MICREL MIC5165YMM

MIC5165
Dual Regulator Controller for DDR3
GDDR3/4/5 Memory Termination
General Description
Features
The MIC5165 is a dual regulator controller designed
• Input voltage range: 0.75V to 6V
specifically
for
low-voltage
memory
termination
• Up to 7A VTT Current
applications such as DDR3 and GDDR3/4/5. The MIC5165
• Tracking programmable output
offers a simple, low-cost JEDEC-compliant solution for
• Power Good signal
terminating high-speed, low-voltage digital buses with a
• Wide bandwidth
Power Good (PG) signal.
• Logic-controlled enable input
The MIC5165 controls two external N-Channel MOSFETs
to form two separate regulators. It operates by switching
• Requires minimal external components
between either the high-side MOSFET or the low-side
• DDR3, GDDR3/4/5 memory termination
MOSFET, depending on whether the current is being
• -40°C < TJ < +125°C
sourced to the load or being sunk by the regulator.
• Tiny MSOP-10 package
Designed to provide a universal solution for memory
termination regardless of input voltage, output voltage, or
load current, the desired MIC5165 output voltage can be
Applications
programmed by forcing the reference voltage externally to
• Desktop Computers
the desired voltage.
• Servers
The MIC5165 operates from an input voltage as low as
• Notebook computers
0.75V up to 6V, with a second bias supply input required
for operation. The MIC5165 is available in a tiny MSOP-10
• Workstations
package with an operating junction temperature range of
• DDR3 andGDDR3/4/5 Memory Termination
–40°C to +125°C.
Data sheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
____________________________________________________________________________________________________________
Typical Application
MIC5165 as a DDR3 Memory Termination Device for 3.5A Application
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
June 2010
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MIC5165
Ordering Information
Part Number
Temperature Range
Package
Lead Finish
MIC5165YMM
–40° to +125°C
10-Pin MSOP
Pb-Free
Note:
MSOP is a Green RoHS compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free.
Pin Configuration
10-Pin MSOP (MM)
Pin Description
Pin Number
Pin Name
1
VCC
2
EN
3
VDDQ
Input Supply Voltage.
4
VREF
Reference voltage equal to half of VDDQ. For internal use only.
5
GND
Ground.
6
FB
7
COMP
8
LD
Low-Side Drive (Output): Connects to the Gate of the external low-side MOSFET.
9
HD
High-Side Drive (Output): Connects to the Gate of the external high-side MOSFET.
10
PG
Power Good (Output): Open drain output.
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Pin Function
Bias Supply (Input): Apply 3V-6V to this input for internal bias to the controller.
Enable (Input): CMOS compatible input. Logic high = enable, logic low = shutdown.
The EN pin can be tied directly to VDDQ or VCC for functionality. Do not float the EN
pin. Floating this pin causes the enable to be in an undetermined state.
Feedback (Input): Input to the internal error amplifier.
Compensation (Output): Connect a capacitor and resistor from COMP pin to FB pin
for compensation of the internal control loop.
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Absolute Maximum Ratings(1)
Operating Ratings(2)
VCC to GND.................................................... −0.3V to +7V
VDDQ to GND ................................................. −0.3V to +7V
EN to GND ....................................................... −0.3V to VCC
FB to GND........................................................ −0.3V to VCC
VREF to GND................................................. −0.3V to VDDQ
COMP to GND.................................................. −0.3V to VCC
HD, LD to GND ................................................ −0.3V to VCC
PG to GND ....................................................... −0.3V to VCC
Lead Temperature (Soldering 10sec.) ....................... 260°C
Storage Temperature (TS).........................−65°C to +150°C
ESD Rating(3)
(HBM) ....................................................................+2kV
(MM) ....................................................................+300V
Supply Voltage (VCC).............................................. 3V to 6V
Supply Voltage (VDDQ) ....................................... 0.75V to 6V
Enable Input Voltage (VEN)..................................... 0V to VIN
Junction Temperature Range (TJ)...... −40°C < TJ < +125°C
Junction Thermal Resistance
MSOP-10 (θJA)..............................................130.5°C/W
MSOP-10 (θJC)................................................42.6°C/W
Electrical Characteristics(4)
TA = 25°C with VDDQ = 1.5V; VCC = EN = 5V, bold values indicate –40°C ≤ TJ ≤ +125°C, unless otherwise specified.
