Freescale Semiconductor Technical Data MPVZ5004G Rev 1, 01/2006 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPVZ5004G SERIES The MPVZ5004G series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for the appliance, consumer, healthcare and industrial market. The analog output can be read directly into the A/ D input of Freescale microcontrollers. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. INTEGRATED PRESSURE SENSOR 0 to 3.92 kPA (0 to 400 mm H2O) 1.0 to 4.9 V OUTPUT SMALL OUTLINE PACKAGE SURFACE MOUNT Features • • • • • 1.5% Maximum Error for 0 to 100 mm H2O over +10° to +60°C with Auto Zero 2.5% Maximum Error for 100 to 400 mm H2O over +10° to +60°C with Auto Zero 6.25% Maximum Error for 0 to 400 mm H2O over +10° to +60°C without Auto Zero Temperature Compensated over +10° to +60°C Available in Surface Mount (SMT) or Through-hole (DIP) Configurations Application Examples • Washing Machine Water Level Measurement (Reference AN1950) • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Appliance Liquid Level and Pressure Measurement • Respiratory Equipment MPVZ5004GW6U CASE 1735-01 MPVZ5004G6U/T1 CASE 482-01 SMALL OUTLINE PACKAGE THROUGH-HOLE ORDERING INFORMATION Device Type Case No. MPVZ Series Order No. Packing Options Device Marking Surface Mount 1735-01 MPVZ5004GW6U Rails MZ5004GW Through-Hole 1560-02 MPVZ5004GW7U Rails MZ5004GW Surface Mount 482-01 MPVZ5004G6U Rails MZ5004G Surface Mount 482-01 MPVZ5004G6T1 Tape & Reel MZ5004G Through-Hole 482B-03 MPVZ5004G7U Rails MZ5004G J MPVZ5004GW7U CASE 1560-02 MPVZ5004G7U CASE 482B-03 PIN NUMBERS(1) 1 N/C 5 N/C 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. © Freescale Semiconductor, Inc., 2006. All rights reserved. VS Gain Stage #2 and Ground Reference Shift Circuitry Thin Film Temperature Compensation and Calibration Circuitry Sensing Element GND VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device. Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 16 kPa Storage Temperature TSTG –30 to +100 °C TA 0 to +85 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2) Symbol Min Typ Max Units Pressure Range Characteristic POP 0 — 3.92 400 kPa mm H2O Supply Voltage(1) VS 4.75 5.0 5.25 VDC Supply Current IS — — 10 mAdc Full Scale Span(2) @ VS = 5.0 Volts VFSS — 4.0 — V Offset(3) (4) VOFF 0.75 1.0 1.25 V Sensitivity V/P — 1.0 9.8 — V/kPa mV/mm H2O 0 to 100 mm H2O (10 to 60°C) — — — ±1.5 100 to 400 mm H2O (10 to 60°C) — — — ±2.5 0 to 400 mm H2O (10 to 60°C) — — — ±6.25 %VFSS with auto zero %VFSS with auto zero %VFSS without auto zero Accuracy(4) (5) 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. • TcSpan: Output deviation over the temperature range of 10 to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement. MPVZ5004G 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPVZ5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and Fluorosilicone Gel Die Coat qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPVZ5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 and Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3 The output will saturate outside of the specified pressure range. Stainless Steel Cap Die +5 V P1 Thermoplastic Case Wire Bond OUTPUT Vout Vs Lead Frame IPS 1.0 µF P2 Figure 2. Cross-Sectional Diagram (Not to Scale) 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.) 5.0 5.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 6.25% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.0 Output (V) 3.0 MAX TYPICAL 2.0 MIN 1.0 0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.0 3.0 Output (V) GND Die Bond Differential Sensing Element 0 0.01 µF TYPICAL 2.0 MIN 1.0 2.0 1.0 MAX 3.0 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential at ±6.25% VFSS (without auto zero, note 5 in Operating Characteristics) 4.0 0 0 1.0 2.0 3.0 4.0 Differential Pressure (kPa) Figure 5. Output versus Pressure Differential at ±2.5% VFSS (with auto zero, note 5 in Operating Characteristics) MPVZ5004G Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which isolates the die from the environment. The Part Number Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Case Type Pressure (P1) Side Identifier MPVZ5004GW6U 1735-01 Vertical Port Attached MPVZ5004GW7U 1560-02 Vertical Port Attached MPVZ5004G6U/T1 482-01 Stainless Steel Cap 482B-03 Stainless Steel Cap MPVZ5004G7U INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 6. SOP Footprint (Case 482) MPVZ5004G 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5004G 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5004G 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5004G 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -ANOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 -BG 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C -T- SEATING PLANE DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0˚ 15˚ 0˚ 15˚ 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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