MICROCHIP TC649VUA

M
TC649
PWM Fan Speed Controller with Auto-Shutdown
and FanSense™ Technology
Features
• Temperature Proportional Fan Speed for Acoustic
Control and Longer Fan Life
• Efficient PWM Fan Drive
• 3.0V to 5.5V Supply Range:
- Fan Voltage Independent of TC649
Supply Voltage
- Supports any Fan Voltage
• FanSense™ Fault Detection Circuits Protect
Against Fan Failure and Aid System Testing
• Automatic Shutdown Mode for “Green” Systems
• Supports Low Cost NTC/PTC Thermistors
• Space Saving 8-Pin MSOP Package
Applications
•
•
•
•
•
•
•
Power Supplies
Computers
File Servers
Portable Computers
Telecom Equipment
UPSs, Power Amps
General Purpose Fan Speed Control
Available Tools
• Fan Controller Demonstration Board (TC642DEMO)
• Fan Controller Evaluation Kit (TC642EV)
Package Types
SOIC/PDIP/MSOP
VIN
1
CF
2
VAS
GND
8
VDD
7
VOUT
3
6
FAULT
4
5
SENSE
TC649
General Description
The TC649 is a switch mode, fan speed controller for
use with brushless DC fans. Temperature proportional
speed control is accomplished using pulse width modulation (PWM). A thermistor (or other voltage output
temperature sensor) connected to the VIN input furnishes the required control voltage of 1.25V to 2.65V
(typical) for 0% to 100% PWM duty cycle. The TC649
automatically suspends fan operation when measured
temperature (VIN) is below a user programmed
minimum setting (VAS). An integrated Start-up Timer
ensures reliable motor start-up at turn-on, coming out
of shutdown mode, auto-shutdown mode or following a
transient fault.
In normal fan operation, a pulse train is present at
SENSE (Pin 5). The TC649 features Microchip
Technology’s proprietary FanSenseTM technology for
increasing system reliability. A missing pulse detector
monitors this pin during fan operation. A stalled, open
or unconnected fan causes the TC649 to trigger its
Start-up Timer once. If the fault persists, the FAULT
output goes low, and the device is latched in its shutdown mode. See Section 5.0, “Typical Applications”,
for more information and system design guidelines.
The TC649 is available in the 8-pin PDIP, SOIC and
MSOP packages and is available in the industrial and
extended commercial temperature ranges.
 2002 Microchip Technology Inc.
DS21449C-page 1
TC649
Functional Block Diagram
TC649
VIN
–
VDD
PWM
+
Control
Logic
VOUT
CF
3 x TPWM
Timer
Clock
Generator
–
VAS
Start-up
Timer
+
FAULT
SHDN
Missing
Pulse
Detect
–
+
–
GND
+
VSHDN
10k
SENSE
70mV (typ.)
DS21449C-page 2
 2002 Microchip Technology Inc.
TC649
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage ......................................................... 6V
Input Voltage, Any Pin.... (GND – 0.3V) to (VDD +0.3V)
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at
these or any other conditions above those indicated in the
operation sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Resistance:
PDIP (RθJA) ............................................ 125°C/W
SOIC (RθJA) ............................................ 155°C/W
MSOP (RθJA) .......................................... 200°C/W
Specified Temperature Range ........... -40°C to +125°C
Storage Temperature Range.............. -65°C to +150°C
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise specified, TMIN ≤ TA ≤ TMAX, VDD = 3.0V to 5.5V.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VDD
Supply Voltage
3.0
—
5.5
V
IDD
Supply Current, Operating
—
0.5
1.0
mA
Pins 6, 7 Open,
CF = 1 µF, VIN = VC(MAX)
IDD(SHDN)
Supply Current, Shutdown/
Auto-shutdown Mode
—
25
—
µA
Pins 6, 7 Open; Note 1
CF =1 µF, VIN = 0.35V
IIN
VIN, VAS Input Leakage
-1.0
—
+1.0
µA
VOUT Output
tR
VOUT Rise Time
—
—
50
µsec
tF
VOUT Fall Time
—
—
50
µsec
IOH = 5 mA, Note 1
IOL = 1 mA, Note 1
tSHDN
Pulse Width (On VIN ) to Clear Fault
Mode
30
—
—
µsec
VSHDN, VHYST
Specifications, Note 1
IOL
Sink Current at VOUT Output
1.0
—
—
mA
VOL = 10% of VDD
IOH
Source Current at V OUT Output
5.0
—
—
mA
VOH = 80% of VDD
50
70
90
mV
Note 1
SENSE Input
VTH(SENSE) SENSE Input threshold Voltage with
Respect to GND
FAULT Output
VOL
Output Low Voltage
—
—
0.3
V
tMP
Missing Pulse Detector Timer
—
32/F
—
Sec
IOL = 2.5 mA
CF = 1.0 µF
tSTART
Start-up Timer
—
32/F
—
Sec
CF = 1.0 µF
tDIAG
Diagnostic Timer
—
3/F
—
Sec
CF = 1.0 µF
VIN , VAS Inputs
VC(MAX)
Voltage at VIN for 100% Duty Cycle
2.5
2.65
2.8
V
VC(SPAN)
VC(MAX) - VC(MIN)
1.3
1.4
1.5
V
VAS
Auto-shutdown Threshold
VC(MAX) -VC(SPAN)
—
VC(MAX)
V
VSHDN
Voltage applied to VIN to Release
Reset/Shutdown
—
—
VDD x 0.13
V
VREL
Voltage applied to V IN to Release
Reset Mode
VDD x 0.19
—
—
V
VHYST
Hysteresis on V SHDN, VREL
—
0.01 x VDD
—
V
VHAS
Hysteresis on Auto-shutdown
Comparator
—
70
—
mV
26
30
34
Hz
VDD = 5V,
See Figure 5-11
Pulse Width Modulator
FOSC
PWM Frequency
CF = 1.0 µF
Note 1: Ensured by design, not tested.
