 5. Power consumption operating behaviors
Symbol
Description
Min.
IDD_RUN
Run mode current — all peripheral clocks disa‐
bled, code executing from flash
• @ 1.8V
• @ 3.0V
IDD_RUN
Typ.
Max.
Unit
1
—
40
TBD
mA
—
42
TBD
mA
Run mode current — all peripheral clocks ena‐
bled, code executing from flash
• @ 1.8V
2
—
55
TBD
mA
Pr
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• @ 3.0V
—
IDD_RUN_M Run mode current — all peripheral clocks ena‐
bled and peripherals active, code executing from
AX
flash
• @ 1.8V
• @ 3.0V
Notes
56
TBD
mA
—
85
TBD
mA
—
85
TBD
mA
3
IDD_WAIT
Wait mode current at 3.0 V — all peripheral
clocks disabled
—
15
TBD
mA
IDD_STOP
Stop mode current at 3.0 V
—
1.4
TBD
mA
IDD_VLPR
Very-low-power run mode current at 3.0 V — all
peripheral clocks disabled
—
1.25
TBD
mA
5
IDD_VLPR
Very-low-power run mode current at 3.0 V — all
peripheral clocks enabled
—
TBD
TBD
mA
6
IDD_VLPW
Very-low-power wait mode current at 3.0 V
—
1.05
TBD
mA
7
IDD_VLPS
Very-low-power stop mode current at 3.0 V
—
30
TBD
μA
IDD_LLS
Low leakage stop mode current at 3.0 V
—
12
TBD
μA
—
8
TBD
μA
IDD_VLLS3
4
Very low-leakage stop mode 3 current at 3.0 V
• 128KB RAM devices
IDD_VLLS2
Very low-leakage stop mode 2 current at 3.0 V
—
4
TBD
μA
IDD_VLLS1
Very low-leakage stop mode 1 current at 3.0 V
—
2
TBD
μA
IDD_VBAT
Average current when CPU is not accessing
RTC registers at 3.0 V
—
550
TBD
nA
1. 100MHz core and system clock, 50MHz bus clock, and 25MHz flash clock . MCG configured for FEI mode. All peripheral
clocks disabled.
2. 100MHz core and system clock, 50MHz bus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral
clocks enabled, but peripherals are not in active operation.
3. 100MHz core and system clock, 50MHz bus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral
clocks enabled, and peripherals are in active operation.
4. 25MHz core and system clock, 25MHz bus clock, and 12.5MHz flash clock. MCG configured for FEI mode.
5. 2 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks
disabled. Code executing from flash.
6. 2 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks
enabled but peripherals are not in active operation. Code executing from flash.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
15
General
7. 2 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks
disabled.
5.1.5.1
Diagram: Typical IDD_RUN operating behavior
The following data was measured under these conditions:
MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE)
All peripheral clocks disabled except FTFL
LVD disabled, USB regulator disabled
No GPIOs toggled
Code execution from flash
Pr
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•
•
•
•
•
Figure 1. Run mode supply current vs. core frequency — all peripheral clocks disabled
The following data was measured under these conditions:
•
•
•
•
•
MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE)
All peripheral clocks enabled but peripherals are not in active operation
LVD disabled, USB regulator disabled
No GPIOs toggled
Code execution from flash
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
16
Preliminary
Freescale Semiconductor, Inc.
Pr
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General
Figure 2. Run mode supply current vs. core frequency — all peripheral clocks enabled
5.1.6 EMC radiated emissions operating behaviors
Table 6. EMC radiated emissions operating behaviors
Symbol
Description
Frequency
band (MHz)
Typ.
Unit
Notes
dBμV
1, 2
—
2, 3
VRE1
Radiated emissions voltage, band 1
0.15–50
TBD
VRE2
Radiated emissions voltage, band 2
50–150
TBD
VRE3
Radiated emissions voltage, band 3
150–500
TBD
VRE4
Radiated emissions voltage, band 4
500–1000
TBD
0.15–1000
TBD
VRE_IEC_SAE IEC and SAE level
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/
Wideband TEM (GTEM) Cell Method.
2. VDD = 3 V, TA = 25 °C, fOSC = 16 MHz (crystal), fBUS = 20 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
17
General
5.1.7 Designing with radiated emissions in mind
1. To find application notes that provide guidance on designing your system to
minimize interference from radiated emissions, go to www.freescale.com and
perform a keyword search for “EMC design.”
5.1.8 Capacitance attributes
Symbol
Pr
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Table 7. Capacitance attributes
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
—
7
pF
CIN_D
Input capacitance: digital pins
—
7
pF
5.2 Switching electrical specifications
Table 8. Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYS
System and core clock
—
100
MHz
fBUS
Bus clock
—
50
MHz
Flash clock
—
25
MHz
fFLASH
VLPR mode
fSYS
System and core clock
—
2
MHz
fBUS
Bus clock
—
2
MHz
Flash clock
—
1
MHz
fFLASH
5.3 Thermal specifications
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
18
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.3.2 Thermal attributes
Symbol
Description
104
MAPBGA
Singlelayer (1s)
RθJA
Thermal resistance, junction to ambient (natural
convection)
TBD
Four-layer
(2s2p)
RθJA
Thermal resistance, junction to ambient (natural
convection)
Singlelayer (1s)
RθJMA
Four-layer
(2s2p)
RθJMA
—
RθJB
—
RθJC
—
ΨJT
100
LQFP
Unit
Notes
TBD
°C/W
1
TBD
TBD
°C/W
1
Thermal resistance, junction to ambient (200 ft./
min. air speed)
TBD
TBD
°C/W
1
Thermal resistance, junction to ambient (200 ft./
min. air speed)
TBD
TBD
°C/W
1
Thermal resistance, junction to board
TBD
TBD
°C/W
2
Thermal resistance, junction to case
TBD
TBD
°C/W
3
Thermal characterization parameter, junction to
package top outside center (natural convection)
TBD
TBD
°C/W
4
Pr
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Board
type
6 Peripheral operating requirements and behaviors
6.1 Core modules
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
19
Peripheral operating requirements and behaviors
6.1.1 Debug trace timing specifications
Table 10. Debug trace operating behaviors
Description
Min.
Max.
Unit
Tcyc
Clock period
Frequency dependent
MHz
Twl
Low pulse width
2
—
ns
Twh
High pulse width
2
—
ns
Tr
Clock and data rise time
—
3
ns
Tf
Clock and data fall time
—
3
ns
Ts
Data setup
3
—
ns
Th
Data hold
Pr
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Symbol
2
—
ns
Figure 3. TRACE_CLKOUT specifications
TRACE_CLKOUT
Ts
TRACE_D[3:0]
Th
Ts
Th
Figure 4. Trace data specifications
6.1.2 JTAG electricals
Table 11. JTAG electricals
Symbol
J1
J2
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
TCLK frequency of operation
MHz
• JTAG and CJTAG
0
25
• Serial Wire Debug
0
50
1/J1
—
TCLK cycle period
ns
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
20
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 11. JTAG electricals (continued)
Symbol
J3
Description
Min.
Max.
TCLK clock pulse width
Unit
ns
20
—
• Serial Wire Debug
10
—
J4
TCLK rise and fall times
—
3
ns
J5
Boundary scan input data setup time to TCLK rise
20
—
ns
J6
Boundary scan input data hold time after TCLK rise
0
—
ns
J7
TCLK low to boundary scan output data valid
—
30
ns
J8
TCLK low to boundary scan output high-Z
—
30
ns
J9
TMS, TDI input data setup time to TCLK rise
16
—
ns
J10
TMS, TDI input data hold time after TCLK rise
1
—
ns
J11
TCLK low to TDO data valid
—
4
ns
J12
TCLK low to TDO high-Z
—
4
ns
J13
TRST assert time
100
—
ns
J14
TRST setup time (negation) to TCLK high
8
—
ns
Pr
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• JTAG and CJTAG
J2
J3
J3
TCLK (input)
J4
J4
Figure 5. Test clock input timing
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
21
Peripheral operating requirements and behaviors
TCLK
J5
Data inputs
J6
Input data valid
J7
Data outputs
Output data valid
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J8
Data outputs
J7
Data outputs
Output data valid
Figure 6. Boundary scan (JTAG) timing
TCLK
J9
TDI/TMS
J10
Input data valid
J11
TDO
Output data valid
J12
TDO
J11
TDO
Output data valid
Figure 7. Test Access Port timing
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
22
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
TCLK
J14
J13
TRST
Figure 8. TRST timing
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6.2 System modules
There are no specifications necessary for the device's system modules.
6.3 Clock modules
6.3.1 MCG Specifications
Table 12. MCG specifications
Symbol
Description
Min.
Typ.
Max.
Unit
fints_ft
Internal reference frequency (slow clock) — facto‐
ry trimmed at nominal VDD and 25°C
—
32.768
—
kHz
fints_t
Internal reference frequency (slow clock) — user
trimmed
31.25
—
39.0625
kHz
tirefsts
Internal reference (slow clock) startup time
—
TBD
4
µs
Resolution of trimmed DCO output frequency at
fixed voltage and temperature — using SCTRIM
and SCFTRIM
—
± 0.1
± 0.3
%fdco
Δfdco_res_t Resolution of trimmed DCO output frequency at
fixed voltage and temperature — using SCTRIM
only
—
± 0.2
± 0.5
%fdco
Total deviation of trimmed DCO output frequency
over voltage and temperature
—
+ 0.5
± 3.5
%fdco
Δfdco_t
Total deviation of trimmed DCO output frequency
over fixed voltage and temperature range of 0–
70°C
—
± 0.5
± TBD
%fdco
fintf_ft
Internal reference frequency (fast clock) — factory
trimmed at nominal VDD and 25°C
3.875
4
4.125
MHz
fintf_t
Internal reference frequency (fast clock) — user
trimmed
3
—
5
MHz
Δfdco_res_t
Δfdco_t
Notes
- 1.0
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
23
Peripheral operating requirements and behaviors
Table 12. MCG specifications (continued)
Symbol
tirefstf
Description
Internal reference startup time (fast clock)
Min.