See test circuit 1 for test circuit configuration.
Parameter
Condition
Min
Typ
Max
Units
-1%
0.5VDDQ
+1%
V
Sourcing; 100mA to 3A
-5
-10
0.4
+5
+10
Sinking; -100mA to -3A
-5
-10
0.4
+5
+10
VREF Voltage Accuracy
VTT Voltage Accuracy (Note 5)
mV
Supply Current (IDDQ)
EN = 1.2V (controller ON)
No Load
25
140
200
µA
Supply Current (ICC)
No Load
15
22
27
mA
ICC Shutdown Current (Note 6)
EN = 0.2V (controller OFF); No PG pull-up
0.1
5
µA
Start-Up Time (Note 7)
VCC = 5V external bias; EN = VIN
8
15
30
µs
Enable Input
Enable Input Threshold
Regulator Enabled
Regulator Shutdown
0.3
Enable Hysteresis
EN Pin Input Current
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V
1.2
50
VIL < 0.2V (controller shutdown)
0.01
VIH > 1.2V (controller enable)
5.75
3
mV
µA
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MIC5165
Electrical Characteristics(4) (Continued)
TA = 25°C with VDDQ = 1.5V; VCC = EN = 5V, bold values indicate –40°C ≤ TJ ≤ +125°C, unless otherwise specified.
See test circuit 1 for test circuit configuration.
Power Good Output
Power Good Window
Threshold, ±% of VTT from Nominal
±5
Hysteresis
±10
±15
%
2
%
Power Good Output Low Voltage
IPG = 2mA (sinking)
100
300
mV
Power Good Leakage Current
PG = EN = 5V, FB = VREF; Switch Leakage Current
to Ground
0.01
1.0
μA
Power Good Startup Delay Time
(Note 8)
Power Good Deglitch (Note 9)
1
Time after FB voltage has gone outside of PG
window
2.4
5
ms
10
μs
Driver
High Side Gate Drive Voltage
Low Side Gate Drive Voltage
High-Side MOSFET Fully ON
4.8
High-Side MOSFET Fully OFF
Low-Side MOSFET Fully ON
4.97
0.03
4.8
Low-Side MOSFET Fully OFF
0.2
4.97
0.03
V
0.2
Notes:
1.
Exceeding the absolute maximum rating may damage the device.
2.
The device is not guaranteed to function outside its operating rating.
3.
Devices are ESD sensitive. Handling precautions recommended. Human body model 1.5kΩ in series with 100pF.
4.
Specification for packaged product only.
5.
The VTT voltage accuracy is measured as a delta voltage from the reference output (VTT - VREF).
6.
Shutdown current is measured only on the VCC pin. The VDDQ pin will always draw a minimum amount of current when voltage is applied.
7.
Start-up time is defined as the amount of time from EN = VCC to VHD = 90% of VCC.
8.
Power Good startup delay is defined as the amount of time from EN=VCC and VFB is within ±10% of ½VDDQ to VPG = 90% of VCC (VFB = VREF),
during startup (VFB is the sense of VTT).
9.
Power Good deglitch is defined as the amount of time from the voltage at FB node going out of PG window (with 10mV overdrive voltage) to
PG = LOW.
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Test Circuit
Figure 1. Test Circuit
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Typical Characteristics
IDDQ Current
vs. VDDQ Voltage
200
ICC Current
vs. Input Voltage
IDDQ Current
vs. Temperature
20
200
19
175
18
180
160
125
100
ROOM TEMP.
