Freescale Semiconductor Technical Data MPX4250D Rev 5, 12/2006 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX4250D SERIES INTEGRATED PRESSURE SENSOR 0 TO 250 kPA (0 TO 36.3 psi) 0.2 TO 4.9 V OUTPUT The MPX4250D series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer. UNIBODY PACKAGES BASIC CHIP CARRIER ELEMENT CASE 867-08 STYLE 1 Features • • • • • • Differential and Gauge Applications Available 1.4% Maximum Error Over 0° to 85°C Patented Silicon Shear Stress Strain Gauge Temperature Compensated Over –40° to +125°C Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules Durable Epoxy Unibody Element Typical Applications • Ideally Suited for Microprocessor or Microcontroller-Based Systems ORDERING INFORMATION(1) MPX Series Order No. Device Marking 867 MPX4250D MPX4250D Gauge Ported Element 867B MPX4250GP MPX4250GP Dual Ported Element 867C MPX4250DP MPX4250DP Device Type Case No. GAUGE PORT OPTION CASE 867B-04 STYLE 1 UNIBODY PACKAGE (MPX4250D SERIES) Basic Element 1. The MPX4250D series silicon pressure sensors are available in the basic element package or with pressure port fittings that provide mounting ease and barbed hose connections. DUAL PORT OPTION CASE 867C-05 STYLE 1 PIN NUMBERS(1) 1 Vout 4 N/C 2 GND 5 N/C 3 VS 6 N/C 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. © Freescale Semiconductor, Inc., 2006. All rights reserved. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 4, 5, and 6 are NO CONNECTS for unibody devices. Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 1000 kPa Storage Temperature TSTG –40 to +125 °C TA –40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX4250D 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 0 — 250 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Pressure Range (1) Minimum Pressure Offset @ VS = 5.1 Volts(3) (0 to 85°C) Voff 0.139 0.204 0.269 Vdc Full Scale Output @ VS = 5.1 Volts(4) (0 to 85°C) VFSO 4.844 4.909 4.974 Vdc Full Scale Span @ VS = 5.1 Volts (0 to 85°C) VFSS — 4.705 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.4 %VFSS ∆V/∆P — 18.8 —- mV/kPa tR — 1.0 —- ms Output Source Current at Full Scale Output Io+ — 0.1 —- mAdc Warm-Up Time(8) — — 20 —- ms Offset Stability(9) — — ±0.5 —- %VFSS (5) Sensitivity Response Time (7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Table 3. Mechanical Characteristics Characteristics Weight, Basic Element (Case 867) Typ Unit 4.0 grams MPX4250D Sensors Freescale Semiconductor 3 ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Fluoro Silicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Epoxy Case RTV Die Bond Lead Frame P2 Sealed Vacuum Reference Figure 2. Cross Sectional Diagram (not to scale) +5 V Output Vout Vs IPS 1.0 µF GND 0.01 µF 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1535) 5.0 Transfer Function: Vout = Vs* (0.00369*P + 0.04) ± Error VS = 5.1 Vdc Temperature = 0 to 85°C 4.5 4.0 Output (Volts) 3.5 TYP 3.0 2.5 2.0 MAX 1.5 MIN 1.0 0.5 250 260 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 0 Pressure in kPa Figure 4. Output versus Absolute Pressure Figure 2 illustrates the differential/gauge pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250D series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. MPX4250D 4 Sensors Freescale Semiconductor Transfer Function (MPX4250D) Nominal Transfer Value: Vout = VS x (0.00369 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.00369 x VS) VS = 5.1 ± 0.25 Vdc Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier –40 0 to 85 +125 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band 5.0 Pressure Error (kPa) 4.0 3.0 2.0 1.0 0 –1.0 –2.0 0 25 50 75 100 125 150 175 200 225 250 Pressure (kPa) –3.0 –4.0 –5.0 Pressure Error (Max) 0 to 250 kPa ±3.45 kPa MPX4250D Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. STYLE 2: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN BASIC ELEMENT (D) CASE 867-08 ISSUE N P 0.25 (0.010) M T Q -A- M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N -Q- PORT #2 VACUUM (P2) B PIN 1 1 C SEATING PLANE -T- -TJ 2 3 4 5 K 6 S SEATING PLANE G F D 6 PL 0.13 (0.005) M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX PRESSURE AND VACUUM SIDE DUAL PORTED (DP) CASE 867C-05 ISSUE F MPX4250D 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 PRESSURE SIDE PORTED (GP) CASE 867B-04 ISSUE G MPX4250D Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 2 OF 2 PRESSURE SIDE PORTED (GP) CASE 867B-04 ISSUE G MPX4250D 8 Sensors Freescale Semiconductor NOTES MPX4250D Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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