TEMIC U2762B

U2762B
900-MHz ISM Band Receiver
Description
The receiver IC U2762B-B is specifically designed for
cordless telephone applications in the 900-MHz ISM
band. It is manufactured using TEMIC’s advanced UHF
process. The IC consists of a 900-MHz RF amplifier and
mixer, 10.7-MHz IF amplifier, limiter, RSSI, quadrature
demodulator and comparator for the bit-slicer function.
The device features 2.9-V operation. In conjunction with
TEMIC’s transmitter IC U2763B-B and the PLL
U2781B, a complete ISM RF IC kit is available which fits
perfectly with AMD’s PhoX controllers AM79C432A
and AM79C433.
Features
Benefits
D Single-conversion receiver with 10.7-MHz IF
D Comparator for bit slicer integrated
D Temperature-compensated RSSI with 65 dB
D Low filter costs due to 10.7-MHz single conversion
D Very low count of external components saves PCB
dynamic range
Supply-voltage range 2.7 V to 3.3 V
Only 17 mA typical current consumption
Few external components
SSO28 package
D Low current consumption results in very long
D
D
D
D
Electrostatic sensitive device.
Observe precautions for handling.
space and costs
stand-by time of approximately 7 days
Block Diagram
VCC1
LO
REF
LO
in
GND1
A2
out
VCC2
Lim1
in
Lim1
REF
Lim1
out
GND3
Lim2
in
Lim2
REF
DEM
NTank
DEM
Tank
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Mix
A2
Demo–
dulator
RSSI
Vcc/2
A1
+
–
Compa–
rator
10 k Ω
1
2
3
4
5
6
7
8
9
10
11
12
13
14
NC
RSSI
A1
REF
A1
in
GND2
Mix
out
VCC3
A2
in
A2
REF
Data
out
Com
Nin
Com
in
SL
in
DEM
out
13951
Figure 1. Block diagram
Ordering Information
Extended Type Number
U2762B-BFS
U2762B-BFSG3
Package
SSO28
SSO28
Remarks
Tubes, MOQ 600 pcs
Taped and reeled, MOQ 4000 pcs
Rev. A3, 10-Jun-98
1 (9)
Preliminary Information
U2762B
Pin Description
NC 1
28 VCC1
RSSI 2
27 LO REF
26 LO in
A1 REF 3
A1 in
4
25 GND1
GND2
5
24 A2 out
Mix out 6
23 VCC2
VCC3
7
22 Lim1 in
A2 in
8
21 Lim1 REF
20 Lim1 out
A2 REF 9
19 GND3
Data out 10
Com Nin
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
18 Lim2 in
11
Com in 12
17 Lim2 REF
16 DEM NTank
SL in 13
15 DEM Tank
DEM out 14
13960
Figure 2. Pinning
17
18
19
20
21
22
23
24
25
26
27
28
Symbol
NC
RSSI
A1 REF
A1 in
GND2
Mix out
VCC3
A2 in
A2 REF
Data out
Com Nin
Com in
SL in
DEM out
DEM Tank
DEM
NTank
Lim2 REF
Lim2 in
GND3
Lim1 out
Lim1 REF
Lim1 in
VCC2
A2 out
GND1
LO in
LO REF
VCC1
Function
Not connected
Signal-strength indicator
RF reference
RF input
IF ground
Mixer output
IF and AF power supply
IF amplifier A2 input
IF amplifier A2 reference
Data output
Comparator reference
Comparator input / slicer output
Slicer input
Demodulator output
Quadrature filter
Quadrature filter
Limiter2 reference
Limiter2 input
IF and AF Ground
Limiter1 output
Limiter1 reference
Limiter1 input
IF power supply 1
IF amplifier A2 output
RF ground
Local oscillator input
Local oscillator reference
RF power supply
Functional Description
RF Amplifier / Mixer
Demodulator
The RF amplifier / mixer down-converts the antenna
signal to the IF frequency. It has asymmetrical RF and IF
ports. The LO input includes an amplifier for good sensitivity and can be used in a symmetrical- as well as an
asymmetrical configuration.
The quadrature demodulator in the receiving path
contains an internal 7-pF quadrature capacitor to couple
the IF signal to the external tank providing the 90-degree
phase shift. The tank may be either an LC-tank circuit or
an alignment-free discrete ceramic resonator.
IF Amplifier A2
Bit-Slicer Amplifier and Comparator
An additional gain stage enables an application-specific
insertion point for IF filtering.
The bit-slicer limits the baseband signal. Furthermore it
eliminates the DC-offset by an AC-coupled lowpass filter
to the demodulator output. A second lowpass filter
recovers the exact comparator threshold value of the
bit-slicer’s output. The time constants of both lowpass
filters can be selected independently from each other to
optimize power-up timing.
Limiter 1 / 2
The two-stage limiting amplifier is designed to be
directly coupled to low-cost 10.7-MHz ceramic IF filters
in front of each stage. The total dynamic range is 65 dB.