 2002 Microchip Technology Inc.
DS21449C-page 3
TC649
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
PIN FUNCTION TABLE
Symbol
Descriptiion
2.3
Analog Input (VAS)
An external resistor divider connected to the VAS input
sets the auto-shutdown threshold. Auto-shutdown
occurs when V IN ≤ VAS. The fan is automatically
restarted when VIN ≥ (VAS + VHAS). See Section 5.0,
“Typical Applications”, for more details.
1
VIN
Analog Input
2
CF
Analog Output
2.4
3
VAS
Analog Input
GND denotes the ground terminal.
4
GND
Ground Terminal
5
SENSE
Analog Input
6
FAULT
Digital (Open Collector) Output
7
VOUT
Digital Output
8
VDD
Power Supply Input
2.1
Analog Input (VIN)
The thermistor network (or other temperature sensor)
connects to the VIN input. A voltage range of 1.25V to
2.65V (typical) on this pin drives an active duty cycle of
0% to 100% on the VOUT pin. The TC649 enters shutdown mode when V IN ≤ VSHDN. During shutdown, the
FAULT output is inactive, and supply current falls to
25 µA (typical). The TC649 exits shutdown mode when
VIN ≥ VREL. See Section 5.0, “Typical Applications”, for
details.
2.2
Analog Output (CF)
CF is the positive terminal for the PWM ramp generator
timing capacitor. The recommended CF is 1 µF for
30 Hz PWM operation.
DS21449C-page 4
2.5
Ground (GND)
Analog Input (SENSE)
Pulses are detected at the SENSE pin as fan rotation
chops the current through a sense resistor (RSENSE).
The absence of pulses indicates a fault. See
Section 5.0, “Typical Applications”, for more details.
2.6
Digital Output (FAULT)
The FAULT line goes low to indicate a fault condition.
When FAULT goes low due to a fan fault condition, the
device is latched in shutdown mode until deliberately
cleared or until power is cycled.
2.7
Digital Output (VOUT)
VOUT is an active high complimentary output that drives
the base of an external NPN transistor (via an appropriate base resistor) or the gate of an N-channel
MOSFET. This output has asymmetrical drive (see
Section 1.0, “Electrical Characteristics”).
2.8
Power Supply Input (VDD)
VDD may be independent of the fan’s power supply
(see Section 1.0, “Electrical Characteristics”).
 2002 Microchip Technology Inc.
TC649
3.0
DETAILED DESCRIPTION
3.5
3.1
PWM
Pulses appearing at SENSE due to the PWM turning
on are blanked, and the remaining pulses are filtered
by a missing pulse detector. If consecutive pulses are
not detected for thirty-two PWM cycles (≅1 Sec if
CF = 1 µF), the Diagnostic Timer is activated, and
VOUT is driven high continuously for three PWM cycles
(≅100 msec if CF = 1 µF). If a pulse is not detected
within this window, the Start-up Timer is triggered (see
Section 3.3, “Start-up Timer”). This should clear a transient fault condition. If the missing pulse detector times
out again, the PWM is stopped and FAULT goes low.
When FAULT is activated due to this condition, the
device is latched in shutdown mode and will remain off
indefinitely. The TC649 is thus prevented from
attempting to drive a fan under catastrophic fault
conditions.
The PWM circuit consists of a ramp generator and
threshold detector. The frequency of the PWM is
determined by the value of the capacitor connected to
the C F input. A frequency of 30 Hz is recommended for
most applications (CF = 1 µF). The PWM is also the
time base for the Start-up Timer (see Section 3.3,
“Start-up Timer”). The PWM voltage control range is
1.25V to 2.65V (typical) for 0% to 100% output duty
cycle.
3.2
VOUT Output
The V OUT pin is designed to drive a low cost transistor
or MOSFET as the low side power switching element in
the system. Various examples of driver circuits will be
shown throughout the datasheet. This output has
asymmetric complementary drive and is optimized for
driving NPN transistors or N-channel MOSFETs. Since
the system relies on PWM rather than linear control,
the power dissipation in the power switch is kept to a
minimum. Generally, very small devices (TO-92 or SOT
packages) will suffice.
3.3
Start-Up Timer
To ensure reliable fan start-up, the Start-up Timer turns
the VOUT output on for 32 cycles of the PWM whenever
the fan is started from the off state. This occurs at
power-up and when coming out of shutdown or autoshutdown mode. If the PWM frequency is 30 Hz (CF =
1 µF) the resulting start-up time will be approximately
one second. If a fan fault is detected (see Section 3.5,
FAULT Output), the Diagnostic Timer is triggered once,
followed by the Start-up Timer. If the fault persists, the
device is shut down (see Section 3.5, FAULT Output).