75
50
16
140
120
VDDQ = 2.5V
100
VDDQ = 1.35V
80
VDDQ = 0.75V
15
14
13
12
11
125°C
10
60
9
40
125°C
25
25°C
17
ICC Current (mA)
-40°C
IDDQ CURRENT (µA)
IDDQ CURRENT (µA)
150
VDDQ = 6V
-40°C
8
7
20
6
0
0
0
1
2
3
4
5
5
-40
6
-20
0
20
40
60
80
100
120
3
0.3
ICC CURRENT (mA)
ICC_Shutdown Current (µA)
14
VDDQ = 1.35V
VCC = 5V
12.5
12
11.5
VDDQ = 1.35V
VCC = 3V
11
0.25
0.2
0.15
0.1
-40°C
10.5
0.05
10
ROOM TEMP.
9.5
0
9
-40
-20
0
20
40
60
80
100
0
120
5
5.5
6
0.3
125°C
ICC SHUTDOWN CURRENT (µA)
14.5
4.5
ICC Shutdown Current
vs. Temperature
0.35
15
13
4
VCC VOLTAGE (V)
ICC Shutdown Current
vs. VCC Voltage
ICC Current
vs. Temperature
13.5
3.5
TEMPERATURE (ºC)
VDDQ VOLTAGE (V)
1
2
3
4
5
0.25
0.2
0.15
VDDQ = 0.75V
VDDQ = 6V
0
6
-40
-20
0
20
40
60
80
100 120
TEMPERATURE (ºC)
VTT - VREF
vs. LOAD (A)
HD Prop Delay
vs. Temperature
HD Prop Delay
vs. VDDQ Voltage
VDDQ = 2.5V
0.05
VCC VOLTAGE (V)
TEMPERATURE (ºC)
VDDQ = 1.35V
0.1
2.5
10
10
9.5
8.5
-40°C
8
7.5
25°C
7
6.5
125 °C
6
VDDQ = 1.35V
VTT-VREF (mV)
HD PROP DELAY (µs)
HD PROP DELAY (µs)
9
9
2.0
VDDQ = 0.75V
9.5
8.5
8
7.5
7
6.5
5
5
2
3
4
VDDQ VOLTAGE (V)
June 2010
VDDQ = 2.5V
0.5
0.0
VDDQ = 0.75V
VDDQ = 2.5V
5.5
1
VDDQ = 6V
1.0
6
5.5
0
VDDQ = 1.35V
1.5
5
6
-0.5
VDDQ = 6V
-40
-20
0
20
40
60
80
-3
100
120
-2
-1
0
1
2
3
LOAD (A)
TEMPERATURE (ºC)
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MIC5165
Typical Characteristics (Continued)
VTT - VREF
vs. TEMPERATURE (ºC)
2.5
3V
VTT - VREF (mV)
2.0
1.5
1.0
-0.1A
-3A
0.5
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (ºC)
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Functional Characteristics
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Functional Diagram
Figure 2. MIC5165 Block Diagram
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MIC5165
VCC
VCC supplies the internal circuitry of the MIC5165 and
provides the voltage to drive the external N-Channel
MOSFETs. A small 1μF ceramic capacitor is
recommended for bypassing the VCC pin.
Functional Description
The MIC5165 is a high-performance linear controller,
utilizing scalable N-Channel MOSFETs to provide
JEDEC-compliant bus termination. Termination is
achieved by dividing down the VDDQ voltage half,
providing the reference (VREF) voltage. The MIC5165
controls two external N-Channel MOSFETs to form two
separate regulators. It operates by switching between
either the high-side MOSFET or the low-side MOSFET,
depending on whether the current is being sourced to
the load or being sunk by the regulator.
FB and COMP
The feedback (FB) pin provides the path for the error
amplifier to regulate VTT. A feedback resistor is
recommended and resistor values should not exceed
10kΩ. The compensation capacitors should not be less
than 40pF.
VDDQ
The VDDQ pin on the MIC5165 provides the source
current through the high-side N-Channel and the
reference voltage to the device. The MIC5165 can
operate at VDDQ input voltages as low as 0.75V. A
bypass capacitance will increase performance by
improving the source impedance at higher frequencies.