Typ.
Max.
Unit
—
TBD
TBD
µs
floc_low
Loss of external clock minimum frequency —
RANGE = 00
(3/5) x
fints_t
—
—
kHz
floc_high
Loss of external clock minimum frequency —
RANGE = 01, 10, or 11
(16/5) x
fints_t
—
—
kHz
20
20.97
25
MHz
Notes
FLL
DCO output fre‐
quency range —
user trimmed
and DMX32=0
Low range (DRS=00)
1, 2
640 × fints_t
Pr
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fdco_t
Mid range (DRS=01)
40
41.94
50
MHz
60
62.91
75
MHz
80
83.89
100
MHz
—
23.99
—
MHz
—
47.97
—
MHz
—
71.99
—
MHz
—
95.98
—
MHz
1280 × fints_t
Mid-high range (DRS=10
192)0 × fints_t
High range (DRS=11)
2560 × fints_t
fdco_t_DMX3 DCO output fre‐
quency range —
2
reference =
32,768Hz and
DMX32=1
Low range (DRS=00)
3
732 × fints_t
Mid range (DRS=01)
1464 × fints_t
Mid-high range (DRS=10)
2197 × fints_t
High range (DRS=11)
2929 × fints_t
Jcyc_fll
FLL period jitter
—
TBD
TBD
ps
Jacc_fll
FLL accumulated jitter of DCO output over a 1µs
time window
—
TBD
TBD
ps
FLL target frequency acquisition time
—
—
1
ms
VCO operating frequency
48.0
—
100
MHz
fpll_ref
PLL reference frequency range
2.0
—
4.0
MHz
Jcyc_pll
PLL period jitter
—
400
—
ps
6, 7
Jacc_pll
PLL accumulated jitter over 1µs window
—
TBD
—
ps
6,7
tfll_acquire
4
5
PLL
fvco
Dlock
Lock entry frequency tolerance
± 1.49
—
± 2.98
%
Dunl
Lock exit frequency tolerance
± 4.47
—
± 5.97
%
tpll_lock
Lock detector detection time
—
—
0.15 +
1075(1/
fpll_ref)
ms
8
1. The resulting system clock frequencies should not exceed their maximum specified values.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
24
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
2.
3.
4.
5.
This specification includes the 2% precision of the internal reference frequency (slow clock).
The resulting clock frequency must not exceed the maximum specified clock frequency of the device.
This specification was obtained at TBD frequency.
This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed,
DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE,
FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running.
6. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of
each PCB and results will vary.
7. This specification was obtained at internal frequency of TBD.
8. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled
(BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes
it is already running.
Pr
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6.3.2 Oscillator Electrical Characteristics
This section provides the electrical characteristics of the module.
6.3.2.1
Oscillator DC Electrical Specifications
Table 13. Oscillator DC electrical specifications, (VSSOSC= 0 VDC) (TA = TL to TH)
Symbol
VDD33OSC
IDDOSC
IDDOSC
Description
Min.
Typ.
Max.
Unit
3.3 V supply voltage
1.71
—
3.6
V
Supply current — low-power mode
• 32 kHz
—
500
—
nA
• 1 MHz
—
100
—
μA
• 4 MHz
—
200
—
μA
• 8 MHz
—
300
—
μA
• 16 MHz
—
700
—
μA
• 24 MHz
—
1.2
—
mA
• 32 MHz
—
1.5
—
mA
Supply current — high gain mode
• 32 kHz
—
25
—
μA
• 1 MHz
—
200
—
μA
• 4 MHz
—
400
—
μA
• 8 MHz
—
800
—
μA
• 16 MHz
—
1.5
—
mA
• 24 MHz
—
3
—
mA
• 32 MHz
—
4
—
mA
Notes
1
1
Cx
EXTAL load capacitance
—
—
—
2, 3
Cy
XTAL load capacitance
—
—
—
2,3
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
25
Peripheral operating requirements and behaviors
Table 13. Oscillator DC electrical specifications, (VSSOSC= 0 VDC) (TA = TL to TH)
(continued)
RF
RS
Description
Min.
Typ.
Max.
Unit
Notes
Feedback resistor — low-frequency, low-power
mode
—
—
—
MΩ
2,3
Feedback resistor — low-frequency, high-gain
mode
—
10
—
MΩ
Feedback resistor — high-frequency, low-power
mode (1 – 8 MHz, 8 – 32 MHz)
—
—
—
MΩ
Feedback resistor — high-frequency, high-gain
mode (1 – 8 MHz, 8 – 32 MHz)
—
1
—
MΩ
Pr
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Symbol
Series resistor — low-frequency, low-power
mode
—
—
—
kΩ
Series resistor — low-frequency, high-gain mode
—
200
—
kΩ
Series resistor — high-frequency, low-power
mode
—
—
—
kΩ
—
6.6
—
kΩ
—
3.3
—
kΩ
—
0
—
kΩ
—
0
—
kΩ
—
0
—
kΩ
—
0
—
kΩ
—
0
—
kΩ
Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, low-power mode
—
0.6
—
V
Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, high-gain mode
0.75 ×
VDD33OSC
VDD33OSC
—
V
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, low-power mode
—
0.6
—
V
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, high-gain mode
0.75 ×
VDD33OSC
VDD33OSC
—
V
Series resistor — high-frequency, high-gain
mode
• 1 MHz resonator
• 2 MHz resonator
• 4 MHz resonator
• 8 MHz resonator
• 16 MHz resonator
• 20 MHz resonator
• 32 MHz resonator
Vpp
1. VDD33OSC=3.3 V, Temperature =27 °C, Cx/Cy=20 pF
2. See crystal or resonator manufacturer's recommendation
3. RF and Cx,Cy are integrated in low-frequency, low-power mode and must not be attached externally
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
26
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.3.2.2
Oscillator frequency specifications
Table 14. Oscillator frequency specifications, (VDD33OSC = VDD33OSC (min) to
VDD33OSC (max), TA = TL to TH)
Symbol
Description
Min.
Typ.
Max.
Unit
Oscillator crystal or resonator frequency — low
frequency mode
32
—
40
kHz
fosc_hi_1
Oscillator crystal or resonator frequency — high
frequency mode (low range)
1
—
8
MHz
fosc_hi_2
Oscillator crystal or resonator frequency — high
frequency mode (high range)
8
—
32
MHz
tdc_extal
Input clock duty cycle (external clock mode)
40
50
60
%
Crystal start-up time — 32 kHz low-frequency,
low-power mode
—
TBD
—
ms
Crystal start-up time — 32 kHz low-frequency,
high-gain mode
—
800
—
ms
Crystal start-up time — 8 MHz high-frequency,
low-power mode
—
4
—
ms
Crystal start-up time — 8 MHz high-frequency,
high-gain mode
—
3
—
ms
tcst
Pr
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fosc_lo
Notes
1, 2, 3
1. This parameter is characterized before qualification rather than 100% tested.
2. Proper PC board layout procedures must be followed to achieve specifications.
3. Crystal start up time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S
register being set.
6.3.3 32kHz Oscillator Electrical Characteristics
This section describes the module electrical characteristics.
6.3.3.1
32kHz Oscillator DC Electrical Specifications
Table 15. 32kHz Oscillator Module DC Electrical Specifications (VSSOSC= 0 VDC)
(TA = TL to TH)
Symbol
Description
Min.
Typ.
Max.
Unit
Supply voltage
1.71
—
3.6
V
Internal feedback resistor
—
100
—
MΩ
Cpara
Parasitical capacitance of EXTAL32 and XTAL32
—
2.5
—
pF
Cload
Internal load capacitance (programmable)
—
15
—
pF
Peak-to-peak amplitude of oscillation
—
0.6
—
V
VBAT
RF
Vpp
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
27
Peripheral operating requirements and behaviors
6.3.3.2
32kHz Oscillator Frequency Specifications
Table 16. 32kHz oscillator frequency specifications (VDD33OSC = VDD33OSC (min)
to VDD33OSC (max), TA = TL to TH)
Symbol
fosc_lo
tstart
Description
Min.
Typ.
Max.
Unit
Oscillator crystal
—
32
—
kHz
Crystal start-up time
—
1000
—
ms
Notes
1, 2
Pr
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1. This parameter is characterized before qualification rather than 100% tested.
2. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFL) Electrical Characteristics
This section describes the electrical characteristics of the FTFL module.
6.4.1.1
Flash Timing Parameters — Program and Erase
The following characteristics represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 17. NVM program/erase timing characteristics
Symbol
Description
Min.
Typ.
Max.
Unit
thvpgm4
Notes
Longword Program high-voltage time
—
20
TBD
μs
thversscr
Sector Erase high-voltage time
—
20
100
ms
1
thversblk
Erase Block high-voltage time
—
160
800
ms
1
Notes
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2
Flash Timing Parameters — Commands
Table 18. Flash command timing characteristics
Symbol
Min.
Typ.
Max.
Unit
Read 1s Block execution time
—
—
1.4
ms
trd1sec2k
Read 1s Section execution time (2 KB flash sec‐
tor)
—
—
40
μs
tpgmchk
Program Check execution time
—
—
35
μs
trd1blk
Description
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
28
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 18. Flash command timing characteristics (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
1
Read Resource execution time
—
—
35
μs
tpgm4
Program Longword execution time
—
50
TBD
μs
tersblk
Erase Flash Block execution time
—
160
800
ms
2
tersscr
Erase Flash Sector execution time
—
20
100
ms
2
Program Section execution time (2 KB flash sec‐
tor)
—
TBD
TBD
ms
trd1all
Read 1s All Blocks execution time
—
—
2.8
ms
trdonce
Read Once execution time
—
—
35
μs
Program Once execution time
—
50
TBD
μs
tersall
Erase All Blocks execution time
—
320
1600
ms
2
tvfykey
Verify Backdoor Access Key execution time
—
—
35
μs
1
tpgmsec2k
tpgmonce
Pr
el
im
in
ar
y
trdrsrc
1
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
6.4.1.3
Flash (FTFL) Current and Power Parameters
Table 19. Flash (FTFL) current and power parameters
Symbol
Description
IDD_PGM
Worst case programming current in program flash
6.4.1.4
Typ.
