深圳市南天星电子科技有限公司 专业代理飞思卡尔 (Freescale) 飞思卡尔主要产品 8 位微控制器 16 位微控制器 数字信号处理器与控制器 i.MX 应用处理器 基于 ARM®技术的 Kinetis MCU 32/64 位微控制器与处理器 模拟与电源管理器件 射频器件（LDMOS，收发器） 传感器（压力，加速度，磁场， 触摸，电池） 飞思卡尔产品主要应用 汽车电子 数据连接 消费电子 工业控制 医疗保健 电机控制 网络 智能能源 深圳市南天星电子科技有限公司 电话：0755－83040796 传真：0755－83040790 邮箱：[email protected] 网址：www.soustar.com.cn 地址：深圳市福田区福明路雷圳大厦 2306 室 Pressure Freescale Semiconductor MPX5999D Rev 6, 09/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX5999D 0 to 1000 kPa (0 to 150 psi) 0.2 to 4.7 V Output The MPX5999D piezoresistive transducer is a state-of-the-art pressure sensor designed for a wide range of applications, but particularly for those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features • • • • Temperature Compensated Over 0 to 85°C Ideally Suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element ORDERING INFORMATION Device Name Case No. None 867 • # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking Unibody Package MPX5999D • UNIBODY PACKAGE MPX5999D CASE 867 © Freescale Semiconductor, Inc., 2005-2009. All rights reserved. MPX5999D Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 0 — 1000 kPa VS 4.75 5.0 5.25 Vdc IO — 7.0 10 mAdc (0 to 85°C) Voff 0.088 0.2 0.313 Vdc (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc (0 to 85°C) VFSS — 4.5 — Vdc V/P — 4.5 — mV/kPa Pressure Range(1) Supply Voltage(2) Supply Current Zero Pressure Offset(3) Full Scale Output(4) Full Scale Span(5) Sensitivity Accuracy(6) — — — ±2.5 %VFSS Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc — — 20 — ms Warm-Up (0 to 85°C) Time(8) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. MPX5999D 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit P1max 4000 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C (2) Maximum Pressure (P2 ≤ 1 Atmosphere) 1. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone sensing chip. VS 3 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 2 Gain Stage #2 and Ground Reference Shift Circuitry 1 Vout Pins 4, 5, and 6 are NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic MPX5999D Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5999D pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. 5.0 Output (V) Transfer Function: 4.5 V = V *(0.000901*P+0.04) ± Error out S 4.0 VS = 5.0 Vdc Temperature = 0 to 85°C 3.5 TYP 3.0 2.5 MAX 2.0 MIN 1.5 1.0 0.5 0 0 100 200 300 400 500 600 700 800 Differential Pressure (kPa) 900 1000 1100 Figure 2. Output vs. Pressure Differential Silicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Lead Frame RTV Die Bond P2 Thermoplastic Case Figure 3. Cross-Sectional Diagrams (not to scale) +5 V Vout Output Vs IPS 1.0 μF 0.01 μF GND 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5999D 4 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Part Number MPX5999D Case Type 867 Pressure (P1) Side Identifier Stainless Steel Cap MPX5999D Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N BASIC ELEMENT MPX5999D 6 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPX5999D Rev. 6 9/2009