Pressure Freescale Semiconductor MPX5700 Rev 9, 09/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX5700 Series 0 to 700 kPa (0 to 101.5 psi) 15 to 700 kPa (2.18 to 101.5 psi) 0.2 to 4.7 V Output The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • • • • • 2.5% Maximum Error over 0° to 85°C Ideally Suited for Microprocessor or Microcontroller-Based Systems Available in Absolute, Differential and Gauge Configurations Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element ORDERING INFORMATION Case Device Name No. Unibody Package (MPX5700 Series) MPX5700A MPX5700AP MPX5700AS MPX5700ASX MPX5700D MPX5700DP MPX5700GP MPX5700GP1 MPX5700GS 867 867B 867E 867F 867 867C 867B 867B 867E None # of Ports Single Dual Gauge Pressure Type Differential • Absolute • • • • • • • • • • • • • • • • • Device Name MPX5700A MPX5700AP MPX5700A MPX5700A MPX5700D MPX5700DP MPX5700GP MPX5700GP MPX5700D UNIBODY PACKAGES MPX5700A/D CASE 867-08 MPX5700AP/GP/GP1 CASE 867B-04 MPX5700DP CASE 867C-05 © Freescale Semiconductor, Inc., 2007-2009. All rights reserved. MPX5700AS/GS CASE 867E-03 MPX5700ASX CASE 867F-03 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 0 15 — — 700 700 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current IO — 7.0 10 mAdc Voff 0.088 0.184 0.2 — 0.313 0.409 Vdc (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc (0 to 85°C) VFSS — 4.5 — Vdc (0 to 85°C) — — — ±2.5 %VFSS Pressure Range(1) Zero Pressure Offset(3) Full Scale Output(4) (5) Full Scale Span (6) Accuracy Sensitivity Gauge, Differential: MPX5700D Absolute: MPX5700A Gauge, Differential (0 to 85°C) Absolute (0 to 85°C) V/P — 6.4 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc — — 20 — ms (8) Warm-Up Time 1. 2. 3. 4. 5. 1.0 kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. MPX5700 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Maximum Pressure(2) Parametrics Symbol (P2 ≤ 1 Atmosphere) Value Unit P1max 2800 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 3 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 2 GND Gain Stage #2 and Ground Reference Shift Circuitry 1 Vout Pins 4, 5, and 6 are no connects Figure 1. Fully Integrated Pressure Sensor Schematic MPX5700 Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 3. illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (For use of the MPX5700D in a high-pressure cyclic application, consult the factory.) The MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2. shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in . The output will saturate outside of the specified pressure range. shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. . 5.0 Transfer Function: Vout = VS*(0.0012858*P+0.04) ± Error VS = 5.0 Vdc Temperature = 0 to 85°C 4.5 4.0 Output (V) 3.5 Typical 3.0 2.5 Maximum 2.0 Minimum 1.5 1.0 0.5 0 0 100 200 500 400 300 Differential Pressure (kPa) 700 600 800 Figure 2. Output vs. Pressure Differential Fluoro Silicone Die Coat Fluoro Silicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Lead Frame Epoxy Case Die P1 Wire Bond Lead Frame RTV Die Bond P2 Stainless Steel Metal Cover Epoxy Case DIFFERENTIAL/GAUGE ELEMENT RTV Die Bond P2 ABSOLUTE ELEMENT Figure 3. Cross-Sectional Diagrams (not to scale) +5 V Vout Output Vs IPS 1.0 μF 0.01 μF GND 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5700 4 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Case Type Pressure (P1) Side Identifier MPX5700A/D 867 Stainless Steel Cap MPX5700DP 867C Side with Part Marking MPX5700GP/AP 867B Side with Port Attached MPX5700GS/AS 867E Side with Port Attached MPX5700ASX 867F Side with Port Attached MPX5700 Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. STYLE 2: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N BASIC ELEMENT P 0.25 (0.010) M T Q -A- M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N -Q- PORT #2 VACUUM (P2) B PIN 1 1 C SEATING PLANE -T- -TJ 2 3 4 5 K 6 S SEATING PLANE G F D 6 PL 0.13 (0.005) M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP) MPX5700 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -B- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A C DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K 4 3 2 1 S J N 5 G F E D 6 PL -T- 0.13 (0.005) M T B M INCHES MILLIMETERS MAX MIN MAX MIN 18.28 0.720 17.53 0.690 6.48 6.22 0.245 0.255 20.82 0.780 0.820 19.81 0.84 0.69 0.027 0.033 4.72 4.52 0.178 0.186 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 9.53 8.76 0.375 0.345 7.87 7.62 0.300 0.310 6.10 5.59 0.220 0.240 4.93 4.62 0.194 0.182 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867E-03 ISSUE D PRESSURE SIDE PORTED (AS, GS) -TC A E -Q- U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) -P0.25 (0.010) T Q M 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867F-03 ISSUE D PRESSURE SIDE AXIAL PORT (ASX) MPX5700 Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPX5700 Rev. 9 09/2009