Unit
10
mA
Reliability Characteristics
Table 20. NVM reliability characteristics
Symbol
Description
Min.
Typ.1
Max.
Unit
Notes
Program Flash
tnvmretp10k
Data retention after up to 10 K cycles
5
TBD
—
years
2
tnvmretp1k
Data retention after up to 1 K cycles
10
TBD
—
years
2
tnvmretp100
Data retention after up to 100 cycles
15
TBD
—
years
2
10 K
TBD
—
cycles
3
nnvmcycp
Cycling endurance
1. Typical data retention values are based on intrinsic capability of the technology measured at high temperature derated to
25°C. For additional information on how Freescale defines typical data retention, please refer to Engineering Bulletin
EB618.
2. Data retention is based on Tjavg = 55°C (temperature profile over the lifetime of the application).
3. Cycling endurance represents number of program/erase cycles at -40°C ≤ Tj ≤ 125°C
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
29
Peripheral operating requirements and behaviors
6.4.2 EzPort Switching Specifications
Table 21. EzPort switching specifications
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
EP1
EZP_CK frequency of operation (all commands except
READ)
—
fSYS/2
MHz
EP1a
EZP_CK frequency of operation (READ command)
—
fSYS/8
MHz
EP2
EZP_CS negation to next EZP_CS assertion
2 x tEZP_CK
—
ns
EP3
EZP_CS input valid to EZP_CK high (setup)
5
—
ns
EP4
EZP_CK high to EZP_CS input invalid (hold)
5
—
ns
EP5
EZP_D input valid to EZP_CK high (setup)
2
—
ns
EP6
EZP_CK high to EZP_D input invalid (hold)
5
—
ns
EP7
EZP_CK low to EZP_Q output valid (setup)
—
12
ns
EP8
EZP_CK low to EZP_Q output invalid (hold)
0
—
ns
EP9
EZP_CS negation to EZP_Q tri-state
—
12
ns
EZP_CK
Pr
el
im
in
ar
y
Num
EP3
EZP_CS
EP9
EP7
EZP_Q (output)
EP5
EZP_D (input)
EP2
EP4
EP8
EP6
Figure 9. EzPort Timing Diagram
6.5 Security and integrity modules
There are no specifications necessary for the device's security and integrity modules.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
30
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.6 Analog
6.6.1 ADC electrical specifications
6.6.1.1
Pr
el
im
in
ar
y
The 16-bit accuracy specifications listed in Table 22 and Table 23 are achievable on the
differential pins (ADCx_DP0, ADCx_DM0, ADC, ADCx_DP1, ADCx_DM1,
ADCx_DP3, and ADCx_DP3). The ADCx_DP2 and ADCx_DM2 ADC inputs are used
as the PGA inputs and are not direct device pins. Accuracy specifications for these pins
are defined in Table 24 and Table 25. All other ADC channels meet the 13-bit
differential/12-bit single-ended accuracy specifications.
16-bit ADC operating conditions
Table 22. 16-bit ADC operating conditions
Description
Conditions
Min.
Typ.1
Max.
Unit
VDDA
Supply voltage
Absolute
1.71
—
3.6
V
ΔVDDA
Supply voltage
Delta to VDD (VDDVDDA)
-100
0
+100
mV
2
ΔVSSA
Ground voltage
Delta to VSS (VSSVSSA)
-100
0
+100
mV
2
VREFH
ADC reference
voltage high
1.13
VDDA
VDDA
V
VREFL
Reference volt‐
age low
VSSA
VSSA
VSSA
V
VADIN
Input voltage
VREFL
—
VREFH
V
CADIN
Input capaci‐
tance
• 16 bit modes
—
8
10
pF
• 8/10/12 bit
modes
—
4
5
—
2
5
Symbol
RADIN
Input resistance
Notes
kΩ
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
31
Peripheral operating requirements and behaviors
Table 22. 16-bit ADC operating conditions (continued)
Symbol
RAS
Description
Conditions
Analog source
resistance
16 bit modes
Min.
Typ.1
Max.
Unit
Notes
External to MCU
• fADCK > 8MHz
—
—
0.5
kΩ
• fADCK = 4–8MHz
—
—
1
kΩ
• fADCK < 4MHz
—
—
2
kΩ
• fADCK > 16MHz
—
—
0.5
kΩ
• fADCK > 8MHz
—
—
1
kΩ
Assumes
ADLSMP=0
Pr
el
im
in
ar
y
13/12 bit modes
• fADCK = 4–8MHz
—
—
2
kΩ
• fADCK < 4MHz
—
—
5
kΩ
• fADCK > 8MHz
—
—
2
kΩ
• fADCK = 4–8MHz
—
—
5
kΩ
• fADCK < 4MHz
—
—
10
kΩ
—
—
5
kΩ
—
—
10
kΩ
• 16 bit modes
1.0
—
TBD
MHz
• ≤13 bit modes
1.0
—
TBD
MHz
1.0
—
8.0
MHz
1.0
—
12.0
MHz
• 16 bit modes
1.0
—
5.0
MHz
• ≤13 bit modes
1.0
—
8.0
MHz
• 16 bit modes
1.0
—
2.5
MHz
• ≤13 bit modes
1.0
—
5.0
MHz
11/10 bit modes
9/8 bit modes
• fADCK > 8MHz
• fADCK < 8MHz
fADCK
ADC conversion
clock frequency
ADLPC=0, ADHSC=1
ADLPC=0, ADHSC=0
• 16 bit modes
• ≤13 bit modes
ADLPC=1, ADHSC=1
ADLPC=1, ADHSC=0
1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. DC potential difference.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
32
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
Z ADIN
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
Pad
leakage
due to
input
protection
Z AS
R AS
ADC SAR
ENGINE
R ADIN
V ADIN
C AS
V AS
Pr
el
im
in
ar
y
R ADIN
INPUT PIN
R ADIN
INPUT PIN
R ADIN
INPUT PIN
C ADIN
Figure 10. ADC input impedance equivalency diagram
6.6.1.2
16-bit ADC electrical characteristics
Table 23. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA)
Symbol
IDDA
fADACK
Conditions1
Min.
Typ.2
Max.
Unit
Notes
• ADLPC=1, ADHSC=0
—
215
—
μA
• ADLPC=1, ADHSC=1
—
340
—
μA
ADLSMP=
0
• ADLPC=0, ADHSC=0
—
470
—
μA
• ADLPC=0, ADHSC=1
—
610
—
μA
Supply current
• Stop, reset, module off
—
0.01
0.8
μA
ADC asynchro‐
nous clock
source
• ADLPC=1, ADHSC=0
TBD
2.4
TBD
MHz
• ADLPC=1, ADHSC=1
TBD
4.0
TBD
MHz
• ADLPC=0, ADHSC=0
TBD
5.2
TBD
MHz
• ADLPC=0, ADHSC=1
TBD
6.2
TBD
MHz
Description
Supply current
Sample Time
ADCO=1
tADACK = 1/
fADACK
See Reference Manual chapter for sample times
Conversion Time See Reference Manual chapter for conversion times
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
33
Peripheral operating requirements and behaviors
Table 23. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
TUE
DNL
INL
EZS
Conditions1
Description
Total unadjusted
error
Min.
Typ.2
Max.
Unit
Notes
• 16 bit differential
—
±14.0
±TBD
LSB3
• 16 bit single-ended
—
±13.0
±TBD
• 13 bit differential
—
±1.5
±TBD
• 12 bit single-ended
—
±TBD
±TBD
Max hard‐
ware aver‐
aging
(AVGE =
%1, AVGS
= %11)
• 11 bit differential
—
±0.8
±TBD
• 10 bit single-ended
—
±TBD
±TBD
• 9 bit differential
—
±0.5
±1.0
• 8 bit single-ended
—
±0.5
±1.0
Pr
el
im
in
ar
y
Symbol
Differential nonlinearity
Integral non-line‐
arity
Zero-scale error
• 16 bit differential
—
±2.5
±TBD
• 16 bit single-ended
—
±2.5
±TBD
• 13 bit differential
—
±0.7
±TBD
• 12 bit single-ended
—
±0.7
±TBD
• 11 bit differential
—
±0.5
±TBD
• 10 bit single-ended
—
±TBD
±TBD
• 9 bit differential
—
±0.2
±0.5
• 8 bit single-ended
—
±0.2
±0.5
• 16 bit differential
—
-6 to +2.5
—
• 16 bit single-ended
—
-2 to +12
—
• 13 bit differential
—
±1.0
±TBD
• 12 bit single-ended
—
±1.0
±TBD
• 11 bit differential
—
±0.5
±TBD
• 10 bit single-ended
—
±0.5
±TBD
• 9 bit differential
—
±0.3
±0.5
• 8 bit single-ended
—
±0.3
±0.5
• 16 bit differential
—
±4.0
—
• 16 bit single-ended
—
±4.0
—
• 13 bit differential
—
±0.7
±TBD
• 12 bit single-ended
—
±0.7
±TBD
• 11 bit differential
—
±0.4
±TBD
• 10 bit single-ended
—
±0.4
±TBD
• 9 bit differential
—
±0.2
±0.5
• 8 bit single-ended
—
±0.2
±0.5
LSB3
Max hard‐
ware aver‐
aging
(AVGE =
%1, AVGS
= %11)
LSB3
Max aver‐
aging
LSB3
VADIN =
VSSA
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
34
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 23. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
EFS
EQ
ENOB
Conditions1
Description
Full-scale error
Min.
