ADS1230 SBAS366A – OCTOBER 2006 – REVISED JULY 2007 20-Bit Analog-to-Digital Converter For Bridge Sensors FEATURES DESCRIPTION 1 • • • • 2 • • • • • • • • • Complete Front-End for Bridge Sensor Onboard PGA with Gain of 64 or 128 Onboard Oscillator RMS Noise: 40nV at 10SPS (G = 128) 88nV at 80SPS (G = 128) 18-Bit Noise-Free Resolution Selectable 10SPS or 80SPS Data Rates Simultaneous 50Hz and 60Hz Rejection at 10SPS External Voltage Reference up to 5V for Ratiometric Measurements Simple, Pin-Driven Control Two-Wire Serial Digital Interface Tiny 16-pin TSSOP Package Supply Range: 2.7V to 5.3V –40°C to +85°C Temperature Range APPLICATIONS • • • • Weigh Scales Strain Gauges Pressure Sensors Industrial Process Control The ADS1230 is a precision 20-bit analog-to-digital converter (ADC). With an onboard low-noise programmable gain amplifier (PGA), onboard oscillator, and precision 20-bit delta-sigma ADC, the ADS1230 provides a complete front-end solution for bridge sensor applications including weigh scales, strain gauges, and pressure sensors. The low-noise PGA has a gain of 64 or 128, supporting a full-scale differential input of ±39mV or ±19.5mV, respectively. The delta-sigma ADC has 20-bit effective resolution and is comprised of a 3rd-order modulator and 4th-order digital filter. Two data rates are supported: 10SPS (with both 50Hz and 60Hz rejection) and 80SPS. The ADS1230 can be clocked by the internal oscillator or an external clock source. Offset calibration is performed on-demand, and the ADS1230 can be put in a low-power standby mode or shut off completely in power-down mode. All of the features of the ADS1230 are controlled by dedicated pins; there are no digital registers to program. Data are output over an easily-isolated serial interface that connects directly to the MSP430 and other microcontrollers. The ADS1230 is available in a TSSOP-16 package and is specified from –40°C to +85°C. AVDD CAP REFP REFN DVDD PDWN Gain = 64 or 128 AINP DRDY/DOUT PGA DS ADC SCLK AINN SPEED Internal Oscillator AGND GAIN CAP CLKIN DGND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2007, Texas Instruments Incorporated ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) ADS1230 UNIT –0.3 to +6 V DVDD to DGND –0.3 to +6 V AGND to DGND –0.3 to +0.3 V 100, Momentary mA AVDD to AGND Input Current 10, Continuous mA Analog Input Voltage to AGND –0.3 to AVDD + 0.3 V Digital Input Voltage to DGND –0.3 to DVDD + 0.3 V +150 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –60 to +150 °C Maximum Junction Temperature (1) 2 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 ELECTRICAL CHARACTERISTICS All specifications at TA = –40°C to +85°C, AVDD = DVDD = REFP = +5V, REFN = AGND, and Gain = 64, unless otherwise noted. ADS1230 PARAMETER CONDITIONS MIN TYP MAX UNIT Analog Inputs Full-Scale Input Voltage (AINP – AINN) ±0.5VREF/PGA Common-Mode Input Range AGND + 1.5V Differential Input Current V AVDD – 1.5V V ±2 nA 80 SPS System Performance Resolution No Missing Codes 20 Internal Oscillator, SPEED = High Internal Oscillator, SPEED = Low Data Rate Digital Filter Settling Time Bits 10 SPS External Oscillator, SPEED = High fCLK/61,440 SPS External Oscillator, SPEED = Low fCLK/491,520 Full Settling SPS 4 Conversions Differential Input, End-Point Fit, G = 64 ±10 Differential Input, End-Point Fit, G = 128 ±6 ppm ±3 ppm of FS Input Offset Drift ±10 nV/°C Gain Error ±0.8 Integral Nonlinearity (INL) Input Offset Error (1) Gain Drift Normal-Mode Rejection (2) fIN = 50Hz or 60Hz ±1Hz, fDATA = 10SPS Common-Mode Rejection at DC, AVDD = 0.1V Input-Referred Noise Power-Supply Rejection ppm % ±4 ppm/°C Internal Oscillator 