1/6 TR0636E-20027 IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT APPROVED TY. ARAI CHECKED TM.MATSUO PREPARED TY.TAKADA HIROSE ELECTRIC CO., LTD. 2/6 [1] Objective To evaluate BGA shearing force by comparing Initial state and Post 3500 thermal cycle in accordance with IPC-9701. [2] Specimens Type Product Assembly State # of specimens Type_1 IT3D-300S-BGA (57) Virgin Initial 3 Type_2 IT3D-300S-BGA (57) Reworked Initial 3 Type_3 IT3D-300S-BGA (57) Virgin Post 3 3500 cycles Type_4 IT3D-300S-BGA (57) Reworked Post 3500 cycles Remarks *Type_3, Type_4 are assembled as Fig.1. *The test board design is based on IPC-9701 specification. *Thickness of the PCB: 3.3mm Fig.1 [3] Test period From: To 2007-09-12 : 2008-01-18 [4] Test Equipment Test equipment Model Manufacture Insertion and withdrawal force tester AG-IS Shimazu 3 3/6 BGA shearing force 1. Requirements The failure mode for the sheared balls shall be either bulk solder failure or copper pad lift-off. Intermetallic failure is unacceptable. 2. Conditions 2-1 Test Condition 0 (+10 / 0 C ) ( 0 / -100C ) Test cycle : 3500 cycles 2-2 BGA Shearing Force IT3D-300S-BGA(57) Insertion and withdrawal force tester CONNECTOR Sample * Speed: 500 micrometer /second 0.3mm space Test PCB 4/6 4. Results 4-1 BGA Shearing Force UNIT: KN No. Type-1 State Type-2 Initial Type-3 Type-4 Post 3500 thermal cycles Assembly Virgin Reworked Virgin Reworked 1 1.22 1.18 1.21 1.13 2 1.18 1.16 1.13 0.91 3 1.25 1.18 1.13 1.11 MAX 1.25 1.18 1.21 1.13 MIN 1.18 1.16 1.13 0.91 AVG 1.22 1.17 1.16 1.05 4-2 Failure Mode No intermetallic failure was found in all specimens. Copper pad lift-off was found in the sheared area. Details are shown in the following pages. 5/6 Type-1 (Initial) Virgin Copper Pad lift-off Type-2 (Initial) Reworked Copper Pad lift-off 6/6 Type-3 (Post 3500 thermal cycles) Virgin Copper Pad lift-off Type-4 (Post 3500 thermal cycles) Reworked Copper Pad lift-off