Typ.2
Max.
Unit
Notes
• 16 bit differential
—
0 to +10
—
LSB3
• 16 bit single-ended
—
0 to +14
—
VADIN =
VDDA
• 13 bit differential
—
±1.0
±TBD
• 12 bit single-ended
—
±TBD
±TBD
• 11 bit differential
—
±0.4
±TBD
• 10 bit single-ended
—
±0.4
±TBD
• 9 bit differential
—
±0.2
±0.5
• 8 bit single-ended
—
±0.2
±0.5
Pr
el
im
in
ar
y
Symbol
Quantization er‐
ror
• 16 bit modes
—
-1 to 0
—
• ≤13 bit modes
—
—
±0.5
Effective number 16 bit differential mode
of bits
• Avg=32
LSB3
TBD
13.6
TBD
bits
• Avg=16
TBD
TBD
TBD
bits
• Avg=8
TBD
14.1
TBD
bits
• Avg=4
TBD
TBD
TBD
bits
• Avg=1
TBD
13.2
TBD
bits
TBD
TBD
TBD
bits
TBD
TBD
TBD
bits
TBD
TBD
TBD
bits
TBD
TBD
TBD
bits
TBD
TBD
TBD
bits
4
16 bit single-ended mode
• Avg=32
• Avg=16
• Avg=8
• Avg=4
• Avg=1
SINAD
THD
Signal-to-noise
plus distortion
See ENOB
Total harmonic
distortion
16 bit differential mode
6.02 × ENOB + 1.76
• Avg=32
dB
—
-94
TBD
dB
—
TBD
TBD
dB
4
16 bit single-ended mode
• Avg=32
SFDR
Spurious free dy‐ 16 bit differential mode
namic range
• Avg=32
4
TBD
95
—
dB
TBD
TBD
—
dB
16 bit single-ended mode
• Avg=32
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
35
Peripheral operating requirements and behaviors
Table 23. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
Symbol
EIL
Conditions1
Description
Typ.2
Min.
Input leakage er‐
ror
Max.
IIn × RAS
Unit
Notes
mV
IIn = leak‐
age cur‐
rent
(refer to
the MCU's
voltage
and cur‐
rent oper‐
ating rat‐
ings)
VTEMP25
• –40°C to 25°C
—
TBD
—
mV/°C
• 25°C to 105°C
—
TBD
—
mV/°C
—
TBD
—
mV
Pr
el
im
in
ar
y
Temp sensor
slope
Temp sensor
voltage
25°C
1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA
2. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
3. 1 LSB = (VREFH - VREFL)/2N
4. Input data is 1 kHz sine wave.
6.6.1.3
16-bit ADC with PGA operating conditions
Table 24. 16-bit ADC with PGA operating conditions
Description
Conditions
Min.
Typ.1
Max.
Unit
VDDA
Supply voltage
Absolute
1.71
—
3.6
V
VREFPGA
PGA ref voltage
Symbol
VADIN
Input voltage
RPGA
Input impedance
RPGAD
Differntial input
impedance
VREFOUT VREFOUT VREFOUT
V
VSSA
—
VDDA
V
Gain = 1, 2, 4, 8
TBD
64
TBD
kΩ
Gain = 16, 32
TBD
32
TBD
Gain = 64
TBD
16
TBD
Gain = 1, 2, 4, 8
TBD
128
TBD
Gain = 16, 32
TBD
64
TBD
Gain = 64
TBD
32
TBD
—
100
1.25
—
RAS
Analog source
resistance
Gain = 16, 32
TS
ADC sampling
time
Gain = 64
Notes
2, 3
kΩ
IN+ to IN-
—
Ω
4
—
µs
5
1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 6 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. ADC must be configured to use the internal voltage reference (VREFOUT)
3. PGA reference connected to the VREFOUT pin. If the user wishes to drive VREFOUT with a voltage other than the output
of the VREF module, the VREF module must be disabled.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
36
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
4. The analog source resistance (RAS), external to MCU, should be kept as minimum as possible. Increased RAS causes drop
in PGA gain without affecting other performances. This is not dependent on ADC clock frequency.
5. The minimum sampling time is dependent on input signal frequency and ADC mode of operation. A minimum of 1.25µs
time should be allowed for Fin=4 kHz at 16-bit differential mode. Recommended ADC setting is: ADLSMP=1, ADLSTS=2 at
8 MHz ADC clock. The ADLSTS bits can be adjusted for different ADC clock frequency
6.6.1.4
16-bit ADC with PGA characteristics
Table 25. 16-bit ADC with PGA characteristics
Symbol
Description
IDDA_PGA
Supply current
G
Leakage current
Gain2
Typ.1
Max.
Unit
TBD
590
TBD
μA
—
<1
TBD
μA
• PGAG=0
TBD
1
TBD
dB
• PGAG=1
TBD
2
TBD
dB
• PGAG=2
TBD
3.9
TBD
dB
• PGAG=3
TBD
TBD
TBD
dB
• PGAG=4
TBD
TBD
TBD
dB
• PGAG=5
TBD
29.9
TBD
dB
• PGAG=6
TBD
TBD
TBD
dB
—
—
±0.5
dB
—
—
4
kHz
—
—
40
kHz
TBD
TBD
—
dB
VDDA= 3V
±100mV,
fVDDA= 50Hz,
60Hz
• Gain=1
TBD
TBD
—
dB
• Gain=64
TBD
TBD
—
dB
VCM=
500mVpp,
fVCM= 50Hz,
100Hz
PGA disabled
Pr
el
im
in
ar
y
ILKG
Min.
Conditions
GA
Gain error
BW
Input signal band‐
width
PSRR
Power supply re‐
jection ration
CMRR
Common mode
rejection ratio
• 16-bit modes
• < 16-bit modes
Gain=1
Notes
RAS < 100Ω
RAS < 100Ω
VOFS
Input offset volt‐
age
—
0.2
TBD
mV
Gain=1, ADC
Averaging=32
TGSW
Gain switching
settling time
—
TBD
10
µs
3
dG/dT
Gain drift over
temperature
—
TBD
TBD
ppm/°C
0 to 50°C
—
TBD
TBD
ppm/°C
—
TBD
TBD
ppm/°C
0 to 50°C, ADC
Averaging=32
—
TBD
TBD
%/V
—
TBD
TBD
%/V
VDDA from 1.71
to 3.6V
dVOFS/dT
Offset drift over
temperature
dG/dVDDA
Gain drift over
supply voltage
• Gain=1
• Gain=64
Gain=1
• Gain=1
• Gain=64
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
37
Peripheral operating requirements and behaviors
Table 25. 16-bit ADC with PGA characteristics (continued)
Symbol
EIL
Description
Conditions
Input leakage er‐
ror
All modes
Min.
Typ.1
Max.
IIn × RAS
Unit
Notes
mV
IIn = leakage
current
(refer to the
MCU's voltage
and current op‐
erating ratings)
SNR
THD
SFDR
ENOB
SINAD
Maximum differ‐
ential input signal
swing
[(VREFPGA × 2.33) - 0.2] / (2 ×
Gain)
V
4
Average=32
Signal-to-noise
ratio
• Gain=1
• Gain=64
TBD
8.3
—
dB
TBD
57.7
—
dB
Total harmonic
distortion
• Gain=1
• Gain=64
TBD
87.3
—
dB
TBD
85.3
—
dB
Spurious free dy‐
namic range
• Gain=1
• Gain=64
TBD
92.42
—
dB
TBD
92.54
—
dB
Effective number
of bits
• Gain=1, Average=4
TBD
12.3
—
bits
• Gain=1, Average=8
TBD
12.7
—
bits
• Gain=64, Average=4
TBD
8.4
—
bits
• Gain=64, Average=8
TBD
8.7
—
bits
• Gain=1, Average=32
TBD
13.4
—
bits
• Gain=2, Average=32
TBD
13.1
—
bits
• Gain=4, Average=32
TBD
12.6
—
bits
• Gain=8, Average=32
TBD
11.8
—
bits
• Gain=16, Average=32
TBD
11.1
—
bits
• Gain=32, Average=32
TBD
10.2
—
bits
• Gain=64, Average=32
TBD
9.3
—
bits
Pr
el
im
in
ar
y
VPP,DIFF
Signal-to-noise
plus distortion ra‐
tio
See ENOB
6.02 × ENOB + 1.76
Average=32,
fin=100Hz
Average=32,
fin=100Hz
dB
1. Typical values assume VDDA =3.0V, Temp=25°C, fADCK=6MHz unless otherwise stated.
2. Gain = 2PGAGx
3. When the PGA gain is changed, it takes some time to settle the output for the ADC to work properly. During a gain
switching, a few ADC outputs should be discarded (minimum two data samples, may be more depending on ADC
sampling rate and time of the switching).
4. Limit the input signal swing so that the PGA does not saturate during operation. Input signal swing is dependent on the
PGA reference voltage and gain setting.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
38
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.6.2 CMP and 6-bit DAC electrical specifications
Table 26. Comparator and 6-bit DAC electrical specifications
Symbol
VDD
Description
Min.
Typ.
Max.