EN
The MIC5165 features an active-high enable (EN) input.
In the off-mode state, leakage currents are reduced to
microamperes. EN has thresholds compatible with
TTL/CMOS for simple logic interfacing.
PG
MIC5165 features a Power Good (PG) output. PG is an
open drain output with an active high signal. PG requires
a pull-up resistor to VCC.
VREF
Two resistors divide down the VDDQ voltage to provide
VREF. The resistors are valued at around 21kΩ. A
minimum capacitor value of 120pF from VREF to ground
is mandatory.
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MIC5165
The MIC5165 provides two drive signals, the high-side
MOSFET acts as a pass element to provide output
voltage and low side MOSFET acts as pull-down to
regulate the output termination voltage (VTT). An internal
error amplifier compares the termination voltage (VTT)
and VREF, controlling two external N-Channel MOSFETs
to sink or source current to maintain a termination
voltage (VTT) equal to VREF. These MOSFETs receive
their enhancement voltage from a separate VCC pin on
the device. Although the general discussion is focused
on DDR3, the MIC5165 is also capable of providing bus
terminations for DDR, DDR2 and GDDR3/4/5.
Application Information
Synchronous Dynamic Random Access Memory
(SDRAM) has continually evolved over the years to keep
up with ever-increasing computing needs. The latest
addition to SDRAM technology is DDR3 SDRAM. DDR3
SDRAM is the third generation of the DDR SDRAM
family and offers improved power savings, higher data
bandwidth and enhanced signal quality with multiple OnDie Termination (ODT) selection. In DDR3 SDRAM the
values of the ODT are based on the value of an external
resistor. In addition to using this external resistor for
setting the ODT value, it is also used for calibrating the
ODT value so that it maintains its resistance value to
within a 10% tolerance.
To improve signal integrity and support higher frequency
operation of memory read/write, the JEDEC committee
defined a fly-by termination scheme used with the
clocks, the command bus and address bus signals. The
fly-by topology reduces Simultaneous Switching Noise
(SSN) by deliberately causing flight-time skew between
the data and strobes at every DRAM as the clock,
address and command signals traverse the DIMM.
The DDR3 SDRAM uses a programmable impedance
output buffer. Currently, there are two drive strength
settings, 34Ω and 40Ω. The 40Ω drive strength setting is
currently a reserved specification defined by JEDEC, but
available on the DDR3 SDRAM.
VDDQ
The MIC5165 can operate at VDDQ voltages as low as
0.75V. Due to the possibility of large transient currents
being sourced from this line, significant bypass
capacitance will increase performance by improving the
source impedance at higher frequencies. Since the
reference is simply VDDQ/2, perturbations on VDDQ will
also appear at half the amplitude on the reference. For
this reason, low-ESR capacitors such as ceramics or
OS-CON are recommended on VDDQ.
VTT
The proper combination and placement of the OS-CON
and ceramic capacitors is important to reduce both ESR
and ESL such that high-current high-speed transients do
not exceed the dynamic voltage tolerance requirement of
VTT. The OS-CON capacitors provide bulk charge
storage while the smaller ceramic capacitors provide
current during the fast edges of the bus transition. Using
several smaller ceramic capacitors distributed near the
termination resistors is typically important to reduce the
effects of PCB trace inductance.
VREF
A minimum capacitor value of 120pF from VREF to
ground is required to remove high-frequency signals
reflected from the source (Refer to Figure 4). Large
capacitance values (>1500pF) should be avoided.
Values greater than 1500pF slow down VREF and detract
from the reference voltage’s ability to track VDDQ during
high speed load transients.
Figure 3. Dynamic OCT between Stratix III/IV
FPGA Devices
Figure 4. MIC5165 as a DDR3 Memory Termination Device
for 7A Application
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MIC5165
low if output moves beyond this range.
