Pressure Freescale Semiconductor MPXHZ6117A Rev 0, 03/2010 Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXHZ6117A Series 10 to 115 kPa (14.5 to 16.7 psi) 0.4 to 4.653 V Output The MPXHZ6117A series pressure sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor’s packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make this sensor a logical and economical choice for the system designer. The MPXHZ6117A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features • • • • • • Resistant to High Humidity and Common Automotive Media Improved Accuracy at High Temperature 1.5% Maximum Error over 0°C to 85°C Temperature Compensated from -40°C to +125°C Durable Thermoplastic (PPS) Surface Mount Package (SSOP) with Optional Axial Port Ideally Suited for Microprocessor or Microcontroller Based Systems ORDERING INFORMATION # of Ports Package Case Device Name Options No. None Single Dual Super Small Outline Package (Media Resistant Gel) (MPXHZ6117A Series) MPXHZ6117A6U Rail 1317 MPXHZ6117A6T1 Tape & Reel 1317 MPXHZ6117AC6U Rail 1317A MPXHZ6117AC6T1 Tape & Reel 1317A Gauge Pressure Type Differential Absolute • • • • • • • • SUPER SMALL OUTLINE PACKAGE MPXHX6117A6U/6T1 CASE 1317 © Freescale Semiconductor, Inc., 2010. All rights reserved. MPXHX6117AC6U/6T1 CASE 1317A Device Marking MPXHZ6117A MPXHZ6117A MPXHZ6117A MPXHZ6117A Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Units Pressure Range POP 10 — 115 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — 6.0 10 mAdc Minimum Pressure @ VS = 5.0 V (0°C to 85°C) VOFF 0.340 0.4 0.461 Vdc Full Scale Output(2) @ VS = 5.0 V (0°C to 85°C) VFSO 4.592 4.653 4.714 Vdc Full Scale Output(3) (0°C to 85°C) VFSS — 4.253 — V V/P — 40.5 — mV/kPa — -1.5 — 1.5 %VFSS Sensitivity Offset Stability(4) (0°C to 85°C) 1. Device is ratiometric within this specified excitation range. 2. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Accuracy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of VSS span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. Offset Stability: Output deviation, after 1000 temperature cycles, -40° to 125°C, and 1.5 million pressure cycles, with minimum rated pressure applied. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. MPXHZ6117A Preliminary 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 400 kPa Storage Temperature TSTG -40 to +125 °C Operating Temperature TA -40 to +125 °C Output Source Current @ Full Scale Output(2) IO + +0.5 mAdc Output Sink Current @ Minimum Pressure Offset IO - -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element Gain Stage #2 and Ground Reference Shift Circuitry 1 VOUT 3 GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for super small outline package devices. Figure 1. Fully Integrated Pressure Sensor Schematic MPXHZ6117A Sensors Freescale Semiconductor Preliminary 3 Pressure ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration, and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the configuration in the basic chip carrier (case 1317-04) prior to porting. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable thermoplastic package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as common automotive media. NOTE: The MPXHZ6117A series pressure sensor’s operating characteristics, internal reliability and qualification tests are based on use of air as the Fluorosilicone Gel Die Coat Die pressure media. Media, other than air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown (Figure 3). The output will saturate outside of the specified pressure range. +5.1 V Stainless Steel Cap P1 VS Pin 2 Wire Bond Thermoplastic Case MPXHZ6117A VOUT Pin 4 100 nF Lead Frame GND Pin 3 Absolute Element To ADC 47 pF 51 K Die Bond Sealed Vacuum Reference Figure 3. Typical Application Circuit (output source current operation) Figure 2. Cross Sectional Diagram SSOP (not to scale) 5.0 Transfer Function: Vout = Vs*[(0.0081*P-0.00095) ± 1.5*0.0081*VS*Tm] 4.0 VS = 5.0 V ± 0.25 Vdc, Temp. = 0 to 85°C 4.5 Output (Volts) 3.5 3.0 2.5 MAX TYP 2.0 1.5 1.0 MIN 0.5 0 5 15 25 35 45 55 65 75 Pressure in kPa 85 95 105 115 125 Figure 4. Output vs. Absolute Pressure MPXHZ6117A Preliminary 4 Sensors Freescale Semiconductor Pressure Temperature Error Band MPXHZ6117A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C. Pressure Error Band 3.0 Error Limits for Pressure Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 -2.0 -3.0 Pressure Error (Max) 10 to 115 (kPa) ±1.5 (kPa) SURFACE MOUNTING INFORMATION Minimum Recommended Footprint for Super Small Outline Packages Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) MPXHZ6117A Sensors Freescale Semiconductor Preliminary 5 Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6117A Preliminary 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6117A Sensors Freescale Semiconductor Preliminary 7 Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6117A Preliminary 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXHZ6117A Sensors Freescale Semiconductor Preliminary 9 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXHZ6117A Preliminary 10 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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