Document Number: MRF5S21045 Rev. 1, 7/2005 Freescale Semiconductor Technical Data RF Power Field Effect Transistors MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 N - Channel Enhancement - Mode Lateral MOSFETs Designed for W - CDMA base station applications with frequencies from 2110 to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applicat i o n s . To b e u s e d i n C l a s s A B f o r P C N - P C S / c e l l u l a r r a d i o a n d W L L applications. • Typical 2 - carrier W - CDMA Performance: VDD = 28 Volts, IDQ = 500 mA, Pout = 10 Watts Avg., Full Frequency Band, Channel Bandwidth = 3.84 MHz, PAR = 8.5 dB @ 0.01% Probability on CCDF. Power Gain — 14.5 dB Drain Efficiency — 25.5% IM3 @ 10 MHz Offset — - 37 dBc @ 3.84 MHz Channel Bandwidth ACPR @ 5 MHz Offset — - 39 dBc @ 3.84 MHz Channel Bandwidth • Capable of Handling 5:1 VSWR, @ 28 Vdc, 2110 MHz, 45 Watts CW Output Power • Characterized with Series Equivalent Large - Signal Impedance Parameters • Internally Matched for Ease of Use • Qualified Up to a Maximum of 32 VDD Operation • Integrated ESD Protection • N Suffix Indicates Lead - Free Terminations • 200°C Capable Plastic Package • In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel. 2170 MHz, 10 W AVG., 28 V 2 x W - CDMA LATERAL N - CHANNEL RF POWER MOSFETs CASE 1486 - 03, STYLE 1 TO - 270 WB - 4 PLASTIC MRF5S21045NR1(MR1) CASE 1484 - 02, STYLE 1 TO - 272 WB - 4 PLASTIC MRF5S21045NBR1(MBR1) Table 1. Maximum Ratings Rating Symbol Value Unit Drain- Source Voltage VDSS - 0.5, +68 Vdc Gate- Source Voltage VGS - 0.5, +15 Vdc Total Device Dissipation @ TC = 25°C Derate above 25°C PD 130 0.74 W W/°C Storage Temperature Range Tstg - 65 to +150 °C Operating Junction Temperature TJ 200 °C CW 45 W Symbol Value (1,2) Unit CW Operation Table 2. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Case Temperature 80°C, 45 W CW Case Temperature 79°C, 10 W CW RθJC 1.35 1.48 °C/W 1. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access the MTTF calculators by product. 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. Freescale Semiconductor, Inc., 2005. All rights reserved. RF Device Data Freescale Semiconductor MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 1 Table 3. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD22 - A114) 1C (Minimum) Machine Model (per EIA/JESD22 - A115) A (Minimum) Charge Device Model (per JESD22 - C101) IV (Minimum) Table 4. Moisture Sensitivity Level Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Rating Package Peak Temperature Unit 3 260 °C Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) Symbol Min Typ Max Unit Zero Gate Voltage Drain Leakage Current (VDS = 68 Vdc, VGS = 0 Vdc) IDSS — — 10 µAdc Zero Gate Voltage Drain Leakage Current (VDS = 28 Vdc, VGS = 0 Vdc) IDSS — — 1 µAdc Gate- Source Leakage Current (VGS = 5 