FODB100, FODB101, FODB102 Single Channel Microcoupler™ tm Features Description ■ Low profile package The FODB100, FODB101 and FODB102 single channel MICROCOUPLERS™ are all Pb-free, low profile miniature surface mount optocouplers in a Ball Grid Array (BGA) package. Each consists of an aluminum gallium arsenide (AlGaAs) infrared emitting diode driving a silicon phototransistor. ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ (1.20mm maximum mounted height) Land pattern allows for optimum board space savings High Current Transfer Ratio (CTR) at low IF Minimum isolation distance of 0.45mm High steady state isolation voltage of 2500Vrms Data rates up to 120Kbit/s (NRZ) Minimum creepage distance of 2mm Wide operating temperature range of -40°C to +125°C Available in tape and reel quantities of 3000 units Applicable to Pb-free Infrared Ray reflow (260°C max) UL and VDE approved Schematic ANODE 1 4 COLLECTOR Applications CATHODE 2 ■ Primarily suited for DC-DC converters 3 EMITTER ■ For ground loop isolation, signal to noise isolation Communications – chargers, adapters Consumer – appliances, set top boxes Industrial – power supplies, motor control Package Dimensions 3.50 ± 0.10 A 2.50 1 4 2 3 3.50 ± 0.10 2.50 BALL #1 INDICATOR 4 3 BOTTOM VIEW 0.98 MAX Ø 0.80 MIN 0.65 MAX B (Ø2.30) 2 1 0.35 MAX 0.25 MIN TOP VIEW 0.10 C B A 1.20 MAX C ©2004 Fairchild Semiconductor Corporation FODB100, FODB101, FODB102 Rev. 1.0.0 0.85 MAX 0.68 MIN SEATING PLANE 1 NOTES: UNLESS OTHERWISE SPECIFIED A) ALL DIMENSIONS ARE IN MILLIMETERS. B) NO JEDEC REGISTRATION REFERENCE AS OF NOVEMBER 2002. 0.10 C www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ July 2006 Symbol Parameter Value Units TOTAL PACKAGE TSTG Storage Temperature -55 to +150 °C TOPR Operating Temperature -40 to +125 °C Junction Temperature 130 °C Continuous Forward Current 30 mA Tj EMITTER IF (avg) VR Reverse Input Voltage 6 V PD Power Dissipation 40 mW 0.39 mW/°C Derate linearly (above 25°C) DETECTOR PD Continuous Collector Current 50 mA Power Dissipation 150 mW Derate linearly (above 25°C) 1.42 mW/°C VCEO Collector-Emitter Voltage 75 V VECO Emitter-Collector Voltage 7 V 2 FODB100, FODB101, FODB102 Rev. 1.0.0 www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ Absolute Maximum Ratings (TA = 25°C Unless otherwise specified) Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit 1.5 V 10 µA EMITTER VF Forward Voltage IF = 2mA IR Reverse Current VR = 6V BVCEO Breakdown Voltage Collector to Emitter IC = 100µA, IF = 0 75 V BVECO Emitter to Collector IE = 100µA, IF = 0 7 V 1.0 DETECTOR ICEO Collector Dark CCE Capacitance Current(1) VCE = 75V, IF = 0 VCE = 0V, f = 1MHz 100 nA 8 pF Transfer Characteristics Symbol CTR Characteristic Test Conditions Current Transfer Ratio(2) IF = 1mA, VCE = 5V CTRCE(SAT) Saturated Current Transfer IF = 1.6mA, VCE = 0.4V Ratio (Collector to Emitter) IF = 1.0mA, VCE = 0.4V VCE (SAT) Saturation Voltage Min. Typ. 100 100 % 75 IF = 3.0mA, IC = 1.8mA 0.4 tr Rise Time (Non-Saturated) IC = 2mA, VCE = 5 V, RL = 1kΩ 1 tf Fall Time (Non-Saturated) IC = 2mA, VCE = 5 V, RL = 1kΩ 5 Propagation Delay High to Low IF = 1.6mA, VCC = 5.0 V, RL = 750Ω 3 IF = 1.6mA, VCC = 5.0 V, RL = 4.7kΩ 12 Propagation Delay Low to High IF = 1.6mA, VCC = 5.0 V, RL = 750Ω 5 IF = 1.6mA, VCC = 5.0 V, RL = 4.7kΩ 19 TPLH Unit % IF = 1.6mA, IC = 1.6mA TPHL Max. V µs µs µs Isolation Characteristics Symbol VISO RISO CISO Characteristic Test Conditions Steady State Isolation Voltage(3) RH ≤ 50%, TA = 25°C, t = 1 sec Resistance (input to output)(3) Capacitance (input to output)(3) VI-O = 500VDC f = 1MHz Min. Typ. Max. Unit 2500 V(rms) 1012 Ω 0.3 0.5 pF Notes: 1. The white dome area is sensitive to high intensity ambient light or any light source in the 500nm to 1200nm wavelength range. If such a light source is present, the part should be covered or protected. If the white dome is exposed to such a light source, the output leakage parameter of the phototransistor will increase. 2. CTR bin (FODB100 only) FODB101: 100% – 200% FODB102: 150% – 300% 3. Pin 1 and Pin 2 are shorted as input and Pin 3 and Pin 4 are shorted as output. 