VDDQ
Input Capacitance
The MIC5165 application operates in the linear region
during the steady state condition, so there are no
switching current pulses from the input capacitor. The
application does not require a bulk input capacitor, but
using one greatly improves device performance during
fast load transients. Since output voltage VTT follows the
input voltage VDDQ attention should be given to possible
voltage dips on VDDQ pin. Capacitors with low ESR
such as OS-CON and ceramics are recommended for
bypassing the input. Although a 100μF ceramic
capacitor will suffice for most applications, input
capacitance may need to be increased in cases where
the termination circuit is greater than 1-inch away from
the bulk capacitance.
VREF
120pF
GND
Figure 5. VDDQ Divided Down to Provide VREF
VREF can also be manipulated for different applications.
A separate voltage source can be used to externally set
the reference point, bypassing the divider network. Also,
external resistors can be added from VREF-to-VDDQ or
VREF-to-ground to shift the reference point up or down.
Output Capacitance
Large, low ESR capacitors are recommended for the
output (VTT) of the MIC5165. Although low ESR
capacitors are not required for stability, they are
recommended to reduce the effects of high-speed
current transients on VTT. The change in voltage during
the transient condition will be the effect of the peak
current multiplied by the output capacitor’s ESR. For that
reason, OS-CON type capacitors and ceramic are
excellent choices for this application. OS-CON
capacitors have extremely low ESR and a large
capacitance-to-size ratio. Ceramic capacitors are also
well suited to termination due to their low ESR. These
capacitors should have a dielectric rating of X5R or X7R.
Y5V and Z5U type capacitors are not recommended,
due to their poor performance at high frequencies and
over temperature. The minimum recommended
capacitance for a 3.5A peak circuit is 100μF. Output
capacitance can be increased to achieve greater
transient performance.
VCC
The VCC voltage range is from 3V to 6V, but the
minimum voltage on the VCC pin should consider the
Gate-to-Source voltage of the MOSFET and VTT voltage.
For example, on a DDR3 compliant terminator, VDDQ
equals 1.5V and VTT equals 0.75V. If the N-Channel
MOSFET selected requires a gate-source voltage of
2.5V, VCC should be a minimum of 3.25V.
VCCmin=VTT+VGS
Feedback and Compensation
The feedback provides the path for the error amplifier to
regulate VTT. An external resistor must be placed
between the feedback and VTT. This allows the error
amplifier to be correctly externally compensated. For
most applications, a 510Ω resistor is recommended.
The COMP pin on the MIC5165 is the output of the
internal error amplifier. By placing a capacitor and
resistor between the COMP pin and the FB pin, this
coupled with the feedback resistor, places an external
pole and zero on the error amplifier. With a 510Ω
feedback resistor, a minimum 220pF capacitor is
recommended for a 3.5A peak termination circuit. An
increase in the load will require additional N-Channel
MOSFETs and/or increase in output capacitance may
require feedback and/or compensation capacitor values
to be changed to maintain stability.
MOSFET Selection
The MIC5165 utilizes external N-Channel MOSFETs to
sink and source current. MOSFET selection will be
determined by two main characteristics: size and gate
threshold (VGS).
MOSFET Power Requirements
One of the most important factors to determine is the
amount of power the MOSFET is going to be required to
dissipate. Power dissipation in a DDR3 circuit will be
identical for both the high side and low side MOSFETs.
Since the supply voltage is divided by half to supply VTT,
both MOSFETs have the same voltage dropped across
them. They are also required to be able to sink and
source the same amount of current (for either all 0s or all
1s). This equates to each side being able to dissipate
the same amount of power. Power dissipation
Enable
EN can be tied directly to VDDQ or VCC for functionality.
Do not float the EN pin. Floating this pin causes the
enable circuitry to be in an indeterminate state.
Power Good
Power Good signal output remains high as long as
output is within ±10% range of regulated VTT and goes
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calculation for the high-side MOSFET is as follows:
The required junction-to-ambient thermal resistance can
be calculated as follows:
PD = (VDDQ − VTT) × I_SOURCE
θ JA =
Where I_source is the average source current.
Power dissipation for the low-side MOSFET is as
follows:
TJ − T A
PD
Where TJ is the maximum junction temperature, TA is the
maximum ambient temperature and PD is the power
dissipation.