Unit
Supply voltage
1.71
—
3.6
V
IDDHS
Supply current, High-speed mode (EN=1, PMODE=1,
VDDA >= VLVI_trip)
—
—
200
μA
IDDLS
Supply current, low-speed mode (EN=1, PMODE=0)
—
—
20
μA
IDDOFF
Supply current, OFF Mode (EN=0,)
—
—
100
nA
VSS – 0.3
—
VDD
V
Analog input voltage
VAIO
Analog input offset voltage
VH
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VAIN
—
—
20
mV
• HYSTCTR = 00
—
5
—
mV
• HYSTCTR = 01
—
10
—
mV
• HYSTCTR = 10
—
20
—
mV
• HYSTCTR = 11
—
30
—
mV
Analog comparator hysteresis
VCMPOh
Output high
VDD – 0.5
—
—
V
VCMPOl
Output low
—
—
0.5
V
tDHS
Propagation delay, high-speed mode (EN=1,
PMODE=1)
20
50
120
ns
tDLS
Propagation delay, low-speed mode (EN=1,
PMODE=1)
120
250
420
ns
Analog comparator initialization delay
—
—
TBD
ns
6-bit DAC current adder (enabled)
—
—
8
μA
IDAC6b
INL
6-bit DAC integral non-Llnearity
–0.5
—
0.5
LSB1
DNL
6-bit DAC differential non-linearity
–0.3
—
0.3
LSB
Notes
1. 1 LSB = Vreference/64
6.6.3 12-bit DAC electrical characteristics
6.6.3.1
Symbol
12-bit DAC operating requirements
Table 27. 12-bit DAC operating requirements
Desciption
Min.
Max.
Unit
VDDA
Supply voltage
1.71
3.6
V
VDACR
Reference voltage
1.15
3.6
V
Temperature
−40
105
°C
TA
1
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
39
Peripheral operating requirements and behaviors
Table 27. 12-bit DAC operating requirements (continued)
Symbol
Desciption
Min.
Max.
Unit
Notes
2
CL
Output load capacitance
—
100
pF
IL
Output load current
—
1
mA
1. The DAC reference can be selected to be VDDA or the voltage output of the VREF module (VREFO)
2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC
6.6.3.2
Table 28. 12-bit DAC operating behaviors
Min.
Typ.
Max.
Unit
12
—
12
b
IDDA_DACLP Supply current — low-power mode
—
—
150
μA
IDDA_DACH Supply current — high-speed mode
—
—
700
μA
n
P
Description
Pr
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Symbol
12-bit DAC operating behaviors
Resolution
Notes
tDACLP
Full-scale settling time (0x080 to 0xF7F) — lowpower mode
—
100
200
μs
1
tDACHP
Full-scale settling time (0x080 to 0xF7F) — highpower mode
—
15
30
μs
1
tCCDACLP
Code-to-code settling time (0xBF8 to 0xC08) —
low-power mode
—
—
5
μs
1
tCCDACHP
Code-to-code settling time (0xBF8 to 0xC08) —
high-speed mode
1
TBD
—
μs
1
Vdacoutl
DAC output voltage range low — high-speed
mode, no load, DAC set to 0x000
0
100
—
mV
Vdacouth
DAC output voltage range high — high-speed
mode, no load, DAC set to 0xFFF
VDACR
−100
—
VDACR
mV
INL
Integral non-linearity error — high speed mode
±3
—
±8
LSB
2
DNL
Differential non-linearity error — VDACR > 2 V
±0.5
—
±1
LSB
3
DNL
Differential non-linearity error — VDACR = VRE‐
FO (1.15 V)
±0.5
—
±1
LSB
4
VOFFSET
Offset error
±0.4
—
±0.8
%FSR
5
EG
Gain error
±0.1
—
±0.6
%FSR
5
90
dB
PSRR
Power supply rejection ratio, VDDA > = 2.4 V
60
TCO
Temperature coefficient offset voltage
—
TBD
—
μV/C
TGE
Temperature coefficient gain error
—
TBD
—
ppm of
FSR/C
AC
Offset aging coefficient
—
—
TBD
μV/yr
Output resistance load = 3 kΩ
—
—
250
Ω
Rop
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
40
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 28. 12-bit DAC operating behaviors (continued)
Symbol
SR
Min.
Typ.
Max.
Slew rate -80h→ F7Fh→ 80h
1.2
1.7
—
• Low power (SPLP)
0.05
0.12
—
—
—
-80
Channel to channel cross talk
BW
3dB bandwidth
Notes
V/μs
• High power (SPHP)
CT
Unit
dB
kHz
• High power (SPHP)
550
—
—
• Low power (SPLP)
40
—
—
Pr
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1.
2.
3.
4.
5.
Description
Settling within ±1 LSB
The INL is measured for 0+100mV to VDACR−100 mV
The DNL is measured for 0+100 mV to VDACR−100 mV
The DNL is measured for 0+100mV to VDACR−100 mV with VDDA > 2.4V
Calculated by a best fit curve from VSS+100 mV to VREF−100 mV
Figure 11. Typical INL error vs. digital code
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
41
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Peripheral operating requirements and behaviors
Figure 12. Offset at half scale vs. temperature
6.6.4 Voltage Reference Electrical Specifications
Table 29. VREF full-range operating requirements
Symbol
Description
Min.
Max.
Unit
Supply voltage
1.71
3.6
V
TA
Temperature
−40
105
°C
CL
Output load capacitance
—
100
nF
VDDA
Notes
Table 30. VREF full-range operating behaviors
Symbol
Description
Min.
Typ.
Max.
Unit
Vout
Voltage reference output with factory trim
TBD
1.2
TBD
V
Vout
Voltage reference output without factory trim
1.15
—
1.24
V
Vdrift
Temperature drift (Vmax -Vmin across the full
temperature range)
—
—
7
mV
Notes
See Fig‐
ure 13
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
42
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 30. VREF full-range operating behaviors (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
Tc
Temperature coefficient
—
—
TBD
ppm/°C
Ac
Aging coefficient
—
—
TBD
ppm/year
Ioff
Powered down current (off mode, VREFEN = 0,
VRSTEN = 0)
—
—
0.10
µA
Ibg
Bandgap only (MODE_LV = 00) current
—
TBD
75
µA
Itr
Tight-regulation buffer (MODE_LV =10) current
—
—
1.1
mA
Load regulation (MODE_LV = 10) current
—
—
100
µV/mA
100
—
TBD
µs
—
—
TBD
mV
–60
—
TBD
dB
Buffer startup time
DC
Line regulation (power supply rejection)
Pr
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Tstup
Notes
Table 31. VREF limited-range operating requirements
Symbol
Description
Min.
Max.
Unit
TA
Temperature
0
50
°C
Notes
Table 32. VREF limited-range operating behaviors
Symbol
Vout
Description
Min.
Max.
Unit
Voltage reference output with factory trim
TBD
TBD
µA
TBD
Notes
Figure 13. Typical output vs.temperature
TBD
Figure 14. Typical output vs. VDD
6.7 Timers
See General Switching Specifications.
6.8 Communication interfaces
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
43
Peripheral operating requirements and behaviors
6.8.1 USB electrical specifications
The USB electricals for the USB On-the-Go module conform to the standards
documented by the Universal Serial Bus Implementers Forum. For the most up-to-date
standards, visit http://www.usb.org.
6.8.2 USB DCD Electrical Specifications
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Table 33. USB DCD specifications
Symbol
Description
Min.
Typ.
Max.
Unit
VDP_SRC
USB_DP source voltage (up to 250 μA)
TBD
TBD
TBD
V
0.8
—
2.0
V
VLGC
Threshold voltage for logic high
IDP_SRC
USB_DP source current
7
10
13
μA
IDM_SINK
USB_DM sink current
50
100
150
μA
RDM_DWN
D- pulldown resistance for data pin contact detect
14.25
—
24.8
kΩ
VDAT_REF
Data detect voltage
0.25
TBD
0.4
V
6.8.3 USB Voltage Regulator Electrical Specifications
Table 34. USB voltage regulator electrical specifications
Symbol
Description
Min.
Typ.
Max.
Unit
VREGIN
Input supply voltage
2.7
—
5.5
V
IDDon
Quiescent current — Run mode, load current
equal zero
—
120
—
μA
IDDstby
Quiescent current — Standby mode, load cur‐
rent equal zero
—
TBD
—
μA
IDDoff
Quiescent current — Shutdown mode
—
—
500
nA
ILOADrun
Maximum load current — Run mode
—
—
120
mA
ILOADstby
Maximum load current — Standby mode
—
—
TBD
mA
VReg33out
Regulator output voltage — Input supply (VRE‐
GIN) > 3.6 V
• Run mode
• Standby mode
• Pass-through mode
Notes
1
3
3.3
3.6
V
TBD
TBD
TBD
V
2.3
—
3.6
V
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
44
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 34. USB voltage regulator electrical specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
COUT
External output capacitor
1.76
2.2
8.16
μF
ESR
External output capacitor equivalent series re‐
sistance
1
—
100
mΩ
ILIM
Current limitation threshold
185
290
395
mA
Notes
1. Operating in pass-through mode: regulator output voltage equal to the input voltage minus a drop proportional to ILoad.
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6.8.4 DSPI Switching Specifications for Low-speed Operation
The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with
master and slave operations. Many of the transfer attributes are programmable. The tables
below provides DSPI timing characteristics for classic SPI timing modes. Refer to the
DSPI chapter of the Reference Manual for information on the modified transfer formats
used for communicating with slower peripheral devices.
Table 35. Master Mode DSPI Timing (Low-speed mode)
Num
Description
Operating voltage
Frequency of operation
Min.
Max.
Unit
Notes
1.71
3.6
V
1
—
12.5
MHz
4 x tBCLK
—
ns
DS1
DSPI_SCK output cycle time
DS2
DSPI_SCK output high/low time
(tSCK/2) - 4
(tSCK/2) + 4
ns
DS3
DSPI_PCSn to DSPI_SCK output valid
(tSCK/2) - 4
—
ns
DS4
DSPI_SCK to DSPI_PCSn output hold
(tSCK/2) - 4
—
ns
DS5
DSPI_SCK to DSPI_SOUT valid
—
10
ns
DS6
DSPI_SCK to DSPI_SOUT invalid
-2
—
ns
DS7
DSPI_SIN to DSPI_SCK input setup
15
—
ns
DS8
DSPI_SCK to DSPI_SIN input hold
0
—
ns
1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage
range the maximum frequency of operation is reduced.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
45
Peripheral operating requirements and behaviors
DSPI_PCSn
DS3
DS1
DS2
DS4
DSPI_SCK
DS8
DS7
(CPOL=0)
DSPI_SIN
Data
First data
Last data
DS5
DSPI_SOUT
DS6
First data
Data
Last data
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Figure 15. DSPI Classic SPI Timing — Master Mode
Table 36. Slave Mode DSPI Timing (Low-speed Mode)
Num
Description
Operating voltage
Frequency of operation
Min.