3.4
FAULT Output
One of two things will restore operation: Cycling power
off and then on again; or pulling VIN below VSHDN and
releasing it to a level above VREL. When one of these
two conditions is satisfied, the normal start-up cycle is
triggered and operation will resume, provided the fault
has been cleared.
3.6
Auto-Shutdown Mode
If the voltage on VIN becomes less than the voltage on
VAS, the fan is automatically shut off (auto-shutdown
mode). The TC649 exits auto-shutdown mode when
the voltage on VIN becomes higher than the voltage on
VAS by VHAS (the auto-shutdown hysteresis voltage,
see Figure 3-1). The Start-up Timer is triggered and
normal operation is resumed upon exiting auto-shutdown mode. The FAULT output is unconditionally
inactive in auto-shutdown mode.
SENSE Input
(FanSense™ Technology)
The SENSE input (Pin 5) is connected to a low value
current sensing resistor in the ground return leg of the
fan circuit. During normal fan operation, commutation
occurs as each pole of the fan is energized. This
causes brief interruptions in the fan current, seen as
pulses across the sense resistor. If the device is not in
shutdown or auto-shutdown mode, and pulses are not
appearing at the SENSE input, a fault exists.
The short, rapid change in fan current (high dl/dt)
causes a corresponding dV/dt across the sense
resistor, RSENSE. The waveform on R SENSE is
differentiated and converted to a logic-level pulse-train
by CSENSE and the internal signal processing circuitry.
The presence and frequency of this pulse-train is a
direct indication of fan operation. See Section 5.0,
“Typical Applications”, for more details.
 2002 Microchip Technology Inc.
DS21449C-page 5
TC649
TC649
Status
Normal
Operation
Auto-Shutdown
Mode
Normal
Operation
ShutDown
Normal
Operation
HI
2.6V
VAS + VHAS
VAS
TEMP.
1.2V
tRESET
VIN
VREL
VSHDN
LO
GND
TIME
FIGURE 3-1:
3.7
TC649 Nominal Operation.
Shutdown Mode (RESET)
If an unconditional shutdown and/or device reset is
desired, the TC649 may be placed in shutdown mode
by forcing VIN to a logic low (i.e., VIN < VSHDN) (see
Figure 3-1). In this mode, all functions cease and the
FAULT output is unconditionally inactive. The TC649
should not be shut down unless all heat producing activity in the system is at a negligible level. The TC649 exits
shutdown mode when VIN becomes greater than VREL,
the release voltage.
Entering shutdown mode also performs a complete
device reset. Shutdown mode resets the TC649 into its
power-up state. The Start-up and Fault Timers and any
current faults are cleared. FAULT is unconditionally
inactive in shutdown mode. Upon exiting shutdown
mode (VIN > VREL), the Start-up Timer will be triggered
and normal operation will resume, assuming no fault
conditions exist and VIN > (VAS + VHAS).
Note:
If VIN < VAS when the device exits shutdown mode, the fan will not restart, but will
be in auto-shutdown mode.
DS21449C-page 6
If a fan fault has occurred and the device has latched
itself into shutdown mode, performing a reset will not
clear the fault unless V IN > (VAS + VHAS). If V IN is not
greater than VAS + VHAS upon exiting shutdown mode,
the fan will not be restarted, and there will be no way to
establish that the fan fault has been cleared. To ensure
that a complete reset takes place, the user’s circuitry
must ensure that VIN > (VAS + VHAS) when the device
is released from shutdown mode. A recommended
algorithm for management of the TC649 by a host
microcontroller or other external circuitry is given in
Section 5.0, “Typical Applications”. A small amount of
hysteresis, typically one percent of VDD (50mV at VDD
= 5.0V), is designed into the V SHDN/VREL threshold.
The levels specified for VSHDN and VREL in Section 1.0,
“Electrical Characteristics”, include this hysteresis plus
adequate margin to account for normal variations in the
absolute value of the threshold and hysteresis.
CAUTION: The fan will remain off as long as the VIN
pin is being held low or VIN < VAS+ VHAS.
 2002 Microchip Technology Inc.
TC649
4.0
SYSTEM BEHAVIOR
The flowcharts describing the TC649’s behavioral
algorithm are shown in Figure 4-1. They can be
summarized as follows:
4.1
Power-Up
(1) Assuming the device is not being held in shutdown
or auto-shutdown mode (VIN > VAS)...
(2) Turn VOUT output on for 32 cycles of the PWM
clock. This ensures that the fan will start from a
dead stop.
4.3
Fan Fault
Fan Fault is an infinite loop wherein the TC649 is
latched in shutdown mode. This mode can only be
released by a reset (i.e., VIN being brought below
VSHDN, then above (VAS + VHAS) or by power-cycling).
(1) While in this state, FAULT is latched on (low) and
the VOUT output is disabled.
(2) A reset sequence applied to the VIN pin will exit the
loop to Power-up.
(3) End.
(3) During this Start-up Timer, if a fan pulse is
detected, branch to Normal Operation; if none are
received…
(4) Activate the 32-cycle Start-up Timer one more
time and look for fan pulse; if a fan pulse is
detected, proceed to Normal Operation; if none
are received…
(5) Proceed to Fan Fault.
(6) End.
