SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 DESCRIPTION The FODB100, FODB101 and FODB102 single channel MICROCOUPLERS™ are all Pb-free, low profile miniature surface mount optocouplers in a Ball Grid Array (BGA) package. Each consists of an aluminum gallium arsenide (AlGaAs) infrared emitting diode driving a silicon phototransistor. FEATURES • Low profile package (1.20mm maximum mounted height) • Land pattern allows for optimum board space savings • High Current Transfer Ratio (CTR) at low IF • Minimum isolation distance of 0.45mm • High steady state isolation voltage of 2500Vrms • Data rates up to 120Kbit/s (NRZ) • Minimum creepage distance of 2mm • Wide operating temperature range of -40°C to +125°C • Available in tape and reel quantities of 3000 units • Applicable to Pb-free Infrared Ray reflow (260°C max) • UL, C-UL approved; VDE pending SCHEMATIC ANODE 1 CATHODE 2 4 COLLECTOR 3 EMITTER APPLICATIONS • Primarily suited for DC-DC converters • For ground loop isolation, signal to noise isolation Communications – chargers, adapters Consumer – appliances, set top boxes Industrial – power supplies, motor control PACKAGE DIMENSIONS 3.50 ± 0.10 A 2.50 1 4 2 3 3.50 ± 0.10 2.50 BALL #1 INDICATOR 4 3 BOTTOM VIEW 0.98 MAX Ø 0.80 MIN 0.65 MAX B (Ø2.30) 2 1 0.35 MAX 0.25 MIN TOP VIEW 0.10 C B A 1.20 MAX C © 2004 Fairchild Semiconductor Corporation 0.85 MAX 0.68 MIN SEATING PLANE Page 1 of 8 NOTES: UNLESS OTHERWISE SPECIFIED A) ALL DIMENSIONS ARE IN MILLIMETERS. B) NO JEDEC REGISTRATION REFERENCE AS OF NOVEMBER 2002. 0.10 C 8/19/04 SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter TOTAL PACKAGE Symbol Value Units Storage Temperature TSTG -55 to +150 °C Operating Temperature TOPR -40 to +125 °C Tj 130 °C IF (avg) 30 mA Junction Temperature EMITTER Continuous Forward Current Reverse Input Voltage Power Dissipation Derate linearly (above 25°C) DETECTOR Continuous Collector Current Power Dissipation Derate linearly (above 25°C) VR 6 V PD 40 0.39 mW mW/°C 50 150 1.42 mA mW mW/°C PD Collector-Emitter Voltage VCEO 75 V Emitter-Collector Voltage VECO 7 V ELECTRICAL CHARACTERISTICS (TA = 25°C) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Min 1.0 Typ** Max Unit 1.5 V 10 µA EMITTER Forward Voltage (IF = 2 mA) VF Reverse Current (VR = 6 V) IR DETECTOR Breakdown Voltage Collector to Emitter (IC = 100 µA, IF = 0) BVCEO 75 Emitter to Collector (IE = 100 µA, IF = 0) BVECO 7 (VCE = 75 V, IF = 0) ICEO (VCE = 0 V, f = 1 MHz) CCE Collector Dark Current Capacitance © 2004 Fairchild Semiconductor Corporation Page 2 of 8 V 100 8 nA pF 8/19/04 SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 TRANSFER CHARACTERISTICS (TA = 25°C) Characteristic Current Transfer Ratio1 Saturated Current Transfer Ratio (Collector to Emitter) Saturation Voltage Test Conditions (IF = 1 mA, VCE = 5 V) (IF = 1.6 mA, VCE = 0.4 V) (IF = 1.0 mA, VCE = 0.4 V) (IF = 3.0 mA, IC = 1.8 mA) (IF = 1.6 mA, IC = 1.6 mA) Symbol Min CTR 100 CTRCE(SAT) (IC = 2 mA, VCE = 5 V) (RL = 1KΩ) tr Fall Time (Non-Saturated) (IC = 2 mA, VCE = 5 V) (RL = 1KΩ) tf Propagation Delay High to Low Propagation Delay Low to High IF = 1.6 mA, VCC = 5.0 V RL = 4.7KΩ IF = 1.6 mA, VCC = 5.0 V RL = 750Ω IF = 1.6 mA, VCC = 5.0 V RL = 4.7KΩ Max Unit % 100 % 75 VCE (SAT) Rise Time (Non-Saturated) IF = 1.6 mA, VCC = 5.0 V RL = 750Ω Typ** 0.4 V 1 µs 5 3 TPHL µs 12 5 TPLH µs 19 ISOLATION CHARACTERISTICS Characteristic Steady State Isolation Voltage2 Test Conditions Symbol Min (RH ≤ 50%, TA = 25°C, t = 1 sec) VISO 2500 V(rms) (VI-O = 500VDC) RISO 1012 Ω f = 1MHz CISO Resistance (input to output)2 Capacitance (input to output)2 Typ** 0.3 Max 0.5 Unit pF Notes: 1. CTR bin (FODB100 only) FODB101: 100% – 200% FODB102: 150% – 300% 2. Pin 1 and Pin 2 are shorted as input and Pin 3 and Pin 4 are shorted as output. © 2004 Fairchild Semiconductor Corporation Page 3 of 8 8/19/04 SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 TYPICAL PERFORMANCE CURVES Fig. 2 Normalized CTR vs. Temperature (VCE = 5V) Normalized CTR @ 25°C Normalized CTR @ 25°C Fig. 1 Normalized CTR vs. Temperature (VCE = 2V) 1.2 IF = 2mA @ VCE = 2V 1 IF = 1mA @ VCE = 2V 0.8 0.6 IF = 500µA @ VCE = 2V 0.4 0.2 0 25 40 60 80 100 Temperature (°C) 120 1.2 IF = 2mA @ VCE = 5V 1 IF = 1mA @ VCE = 5V 0.8 IF = 500µA @ VCE = 5V 0.6 0.4 0.2 0 25 140 40 Fig. 3 Current Transfer Ratio vs. Collector to Emitter Voltage 350 2mA 140 1mA 300 400 1mA 500µA 250 CTR (%) 300 120 Fig. 4 Current Transfer Ratio vs. Collector Saturation Voltage 500 CTR (%) 60 80 100 Temperature (°C) 500µA 200 2mA 200 150 100 100 50 0 0 0 2 4 6 8 10 0 VCE (V) 0.8 0.2 0.4 0.6 Collector Saturation Voltage (V) 1.0 Fig. 5 Baud Rate vs. Load Resistor Baud Rate – Kbit/s 200 IF = 1.47 mA Ta = 23C, PRSG = (28-1) BER < 10-6 150 100 Vcc = 12V 50 Vcc = 5V 0 200 © 2004 Fairchild Semiconductor Corporation 400 600 800 1000 1200 1400 RL - Load Resistor - Ohms Page 4 of 8 1600 8/19/04 SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 TAPE AND REEL SPECIFICATIONS Embossed Carrier Tape Configuration D0 P0 T E1 F K0 Wc W E2 B0 Tc D1 P1 A0 User Direction of Feed Dimensions are in millimeter Pkg type Optocoupler (12mm) A0 B0 W D0 D1 E1 E2 3.80 ±0.10 3.80 ±0.10 12.0 +0.3/ –0.1 1.50 +0.25/ –0.00 1.50 +0.25/ –0.00 1.75 ±0.10 10.25 min F 5.50 ±0.05 P1 P0 K0 8.0 ±0.1 4.0 ±0.1 1.40 ±0.10 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). T 0.279 ±0.02 Tc 9.2 ±0.3 0.06 ±0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 Wc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) Sketch C (Top View) A0 Component Rotation Component lateral movement Sketch B (Top View) Component Rotation Optocoupler Reel Configuration W1 Measured at Hub B Min Dim C Dim D min Dim A max Dim N DETAIL AA See detail AA W3 13" Diameter Reel W2 max Measured at Hub Dimension are in inches and millimeters Tape Size 12mm Reel Option 13" Dia Dim A 13.00 330 © 2004 Fairchild Semiconductor Corporation Dim B 0.059 1.5 Dim C Dim D 512 +0.020/–0.008 13 +0.5/–0.2 0.795 20.2 Dim N 7.00 178 Page 5 of 8 Dim W1 0.488 +0.078/–0.000 12.4 +2/–0 Dim W2 0.724 18.4 Dim W3 (LSL–USL) 0.469 – 0.606 11.9 – 15.4 8/19/04 SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 MARKING INFORMATION 4 3 4 3 Definitions 5 1 X Y TT B100 C V 1 2 7 6 2 Ball #1 Indicator 1 Fairchild logo 2 Device number (FODB100) 3 One digit year code e.g. “4” for 2004 4 6-week date code character 5 Die Run Code 6 Assembly package code 7 VDE 0884 approved (Optional) Note: The device number prefix of “FOD” will be ommitted in the part number RECOMMENDED FOOTPRINT DRAWING FOR PCB LAYOUT Ø0.65 4 3 2.50 1 2.50 2 Note: 1. All dimensions in millimeters (mm) 2. It is recommended to use 6 mils of stencil thickness on PCB © 2004 Fairchild Semiconductor Corporation Page 6 of 8 8/19/04 SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 RECOMMENDED INFRARED REFLOW SOLDERING PROFILE Entrance Zone 1 Zone 2 Zone 3 Zone 4 Zone 5 Cooling 270.00 Temperature (°C) 236.25 202.50 168.75 135.00 101.25 67.50 33.75 0.00 0.66 1.31 1.97 2.63 3.28 3.94 4.60 5.26 5.91 6.57 7.23 7.88 Time (min.) Reflow Profile for Pb Free Convection Reflow Average ramp-up rate (183°C to peak) Preheat Temperature 125(±25)°C to 200°C 3°C/sec max 60-180°C Temperature maintained above 220°C 60-150 sec Time within 5°C of actual peak temperature 20-40 sec Peak temperature range Ramp down rate 260 ±5°C 6°C/sec max 8min max Time 25°C to peak temperature Note: Surface Mount Adhesives (SMA) isn’t recommended to be used on the dome area (white dome). © 2004 Fairchild Semiconductor Corporation Page 7 of 8 8/19/04 SINGLE CHANNEL MICROCOUPLER™ FODB100 FODB101 FODB102 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2004 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 8 of 8 8/19/04