Max.
Unit
1.71
3.6
V
—
6.25
MHz
8 x tBCLK
—
ns
(tSCK/2) - 4
(tSCK/2) + 4
ns
DS9
DSPI_SCK input cycle time
DS10
DSPI_SCK input high/low time
DS11
DSPI_SCK to DSPI_SOUT valid
—
20
ns
DS12
DSPI_SCK to DSPI_SOUT invalid
0
—
ns
DS13
DSPI_SIN to DSPI_SCK input setup
5
—
ns
DS14
DSPI_SCK to DSIP_SIN input hold
15
—
ns
DS15
DSPI_SS active to DSPI_SOUT driven
—
15
ns
DS16
DSPI_SS inactive to DSPI_SOUT not driven
—
15
ns
DSPI_SS
DS10
DS9
DSPI_SCK
(CPOL=0)
DS15
DSPI_SOUT
First data
DS13
DSPI_SIN
DS12
DS16
DS11
Data
Last data
DS14
First data
Data
Last data
Figure 16. DSPI Classic SPI Timing — Slave Mode
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
46
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.8.5 DSPI Switching Specifications (High-speed mode)
The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with
master and slave operations. Many of the transfer attributes are programmable. The tables
below provide DSPI timing characteristics for classic SPI timing modes. Refer to the
DSPI chapter of the Reference Manual for information on the modified transfer formats
used for communicating with slower peripheral devices.
Table 37. Master Mode DSPI Timing (High-speed mode)
Num
Description
Max.
Unit
2.7
3.6
V
Pr
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Operating voltage
Min.
Frequency of operation
—
25
MHz
2 x tBCLK
—
ns
DS1
DSPI_SCK output cycle time
DS2
DSPI_SCK output high/low time
(tSCK/2) − 2
(tSCK/2) + 2
ns
DS3
DSPI_PCSn to DSPI_SCK output valid
(tSCK/2) − 2
—
ns
DS4
DSPI_SCK to DSPI_PCSn output hold
(tSCK/2) − 2
—
ns
DS5
DSPI_SCK to DSPI_SOUT valid
—
8.5
ns
DS6
DSPI_SCK to DSPI_SOUT invalid
−2
—
ns
DS7
DSPI_SIN to DSPI_SCK input setup
TBD
—
ns
DS8
DSPI_SCK to DSPI_SIN input hold
0
—
ns
DSPI_PCSn
DS3
DSPI_SCK
(CPOL=0)
DSPI_SIN
DSPI_SOUT
DS1
DS2
DS4
DS8
DS7
Data
First data
Last data
DS5
First data
DS6
Data
Last data
Figure 17. DSPI Classic SPI Timing — Master Mode
Table 38. Slave Mode DSPI Timing (High-speed mode)
Num
Description
Operating voltage
Min.
Max.
Unit
2.7
3.6
V
12.5
MHz
4 x tBCLK
—
ns
(tSCK/2) − 2
(tSCK/2 + 2
ns
—
TBD
ns
Frequency of operation
DS9
DSPI_SCK input cycle time
DS10
DSPI_SCK input high/low time
DS11
DSPI_SCK to DSPI_SOUT valid
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
47
Peripheral operating requirements and behaviors
Table 38. Slave Mode DSPI Timing (High-speed mode) (continued)
Num
Description
Min.
Max.
Unit
DSPI_SCK to DSPI_SOUT invalid
0
—
ns
DS13
DSPI_SIN to DSPI_SCK input setup
2
—
ns
DS14
DSPI_SCK to DSIP_SIN input hold
7
—
ns
DS15
DSPI_SS active to DSPI_SOUT driven
—
14
ns
DS16
DSPI_SS inactive to DSPI_SOUT not driven
—
14
ns
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DS12
DSPI_SS
DS10
DSPI_SCK
DS15
(CPOL=0)
DSPI_SOUT
DS12
First data
DS13
DSPI_SIN
DS9
DS16
DS11
Data
Last data
DS14
First data
Data
Last data
Figure 18. DSPI Classic SPI Timing — Slave Mode
6.8.6 SDHC Specifications
The following timing specs are defined at the chip I/O pin and must be translated
appropriately to arrive at timing specs/constraints for the physical interface.
Table 39. SDHC switching specifications
Num
Symbol
Description
Min.
Max.
Unit
Card input clock
SD1
fpp
Clock frequency (low speed)
0
400
kHz
fpp
Clock frequency (SD\SDIO full speed)
0
25
MHz
fpp
Clock frequency (MMC full speed)
0
20
MHz
fOD
Clock frequency (identification mode)
0
400
kHz
SD2
tWL
Clock low time
7
—
ns
SD3
tWH
Clock high time
7
—
ns
SD4
tTLH
Clock rise time
—
3
ns
SD5
tTHL
Clock fall time
—
3
ns
SDHC output / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK)
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
48
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 39. SDHC switching specifications (continued)
Num
Symbol
SD6
tOD
Description
Min.
Max.
Unit
-5
6.5
ns
SDHC output delay (output valid)
SDHC input / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK)
SD7
tTHL
SDHC input setup time
5
—
ns
SD8
tTHL
SDHC input hold time
0
—
ns
SD3
SD2
SD1
SDHC_CLK
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SD6
Output SDHC_CMD
Output SDHC_DAT[3:0]
SD7
SD8
Input SDHC_CMD
Input SDHC_DAT[3:0]
Figure 19. SDHC timing
6.8.7 I2S Switching Specifications
This section provides the AC timings for the I2S in master (clocks driven) and slave
modes (clocks input). All timings are given for non-inverted serial clock polarity
(TCR[TSCKP] = 0, RCR[RSCKP] = 0) and a non-inverted frame sync (TCR[TFSI] = 0,
RCR[RFSI] = 0). If the polarity of the clock and/or the frame sync have been inverted, all
the timings remain valid by inverting the clock signal (I2S_BCLK) and/or the frame sync
(I2S_FS) shown in the figures below.
Table 40. I2S master mode timing
Num
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
S1
I2S_MCLK cycle time
2 x tSYS
S2
I2S_MCLK pulse width high/low
S3
I2S_BCLK cycle time
S4
I2S_BCLK pulse width high/low
ns
45%
55%
MCLK period
5 x tSYS
—
ns
45%
55%
BCLK period
Table continues on the next page...
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
49
Peripheral operating requirements and behaviors
Table 40. I2S master mode timing (continued)
Num
Description
Min.
Max.
Unit
—
15
ns
-2.5
—
ns
I2S_BCLK to I2S_FS output valid
S6
I2S_BCLK to I2S_FS output invalid
S7
I2S_BCLK to I2S_TXD valid
—
15
ns
S8
I2S_BCLK to I2S_TXD invalid
-3
—
ns
S9
I2S_RXD/I2S_FS input setup before I2S_BCLK
20
—
ns
S10
I2S_RXD/I2S_FS input hold after I2S_BCLK
0
—
ns
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S5
S1
I2S_MCLK (output)
S2
S2
S3
I2S_BCLK (output)
S4
S4
S5
I2S_FS (output)
S10
S9
I2S_FS (input)
S7
S8
S7
I2S_TXD
S9
I2S_RXD
S6
S8
S10
Figure 20. I2S timing — master mode
Table 41. I2S alave mode timing
Num
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
8 x tSYS
—
ns
S11
I2S_BCLK cycle time (input)
S12
I2S_BCLK pulse width high/low (input)
45%
55%
MCLK period
S13
I2S_FS input setup before I2S_BCLK
10
—
ns
S14
I2S_FS input hold after I2S_BCLK
3
—
ns
S15
I2S_BCLK to I2S_TXD/I2S_FS output valid
—
20
ns
S16
I2S_BCLK to I2S_TXD/I2S_FS output invalid
0
—
ns
S17
I2S_RXD setup before I2S_BCLK
10
—
ns
S18
I2S_RXD hold after I2S_BCLK
2
—
ns
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
50
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
S11
S12
I2S_BCLK (input)
S12
S15
S16
I2S_FS (output)
S13
S14
I2S_FS (input)
S15
S16
S15
S16
I2S_TXD
S17
S18
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I2S_RXD
Figure 21. I2S timing — slave modes
6.9 Human-machine interfaces (HMI)
6.9.1 General Switching Specifications
These general purpose specifications apply to all signals configured for GPIO, SCI,
FlexCAN, CMT, and I2C signals.
Table 42. General switching specifications
Symbol
Description
Min.
Max.
Unit
Notes
GPIO pin interrupt pulse width (digital glitch filter disa‐
bled) — Synchronous path
1.5
—
Bus clock
cycles
1
GPIO pin interrupt pulse width (digital glitch filter disa‐
bled, analog filter enabled) — Asynchronous path
100
—
ns
2
GPIO pin interrupt pulse width (digital glitch filter disa‐
bled, analog filter disabled) — Asynchronous path
16
—
ns
2
External reset pulse width (digital glitch filter disabled)
TBD
—
Mode select (EZP_CS) hold time after reset deasser‐
tion
2
—
Bus clock
cycles
Port rise and fall time (high drive strength)
3
• Slew disabled
—
12
ns
• Slew enabled
—
36
ns
Port rise and fall time (low drive strength)
4
• Slew disabled
—
32
ns
• Slew enabled
—
36
ns
1. The greater synchronous and asynchronous timing must be met.
2. This is the shortest pulse that is guaranteed to be recognized.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
51
Peripheral operating requirements and behaviors
3. 75pF load
4. 15pF load
6.9.2 TSI Electrical Specifications
Table 43. Touch Sensing Input module specifications
Description
Min.
Typ.
Max.
