FREESCALE MPVZ5004GW6U

Freescale Semiconductor
Technical Data
MPVZ5004G
Rev 1, 01/2006
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPVZ5004G
SERIES
The MPVZ5004G series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for the appliance, consumer,
healthcare and industrial market. The analog output can be read directly into the A/
D input of Freescale microcontrollers. This transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure. The axial port has been modified to accommodate industrial
grade tubing.
INTEGRATED
PRESSURE SENSOR
0 to 3.92 kPA
(0 to 400 mm H2O)
1.0 to 4.9 V OUTPUT
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Features
•
•
•
•
•
1.5% Maximum Error for 0 to 100 mm H2O over +10° to +60°C with Auto Zero
2.5% Maximum Error for 100 to 400 mm H2O over +10° to +60°C with Auto Zero
6.25% Maximum Error for 0 to 400 mm H2O over +10° to +60°C without Auto Zero
Temperature Compensated over +10° to +60°C
Available in Surface Mount (SMT) or Through-hole (DIP) Configurations
Application Examples
• Washing Machine Water Level Measurement (Reference AN1950)
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Appliance Liquid Level and Pressure Measurement
• Respiratory Equipment
MPVZ5004GW6U
CASE 1735-01
MPVZ5004G6U/T1
CASE 482-01
SMALL OUTLINE PACKAGE
THROUGH-HOLE
ORDERING INFORMATION
Device
Type
Case
No.
MPVZ Series
Order No.
Packing
Options
Device
Marking
Surface Mount
1735-01
MPVZ5004GW6U
Rails
MZ5004GW
Through-Hole
1560-02
MPVZ5004GW7U
Rails
MZ5004GW
Surface Mount
482-01
MPVZ5004G6U
Rails
MZ5004G
Surface Mount
482-01
MPVZ5004G6T1
Tape & Reel
MZ5004G
Through-Hole
482B-03
MPVZ5004G7U
Rails
MZ5004G
J
MPVZ5004GW7U
CASE 1560-02
MPVZ5004G7U
CASE 482B-03
PIN NUMBERS(1)
1
N/C
5
N/C
2
VS
6
N/C
3
GND
7
N/C
4
VOUT
8
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and Calibration
Circuitry
Sensing
Element
GND
VOUT
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package device.
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
16
kPa
Storage Temperature
TSTG
–30 to +100
°C
TA
0 to +85
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Symbol
Min
Typ
Max
Units
Pressure Range
Characteristic
POP
0
—
3.92
400
kPa
mm H2O
Supply Voltage(1)
VS
4.75
5.0
5.25
VDC
Supply Current
IS
—
—
10
mAdc
Full Scale Span(2)
@ VS = 5.0 Volts
VFSS
—
4.0
—
V
Offset(3) (4)
VOFF
0.75
1.0
1.25
V
Sensitivity
V/P
—
1.0
9.8
—
V/kPa
mV/mm H2O
0 to 100 mm H2O (10 to 60°C)
—
—
—
±1.5
100 to 400 mm H2O (10 to 60°C)
—
—
—
±2.5
0 to 400 mm H2O (10 to 60°C)
—
—
—
±6.25
%VFSS with
auto zero
%VFSS with
auto zero
%VFSS without
auto zero
Accuracy(4) (5)
1. Device is ratiometric within this specified excitation range.
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• Offset Stability:
Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with minimum
rated pressure applied.
• TcSpan:
Output deviation over the temperature range of 10 to 60°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect
the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's
output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature
change of ± 5°C between autozero and measurement.
MPVZ5004G
2
Sensors
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPVZ5004G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
Fluorosilicone
Gel Die Coat
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the MPVZ5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 and Figure 5 shows the sensor output signal
relative to pressure input. Typical, minimum and maximum
output curves are shown for operation over a temperature
range of 10°C to 60°C using the decoupling circuit shown in
Figure 3 The output will saturate outside of the specified
pressure range.
Stainless
Steel Cap
Die
+5 V
P1
Thermoplastic
Case
Wire Bond
OUTPUT
Vout
Vs
Lead Frame
IPS
1.0 µF
P2
Figure 2. Cross-Sectional Diagram (Not to Scale)
470 pF
Figure 3. Recommended Power Supply Decoupling and
Output Filtering.
(For additional output filtering, please refer to Application
Note AN1646.)
5.0
5.0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] ± 6.25% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60°C
4.0
Output (V)
3.0
MAX
TYPICAL
2.0
MIN
1.0
0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60°C
4.0
3.0
Output (V)
GND
Die Bond
Differential Sensing
Element
0
0.01 µF
TYPICAL
2.0
MIN
1.0
2.0
1.0
MAX
3.0
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
at ±6.25% VFSS (without auto zero, note 5 in
Operating Characteristics)
4.0
0
0
1.0
2.0
3.0
4.0
Differential Pressure (kPa)
Figure 5. Output versus Pressure Differential
at ±2.5% VFSS (with auto zero, note 5 in
Operating Characteristics)
MPVZ5004G
Sensors
Freescale Semiconductor
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing a gel
die coat which isolates the die from the environment. The
Part Number
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
Case Type
Pressure (P1) Side Identifier
MPVZ5004GW6U
1735-01
Vertical Port Attached
MPVZ5004GW7U
1560-02
Vertical Port Attached
MPVZ5004G6U/T1
482-01
Stainless Steel Cap
482B-03
Stainless Steel Cap
MPVZ5004G7U
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 6. SOP Footprint (Case 482)
MPVZ5004G
4
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ5004G
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Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ5004G
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PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ5004G
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Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ5004G
8
Sensors
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PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ5004G
Sensors
Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ5004G
10
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Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-ANOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4
5
-BG
8
1
0.25 (0.010)
M
T B
D 8 PL
S
A
S
DETAIL X
S
PIN 1 IDENTIFIER
N
C
-T-
SEATING
PLANE
DIM
A
B
C
D
G
J
K
M
N
S
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.415
0.425 10.54
10.79
0.415
0.425 10.54
10.79
0.210
0.220
5.33
5.59
0.026
0.034
0.66
0.864
0.100 BSC
2.54 BSC
0.009
0.011
0.23
0.28
0.100
0.120
2.54
3.05
0˚
15˚
0˚
15˚
0.405
0.415 10.29
10.54
0.540
0.560 13.72
14.22
K
M
J
DETAIL X
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
MPVZ5004G
Sensors
Freescale Semiconductor
11
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MPVZ5004G
Rev. 1
01/2006
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