4.2
Normal Operation
Normal Operation is an endless loop which may only
be exited by entering shutdown mode, auto-shutdown
mode or Fan Fault. The loop can be thought of as executing at the frequency of the oscillator and PWM.
(1) Reset the missing pulse detector.
(2) Is TC649 in shutdown or auto-shutdown mode? If
so…
a. V OUT duty cycle goes to zero.
b. FAULT is disabled.
c. Exit the loop and wait for VIN > (VAS + VHAS) to
resume operation.
(3) Drive VOUT to a duty cycle proportional to VIN on a
cycle by cycle basis.
(4) If a fan pulse is detected, branch back to the start
of the loop (1).
(5) If the missing pulse detector times out …
(6) Activate the 3-cycle Diagnostic Timer and look for
pulses; if a fan pulse is detected, branch back to
the start of the loop (1); if none are received…
(7) Activate the 32-cycle Start-up Timer and look for
pulses; if a fan pulse is detected, branch back to
the start of the loop (1); if none are received…
(8) Quit Normal Operation and go to Fan Fault.
(9) End.
 2002 Microchip Technology Inc.
DS21449C-page 7
TC649
Normal
Operation
Power-Up
Clear Missing
Pulse Detector
Power-on
Reset
FAULT = 1
Yes
Shutdown
VOUT = 0
VIN < VSHDN
Yes
No
VIN > VREL?
VIN < VSHDN?
No
No
VIN > VREL
No
Yes
Yes
AutoShutdown
VOUT = 0
Yes
VIN < VAS?
VIN < VAS?
No
VIN >
No
(VAS + VHAS)
Fire Start-up
Timer
(1 SEC)
Yes
Fan Pulse
Detected?
Fan Pulse
Detected?
Hot Start
No
No
Yes
Fire
Diagnostic
Timer
(100msec)
Yes
Fan Pulse
Detected?
Yes
Normal
Operation
Power-Up
Yes
M.P.D.
Expired?
Fire Start-up
Timer
YES
(1 SEC)
Yes
Yes
VOUT
Proportional
to VIN
Yes
No
Auto
Shutdown
VOUT = 0
No
VIN >
(VAS + VHAS)
No
Hot Start
Shutdown
VOUT = 0
No
No
Fan Pulse
Detected?
Fire Start-up
Timer
(1 Sec)
Fan Fault
Yes
Fan Pulse
Detected?
No
Fan Fault
Fan Fault
FAULT = 0,
VOUT = 0
No
Auto-Shutdown
FAULT = 1,
VOUT = 0
VIN < VSHDN?
Yes
Yes
No
VIN > VREL?
No
No
Cycling
Power
Yes
VIN > (VAS + VHAS)?
Yes
Power-Up
FIGURE 4-1:
DS21449C-page 8
TC649 Behavioral Algorithm Flowchart.
 2002 Microchip Technology Inc.
TC649
5.0
TYPICAL APPLICATIONS
The TC642 demonstration and prototyping board
(TC642DEMO) and the TC642 Evaluation Kit
(TC642EV) provide working examples of TC649 circuits and prototyping aids. The TC642DEMO is a
printed circuit board optimized for small size and ease
of inclusion into system prototypes. The TC642EV is a
larger board intended for benchtop development and
analysis. At the very least, anyone contemplating a
design using the TC649 should consult the documentation for both TC642EV (DS21403) and TC642DEMO
(DS21401).Figure 5-1 shows the base schematic for
the TC642DEMO.
Designing with the TC649 involves the following:
(1) The temperature sensor network must be
configured to deliver 1.25V to 2.65V on V IN for 0%
to 100% of the temperature range to be regulated.
(2) The auto-shutdown temperature must be set
with a voltage divider on VAS.
(3) The output drive transistor and associated circuitry
must be selected.
(4) The SENSE network, RSENSE and CSENSE, must
be designed for maximum efficiency while
delivering adequate signal amplitude.
(5) If shutdown capability is desired, the drive requirements of the external signal or circuit must be
considered.
+5V*
+C
+12V
B
1 µF
R1
NTC
Fan
Shutdown**
CB
0.01 µF
R2
VIN
VDD
FAULT
+5V
Fan Fault
Shutdown
Q1
RBASE
TC649
VOUT
R3
VAS
CB
0.01 µF
SENSE
CSENSE
CF
R4
CF
GND
RSENSE
1 µF
Notes: *See cautions regarding Latch-up Considerations in Section 5.0, "Typical Applications".
**Optional. See Section 5.0, "Typical Applications" for details.
FIGURE 5-1:
Typical Application Circuit.
 2002 Microchip Technology Inc.
DS21449C-page 9
TC649
5.1
Temperature Sensor Design
EQUATION
The temperature signal connected to VIN must output a
voltage in the range of 1.25V to 2.65V (typical) for 0%
to 100% of the temperature range of interest. The
circuit in Figure 5-2 illustrates a convenient way to
provide this signal.
VDD x R2
RTEMP (T1) + R2
VDD x R2
RTEMP (T2) + R2
IDIV
R1 =100 kΩ
VIN
R2 = 23.2 kΩ
FIGURE 5-2:
Circuit.
