Ordering number : ENA2017 Monolithic Linear IC LV5694P For Car Audio Systems Multi-Power Supply System IC Overview LV5694P is a power supply IC suitable for USB/CD receiver system for car audio system.This IC enables drastic reduction of power dissipation compared to the existing model.This IC integrates 5 systems of regulator output, 2 systems of high side power switch, overcurrent protector, overvoltage protector and overheat protector (the package is HZIP15J). Features • Low consumption current: 50µA (typ, only VDD output is in operation) • 5 systems of regulator output VDD for microcontroller: output voltage: 5.0V/3.3V (always ON), maximum output current: 300mA For SWD5V: output voltage: 5V, maximum output current: 500mA For CD: output voltage: 7.6V/8.1V, maximum output current: 2000mA For illumination: output voltage: 9.0V, maximum output current: 500mA For audio: output voltage: 8.45V, maximum output current: 800mA • 2 lines of high side switch with interlock VCC AMP: Maximum output current: 500mA, voltage difference between input and output: 0.5V ANT: Maximum output current: 350mA, voltage difference between input and output: 0.5V • Overcurrent protector • Overvoltage protector: Typ 36V (All outputs are turned off) • Overheat protector: Typ 175°C • PchLDMOS is used in power output block (Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under over current protection range or thermal shutdown state may degrade the IC’s reliability and eventually damage the IC. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. 30712 SY 20120203-S00001No.A2017-1/13 LV5694P Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Conditions Power supply voltage VCC max Power dissipation Pd max Conditions Ratings Unit Ta ≤ 25°C IC unit At using Al heat sink At infinity heat sink Peak voltage VCC peak 36 V 1.5 W 5.6 W 32.5 W 50 V Regarding Bias wave, refer to below the pulse. Junction temperature Tj max 150 °C Operating temperature Topr -40 to +85 °C Storage temperature Tstg -55 to +150 °C Recommended Operating range at Ta = 25°C Parameter Conditions Power supply voltage rating 1 VDD output ON, SWD output ON Power supply voltage rating 2 ILM output ON Power supply voltage rating 3 Power supply voltage rating 4 Ratings Unit 7 to 16 V 10.8 to 16 V Audio output ON, CD output ON 10 to 16 V ANT output ON, AMP output ON 7.5 to 16 V * VCC1 should be as follows: VCC1>VCC-0.7V Electrical Characteristics at Ta = 25°C, VCC = VCC1=14.4V (*2) Parameter Symbol VCC1 input voltage VCC1 Current drain ICC Conditions Ratings min typ Unit max VCC-0.7V 16 V 50 100 μA - - 0.3 V VDD no load, CTRL1/2/3 = ⎡L/L/L⎦ CTRL1/2/3 Input Low input voltage VIL1 Middle1 input voltage VIM1 0.9 1.18 1.45 V Middle2 input voltage VIM2 1.85 2.10 2.4 V High input voltage VIH1 2.95 3.29 5.5 V Input impedance RIH1 280 400 520 kΩ Low input voltage VIL2 - - 0.7 V High input voltage VIH2 - - V V IKCD/IKVDD Input IKCD IKVDD VCC-0.7V VCC1-0.7V VDD output (5V/3.3V) Output voltage VO11 IO1 = 200mA, IKVDD=VCC1 4.75 5.0 5.25 VO12 IO1 = 200mA, IKVDD=GND 3.16 3.3 3.45 Output current IO1 VO11 ≥ 4.70V, VO12 ≥ 3.10V 300 Line regulation ΔVOLN1 7.5V < VCC1 < 16V, IO1 = 200mA Load regulation