FREESCALE MPVZ12

Freescale Semiconductor
Technical Data
MPVZ12
Rev 2, 01/2007
10 kPa Uncompensated
Silicon Pressure Sensors
MPVZ12 SERIES
The MPVZ12 series is a silicon piezoresistive pressure sensor providing a
very accurate and linear voltage output — directly proportional to the applied
pressure. This standard, low cost, uncompensated sensor permits
manufacturers to design and add their own external temperature compensating
and signal conditioning networks. Compensation techniques are simplified
because of the predictability of Freescale's single element strain gauge design.
SMALL OUTLINE PACKAGE
Features
•
•
•
•
•
•
•
UNCOMPENSATED PRESSURE
SENSOR
0 TO 10 kPA (0–1.45 psi)
55 mV FULL SCALE SPAN
(TYPICAL)
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Differential and Gauge Options
Durable Epoxy Package
Increased media compatibility fluorocarbon gel
MPVZ12GC6U
CASE 482A-01
Application Examples
• Air Movement Control
• Environmental Control Systems
• Level Indicators
• Leak Detection
• Medical Instrumentation
• Industrial Controls
• Pneumatic Control Systems
• Robotics
MPVZ12GC7U
CASE 482C-03
ORDERING INFORMATION(1)
Device Type
Ported
Options
Gauge
Case No.
Order Number
MPVZ12GW6U
CASE 1735-01
Device Marking
482A
MPVZ12GC6U
MPVZ12G
482C
MPVZ12GC7U
MPVZ12G
1735
MPVZ12GW6U
MZ12GW
1560
MPVZ12GW7U
MZ12GW
1. MPVZ12 series pressure sensors are available in differential and gauge configurations.
Devices are available in the basic element package or with pressure port fittings which
provide printed circuit board mounting ease and barbed hose pressure connections.
MPVZ12GW7U
CASE 1560-02
PIN NUMBERS
1
GND
5
N/C
2
+Vout
6
N/C
3
Vs
7
N/C
4
–Vout
8
N/C
NOTE: Pin 1 is noted by the notch in the lead.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
3
+VS
2
Sensing
Element
4
+VOUT
–VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Table 1. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)
Burst Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Value
Unit
PMAX
75
kPa
PBURST
100
kPa
TSTG
–40 to +125
°C
TA
–40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPVZ12
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
10
kPa
VS
—
3.0
6.0
Vdc
Io
—
6.0
—
mAdc
VFSS
45
55
70
mV
Voff
0
20
35
mV
Sensitivity
∆V/∆P
—
5.5
—
mV/kPa
Linearity(5)
—
–0.5
—
5.0
%VFSS
—
—
±0.1
—
%VFSS
—
—
±0.5
—
%VFSS
TCVFSS
–0.22
—
–0.16
%VFSS/°C
TCVoff
—
±15
—
µV/°C
TCR
0.28
—
0.34
%Zin/°C
Input Impedance
Zin
400
—
550
W
Output Impedance
Zout
750
—
1250
W
tR
—
1.0
—
ms
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Differential Pressure Range
Supply
(1)
Voltage(2)
Supply Current
Full Scale Span
(3)
Offset(4)
Pressure
Hysteresis6
(0 to 10 kPa)
(5)
Temperature Hysteresis
(–40°C to +125°C)
Temperature Coefficient of Full Scale
Temperature Coefficient of
Span(5)
Offset(5)
Temperature Coefficient of Resistance
(6)
Response Time
Warm-Up Time
Offset Stability
(5)
(10% to 90%)
(7)
(8)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
•
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
TCR:
ZIN deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to
25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
8. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPVZ12
Sensors
Freescale Semiconductor
3
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPVZ12 series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
80
70
+25°C
VS = 3 VDC
P1 > P2
-40°C
Output (mVdc)
60
Span
Range
(Typ)
50
40
+125°C
30
20
Offset
(Typ)
10
0
PSI 0
0.3
kPa
2.0
0.6
0.9
4.0
6.0
1.2
1.5
8.0
10
Pressure Differential
Figure 2. Output versus Pressure Differential
80
Linearity
70
60
Actual
Output (mVdc)
50
Span
(VFSS)
40
Theoretical
30
20
Offset
(Voff)
10
0
0
Pressure (kPA)
Max
POP
Figure 3. Linearity Specification Comparison
MPVZ12
4
Sensors
Freescale Semiconductor
Die
Gel Die Coat
Stainless
Steel Cap
P1
Thermoplastic
Case
Wire Bond
Lead Frame
P2
Die Bond
Differential Sensing
Element
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (applicable to cases 482, 1560 and
1735). A gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
Operating characteristics, internal reliability and
qualification tests are based on use of dry clean air as the
pressure media. Media other than dry clean air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing gel which isolates
the die from the environment. The Freescale MPVZ12 series
is designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table
Part Number
Case Type
Pressure (P1) Side
Identifier
MPVZ12GC6U
482A
98ASB17757C
Top with Port Attached
MPVZ12GC7U
482C
98ASB17759C
Top with Port Attached
MPVZ12GW6U
1735
98ASA10686D
Top with Port Attached
MPVZ12GW7U
1560
98ASA10611D
Top with Port Attached
MPVZ12
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
–A–
D 8 PL
4
0.25 (0.010)
5
M
T B
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0_
7_
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0_
7_
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
PIN 1 IDENTIFIER
M
K
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4
5
N –B–
G
0.25 (0.010)
8
1
M
T B
D 8 PL
S A
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
DETAIL X
S
W
V
PIN 1
IDENTIFIER
C
–T–
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0_
15 _
0.444
0.448
0.540
0.560
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0_
15 _
11.28
11.38
13.72
14.22
6.22
6.48
2.92
3.17
SEATING
PLANE
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPVZ12
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ12
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ12
8
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ12
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ12
10
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ12
Sensors
Freescale Semiconductor
11
PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ12
12
Sensors
Freescale Semiconductor
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MPVZ12
Rev. 2
01/2007
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