2 (9)
Rev. A3, 10-Jun-98
Preliminary Information
U2762B
Absolute Maximum Ratings
Parameters
Supply voltage
Input voltages
Input voltages
Pins 7, 23, 28
Pins 1, 2, 6, 10, 14, 20 and 24
Pins 3, 4, 8, 9, 11, 12, 13,15, 16,
18, 21, 22, 26 and 27
Junction temperature
Storage temperature
Symbol
VCC
Vin
Vin
Value
0 to 3.5
0 to VCC
0 to VCC – 1 V
Unit
V
V
V
Tj
Tstg
125
–40 to +125
_C
_C
Symbol
RthJA
Value
130
Unit
K/W
Symbol
VS
Tamb
Value
2.7 to 3.3
0 to 70
Unit
V
_C
Thermal Resistance
Parameters
Junction ambient
SSO28
Operating Range
Parameters
Supply voltage
Ambient temperature
Electrical Characteristics Cascaded A1 and MX1
Temperature range: 0_C to 70_C
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Parameters
Supply-voltage range
Supply current
A1MX1 turn-on time
RF input impedance
RF input SWR
RF input frequency
LO input impedance
LO input frequency
A1/MX1 cascaded
insertion voltage gain
Noise figure
1-dB compression point
Output voltage @ 1 dB
compression
3rd-order intercept point
LO to RF leakage
LO to IF leakage
IF output impedance
Test Conditions / Pins
Pin 28
Pin 4
Pin 4
Symbol
VCC
ISA1on
tA1MX1on
ZA1in
fin
Min.
2.7
800
Pins 26, 27
Max.
3.3
1200
2
fLOin
MX1LO = 916.8 MHz
MX1RF = 927.5 MHz
Pin = –40 dBm
PLOin = –20 dBm
SSB
Input Pin 4
MX1LO = 916.8 MHz,
MX1RF = 927.5 MHz, Pin 6
fLO = 980 MHz
PLO = –20 dBm
fRF1 = 1 GHz
fRF2 = 995 MHz
PRF = –40 dBm,
Pin 4
PLO = –20 dBm
Pin 4
PLO = –20 dBm
Pin 6
@10.7-MHz IF
single ended
Pin 6
Typ.
2.9
6.5
2.5
50
< 2:1
GVA1MX1
800
21
24
1200
27
Unit
V
mA
s
VSWR
MHz
k
MHz
dB
NF
P1dB
P1dBout
11.5
–27
104
dB
dBm
dB V
IIP3
–15
dBm
dBm
dB V
LMX1Zout
–50
62
330
Rev. A3, 10-Jun-98
3 (9)
Preliminary Information
U2762B
Electrical Characteristics A2
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Parameters
A2 turn-on time
IF input impedance
Input frequency
Output frequency
Gain
Noise figure
1-dB compression point
3rd-order intercept point
Output voltage @ 1 dB
compression
Output load
Test Conditions / Pins
Min.
@10.7 MHz
Pin 8
Pin 8
Pin 24
Symbol
tA2on
ZMX2in
fMX2in
fMX2out
Gp
NF
P1dB
IIP3
P1dBout
Single ended
Pin 24
LMX2out
@10.7 MHz
Pin 8
Pin 24
@10.7 MHz
Typ.
2.5
330
10.7
10.7
10
8
95
112
104
Max.
260
330
400
Min.
2.7
Typ.
2.9
4.9
6.0
Max.
3.3
260
8
400
22
22
12
Unit
ms
MHz
MHz
dB
dB
dB V
dB V
dB V
Common Electrical Characteristics IF/AF System
Parameters
Supply-voltage range
Supply current
Supply current
Test Conditions / Pins
Pins 7, 23
Pin 7
Pin 23
Symbol
V7, V23
I7
I23
Unit
V
mA
mA
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Electrical Characteristics RSSI/Lim1 and Lim2
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m
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m
m
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Parameters
–3 dB limiting at Lim1
input
Lim1/Lim2 cascaded
voltage gain
Limiter 1
Lim1 input impedance
Lim1 input frequency
Lim1 output impedance
Voltage gain
Limiter 2
Lim2 input impedance
Lim2 input frequency
RSSI
Dynamic range
Output voltage
RSSI fall time
RSSI rise time
Output impedance
Test Conditions / Pins
Valid for –5 dB insertion
loss for 2nd IF filter
Pin 22
fIF = 10.7 MHz,
PIFin = –110 dBm
Symbol
P3dB
Pin 22
Pin 22
Pin 22
ZLIM1in
fLIM1BW
fLIM1out
GLIM1
260
1
260
ZLIM2in
fLIM2BW
260
1
DRSSI
Vout
20
0.1
1.7
Pin 18
Pin 18
@ 20 dB V
@ 85 dB V
Pin 2
Pin 2
Pin 2
Min.
GLIM12
Typ.
Max.