ΔVOLD1 Dropout voltage 1 VDROP1 Dropout voltage 2 VDROP1’ IO1 = 100mA (VDD output 5V) Ripple rejection RREJ1 f = 120Hz, IO1 = 200mA 30 40 Short circuit current IS1 VO11, VO12 = 0 50 V mA 30 100 mV 1mA < IO1 < 200mA 70 150 mV IO1 = 200mA (VDD output 5V) 0.8 1.6 V 0.4 0.8 V 150 340 mA 8.45 8.7 dB AUDIO (8.45V) Output ; CTRL2 = ⎡M1 or H⎦ AUDIO output voltage 1 VO3 IO3 = 650mA 8.16 AUDIO output current IO3 VO3 ≥ 8.0V 800 Line regulation ΔVOLN3 10V < VCC < 16V, IO3 = 650mA Load regulation ΔVOLD3 Dropout voltage 1 VDROP3 Dropout voltage 2 VDROP3’ IO3 = 200mA Ripple rejection RREJ3 f = 120Hz, IO3 = 650mA Short circuit current IS3 VO3 = 0 V mA 30 90 mV 1mA < IO3 < 650mA 100 200 mV IO3 = 650mA 0.7 1.2 V 0.2 0.35 40 50 120 250 V dB 550 mA Continued on next page. No.A2017-2/13 LV5694P Continued from preceding page. Parameter Symbol Conditions Ratings min typ Unit max ILM (9V) Output ; CTRL1 = ⎡M1 or H⎦ ILM output voltage VO4 IO4 = 350mA 8.7 ILM output current IO4 VO4 ≥ 8.6V 500 9.0 9.3 V Line regulation ΔVOLN4 10.8V < VCC < 16V, IO4 = 350mA 40 100 mV Load regulation ΔVOLD4 1mA < IO4 < 350mA 70 150 mV Dropout voltage 1 VDROP4 IO4 = 350mA 1.0 1.5 V 0.3 0.6 mA Dropout voltage 2 VDROP4’ IO4 = 200mA Ripple rejection RREJ4 f = 120Hz, IO4 = 350mA Short circuit current IS4 VO4 = 0 Output voltage VO5 IO5 = 500mA Output current IO5 VO5 ≤ VCC-1.0 500 Short circuit current IS5 VO5 = 0 120 Output voltage VO6 IO6 = 500mA Output current IO6 VO6 ≤ VCC-1.0 350 Short circuit current IS6 VO6 = 0 100 200 450 mA VO7 IO7 = 350mA 4.75 5.0 5.25 V SWD output current IO7 VO7 ≥ 4.7V 500 Line regulation ΔVOLN7 10V < VCC < 16V, IO7 = 350mA 30 70 mV Load regulation ΔVOLD7 1mA < IO7 < 350mA 70 150 mV Dropout voltage VDROP7 IO7 = 350mA 0.8 1.6 Ripple rejection RREJ7 f = 120Hz, IO7 = 350mA Short circuit current IS7 VO7 = 0 40 50 100 200 400 VCC-0.5 VCC-1.0 V dB mA AMP_HS-SW; CTRL3 = ⎡M2 or H⎦ V mA 250 500 VCC-0.5 VCC-1.0 mA ANT_HS-SW; CTRL3 = ⎡M1 or H⎦ V mA SWD5V; CTRL2 = ⎡M2 or H⎦ SWD output voltage mA 40 50 100 200 V dB 450 mA CD(7.6/8.1V output); CTRL1 = ⎡M2 or H⎦ CD output voltage VO81 IO8 = 1300mA, IKCD=GND 7.2 7.6 8.0 V VO82 IO8 = 1300mA, IKCD=VCC 7.7 8.1 8.5 V CD output current IO8 VO81 ≥ 7.1V, VO82 ≥ 7.5V 2000 Line regulation ΔVOLN8 10.5V < VCC < 16V, IO8 = 1300mA 40 100 mV Load regulation ΔVOLD8 10mA < IO8 < 1300mA 70 200 mV Dropout voltage 1 VDROP8 IO8 = 1300mA 1.3 1.5 V 0.35 0.7 Dropout voltage 2 VDROP8’ IO8 = 350mA Ripple rejection RREJ8 f = 120Hz, IO8 = 1300mA 40 mA 50 V dB Short circuit current IS8 VO81 = 0, VO82 = 0 300 550 1000 mA *2: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta (=25°C) are almost equal. There tests were performed with pulse load to minimize the increase of junction temperature (Tj). No.A2017-3/13 LV5694P Package Dimensions unit : mm (typ) 3395 • Allowable power dissipation derating curve Pd max -- Ta (20.0) HEAT SPREADER HEAT SINK (15.8) 3.0 (11.0) 3.35 12.4 (9.05) (14.55) 17.9 (9.6) (R1.75) 1 0.4 15 (1.91) 1.27 2.54 2.54 0.7 Allowable power dissipation, Pd max -- W 8 21.6 Aluminum heat sink mounting conditions tightening torque : 39N⋅cm, using silicone grease 7 Aluminum heat sink (50 × 50 × 1.5mm3) when using 