Unit
VDDTSI
Operating voltage
1.71
—
3.6
V
Target electrode capacitance range
1
20
500
pF
fREFmax
Reference oscillator frequency
—
5.5
TBD
MHz
fELEmax
Electrode oscillator frequency
—
0.5
TBD
MHz
Internal reference capacitor
TBD
1
TBD
pF
Oscillator delta voltage
TBD
600
TBD
mV
IREF
Reference oscillator current source base current
TBD
1
TBD
μA
2
IELE
Electrode oscillator current source base current
TBD
1
TBD
μA
3
Pres5
Electrode capacitance measurement precision
—
TBD
TBD
%
4
Pres20
Electrode capacitance measurement precision
—
TBD
TBD
%
5
Pres100
Electrode capacitance measurement precision
—
TBD
TBD
%
6
Max‐
Sens20
Max sensitivity @ 20pF electrode
0.15
0.326
600
fF
7
Maximum sensitivity
0.006
0.326
24
fF
8
Resolution
—
—
16
bits
Response time @ 20pF
—
30
—
μs
Current added in run mode
—
TBD
—
μA
Low power mode current adder
—
1
TBD
μA
CELE
CREF
VDELTA
MaxSens
Res
TCon20
ITSI_RUN
ITSI_LP
Pr
el
im
in
ar
y
Symbol
Notes
1
9
1. The TSI module is functional with capacitance values outside of this range. However, optimal performance is not
guaranteed.
2. The programmable current source value is generated by multiplying the SCANC[REFCHRG] value and the base current
3. The programmable current source value is generated by multiplying the SCANC[EXTCHRG] value and the base current
4. Measured with a 5pF electrode, reference oscillator frequency of 10MHz, PS = 128, NCSC = 8; Iext = 16
5. Measured with a 20pF electrode, reference oscillator frequency of 10MHz, PS = 128, NCSC = 2; Iext = 16
6. Measured with a 20pF electrode, reference oscillator frequency of 10MHz, PS = 16, NCSC = 3; Iext = 16
7. 6.2ms scan time
8. 1pF electrode capacitance with 4.96ms scan time
9. Time that takes to do one complete measurement of the electrode. Sensitivity resolution of 0.0133pF
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
52
Preliminary
Freescale Semiconductor, Inc.
Dimensions
6.9.3 LCD electrical characteristics
Table 44. LCD electricals
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
fFrame
LCD frame frequency
28
30
58
Hz
CLCD
LCD charge pump capacitance — nominal value
—
100
—
nF
1
CBYLCD
LCD bypass capacitance — nominal value
—
100
—
nF
1
CGlass
LCD glass capacitance
—
2000
8000
pF
VIREG
VIREG — HREFSEL = 0
—
• HREFSEL = 0
0.89
1.00
1.15
V
• HREFSEL = 1
1.49
1.67
1.85
V
3.0
—
—
% VIREG
• HREFSEL = 0
—
—
30
mV
• HREFSEL = 1
—
—
50
mV
—
1
—
µA
Pr
el
im
in
ar
y
ΔRTRIM
VIREG TRIM resolution
VIREG ripple
IVIREG
VIREG current adder — RVEN = 1
IRBIAS
RBIAS current adder
RRBIAS
2
• HREFSEL = 0
—
10
—
µA
• HREFSEL = 1
—
1
—
µA
—
0.28
—
MΩ
—
2.98
—
MΩ
• HREFSEL = 0
2.0 − 5%
2.0
—
V
• HREFSEL = 1
3.3 − 5%
3.3
—
V
• HREFSEL = 0
3.0 − 5%
3.0
—
V
• HREFSEL = 1
5 − 5%
5
—
V
• LADJ = 10 or 11 — High load (LCD glass
capacitance ≤ 8000 pF)
VLL3
3
RBIAS resistor values
• LADJ = 00 or 01 — Low load (LCD glass
capacitance ≤ 2000 pF)
VLL2
3
VLL2 voltage
VLL3 voltage
1. The actual value used could vary with tolerance.
2. VIREG maximum should never be externally driven to any level other than VDD - 0.15 V
3. 2000 pF load LCD, 32 Hz frame frequency
7 Dimensions
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
53
Pinout
7.1 Obtaining package dimensions
Package dimensions are provided in package drawings.
To find a package drawing, go to www.freescale.com and perform a keyword search for
the drawing’s document number:
If you want the drawing for this package
Then use this document number
98ASS23308W
104-pin MAPBGA
98ARH98267A
8 Pinout
Pr
el
im
in
ar
y
100-pin LQFP
8.1 K40 Signal Multiplexing and Pin Assignments
The following table shows the signals available on each pin and the locations of these
pins on the devices supported by this document. The Port Control Module is responsible
for selecting which ALT functionality is available on each pin.
100
QFP
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
1
ADC1_SE4a
ADC1_SE4a
PTE0
SPI1_PCS1
UART1_TX
SDHC0_D1
I2C1_SDA
2
ADC1_SE5a
ADC1_SE5a
PTE1
SPI1_SOUT
UART1_RX
SDHC0_D0
I2C1_SCL
3
ADC1_SE6a
ADC1_SE6a
PTE2
SPI1_SCK
UART1_CTS_ SDHC0_DCLK
b
4
ADC1_SE7a
ADC1_SE7a
PTE3
SPI1_SIN
UART1_RTS_ SDHC0_CMD
b
5
DISABLED
PTE4
SPI1_PCS0
UART3_TX
SDHC0_D3
6
DISABLED
PTE5
SPI1_PCS2
UART3_RX
SDHC0_D2
7
DISABLED
PTE6
SPI1_PCS3
UART3_CTS_ I2S0_MCLK
b
8
VDD
ALT7
EzPort
I2S0_CLKIN
VDD
9
VSS
VSS
10
USB0_DP
USB0_DP
11
USB0_DM
USB0_DM
12
VOUT33
VOUT33
13
VREGIN
VREGIN
14
ADC0_DP1
ADC0_DP1
15
ADC0_DM1
ADC0_DM1
16
ADC1_DP1
ADC1_DP1
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
54
Preliminary
Freescale Semiconductor, Inc.
Pinout
100
QFP
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
EzPort
ADC1_DM1
ADC1_DM1
18
PGA0_DP/
ADC0_DP0/
ADC1_DP3
PGA0_DP/
ADC0_DP0/
ADC1_DP3
19
PGA0_DM/
ADC0_DM0/
ADC1_DM3
PGA0_DM/
ADC0_DM0/
ADC1_DM3
20
PGA1_DP/
ADC1_DP0/
ADC0_DP3
PGA1_DP/
ADC1_DP0/
ADC0_DP3
21
PGA1_DM/
ADC1_DM0/
ADC0_DM3
PGA1_DM/
ADC1_DM0/
ADC0_DM3
22
VDDA
VDDA
23
VREFH
VREFH
24
VREFL
VREFL
25
VSSA
VSSA
26
VREF_OUT
VREF_OUT
27
DAC0_OUT
DAC0_OUT
28
XTAL32
XTAL32
29
EXTAL32
EXTAL32
30
VBAT
VBAT
31
ADC0_SE17
ADC0_SE17
PTE24
CAN1_TX
UART4_TX
EWM_OUT_b
32
ADC0_SE18
ADC0_SE18
PTE25
CAN1_RX
UART4_RX
EWM_IN
33
DISABLED
UART4_CTS_
b
RTC_CLKOUT USB_CLKIN
34
JTAG_TCLK/
SWD_CLK/
EZP_CLK
TSI0_CH1
PTA0
UART0_CTS_ FTM0_CH5
b
JTAG_TCLK/
SWD_CLK
EZP_CLK
35
JTAG_TDI/
EZP_DI
TSI0_CH2
PTA1
UART0_RX
FTM0_CH6
JTAG_TDI
EZP_DI
36
JTAG_TDO/
TSI0_CH3
TRACE_SWO/
EZP_DO
PTA2
UART0_TX
FTM0_CH7
JTAG_TDO/
EZP_DO
TRACE_SWO
37
JTAG_TMS/
SWD_DIO
TSI0_CH4
PTA3
UART0_RTS_ FTM0_CH0
b
38
NMI_b/
EZP_CS_b
TSI0_CH5
PTA4
FTM0_CH1
39
JTAG_TRST
PTA5
FTM0_CH2
40
VDD
VDD
41
VSS
VSS
42
CMP2_IN0
CMP2_IN0
PTA12
CAN0_TX
FTM1_CH0
I2S0_TXD
FTM1_QD_PH
A
43
CMP2_IN1
CMP2_IN1
PTA13
CAN0_RX
FTM1_CH1
I2S0_TX_FS
FTM1_QD_PH
B
Pr
el
im
in
ar
y
17
PTE26
JTAG_TMS/
SWD_DIO
NMI_b
CMP2_OUT
EZP_CS_b
I2S0_RX_BCL JTAG_TRST
K
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
55
Pinout
100
QFP
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
44
DISABLED
PTA14
SPI0_PCS0
UART0_TX
I2S0_TX_BCL
K
45
DISABLED
PTA15
SPI0_SCK
UART0_RX
I2S0_RXD
46
DISABLED
PTA16
SPI0_SOUT
UART0_CTS_
b
I2S0_RX_FS
47
ADC1_SE17
ADC1_SE17
PTA17
SPI0_SIN
UART0_RTS_
b
I2S0_MCLK
48
VDD
VDD
49
VSS
VSS
50
EXTAL
EXTAL
51
XTAL
XTAL
52
RESET_b
RESET_b
53
LCD_P0/
ADC0_SE8/
ADC1_SE8/
TSI0_CH0
LCD_P0/
ADC0_SE8/
ADC1_SE8/
TSI0_CH0
PTB0
I2C0_SCL
FTM1_CH0
FTM1_QD_PH LCD_P0
A
54
LCD_P1/
ADC0_SE9/
ADC1_SE9/
TSI0_CH6
LCD_P1/
ADC0_SE9/
ADC1_SE9/
TSI0_CH6
PTB1
I2C0_SDA
FTM1_CH1
FTM1_QD_PH LCD_P1
B
55
LCD_P2/
ADC0_SE12/
TSI0_CH7
LCD_P2/
ADC0_SE12/
TSI0_CH7
PTB2
I2C0_SCL
UART0_RTS_
b
FTM0_FLT3
LCD_P2
56
LCD_P3/
ADC0_SE13/
TSI0_CH8
LCD_P3/
ADC0_SE13/
TSI0_CH8
PTB3
I2C0_SDA
UART0_CTS_
b
FTM0_FLT0
LCD_P3
57
LCD_P7/
ADC1_SE13
LCD_P7/
ADC1_SE13
PTB7
58
LCD_P8
LCD_P8
PTB8
59
LCD_P9
LCD_P9
PTB9
60
LCD_P10/
ADC1_SE14
LCD_P10/
ADC1_SE14
61
LCD_P11/
ADC1_SE15
62
FTM0_FLT2
I2S0_CLKIN
FTM_CLKIN0
Pr
el
im
in
ar
y
PTA18
EzPort
PTA19
FTM1_FLT0
FTM_CLKIN1
LPT0_ALT1
LCD_P7
UART3_RTS_
b
LCD_P8
SPI1_PCS1
UART3_CTS_
b
LCD_P9
PTB10
SPI1_PCS0
UART3_RX
FTM0_FLT1
LCD_P10
LCD_P11/
ADC1_SE15
PTB11
SPI1_SCK
UART3_TX
FTM0_FLT2
LCD_P11
LCD_P12/
TSI0_CH9
LCD_P12/
TSI0_CH9
PTB16
SPI1_SOUT
UART0_RX
EWM_IN
LCD_P12
63
LCD_P13/
TSI0_CH10
LCD_P13/
TSI0_CH10
PTB17
SPI1_SIN
UART0_TX
EWM_OUT_b
LCD_P13
64
LCD_P14/
TSI0_CH11
LCD_P14/
TSI0_CH11
PTB18
CAN0_TX
FTM2_CH0
I2S0_TX_BCL
K
FTM2_QD_PH LCD_P14
A
65
LCD_P15/
TSI0_CH12
LCD_P15/
TSI0_CH12
PTB19
CAN0_RX
FTM2_CH1
I2S0_TX_FS
FTM2_QD_PH LCD_P15
B
66
LCD_P16
LCD_P16
PTB20
SPI2_PCS0
CMP0_OUT
LCD_P16
67
LCD_P17
LCD_P17
PTB21
SPI2_SCK
CMP1_OUT
LCD_P17
68
LCD_P18
LCD_P18
PTB22
SPI2_SOUT
CMP2_OUT
LCD_P18
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
56
Preliminary
Freescale Semiconductor, Inc.