Temperature Sensing
Figure 5-2 shows a simple temperature dependent
voltage divider circuit. RT1 is a conventional NTC thermistor, while R 1 and R2 are standard resistors. The
supply voltage, VDD, is divided between R2 and the
parallel combination of RT1 and R1. For convenience,
the parallel combination of RT1 and R1 will be referred
to as RTEMP. The resistance of the thermistor at various
temperatures is obtained from the manufacturer’s
specifications. Thermistors are often referred to in
terms of their resistance at 25°C.
Generally, the thermistor shown in Figure 5-2 is a nonlinear device with a negative temperature coefficient
(also called an NTC thermistor). In Figure 5-2, R 1 is
used to linearize the thermistor temperature response
and R2 is used to produce a positive temperature
coefficient at the VIN node. As an added benefit, this
configuration produces an output voltage delta of 1.4V,
which is well within the range of the V C(SPAN)
specification of the TC649. A 100 kΩ NTC thermistor is
selected for this application in order to keep IDIV at a
minimum.
For the voltage range at VIN to be equal to 1.25V to
2.65V, the temperature range of this configuration is
0°C to 50°C. If a different temperature range is required
from this circuit, R 1 should be chosen to equal the
resistance value of the thermistor at the center of this
new temperature range. It is suggested that a maximum temperature range of 50°C be used with this circuit due to thermistor linearity limitations. With this
change, R2 is adjusted according to the following
equations:
DS21449C-page 10
= V(T2)
Where T1 and T2 define the temperature range of the
circuit. RTEMP is the parallel equivalent of the
thermistor and R1 at those temperatures.
VDD
RT1
NTC
Thermistor
100 kΩ @ 25˚C
= V(T1)
More information about thermistors may be obtained
from AN679, “Temperature Sensing Technologies”,
and AN685, “Thermistors in Single Supply
Temperature Sensing Circuit”, which can be downloaded
from
Microchip’s
website
at
www.microchip.com.
5.2
Auto-Shutdown Temperature
Design
A voltage divider on VAS sets the temperature at which
the part is automatically shut down if the sensed temperature at VIN drops below the set temperature at VAS
(i.e. V IN < VAS). As with the VIN input, 1.25V to 2.65V
(typ.) corresponds to the temperature range of interest
from T1 to T2, respectively. Assuming that the temperature sensor network designed above is linearly related
to temperature, the shutdown temperature TAS is
related to T2 and T1 by:
EQUATION
2.65V - 1.25V
T2 - T1
VAS =
(
1.4V
T2 - T1
=
VAS - 1.25
TAS - T1
)
(TAS - T1) + 1.25
For example, if 1.25V and 2.65V at VIN corresponds to
a temperature range of T1 = 0°C to T2 = 125°C, and the
auto-shutdown temperature desired is 25°C, then VAS
voltage is:
EQUATION
VAS =
1.4V
(125 - 0)
(25 - 0) + 1.25 = 1.53V
The VAS voltage may be set using a simple resistor
divider, as is shown in Figure 5-3.
 2002 Microchip Technology Inc.
TC649
5.3
VDD
R1
IDIV
One boundary condition which may impact the
selection of the minimum fan speed is the irregular
activation of the Diagnostic Timer due to the TC649
“missing” fan commutation pulses at low speeds. This
is a natural consequence of low PWM duty cycles (typically 25% or less). Recall that the SENSE function
detects commutation of the fan as disturbances in the
current through RSENSE. These can only occur when
the fan is energized (i.e., VOUT is “on”). At very low duty
cycles, the VOUT output is “off” most of the time. The fan
may be rotating normally, but the commutation events
are occurring during the PWM’s off-time.
IIN
VAS
R2
GND
FIGURE 5-3:
VAS Circuit.
Per Section 1.0, “Electrical Characteristics”, the leakage current at the VAS pin is no more than 1 µA. It is
conservative to design for a divider current, IDIV, of
100 µA. If VDD = 5.0V then:
EQUATION
5.0V
IDIV = 1e– 4A
R1 + R2
5.0V
R1 + R2 =
1e–4A
, therefore
= 50,000Ω = 50 kΩ
We can further specify R1 and R 2 by the condition that
the divider voltage is equal to our desired VAS. This
yields the following:
EQUATION
VAS =
VDD x R 2
R1 + R2
Solving for the relationship between R1 and R 2 results
in:
EQUATION
R1 = R2 x
VDD - VAS
VAS
= R2 x
Operations at Low Duty Cycle
5 -1.53
1.53
In the case of this example, R 1 = (2.27) R 2. Substituting
this relationship back into the VAS equation above
yields the resistor values:
The phase relationship between the fan’s commutation
and the PWM edges tends to “walk around” as the
system operates. At certain points, the TC649 may fail
to capture a pulse within the 32-cycle missing pulse
detector window. If this happens, the 3-cycle
Diagnostic Timer will be activated, the VOUT output will
be active continuously for three cycles and, if the fan is
operating normally, a pulse will be detected. If all is
well, the system will return to normal operation. There
is no harm in this behavior, but it may be audible to the
user as the fan accelerates briefly when the Diagnostic
Timer fires. For this reason, it is recommended that VAS
be set no lower than 1.8V.
