Pressure Freescale Semiconductor MPXC12DT1 Rev 0, 11/2010 10 kPa Uncompensated Silicon Pressure Sensor MPXC12DT1 Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of Freescale’s single element strain gauge design. Pressure Sensor 55 mV Full Scale Span (Typical) 0 to 10 kPa Application Examples • Respiratory Diagnostics Features • • • • • Low Cost Ratiometric to Supply Voltage Polysulfone Case Material (ISO 10993) Provided in Easy-to-Use Tape and Reel Patented Silicon Shear Stress Strain Gauge Design ORDERING INFORMATION Device Name MPXC12DTI Package Options Case No. Tape and Reel 423A Gauge Pressure Type Differential • Absolute Device Marking Date Code, Lot ID CHIP PAK PACKAGE MPXC12DT1 CASE 423A NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. © Freescale Semiconductor, Inc., 2010. All rights reserved. Pressure Freescale Semiconductor's Bio-compatible Pressure Sensors have been designed for medical usage by combining the performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: 10993-5:1999, 10993-10:2002, and 1099311:1993. These sensors contain a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. The MPXC12DT1 is a no-gel option. MPXC12DT1 2 Sensors Freescale Semiconductor Pressure MAXIMUM RATINGS Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (Backside) Pmax 75 kPa Storage Temperature Tstg -25 to +85 °C Operating Temperature TA +15 to +40 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 3 10 Vdc Supply Current Io — 6.0 — mAdc VFSS 45 65 80 mV Voff 0 20 35 mV ΔV/ΔP — 6.5 — mV/kPa Linearity — 0 — 10 %VFSS Pressure Hysteresis (0 to 10 kPa) — — ±0.1 — %VFSS Temperature Hysteresis (+15°C to +40°C) — — ±0.1 — %VFSS Input Impedance Zin 400 — 550 Ω Output Impedance Zout 750 — 1250 Ω Response Time(5) (10% to 90%) tR — 1.0 — ms Warm-Up(6) — — 20 v ms Offset Stability(7) — — ±0.5 — %VFSS Full Scale Span(3) Offset(4) Sensitivity 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXC12DT1 Sensors Freescale Semiconductor 3 Pressure PACKAGE DIMENSIONS A M C L F N 1 2 3 4 B V K DETAIL A –T– D1 G J H FRONT VIEW E END VIEW AC NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 3. Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4. F AA AB AD D2 DETAIL A BACK VIEW DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MIN MAX 0.240 0.260 0.350 0.370 0.140 0.150 0.012 0.020 0.014 0.022 0.088 0.102 0.123 0.128 0.045 0.055 0.037 0.047 0.007 0.011 0.120 0.140 0.095 0.105 0.165 0.175 0.223 0.239 0.105 0.115 0.095 0.107 0.015 0.035 0.120 0.175 0.100 0.115 MILLIMETERS MIN MAX 6.10 6.60 8.89 9.40 3.56 3.81 0.30 0.51 0.36 0.56 2.24 2.59 3.12 3.25 1.14 1.40 0.94 1.19 0.18 0.28 3.05 3.56 2.41 2.67 4.19 4.45 5.66 6.07 2.67 2.92 2.41 2.72 0.38 0.89 3.05 4.45 2.54 2.92 STYLE 2: 1: STYLE PINPIN 1. 1. GND VCC 2. 2.S++OUT 3. 3.Vs–OUT 4. 4.S-GROUND CASE 423A-03 ISSUE C CHIP PAK PACKAGE MPXC12DT1 4 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor China Ltd. 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