Pinout
100
QFP
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
LCD_P19
LCD_P19
PTB23
SPI2_SIN
SPI0_PCS5
LCD_P19
70
LCD_P20/
ADC0_SE14/
TSI0_CH13
LCD_P20/
ADC0_SE14/
TSI0_CH13
PTC0
SPI0_PCS4
PDB0_EXTRG I2S0_TXD
LCD_P20
71
LCD_P21/
ADC0_SE15/
TSI0_CH14
LCD_P21/
ADC0_SE15/
TSI0_CH14
PTC1
SPI0_PCS3
UART1_RTS_ FTM0_CH0
b
LCD_P21
72
LCD_P22/
ADC0_SE4b/
CMP1_IN0/
TSI0_CH15
LCD_P22/
ADC0_SE4b/
CMP1_IN0/
TSI0_CH15
PTC2
SPI0_PCS2
UART1_CTS_ FTM0_CH1
b
LCD_P22
73
LCD_P23/
CMP1_IN1
LCD_P23/
CMP1_IN1
PTC3
SPI0_PCS1
UART1_RX
FTM0_CH2
LCD_P23
74
VSS
VSS
75
VLL3
VLL3
76
VLL2
VLL2
77
VLL1
VLL1
78
VCAP2
VCAP2
79
VCAP1
VCAP1
80
LCD_P24
LCD_P24
PTC4
SPI0_PCS0
UART1_TX
FTM0_CH3
CMP1_OUT
LCD_P24
81
LCD_P25
LCD_P25
PTC5
SPI0_SCK
LPT0_ALT2
CMP0_OUT
LCD_P25
82
LCD_P26/
CMP0_IN0
LCD_P26/
CMP0_IN0
PTC6
SPI0_SOUT
83
LCD_P27/
CMP0_IN1
LCD_P27/
CMP0_IN1
PTC7
SPI0_SIN
84
LCD_P28/
ADC1_SE4b/
CMP0_IN2
LCD_P28/
ADC1_SE4b/
CMP0_IN2
PTC8
85
LCD_P29/
ADC1_SE5b/
CMP0_IN3
LCD_P29/
ADC1_SE5b/
CMP0_IN3
PTC9
86
LCD_P30/
ADC1_SE6b/
CMP0_IN4
LCD_P30/
ADC1_SE6b/
CMP0_IN4
PTC10
I2C1_SCL
I2S0_RX_FS
LCD_P30
87
LCD_P31/
ADC1_SE7b
LCD_P31/
ADC1_SE7b
PTC11
I2C1_SDA
I2S0_RXD
LCD_P31
88
VSS
VSS
89
VDD
VDD
90
LCD_P36
LCD_P36
PTC16
CAN1_RX
UART3_RX
LCD_P36
91
LCD_P37
LCD_P37
PTC17
CAN1_TX
UART3_TX
LCD_P37
92
LCD_P38
LCD_P38
PTC18
UART3_RTS_
b
LCD_P38
93
LCD_P40
LCD_P40
PTD0
SPI0_PCS0
UART2_RTS_
b
LCD_P40
94
LCD_P41/
ADC0_SE5b
LCD_P41/
ADC0_SE5b
PTD1
SPI0_SCK
UART2_CTS_
b
LCD_P41
95
LCD_P42
LCD_P42
PTD2
SPI0_SOUT
UART2_RX
LCD_P42
Pr
el
im
in
ar
y
69
EzPort
PDB0_EXTRG
LCD_P26
LCD_P27
I2S0_MCLK
I2S0_CLKIN
I2S0_RX_BCL
K
LCD_P28
FTM2_FLT0
LCD_P29
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
57
Pinout
100
QFP
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
96
LCD_P43
LCD_P43
PTD3
SPI0_SIN
UART2_TX
97
LCD_P44
LCD_P44
PTD4
SPI0_PCS1
UART0_RTS_ FTM0_CH4
b
EWM_IN
LCD_P44
98
LCD_P45/
ADC0_SE6b
LCD_P45/
ADC0_SE6b
PTD5
SPI0_PCS2
UART0_CTS_ FTM0_CH5
b
EWM_OUT_b
LCD_P45
99
LCD_P46/
ADC0_SE7b
LCD_P46/
ADC0_SE7b
PTD6
SPI0_PCS3
UART0_RX
FTM0_CH6
FTM0_FLT0
LCD_P46
LCD_P47
PTD7
CMT_IRO
UART0_TX
FTM0_CH7
FTM0_FLT1
LCD_P47
100 LCD_P47
EzPort
LCD_P43
Pr
el
im
in
ar
y
8.2 K40 Pinouts
The below figure shows the pinout diagram for the devices supported by this document.
Many signals may be multiplexed onto a single pin. To determine what signals can be
used on which pin, see the previous section.
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
58
Preliminary
Freescale Semiconductor, Inc.
84
VLL2
PTC8
85
VLL1
PTC9
86
76
PTC10
87
77
PTC11
88
VCAP1
VSS
89
VCAP2
VDD
90
78
PTC16
91
PTC4
PTC17
92
79
PTC18
93
PTC5
PTD0
94
80
PTD1
95
81
PTD2
96
PTC7
PTD3
97
PTC6
PTD4
98
82
PTD5
99
83
PTD7
PTD6
100
Revision History
PTE0
1
75
VLL3
PTE1
2
74
VSS
PTE2
3
73
PTC3
PTE3
4
72
PTC2
PTE4
5
71
PTC1
PTE5
6
70
PTC0
PTE6
7
69
PTB23
VDD
8
68
PTB22
VSS
9
67
PTB21
10
66
PTB20
Pr
el
im
in
ar
y
USB0_DP
USB0_DM
11
65
PTB19
VOUT33
12
64
PTB18
VREGIN
13
63
PTB17
ADC0_DP1
14
62
PTB16
ADC0_DM1
15
61
PTB11
ADC1_DP1
16
60
PTB10
ADC1_DM1
17
59
PTB9
PGA0_DP/ADC0_DP0/ADC1_DP3
18
58
PTB8
PGA0_DM/ADC0_DM0/ADC1_DM3
19
57
PTB7
PTB3
37
38
39
40
41
42
43
44
45
46
47
48
PTA3
PTA4
PTA5
VDD
VSS
PTA12
PTA13
PTA14
PTA15
PTA16
PTA17
VDD
49
36
PTA2
50
35
PTA1
VSS
34
PTA0
PTA18
33
PTA19
PTE26
51
32
25
PTE25
RESET_b
VSSA
31
PTB0
52
PTE24
53
24
30
23
VREFL
VBAT
VREFH
29
PTB1
28
54
XTAL32
22
EXTAL32
PTB2
VDDA
DAC0_OUT
55
27
56
21
26
20
VREF_OUT
PGA1_DP/ADC1_DP0/ADC0_DP3
PGA1_DM/ADC1_DM0/ADC0_DM3
Figure 22. K40 100 LQFP Pinout Diagram
9 Revision History
The following table provides a revision history for this document.
Table 45. Revision History
Rev. No.
Date
1
11/2010
Substantial Changes
Initial public revision
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
59
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K40P104M100SF2
Rev. 1
11/2010