5.4
FanSense™ Network
(RSENSE and CSENSE)
The FanSense network, comprised of RSENSE and
CSENSE, allows the TC649 to detect commutation of
the fan motor (FanSense™ technology). This network
can be thought of as a differentiator and threshold
detector. The function of R SENSE is to convert the fan
current into a voltage. CSENSE serves to AC-couple this
voltage signal and provide a ground-referenced input to
the SENSE pin. Designing a proper SENSE network is
simply a matter of scaling RSENSE to provide the necessary amount of gain (i.e., the current-to-voltage conversion ratio). A 0.1 µF ceramic capacitor is
recommended for CSENSE. Smaller values require
larger sense resistors, and higher value capacitors are
bulkier and more expensive. Using a 0.1 µF capacitor
results in reasonable values for RSENSE. Figure 5-4
illustrates a typical SENSE network. Figure 5-5 shows
the waveforms observed using a typical SENSE network.
R2 = 15.3 kΩ, and
R1 = 34.7 kΩ
In this case, the standard values of 34.8 kΩ and
15.4 kΩ are very close to the calculated values and
would be more than adequate.
 2002 Microchip Technology Inc.
DS21449C-page 11
TC649
RSENSE VS. FAN CURRENT
TABLE 5-1:
VDD
Nominal Fan Current (mA)
RSENSE (Ω)
Fan
RBASE
VOUT
Q1
SENSE
CSENSE
(0.1 µF Typ.)
RSENSE
5.5
GND
FIGURE 5-4:
SENSE Network.
Tek Run: 10.0kS/s Sample
[
T
]
Waveform @ Sense Resistor
GND
1
Waveform @ Sense Pin
90mV
50mV
GND
T
2
Ch1
100mV
Ch2
FIGURE 5-5:
100mV
M5.00ms
Ch1
142mV
SENSE Waveforms.
Table 5-1 lists the recommended values of RSENSE
based on the nominal operating current of the fan. Note
that the current draw specified by the fan manufacturer
may be a worst-case rating for near-stall conditions and
may not be the fan’s nominal operating current. The
values in Table 5-1 refer to actual average operating
current. If the fan current falls between two of the values listed, use the higher resistor value. The end result
of employing Table 5-1 is that the signal developed
across the sense resistor is approximately 450 mV in
amplitude.
DS21449C-page 12
50
9.1
100
4.7
150
3.0
200
2.4
250
2.0
300
1.8
350
1.5
400
1.3
450
1.2
500
1.0
Output Drive Transistor Selection
The TC649 is designed to drive an external transistor
or MOSFET for modulating power to the fan. This is
shown as Q1 in Figures 5-1, 5-4, 5-6, 5-7, 5-8 and 5-9.
The VOUT pin has a minimum source current of 5 mA
and a minimum sink current of 1 mA. Bipolar transistors
or MOSFETs may be used as the power switching
element as shown in Figure 5-6. When high current
gain is needed to drive larger fans, two transistors may
be used in a Darlington configuration. These circuit
topologies are shown in Figure 5-6: (a) shows a single
NPN transistor used as the switching element; (b)
illustrates the Darlington pair; and (c) shows an Nchannel MOSFET.
One major advantage of the TC649’s PWM control
scheme versus linear speed control is that the power
dissipation in the pass element is kept very low. Generally, low cost devices in very small packages, such as
TO-92 or SOT, can be used effectively. For fans with
nominal operating currents of no more than 200 mA, a
single transistor usually suffices. Above 200 mA, the
Darlington or MOSFET solution is recommended. For
the fan sensing function to work correctly, it is
imperative that the pass transistor be fully saturated
when “on”.
 2002 Microchip Technology Inc.
TC649
be enough to saturate the transistor when conducting
the full fan current (transistor must have sufficient
gain); (3) the VOUT voltage must be high enough to sufficiently drive the gate of the MOSFET to minimize the
RDS(on) of the device; (4) rated fan current draw must
be within the transistor's/MOSFET's current handling
capability; and (5) power dissipation must be kept
within the limits of the chosen device.
Table 5-2 gives examples of some commonly available
transistors and MOSFETs. This table should be used
as a guide only since there are many transistors and
MOSFETs which will work just as well as those listed.
The critical issues when choosing a device to use as
Q1 are: (1) the breakdown voltage (V(BR)CEO or VDS
(MOSFET)) must be large enough to withstand the
highest voltage applied to the fan (Note: This will occur
when the fan is off); (2) 5 mA of base drive current must
VDD
VDD
VDD
Fan
Fan
Fan
RBASE
VOUT
VOUT
Q1
RBASE
Q1
Q1
VOUT
Q2
RSENSE
GND
TABLE 5-2:
Device
MMBT2222A
MPS2222A
MPS6602
GND
GND
a) Single Bipolar Transistor
FIGURE 5-6:
RSENSE
RSENSE
C) N-Channel MOSFET
b) Darlington Transistor Pair
Output Drive Transistor Circuit Topologies.
TRANSISTORS AND MOSFETS FOR Q1 (VDD = 5V)
Package
Max. V BE(sat)/VGS
(V)
Min. HFE
VCEO/VDS
(V)
Fan Current
(mA)
Suggested
RBASE (Ω)
SOT-23
1.2
50
40
150
800
TO-92
1.2
50
40
150
800
TO-92
1.2
50
40
500
301
SI2302
SOT-23
2.5
NA
20
500
Note 1
MGSF1N02E
SOT-23
2.5
NA
20
500
Note 1
SI4410
SO-8
4.5
NA
30
1000
Note 1
SI2308
SOT-23
4.5
NA
60
500
Note 1
Note 1: A series gate resistor may be used in order to control the MOSFET turn-on and turn-off times.