Vdc, VDS = 0 Vdc) IGSS — — 1 µAdc Gate Threshold Voltage (VDS = 10 Vdc, ID = 120 µAdc) VGS(th) 2 — 3.5 Vdc Gate Quiescent Voltage (VDS = 28 Vdc, ID = 500 mAdc) VGS(Q) 2 3.8 5 Vdc Drain- Source On - Voltage (VGS = 10 Vdc, ID = 1.2 Adc) VDS(on) 0.2 — 0.35 Vdc Forward Transconductance (VDS = 10 Vdc, ID = 1.2 Adc) gfs — 3.2 — S Crss — 0.9 — pF Characteristic Off Characteristics On Characteristics Dynamic Characteristics (1) Reverse Transfer Capacitance (VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 500 mA, Pout = 10 W Avg., f1 = 2112.5 MHz, f2 = 2122.5 MHz and f1 = 2157.5 MHz, f2 = 2167.5 MHz, 2 - carrier W - CDMA, 3.84 MHz Channel Bandwidth Carriers. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset. IM3 measured in 3.84 MHz Bandwidth @ ±10 MHz Offset. PAR = 8.5 dB @ 0.01% Probability on CCDF. Power Gain Gps 13.5 14.5 16.5 dB Drain Efficiency ηD 24 25.5 — % Intermodulation Distortion Adjacent Channel Power Ratio Input Return Loss IM3 — - 37 - 35 dBc ACPR — - 39 - 37 dBc IRL — - 12 -9 dB 1. Part is internally matched both on input and output. MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 2 RF Device Data Freescale Semiconductor R1 VBIAS VSUPPLY R2 C1 C2 C4 C5 Z11 Z10 Z6 + C6 C3 Z13 R3 RF INPUT Z1 Z2 Z3 Z4 Z5 Z7 Z12 Z9 C12 C7 C8 DUT C9 C10 Z8 RF OUTPUT C11 C13 C14 Z1, Z9 Z2 Z3 Z4 Z5 Z6 0.250″ x 0.080″ Microstrip 0.987″ x 0.080″ Microstrip 0.157″ x 0.080″ Microstrip 0.375″ x 0.080″ Microstrip 0.480″ x 1.000″ Microstrip 0.510″ x 0.080″ Microstrip Z7 Z8, Z13 Z10 Z11 Z12 PCB C15 0.500″ x 1.000″ Microstrip 0.270″ x 0.080″ Microstrip 0.789″ x 0.080″ Microstrip 0.527″ x 0.080″ Microstrip 0.179″ x 0.080″ Microstrip Taconic TLX8 - 0300, 0.030″, εr = 2.55 Figure 1. MRF5S21045NR1(NBR1)/MR1(MBR1) Test Circuit Schematic Table 6. MRF5S21045NR1(NBR1)/MR1(MBR1) Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1 220 nF Chip Capacitor (1812) 1812Y224KXA Vishay - Vitramon C2, C3, C7, C12, C13 6.8 pF 100B Chip Capacitors 100B6R8CW ATC C4, C5, C14, C15 6.8 µF Chip Capacitors (1812) C4532X5R1H685MT TDK C6 220 µF, 63 V Electrolytic Capacitor, Radial 13668221 Philips C8, C10 1 pF 100B Chip Capacitors 100B1R0BW ATC C9 1.5 pF 100B Chip Capacitor 100B1R5BW ATC C11 0.5 pF 100B Chip Capacitor 100B0R5BW ATC R1, R2 10 kW, 1/4 W Chip Resistors R3 10 W, 1/4 W Chip Resistor MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 RF Device Data Freescale Semiconductor 3 C1 C2 C4 C5 R1 C3 R2 C6 R3 C8 C9 CUT OUT AREA C7 C10 C11 C12 C13 C14 C15 MRF5S21045N Rev. 0 Figure 2. MRF5S21045NR1(NBR1)/MR1(MBR1) Test Circuit Component Layout MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 4 RF Device Data Freescale Semiconductor 28 24 Gps, POWER GAIN (dB) 14.8 14.6 VDD = 28 Vdc, Pout = 10 W (Avg.), IDQ = 500 mA 2−Carrier W−CDMA, 10 MHz Carrier Spacing, 3.84 MHz Channel Bandwidth PAR = 8.5 dB @ 0.01% Probability (CCDF) Gps 14.4 14.2 IRL 14 20 16 −28 −32 13.8 −36 IM3 13.6 −40 ACPR 13.4 2060 2080 2100 2120 2140 2160 2180 2200 −44 2220 IM3 (dBc), ACPR (dBc) ηD 15 −10 −13 −16 −19 −22 IRL, INPUT RETURN LOSS (dB) 32 15.2 ηD, DRAIN EFFICIENCY (%) TYPICAL CHARACTERISTICS f, FREQUENCY (MHz) 46 14.6 42 Gps, POWER GAIN (dB) 14.2 38 Gps VDD = 28 Vdc, Pout = 20 W (Avg.), IDQ = 500 mA 2−Carrier W−CDMA, 10 MHz Carrier Spacing, 3.84 MHz Channel Bandwidth, PAR = 8.5 dB @ 0.01% Probability (CCDF) 14 13.8 IRL 13.6 34 30 −18 −22 −26 13.4 IM3 13.2 −30 ACPR 13 2060 2080 2100 2120 2140 2160 f, FREQUENCY (MHz) 2180 2200 −34 2220 IM3 (dBc), ACPR (dBc) ηD 14.4 −8 −11 −14 −17 −20 IRL, INPUT RETURN LOSS (dB) 14.8 ηD, DRAIN EFFICIENCY (%) Figure 3. 2 - Carrier W - CDMA Broadband Performance @ Pout = 10 Watts Figure 4. 2 - Carrier W - CDMA Broadband Performance @ Pout = 20 Watts 17 IDQ = 800 mA 16 Gps, POWER GAIN (dB) IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc) −10 650 mA 15 500 mA 14 350 mA 200 mA 13 VDD = 28 Vdc f1 = 2135 MHz, f2 = 2145 MHz Two−Tone Measurements, 10 MHz Tone Spacing 12 11 1 10 100 −20 IDQ = 200 mA −30 800 mA −40 650 mA 500 mA −50 350 mA VDD = 28 Vdc f1 = 2135 MHz, f2 = 2145 MHz Two−Tone Measurements, 10 MHz Tone Spacing −60 1 10 100 Pout, OUTPUT POWER (WATTS) PEP Pout, OUTPUT POWER (WATTS) PEP Figure 5. Two - Tone Power Gain versus Output Power Figure 6. Third Order Intermodulation Distortion versus Output Power MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 RF Device Data Freescale Semiconductor 5 −25 54 Pout, OUTPUT POWER (dBm) −35 −40 5th Order −45 7th Order −50 −55 Actual 48 46 VDD = 28 Vdc, IDQ = 500 mA Pulsed CW, 5 µsec(on), 1 msec(off) Center Frequency = 2140 MHz 30 32 34 36 38 40 Pin, INPUT POWER (dBm) Figure 7. Intermodulation Distortion Products versus Tone Spacing Figure 8. Pulse CW Output Power versus Input Power −30_C 25_C ηD 17 −10 60 85_C −30_C 25_C IM3 85_C 25_C −30_C 16 −20 85_C −30 25_C ACPR −30_C TC = −30_C Gps −40 25_C 85_C 10 P1dB = 47.60 dBm (57.5 W) TWO−TONE SPACING (MHz) IM3 (dBc), ACPR (dBc) 30 50 42 28 100 10 VDD = 28 Vdc, IDQ = 500 mA f1 = 2135 MHz, f2 = 2145 MHz 2 x W−CDMA, 10 MHz @ 3.84 MHz Bandwidth PAR = 8.5 dB @ 0.01% Probability (CCDF) 40 20 1 52 44 VDD = 28 Vdc, Pout = 45 W (PEP), IDQ = 500 mA Two−Tone Measurements, Center Frequency = 2140 MHz −60 0.1 Ideal P3dB = 48.17 dBm (65.6 W) 3rd Order TC = −30_C 50 85_C 15 25_C 14 85_C 40 30 13 VDD = 28 Vdc IDQ = 500 mA f = 2140 MHz 12 20 ηD, DRAIN EFFICIENCY (%) −30 Gps, POWER GAIN (dB) ηD, DRAIN EFFICIENCY (%), Gps, POWER GAIN (dB) IMD, INTERMODULATION DISTORTION (dBc) TYPICAL CHARACTERISTICS 10 −50 0 1 10 11 0.1 100 1 10 Pout, OUTPUT POWER (WATTS) AVG. Pout, OUTPUT POWER (WATTS) CW Figure 9. 