6 5.6 5 4 3 2 Independent IC 1.5 1 0 0 20 40 60 80 100 120 140 150 160 Ambient temperature, Ta -- °C SANYO : HZIP15J • Waveform applied during surge test 50V 90% 10% 16V 5msec 100msec No.A2017-4/13 LV5694P CTRL Pin Output Truth Table (each output is controllable by 4-value input) CTRL1 CTRL2 CTRL3 AMP ANT L L L OFF OFF L H M1 OFF ON H L M2 ON OFF H H H ON ON CTRL2 SWD5V AUDIO CTRL1 Microcontroller INAMP CD ILM L OFF OFF L OFF OFF M1 OFF ON M1 OFF ON M2 ON OFF M2 ON OFF H ON ON H ON ON INANT CTRL3 (Warning) Usage of CTRL pin When CTRL pin transits between L and M2, since it passes M1, ILM/AUDIO/ANT is turned on for a moment. Likewise, when CTRL pin transits between H and M1, since it passes M2, ILM/AUDIO/ANT is turned off for a moment. To avoid operation failure by the above factors, please refer to (1) and (2) as shown below for precaution. • Do not connect parasitic capacitor to CTRL as much as possible. • If use of capacitor for CTRL is required, keep the resistance value as low as possible. (Recommendation level: 2.2kΩ / 3.9kΩ) • Make sure that the output load capacitor has enough marjin against the voltage fluctuation due to instantaneous ON/OFF. (1) The time until a reaction occurs in output after shifting from CTRL ON to OFF (typ) OFF → ON time 27°C CTRL1 → ILM 0.95μs CTRL2 → AUDIO 1.33μs CTRL3 → ANT 2.86μs Due to quality fluctuation of the ICs in manufacturing process, the above-mentioned time can be shortened by 10 to 20%. (2) The time until output starts to react after shifting from CTRL ON→OFF control (typ): All output: 200ns to 300ns No.A2017-5/13 LV5694P z Block Diagram VCC AMP out AMP-SW(VCC -0.5V) 500mA Start up Over Voltage Protection Vref ANT out ANT-SW(VCC -0.5V) 350mA + ILM output (9V) 500mA + CTRL1 CTRL2 800mA OUTPUT Control + CTRL3 SWD output (5V) 500mA Thermal + CD output (7.6/8.1V) 2000mA Shut Down GND AUDIO output (8.45V) VCC1(VDD supply input) VCC + VDD output (5.7V) 300mA IKVDD:VDD(3.3/5.0V)change pin IKVDD=VCC1:5.0V IKVDD=GND:3.3V IKVDD:CD(7.6/8.1V)change pin IKCD=VCC:8.1V IKCD=GND:7.6V No.A2017-6/13 LV5694P Pin Function Pin No. 1 Pin name ILM Description ILM output pin ON when CTRL1 = M1, H Equivalent Circuit VCC 15 9V/0.5A 1 2 GND 3 CD 2 GND 15 VCC GND pin CD output pin ON when CTRL1 = M2, H 8.1V/2A (IKCD=VCC) 7.6V/2A (IKCD=GND) 3 2 4 CTRL1 CTRL1/2/3 input pin 6 CTRL2 Four value input 8 CTRL3 GND 15 VCC 4 6 8 2 5 AUDIO AUDIO output pin ON when CTRL2 = M1, H 15 GND VCC 8.45V/0.8A 5 7 SWD SWD output pin ON when CTRL2 = M2, H 2 GND 15 VCC 5V/0.5A 7 2 GND Continued on next page. No.A2017-7/13 LV5694P Continued from preceding page. Pin No. 9 Pin name ANT Description Equivalent Circuit ANT output pin VCC 15 ON when CTRL3 = M1, H VCC-0.5V/350mA 11 9 2 10 IKCD CD voltage reshuffling control input pin GND VCC 15 10 2 11 AMP AMP output pin ON when CTRL2 = M2, H GND VCC 15 VCC-0.5V/500mA 11 2 12 IKVDD VDD voltage reshuffling control input pin VCC1/GND GND 15 5V VCC 12 2 13 VDD VDD output pin 5.0V/0.3A (IKVDD = VCC1) GND VCC 15 3.3V/0.3A (IKVDD = GND) 13 2 14 VCC1 VDD power supply pin 15 VCC Power supply pin GND VCC 15 2 14 VCC1 GND No.A2017-8/13 LV5694P Timing Chart 36V VCC (15PIN) 36V VCC1 (14PIN) 