 2002 Microchip Technology Inc.
DS21449C-page 13
TC649
A base-current limiting resistor is required with bipolar
transistors (Figure 5-7). The correct value for this
resistor can be determined as follows:
VOH
VRSENSE
= VRSENSE + VBE(SAT) + VRBASE
= IFAN x RSENSE
VRBASE
= RBASE x IBASE
IBASE
= IFAN / hFE
VDD
Fan
VOH is specified as 80% of VDD in Section 1.0,
“Electrical Characteristics”; VBE(SAT) is given in the chosen transistor data sheet. It is now possible to solve for
RBASE.
RBASE
VOH = 80% VDD
+V
RBASE
VBE(SAT)–
EQUATION
RBASE =
Q1
–
+
+
VRSENSE
VOH - V BE(SAT) - VRSENSE
IBASE
RSENSE
–
Some applications benefit from the fan being powered
from a negative supply to keep motor noise out of the
positive supply rails. This can be accomplished as
shown in Figure 5-8, with zener diode D1 offsetting the
-12V power supply voltage, holding transistor Q1 off
when VOUT is low. When VOUT is high, the voltage at
the anode of D1 increases by VOUT, causing Q1 to turn
on. Operation is otherwise the same as in the case of
fan operation from +12V.
GND
FIGURE 5-7:
R BASE.
Circuit For Determining
+5V
VDD
R2*
2.2 kΩ
VOUT
D1
12.0V
Zener
FAN
TC649
Q1*
GND
R4*
10 kΩ
R3*
2.2 Ω
-12V
Note: * Value depends on the specific application and is shown for example only.
See Section 5.0, "Typical Applications", for more details.
FIGURE 5-8:
DS21449C-page 14
Powering the Fan from a -12V Supply.
 2002 Microchip Technology Inc.
TC649
5.6
Latch-up Considerations
a high impedance source (such as a thermistor). Additionally, the VDD input should be bypassed with a 1 µF
capacitor with grounds being kept as short as possible.
To keep fan noise off the TC649 ground pin, individual
ground returns for the TC649 and the low side of the
fan current sense resistor should be used.
As with any CMOS IC, the potential exists for latch-up
if signals are applied to the device which are outside
the power supply range. This is of particular concern
during power-up if the external circuitry (such as the
sensor network, VAS divider or shutdown circuit) are
powered by a supply different from that of the TC649.
Care should be taken to ensure that the TC649’s VDD
supply powers up first. If possible, the networks
attached to VIN and VAS should connect to the VDD supply at the same physical location as the IC itself. Even
if the IC and any external networks are powered by the
same supply, physical separation of the connecting
points can result in enough parasitic capacitance and/
or inductance in the power supply connections to delay
one power supply “routing” versus another.
5.7
Design Example
Step 1. Calculate R1 and R2 based on using an NTC
having a resistance of 10 kΩ at TMIN (25°C)
and 4.65 kΩ at TMAX (45°C) (see Figure 5-9).
R1 = 20.5 kΩ
R2 = 3.83 kΩ
Step 2. Set auto-shutdown Level.
VAS = 1.8V.
Limit the divider current to 100 µA
R5 = 33 kΩ
R6 = 18 kΩ
Power Supply Routing and
Bypassing
Step 3. Design the output circuit.
Noise present on the VIN and VAS inputs may cause
erroneous operation of the FAULT output. As a result,
these inputs should be bypassed with a 0.01 µF
capacitor mounted as close to the package as possible.
This is especially true of VIN, which is usually drive from
Maximum fan motor current = 250 mA.
Q1 beta is chosen at 50 from which
R7 = 800 Ω.
+5V
OpenDrain
Device
R1
20.5 kΩ
R2
3.83 kΩ
(Optional)
NTC
10 kΩ
@ 25˚C
1
RESET
Shutdown
CB
1 µF
VIN
+12V
+5V
8
4
VDD
GND
CB
0.01 µF
Fan
FAULT
6
R7
800 Ω
+5V
TC649
VOUT
R5
33 kΩ
R6
18 kΩ
3 VAS
CB
0.01 µF
2
CF
Q1
Fan Fault
SENSE
7
5
CSENSE
0.1 µF
RSENSE
2.2 Ω
C1
1 µF
FIGURE 5-9:
Design Example.
 2002 Microchip Technology Inc.
DS21449C-page 15
TC649
5.8
TC649 as a Microcontroller
Peripheral
In a system containing a microcontroller or other host
intelligence, the TC649 can be effectively managed as
a CPU peripheral. Routine fan control functions can be
performed by the TC649 without processor intervention. The microcontroller receives temperature data
from one or more points throughout the system. It
calculates a fan operating speed based on an algorithm
specifically designed for the application at hand. The
processor controls fan speed using complementary
port bits I/O1 through I/O3. Resistors R1 through R6
(5% tolerance) form a crude 3-bit DAC that translates
this 3-bit code from the processor's outputs into a 1.6V
DC control signal. A monolithic DAC or digital pot may
be used instead of the circuit shown in Figure 5-10.