In our example:
PD = VTT × I_SINK
where I_sink is the average sink current.
In a typical 3.5A peak DDR3 circuit, power
considerations for MOSFET selection would occur as
follows:
PD = (VDDQ −VTT) × I_SOURCE
θ JA =
TJ − T A
PD
θ JA =
125°C - 60°C
1.3125W
θ JA = 49.52
PD = (1.5V −0.75V) × 1.75A
°C
W
PD = 1.3125 W
This shows that our total thermal resistance must be
better than 49.52°C/W. Since the total thermal
resistance is a combination of all the individual thermal
resistances, the amount of heat sink required can be
calculated as follows:
This typical DDR3 application would require the highside and low-side N-Channel MOSFETs to be able to
handle 1.3125 Watts each. In higher current
applications, multiple N-Channel MOSFETs may be
placed in parallel to spread the power dissipation. These
MOSFETs will share current, distributing power
dissipation across each device.
The maximum MOSFET die (junction) temperature limits
maximum power dissipation. The ability of the device to
dissipate heat away from the junction is specified by the
junction-to-ambient (θJA) thermal resistance. This is the
sum of junction-to-case (θJC) thermal resistance, caseto-sink (θCS) thermal resistance and sink-to-ambient
(θSA) thermal resistance:
θSA = θJA − (θJC + θCS)
In our example:
θSA = θJA − (θJC + θCS)
θ SA = 49.52
θ SA = 47.52
θJA = θJC + θCS + θSA
In our example of a 3.5A peak DDR3 termination circuit,
we have selected a D-pack N-Channel MOSFET that
has a maximum junction temperature of 125°C. The
device has a junction-to-case thermal resistance of
1.5°C/W. Our application has a maximum ambient
temperature of 60°C.
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°C
°C
°C
- (1.5
+ 0 .5
)
W
W
W
°C
W
In most cases, case-to-sink thermal resistance can be
assumed to be about 0.5°C/W.
The DDR3 termination circuit for our example, using two
D-pack N-Channel MOSFETs (one high-side and one
low-side) will require enough copper area to spread the
heat away from the MOSFET. In this example to
dissipate 1.3W from TO-252 package a 2 oz copper of
0.4 in2 on component side is required. In some cases,
airflow may also help to reduce thermal resistance. For
different MOSFET package refer to manufacturer Data
Sheet for copper area requirements.
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MOSFET Gate Threshold
N-Channel MOSFETs require an enhancement voltage
greater than its source voltage. Typical N-Channel
MOSFETs have a gate-source threshold (VGS) of 1.8V or
higher. Since the source of the high side N-Channel
MOSFET is connected to VTT, the MIC5165 VCC pin
requires a voltage equal to or greater than the VGS + VTT
voltage. For example, our DDR3 termination circuit has a
VTT voltage of 0.75V. For an N-Channel MOSFET that
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has a VGS rating of 2.5V, the VCC voltage can be as min
as 3.25V. For an N-Channel MOSFET that has a 4.5V
VGS, the minimum VCC required is 5.25V. It is
recommended that the VCC voltage has enough margin
to be able to fully enhance the MOSFETs for large signal
transient response. In addition, low gate thresholds
MOSFETs are recommended to reduce the VCC
requirements.
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Ripple Measurements
To properly measure ripple on either input or output of a
switching regulator, a proper ring in tip measurement is
required. Standard oscilloscope probes come with a
grounding clip, or a long wire with an alligator clip.
Unfortunately, for high frequency measurements, this
ground clip can pick up high-frequency noise and
erroneously inject it into the measured output ripple.
By maintaining the shortest possible ground lengths on
the oscilloscope probe, true ripple measurements can be
obtained. This requires the removing of the oscilloscope
probe sheath and ground clip from a standard
oscilloscope probe and wrapping a non-shielded bus
wire around the oscilloscope probe. If there does not
happen to be any non-shielded bus wire immediately
available, the leads from axial resistors will work.