3 FODB100, FODB101, FODB102 Rev. 1.0.0 www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ Electrical Characteristics (TA = 25°C Unless otherwise specified) Normalized CTR @ 25°C 1.2 IF = 2mA @ VCE = 2V 1 IF = 1mA @ VCE = 2V 0.8 0.6 IF = 500µA @ VCE = 2V 0.4 0.2 0 25 40 60 80 100 120 1.2 IF = 2mA @ VCE = 5V 1 IF = 1mA @ VCE = 5V 0.8 IF = 500µA @ VCE = 5V 0.6 0.4 0.2 0 25 140 Temperature (°C) 100 60 80 Temperature (°C) Fig. 3 Current Transfer Ratio vs. Collector to Emitter Voltage Fig. 4 Current Transfer Ratio vs. Collector Saturation Voltage 500 40 350 2mA 1mA 300 120 140 1mA 300 400 CTR (%) Fig. 2 Normalized CTR vs. Temperature (VCE = 5V) 500µA 250 CTR (%) Normalized CTR @ 25°C Fig. 1 Normalized CTR vs. Temperature (VCE = 2V) 500µA 200 2mA 200 150 100 100 50 0 0 0 2 4 6 8 10 0 VCE (V) 0.2 0.4 0.6 0.8 1.0 Collector Saturation Voltage (V) Fig. 5 Baud Rate vs. Load Resistor Baud Rate – Kbit/s 200 IF = 1.47 mA Ta = 23C, PRSG = (28-1) BER < 10-6 150 100 Vcc = 12V 50 Vcc = 5V 0 200 400 600 800 1000 1200 1400 RL - Load Resistor - Ohms 4 FODB100, FODB101, FODB102 Rev. 1.0.0 1600 www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ Typical Performance Characteristics Embossed Carrier Tape Configuration D0 P0 T E1 F K0 Wc W E2 B0 Tc D1 P1 A0 User Direction of Feed Dimensions are in millimeter Pkg type A0 Optocoupler (12mm) 3.80 ±0.10 B0 W D0 D1 E1 E2 3.80 ±0.10 12.0 +0.3/ –0.1 1.50 +0.25/ –0.00 1.50 +0.25/ –0.00 1.75 ±0.10 10.25 min F 5.50 ±0.05 P1 P0 K0 8.0 ±0.1 4.0 ±0.1 1.40 ±0.10 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). T 0.279 ±0.02 Tc 9.2 ±0.3 0.06 ±0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 Wc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) Sketch C (Top View) A0 Component Rotation Component lateral movement Sketch B (Top View) Component Rotation Optocoupler Reel Configuration W1 Measured at Hub B Min Dim C Dim D min Dim A max Dim N DETAIL AA See detail AA W3 13" Diameter Reel W2 max Measured at Hub Dimension are in inches and millimeters Tape Size 12mm Reel Option 13" Dia Dim A 13.00 330 Dim B 0.059 1.5 Dim C 512 +0.020/–0.008 13 +0.5/–0.2 Dim D 0.795 20.2 7.00 178 5 FODB100, FODB101, FODB102 Rev. 1.0.0 Dim N Dim W1 0.488 +0.078/–0.000 12.4 +2/–0 Dim W2 0.724 18.4 Dim W3 (LSL–USL) 0.469 – 0.606 11.9 – 15.4 www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ Tape and Reel Specifications 4 3 4 3 Definitions 5 1 X Y TT B100 C V 1 2 7 6 2 Ball #1 Indicator 1 Fairchild logo 2 Device number (FODB100) 3 One digit year code e.g. “E” for 2004 4 6-week date code character 5 Die Run Code 6 Assembly package code 7 VDE 0884 approved (Optional) Note: The device number prefix of “FOD” will be ommitted in the part number Recommended Footprint Drawing for PCB Layout Ø0.65 4 3 2.50 1 2.50 2 Note: 1. All dimensions in millimeters (mm) 2. It is recommended to use 6 mils of stencil thickness on PCB 6 FODB100, FODB101, FODB102 Rev. 1.0.0 www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ Marking Information Entrance Zone 1 Zone 2 Zone 3 Zone 4 Zone 5 Cooling 270.00 236.25 Temperature (°C) 202.50 168.75 135.00 101.25 67.50 33.75 0.00 0.66 1.31 1.97 2.63 3.28 3.94 4.60 5.26 5.91 6.57 7.23 7.88 Time (min.) Reflow Profile for Pb Free Convection Reflow Average ramp-up rate (183°C to peak) Preheat Temperature 125(±25)°C to 200°C 3°C/sec max 60-180°C Temperature maintained above 220°C 60-150 sec Time within 5°C of actual peak temperature 20-40 sec 260 ±5°C 6°C/sec max Peak temperature range Ramp down rate Time 25°C to peak temperature 8min max Note: Surface Mount Adhesives (SMA) isn’t recommended to be used on the dome area (white dome). 7 FODB100, FODB101, FODB102 Rev. 1.0.0 www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ Recommended Infrared Reflow Soldering Profile The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FAST® FASTr™ FPS™ FRFET™ FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™ UniFET™ UltraFET® VCX™ Wire™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20 8 FODB100, FODB101, FODB102 Rev. 1.0.0 www.fairchildsemi.com FODB100, FODB101, FODB102 Single Channel Microcoupler™ TRADEMARKS