With VAS set at 1.8V, the TC649 enters auto-shutdown
when the processor's output code is 000[B]. Output
codes 001[B] to 111[B] operate the fan from roughly
40% to 100% of full speed. An open-drain output from
the processor (I/O0) can be used to reset the TC649
following detection of a fault condition. The FAULT output can be connected to the processor's interrupt input
or to another I/O pin for polled operation.
.
+12V
+5V
Analog or Digital
Temperature Data from
One or more Sensors
(RESET) (Optional)
Open-Drain
I/O0
Output
R1
110 kΩ
(MSB)
1
I/O1
CB
R2
CMOS
240 kΩ
.01 µF
2
Outputs I/O2
R3
+
360 kΩ
R7
1µF
R4
I/O3
18 kΩ 33 kΩ
3
CMOS
(LSB)
R5
CB
1.5 kΩ
Microcontroller
+5V
R8
+5V
.01µF
18 kΩ
4
R6
1 kΩ
+5V
VIN
VDD
VOUT
CF
8
7
TC649
VAS
FAULT
GND
SENSE
6
5
Fan
CB
1 µF
R9
800 Ω
2N2222A
+5V
R10
10 kΩ
0.1 µF
R11
2.2 Ω
GND
FIGURE 5-10:
INT
TC649 as a Microcontroller Peripheral.
VRELEASE vs. Temperature
1.0
VDD = 5.5V
VRELEASE (V)
0.9
VDD = 5.0V
0.8
0.7
VDD = 4.0V
0.6
VDD = 3.0V
0.5
0.4
0˚C
25˚C
85˚C
TEMPERATURE
FIGURE 5-11:
DS21449C-page 16
VRELEASE vs. Temperature.
 2002 Microchip Technology Inc.
TC649
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
NNN
YYWW
TC649VPA
025
0215
8-Lead SOIC (150 mil)
Example:
8-Lead MSOP
TC649E
XXXXXX
YWWNNN
Note:
*
XX...X
YY
WW
NNN
Example:
TC649VOA
0215
025
XXXXXXXX
YYWW
NNN
Legend:
Example:
215025
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office.
 2002 Microchip Technology Inc.
DS21449C-page 17
TC649
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21449C-page 18
 2002 Microchip Technology Inc.
TC649
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45×
c
A2
A
f
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
f
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2002 Microchip Technology Inc.
DS21449C-page 19
TC649
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
p
E1
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
NOM
MAX
8
0.65
.026
A
.044
.030
Standoff
A1
.002
E
.184
Molded Package Width
MIN
8
A2
Overall Width
MAX
NOM
Molded Package Thickness
§
MILLIMETERS*
INCHES
MIN
1.18
.038
0.76
.006
0.05
.193
.200
.034
0.86
0.97
4.67
4.90
.5.08
0.15
E1
.114
.118
.122
2.90
3.00
3.10
Overall Length
D
.114
.118
.122
2.90
3.00
3.10
Foot Length
L
.016
.022
.028
0.40
0.55
0.70
Footprint (Reference)
.035
.037
.039
0.90
0.95
1.00
Foot Angle
F
φ
6
0
Lead Thickness
c
.004
.006
.008
0.10
0.15
0.20
Lead Width
B
α
.010
.012
.016
0.25
0.30
0.40
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
6
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed. 010" (0.254mm) per side.
Drawing No. C04-111
DS21449C-page 20
 2002 Microchip Technology Inc.
TC649
6.2
Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
 2002 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
DS21449C-page 21
TC649
NOTES:
DS21449C-page 22
 2002 Microchip Technology Inc.
TC649
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
Connecting to the Microchip Internet Web Site
The Microchip web site is available at the following
URL:
www.microchip.com
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
092002
The file transfer site is available by using an FTP service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
 2002 Microchip Technology Inc.
DS21449C-page23
TC649
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
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RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: TC649
Y
N
Literature Number: DS21449C
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21449C-page24
 2002 Microchip Technology Inc.
TC649
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Device:
TC649:
PWM Fan Speed Controller w/Auto Shutdown
and Fault Detection
Temperature Range:
V
E
Package:
PA = Plastic DIP (300 mil Body), 8-lead *
OA = Plastic SOIC, (150 mil Body), 8-lead
UA = Plastic Micro Small Outline (MSOP), 8-lead
Examples:
a)
TC649VOA: PWM Fan Speed Controller w/
Auto-Shutdown and Fault Detection, SOIC
package.
b)
TC649VUA: PWM Fan Speed Controller w/
Auto-Shutdown and Fault Detection, MSOP
package
c)
TC649VPA: PWM Fan Speed Controller w/
Auto-Shutdown and Fault Detection, PDIP
package.
d)
TC649EOATR: PWM Fan Speed Controller w/
Auto-Shutdown and Fault Detection, SOIC
package, Tape and Reel.
= 0°C to +85°C
= -40°C to +85°C
* PDIP package is only offered in the V temp range.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21449C-page25
TC649
NOTES:
DS21449C-page 26
 2002 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, K EELOQ,
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21449C - page 27
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Rocky Mountain
China - Beijing
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
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Tel: 978-692-3848 Fax: 978-692-3821
Chicago
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Tel: 630-285-0071 Fax: 630-285-0075
Dallas
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Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
China - Hong Kong SAR
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
New York
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
08/01/02
DS21449C-page 28
 2002 Microchip Technology Inc.