Figure 6. Low-Noise Measurement
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PCB Layout Guideline
Warning!!! To minimize EMI and output noise, follow
these layout recommendations.
PCB Layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power,
signal and return paths.
The following guidelines should be followed to insure
proper operation of the MIC5165 controller application.
IC and MOSFET
•
Place the IC close to the point of load (POL).
•
The trace connecting controller drive pins to
MOSFETs gates should be short and wide to avoid
oscillations. These oscillations are the result of tank
circuit formed by trace inductance and gate
capacitance.
•
Use fat traces to route the input and output power
lines.
•
Signal and power grounds should be kept separate
and connected at only one location.
Place the input capacitor next.
•
Place the input capacitors on the same side of the
board and as close to the MOSFET and IC as
possible.
•
Place a ceramic bypass capacitor next to MOSFET.
•
Keep both the VIN and PGND connections short.
•
Place several vias to the ground plane close to the
input capacitor ground terminal, but not between the
input capacitors and MOSFET.
June 2010
Use either X7R or X5R dielectric input capacitors.
Do not use Y5V or Z5U type capacitors.
•
Do not replace the ceramic input capacitor with any
other type of capacitor. Any type of capacitor can be
placed in parallel with the input capacitor.
•
If a Tantalum input capacitor is placed in parallel
with the input capacitor, it must be recommended for
switching regulator applications and the operating
voltage must be derated by 50%.
•
In “Hot-Plug” applications, a Tantalum or Electrolytic
bypass capacitor must be used to limit the overvoltage spike seen on the input supply with power is
suddenly applied.
Output Capacitor
Input Capacitor
•
•
16
•
Use a wide trace to connect the output capacitor
ground terminal to the input capacitor ground
terminal.
•
Phase margin will change as the output capacitor
value and ESR changes. Contact the factory if the
output capacitor is different from what is shown in
the BOM.
•
The feedback trace should be separate from the
power trace and connected as close as possible to
the output capacitor. Sensing a long high current
load trace can degrade the DC load regulation.
M9999-061510-B
Micrel, Inc.
MIC5165
Design Example
MIC5165 as a DDR3 Memory Termination Device for 3.5A Application (VDDQ and MOSFET Input Separated)
June 2010
17
M9999-061510-B
Micrel, Inc.
MIC5165
Bill of Materials
Item
C1, C2,
C3, C4
Part Number
GRM21BR60J226ME39L
C6
Qty.
Murata
TDK(2)
08056D226MAT2A
AVX(3)
22µF, 6.3V, Ceramic capacitor, X5R, 0805
4
10µF, 6.3V, Ceramic capacitor, X5R, 0603
1
Murata(1)
C1608X5R0J106M
TDK(2)
06036D106MAT2A
(3)
GRM1885C1H390JA01D
Description
(1)
C2012X5R0J226M
GRM188R60J106ME47D
C5
Manufacturer
AVX
Murata(1)
39pF, 50V, Ceramic capacitor, NPO, 0603
(2)
1
C1608C0G1H390J
TDK
C7
06035C101MAT2A
AVX(3)