8
110
tfRSSI
trRSSI
ZRSSI
4 (9)
330
330
45
330
0.2
1.8
10 || 3
Unit
dB V
dB
400
22
400
MHz
dB
400
22
85
0.3
1.9
50
50
MHz
dB V
V
V
s
s
k || pF
Rev. A3, 10-Jun-98
Preliminary Information
U2762B
Electrical Characteristics Demodulator
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Electrical Characteristics Comparator
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Electrical Characteristics Slicer Amplifier
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Parameters
Demodulator 3 db BW
Demodulator total
harmonic distortion
Symbol
fDEMODBW
THD
DC output voltage
Output load
Test Conditions / Pins
Pin 14
fmod = 36 kHz
fdev = 40 kHz
Pin 14
fIFin = 10.7 MHz
fmod = 36 kHz
Pin 14
fdev = 40 kHz
fIFin = 10.7 MHz
Pin 14
Pin 14
LDout
10
Parameters
Ref. input impedance
Output voltage ‘high’
Output voltage ‘low’
Output low-to-high
rise time
Output high-to-low
fall time
Hysteresis
Test Conditions / Pins
Pin 11
RLOAD > 10 k
Pin 10
RLOAD > 10 k
Pin 10
RLOAD = 10 k
Pin 10
CLOAD = 10 pf
RLOAD = 10 k
Pin 10
CLOAD = 10 pf
Pin 12
Symbol
ZCOMPin
VoutH
VoutL
tr
Min.
Parameters
Open loop gain
Output load
Output swing
Test Conditions / Pins
Pin 13 to 12
AC load
Pin 12
Pin 12
Symbol
GSol
LSout
Demodulator output
voltage
Min.
VDout
Typ.
200
<3
Max.
Unit
kHz
%
150
mVrms
1.5
V
k
Typ.
100
Max.
0.3
500
Unit
k
V
V
ns
500
ns
VCC–0.3
tf
VHYST
25
Min.
Typ.
40
mV
Max.
10
0.7
Unit
dB
k
V
Internal Pin Configuration
VCC
VCC
5 kΩ
1 kΩ
2
3.3 pF
1 kΩ
3
10 kΩ
13956
4
800 Ω
13957
Figure 3. Pin 2: Signal strength indicator (RSSI)
Figure 4. Pins 3/4: RF reference / RF input
Rev. A3, 10-Jun-98
5 (9)
Preliminary Information
U2762B
VCC
VCC
10 µA
296 Ω
6
11
13963
1 mA
Figure 8. Pin 11: Comparator reference
13958
VCC
VCC
Figure 5. Pin 6: Mixer output
10 kΩ
12
VCC
290 µA
9
8
10 pF
257 Ω
13
80 µA
800 Ω
13964
13959
Figure 6. Pins 8/9: IF amplifier A2 input / reference
Figure 9. Pin 12: Comparator input / Slicer output
Pin 13: Slicer input
.
VCC
VCC
180 µA
20 kΩ
10
14
13962
13965
Figure 7. Pin 10: Data output
Figure 10. Pin 14: Demodulator output
6 (9)
Rev. A3, 10-Jun-98
Preliminary Information
U2762B
VCC
20 kΩ
7 pF
21
100 kΩ
330 Ω
15,16
22
140 µA
11 µA
13966
13969
Figure 11. Pin 15/16: Quadrature filter
Figure 14. Pins 21/22: Limiter 1 input / reference
VCC
17
272 Ω
330 Ω
24
18
1.1 mA
13970
13967
Figure 12. Pins 17/18: Limiter 2 input / reference
Figure 15. Pin 24: IF amplifier A2 output
26
VCC
27
240 Ω
20
1 kΩ
1 kΩ
440 µA
13971
13968
Figure 13. Pin 20: Limiter 1 output
Figure 16. Pins 26/27: Local oscillator input / reference
Rev. A3, 10-Jun-98
7 (9)
Preliminary Information
U2762B
Application Circuit
C51
C52
C53
100pF 0.1µF
C54
1nF
C47
1nF
1nF
R87
560Ω
Y2
FL4
LO in
C90
C58
100pF
R88
560Ω
1nF
100pF
VCC
FCD1070MB115
TDK Ceramic
Discriminator
DEM out
C0 8.2pF
1µF
C65
C64
28
27
26
25
24
23
22
21
20
19
18
17
16
15
0.1µF 100pF
U2762B
1
A1 in
2
3
4
5
6
7
8
SL in
9
10
11
12
13
C72
1µF
14
R75
C71
Data out
5.6kΩ
100pF
C77
C76
C78
100pF 0.01µF 100pF
RSSI
R99
10kΩ
R97 10kΩ
1nF
FL5
C83
4.7µF
10kΩ
10kΩ
C79
FL4/5: SFE10.7MS3C10-A
R100
0.1µF
13972
Figure 17. Application circuit
Package Information
Package SSO28
Dimensions in mm
5.7
5.3
9.10
9.01
4.5
4.3
1.30
0.15
0.15
0.05
0.25
6.6
6.3
0.65
8.45
28
15
technical drawings
according to DIN
specifications
13018
1
14
8 (9)
Rev. A3, 10-Jun-98
Preliminary Information
U2762B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC Semiconductor GmbH semiconductor division has been able to use its policy of continuous improvements
to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
Rev. A3, 10-Jun-98
9 (9)
Preliminary Information