2 - Carrier W - CDMA ACPR, IM3, Power Gain and Drain Efficiency versus Output Power Figure 10. Power Gain and Drain Efficiency versus CW Output Power 0 100 16 Gps, POWER GAIN (dB) 14 32 V 12 28 V 24 V 10 20 V 8 16 V IDQ = 500 mA f = 2140 MHz VDD = 12 V 6 0 10 20 30 40 50 60 70 80 Pout, OUTPUT POWER (WATTS) CW Figure 11. Power Gain versus Output Power MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 6 RF Device Data Freescale Semiconductor TYPICAL CHARACTERISTICS MTTF FACTOR (HOURS x AMPS2) 109 108 107 106 90 100 110 120 130 140 150 160 170 180 190 200 210 TJ, JUNCTION TEMPERATURE (°C) This above graph displays calculated MTTF in hours x ampere2 drain current. Life tests at elevated temperatures have correlated to better than ±10% of the theoretical prediction for metal failure. Divide MTTF factor by ID2 for MTTF in a particular application. Figure 12. MTTF Factor versus Junction Temperature W - CDMA TEST SIGNAL 100 +20 3.84 MHz Channel BW +30 0 −10 1 (dB) PROBABILITY (%) 10 0.1 W−CDMA. ACPR Measured in 3.84 MHz Channel Bandwidth @ +5 MHz Offset. IM3 Measured in 3.84 MHz Bandwidth @ +10 MHz Offset. PAR = 8.5 dB @ 0.01% Probability on CCDF 0.01 −50 4 6 −70 −ACPR @ +ACPR @ 3.84 MHz BW 3.84 MHz BW −IM3 @ 3.84 MHz BW −80 −25 −20 −60 0.0001 2 −30 −40 0.001 0 −20 8 10 PEAK−TO−AVERAGE (dB) −15 −10 −5 0 5 10 +IM3 @ 3.84 MHz BW 15 20 25 f, FREQUENCY (MHz) Figure 13. CCDF W - CDMA 3GPP, Test Model 1, 64 DPCH, 67% Clipping, Single - Carrier Test Signal Figure 14. 2-Carrier W-CDMA Spectrum MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 RF Device Data Freescale Semiconductor 7 Zo = 10 Ω f = 2200 MHz f = 2000 MHz Zsource Zload f = 2000 MHz f = 2200 MHz VDD = 28 Vdc, IDQ = 500 mA, Pout = 10 W Avg. f MHz Zsource Ω Zload Ω 2000 8.15 - j5.91 4.78 - j5.19 2110 7.07 - j7.32 4.04 - j4.14 2140 6.28 - j7.71 3.81 - j3.69 2170 5.61 - j7.85 3.69 - j3.39 2200 4.92 - j7.85 3.57 - j3.11 Zsource = Test circuit impedance as measured from gate to ground. Zload = Test circuit impedance as measured from drain to ground. Output Matching Network Device Under Test Input Matching Network Z source Z load Figure 15. Series Equivalent Source and Load Impedance MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 8 RF Device Data Freescale Semiconductor NOTES MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 RF Device Data Freescale Semiconductor 9 PACKAGE DIMENSIONS E1 B A 2X E3 GATE LEAD DRAIN LEAD D D1 4X e 4X aaa b1 C A M 2X 2X D2 c1 E H DATUM PLANE F ZONE J A A1 2X A2 E2 NOTE 7 C E5 E4 4 D3 3 ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ ÇÇÇÇÇÇ E5 BOTTOM VIEW SEATING PLANE PIN 5 NOTE 8 1 2 CASE 1486 - 03 ISSUE C TO - 270 WB - 4 MRF5S21045NR1(MR1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M−1994. 3. DATUM PLANE −H− IS LOCATED AT THE TOP OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE TOP OF THE PARTING LINE. 4. DIMENSIONS “D" AND “E1" DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .006 PER SIDE. DIMENSIONS “D" AND “E1" DO INCLUDE MOLD MISMATCH AND ARE DETER− MINED AT DATUM PLANE −H−. 