100pF, 50V, Ceramic capacitor, X7R, 0603
1
C8
GRM188R71H391KA01D
Murata(1)
390pF, 50V, Ceramic capacitor, X7R, 0603
1
GRM31CR60J476ME19L
Murata(1)
47µF, 6.3V, Ceramic capacitor, X5R, 1206
2
1nF, 50V, Ceramic capacitor, X7R, 0603
1
10nF, 50V, Ceramic capacitor, X7R, 0603
1
1µF, 10V, Ceramic capacitor, X5R, 0603
1
120pF, 25V, Ceramic capacitor, NPO, 0603
2
C9, C10
C13
C14
C22, C28
C23, C12
C27
C26
C3216X5R0J476M
TDK(2)
12066D476MAT2A
(3)
AVX
GRM188R71H102KA01D
Murata(1)
GRM188R71H103KA01D
(1)
0603ZD105KAT2A
Murata
(3)
AVX
GRM188R61A105K
Murata(1)
VJ0603A121JXACW1BC
Vishay(4)
06033A121JAT2A
39pF, 25V, Ceramic capacitor, NPO, 0603
AVX(3)
Vishay(4)
220pF, 50V, Ceramic capacitor, X7R, 0603
06033C221JAT2A
AVX(3)
220pF, 25V, Ceramic capacitor, X7R, 0603
TCJB107M006R0070
AVX(3)
100µF, 6.3V, Tantalum capacitor, 1210
1
N.U. 0603 ceramic cap
3
100µF, 6.3V, Ceramic capacitor, X5R, 1812
1
2700µF, 2.5V OS-CON Cap
1
1200µF, 10V, Electrolytic capacitor, SMD, 10x10.2-case
1
VJ0603Y221KXACW1BC
C24, C11
C30,
C32, C21
C4532X5R0J107M
C31
Open (2SEPC2700M)
CIN
EEE-FPA122UAP
L1
CDEP105ME-1R2MC
TDK
(2)
Sanyo(5)
Panasonic(6)
Sumida
(7)
1
1.2µH, 21A, Inductor, 10.4mmX10.4mm
1
(4)
Signal MOSFET, SOT-23-6
2
(4)
Low VGS(th) N-Channel 20-V (D-S)
1
Q1
2N7002E(SOT-23)
Vishay
Q21,
Q22
SUD50N02-06P
Vishay
R1
CRCW06031101FRT1
Vishay Dale(4)
510Ω, Resistor, 1%, 0603
1
R2
CRCW0603698RFRT1
(4)
Vishay Dale
698Ω, Resistor, 1%, 0603
1
R3
CRCW06032002FRT1
Vishay Dale(4)
20K, Resistor, 1%, 0603
1
CRCW06034752FRT1
(4)
47.5K, Resistor, 1%, 0603
1
R4
June 2010
Vishay Dale
18
M9999-061510-B
Micrel, Inc.
MIC5165
Bill of Materials (Continued)
Item
R5
Part Number
CRCW06031003FRT1
Manufacturer
Description
Qty.
(4)
100K, Resistor, 1%, 0603
1
(4)
Vishay Dale
R21
CRCW0805510RFKTA
Vishay Dale
510Ω, Resistor, 1%, 0805
1
R23, R24
CRCW06031K00FKTA
Vishay Dale(4)
1K, Resistor, 1%, 0603
1
CRCW06030000FKTA
(4)
0Ω, Resistor, 1%, 0603
1
(4)
10K, Resistor, 1%, 0603
1
R22
R25
CRCW06031002FRT1
Vishay Dale
Vishay Dale
(8)
U1
MIC22950YML
Micrel
U21
MIC5165YMM
Micrel(8)
10A, 0.4MHz-2MHz, Synchronous Buck Regulator
1
Dual Regulator Controller for DDR3
1
Notes:
1. Murata: www.murata.com.
2. TDK: www.tdk.com.
3. AVX: www.avx.com.
4. Vishay: www.vishay.com.
5. Sanyo: www.sanyo.com.
6. Panasonic.: www.panasonic.com.
7. Sumida: www.sumida.com.
8. Micrel, Inc.: www.micrel.com.
June 2010
19
M9999-061510-B
Micrel, Inc.
MIC5165
PCB Layout Recommendations
Top Layer
Top Component Layer
June 2010
20
M9999-061510-B
Micrel, Inc.
MIC5165
PCB Layout Recommendations (Continued)
Mid-1 Layer
Mid-2 Layer
June 2010
21
M9999-061510-B
Micrel, Inc.
MIC5165
PCB Layout Recommendations (Continued)
Bottom Layer
Bottom Silk
June 2010
22
M9999-061510-B
Micrel, Inc.
MIC5165
Package Information
10-Pin MSOP (MM)
June 2010
23
M9999-061510-B
Micrel, Inc.
MIC5165
Recommended Land Pattern
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2010 Micrel, Incorporated.
June 2010
24
M9999-061510-B