5.8V VDD output (13PIN) H CTRL1 input (4PIN) M2 L M1 H CTRL2 input (6PIN) M2 M1 L H CTRL3 input (8PIN) M2 L M1 ILM output (1PIN) CD output (3PIN) AUDIO output (5PIN) SWD output (7PIN) ANT output (9PIN) AMP output (11PIN) *Usage condition: Use under typical value. No.A2017-9/13 LV5694P C4 + C3 C2 + C1 ILM CD CTRL2 C6 + C5 C8 + C7 AUDIO CTRL3 D2 VCC1 14 13 C10 + R1 C11 C12 + D4 15 D6 C16 + R2 VDD D5 D3 DSP ANT VCC 12 11 VDD 10 9 C9 + CTRL1 IKVDD IKCD CTRL3 8 7 AMP 6 5 ANT 4 3 DSP CTRL2 AUDIO 2 1 CD ILM GND CTRL1 Applied circuit example AMP C14 + C15 C13 D1 VCC Peripheral parts list Name of part Description Recommended value C2, C4, C6, C8, C12 Output stabilization capacitor 10μF or more* C1, C3, C5, C7, C11 Output stabilization capacitor 0.22μF or more* Remarks Electrolytic capacitor Ceramic capacitor C14, C16 Power supply bypass capacitor 100μF or more These capacitors must be placed near C13, C15 Oscillation prevention capacitor 0.22μF or more the VCC and GND pins. C9, C10 AMP/ANT output stabilization capacitor 2.2μF or more R1, R2 Resistance for protection D1 10 to 100kΩ Diode for prevention of backflow Meeting the specifications of the rush electric current in a true use state D2, D3, D4, D5 Diode for internal element protection SANYO SB1003M3 D6 Diode for internal element protection SANYO SB1003M3 When a minus number surge is applied * : Make sure that the capacitors of the output pins are 10μF or higher and meets the condition of ESR is 0.001 to 10Ω (ceramic capacitor alone can be used.), in which voltage/ temperature fluctuation and unit differences are taken into consideration. Moreover, RF characteristics of electrolytic capacitor should be sufficient. No.A2017-10/13 LV5694P Caution for implementing LV5694P to a system board The package of LV5694P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown in the diagram below. The electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the VCC pin and (3) (=pin 1) is the ILM (regulator) output pin. When you implement the IC to the set board, make sure that the bolts and the heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts which has the same electrical potential with GND, GND short occurs in ILM output and VCC. The exposures of (1) are connected to heatsink which has the same electrical potential with substrate of the IC chip (GND). Therefore, (1) and GND electrical potential of the set board can connect each other. • HZIP15J outline Heat-sink 1 Same potential 2 15PIN Same potential 1PIN 3 Same potential Heat-sink side Heat-sink 1 Same potential 1 Heat-sink Same potential :Metal exposure Heat-sink side :Metal exposure <Side view of HZIP15J> <Top view of HZIP15J> • Frame diagram (LV5694P) *In the system power supply other than LV5694P, pin assignment may differ. Metal exposure 1 Metal exposure 3 Metal exposure 2 Metal exposure 1 LV5694 Metal exposure 1 Metal exposure 1 1PIN 15PIN PS No.A2017-11/13 LV5694P HZIP15J Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. PS No.A2017-12/13 LV5694P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of March, 2012. Specifications and information herein are subject to change without notice. PS No.A2017-13/13