5. DIMENSION “b1" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .005 TOTAL IN EXCESS OF THE “b1" DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. DATUMS −A− AND −B− TO BE DETERMINED AT DATUM PLANE −H−. 7. DIMENSION A2 APPLIES WITHIN ZONE “J" ONLY. 8. HATCHING REPRESENTS THE EXPOSED AREA OF THE HEAT SLUG. DIM A A1 A2 D D1 D2 D3 E E1 E2 E3 E4 E5 F b1 c1 e aaa INCHES MIN MAX .100 .104 .039 .043 .040 .042 .712 .720 .688 .692 .011 .019 .600 −−− .551 .559 .353 .357 .132 .140 .124 .132 .270 −−− .346 .350 .025 BSC .164 .170 .007 .011 .106 BSC .004 STYLE 1: PIN 1. 2. 3. 4. 5. MILLIMETERS MIN MAX 2.54 2.64 0.99 1.09 1.02 1.07 18.08 18.29 17.48 17.58 0.28 0.48 15.24 −−− 14 14.2 8.97 9.07 3.35 3.56 3.15 3.35 6.86 −−− 8.79 8.89 0.64 BSC 4.17 4.32 0.18 0.28 2.69 BSC 0.10 DRAIN DRAIN GATE GATE SOURCE MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 10 RF Device Data Freescale Semiconductor E1 r1 aaa M C A B 2X A B GATE LEAD E2 DRAIN LEAD 3 D D2 D1 4X e 4 b1 aaa M C A 4X ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ H ZONE J A A1 A2 7 Y E3 1 2 NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M−1994. 3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE TOP OF THE PARTING LINE. 4. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .006 PER SIDE. DIMENSIONS "D" AND "E1" DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE −H−. 5. DIMENSION "b1" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .005 TOTAL IN EXCESS OF THE "b1" DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. DATUMS −A− AND −B− TO BE DETERMINED AT DATUM PLANE −H−. 7. DIMENSION A2 APPLIES WITHIN ZONE "J" ONLY. 8. HATCHING REPRESENTS THE EXPOSED AREA OF THE HEAT SLUG. F DATUM PLANE NOTE 8 E3 VIEW Y - Y E c1 PIN 5 Y C SEATING PLANE STYLE 1: PIN 1. 2. 3. 4. 5. CASE 1484 - 02 ISSUE B TO - 272 WB - 4 MRF5S21045NBR1(MBR1) DRAIN DRAIN GATE GATE SOURCE DIM A A1 A2 D D1 D2 E E1 E2 E3 F b1 c1 r1 e aaa INCHES MIN MAX .100 .104 .039 .043 .040 .042 .928 .932 .810 BSC .600 −−− .551 .559 .353 .357 .270 −−− .346 .350 .025 BSC .164 .170 .007 .011 .063 .068 .106 BSC .004 MILLIMETERS MIN MAX 2.54 2.64 0.99 1.09 1.02 1.07 23.57 23.67 20.57 BSC 15.24 −−− 14 14.2 8.97 9.07 6.86 −−− 8.79 8.89 0.64 BSC 4.17 4.32 .18 .28 1.60 1.73 2.69 BSC .10 MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 RF Device Data Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E - mail: [email protected] RoHS-compliant and/or Pb- free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. 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Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2005. All rights reserved. MRF5S21045NR1 MRF5S21045NBR1 MRF5S21045MR1 MRF5S21045MBR1 Document Number: MRF5S21045 Rev. 1, 7/2005 12 RF Device Data Freescale Semiconductor