80 90 dB External Oscillator (3) 90 100 dB 110 dB fDATA = 10SPS 53 nV, rms fDATA = 80SPS 100 nV, rms 90 100 dB 1.5 AVDD at DC, AVDD = 0.1V Voltage Reference Input Voltage Reference Input (VREF) AVDD + 0.1V V Negative Reference Input (REFN) VREF = REFP – REFN AGND – 0.1 REFP – 1.5 V Positive Reference Input (REFP) REFN + 1.5 AVDD + 0.1 Voltage Reference Input Current 10 V nA Digital VIH Logic Levels All digital inputs except CLKIN 0.7 DVDD DVDD + 0.1 V CLKIN 0.7 DVDD 5.1 V DGND 0.2 DVDD V VIL VOH IOH = 1mA VOL IOL = 1mA Input Leakage DVDD – 0.4 0 < VIN < DVDD External Clock Input Frequency (fCLKIN) 0.2 Serial Clock Input Frequency (fSCLK) (1) (2) (3) V 4.9152 0.2 DVDD V ±10 μA 6 MHz 5 MHz Offset calibration can minimize these errors to the level of noise at any temperature. Specification is assured by the combination of design and final production test. External oscillator = 4.9152MHz. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 3 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 ELECTRICAL CHARACTERISTICS (continued) All specifications at TA = –40°C to +85°C, AVDD = DVDD = REFP = +5V, REFN = AGND, and Gain = 64, unless otherwise noted. ADS1230 PARAMETER CONDITIONS MIN TYP MAX UNIT Power Supply Power-Supply Voltage (AVDD, DVDD) Analog Supply Current Digital Supply Current Power Dissipation, Total 4 2.7 5.3 V Normal Mode, AVDD = 3V 900 1400 μA Normal Mode, AVDD = 5V 900 1400 μA Standby Mode 0.1 1 μA Power-Down 0.1 1 μA Normal Mode, DVDD = 3V 60 100 μA Normal mode, DVDD = 5V 95 140 μA Standby Mode, SCLK = High, DVDD = 3V 45 65 μA Standby Mode, SCLK = High, DVDD = 5V 65 80 μA Power-Down 0.2 Normal Mode, AVDD = DVDD = 3V 2.9 4.5 mW Normal Mode, AVDD = DVDD = 5V 5.0 7.7 mW Standby Mode, AVDD = DVDD = 5V 0.3 0.4 mW Submit Documentation Feedback μA Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 PIN CONFIGURATION PW PACKAGE TSSOP-16 (Top View) DVDD 1 16 DRDY/DOUT DGND 2 15 SCLK CLKIN 3 14 PDWN GAIN 4 13 SPEED ADS1230 CAP 5 12 AVDD CAP 6 11 AGND AINP 7 10 REFP AINN 8 9 REFN PIN DESCRIPTIONS NAME TERMINAL ANALOG/DIGITAL INPUT/OUTPUT DVDD 1 Digital Digital Power Supply: 2.7V to 5.3V DGND 2 Digital Digital Ground CLKIN 3 Digital/Digital Input DESCRIPTION External Clock Input: typically 4.9152MHz. Tie low to activate internal oscillator. PGA Gain Select GAIN 4 Digital Input GAIN PGA 0 64 1 128 CAP 5 Analog Gain Amp Bypass Capacitor Connection CAP 6 Analog Gain Amp Bypass Capacitor Connection AINP 7 Analog Input Positive Analog Input AINN 8 Analog Input Negative Analog Input REFN 9 Analog Input Negative Reference Input REFP 10 Analog Input Positive Reference Input AGND 11 Analog Analog Ground AVDD 12 Analog Analog Power Supply, 2.7V to 5.3V Data Rate Select: SPEED 13 Digital Input SPEED DATA RATE 0 10SPS 1 80SPS PDWN 14 Digital Input Power-Down: Holding this pin low powers down the entire converter and resets the ADC. SCLK 15 Digital Input Serial Clock: Clock out data on the rising edge. Also used to initiate Offset Calibration and Sleep modes. See the Offset Calibration, Standby Mode, and Standby Mode with Offset Calibration sections for more details. DRDY/DOUT 16 Digital Output Dual-Purpose Output: Data Ready: Indicates valid data by going low. Data Output: Outputs data, MSB first, on the first rising edge of SCLK. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 5 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 NOISE PERFORMANCE The ADS1230 offers outstanding noise performance. Table 1 summarizes the typical noise performance with inputs shorted externally for different data rates and voltage reference values. The RMS and Peak-to-Peak noise are referred to the input. The effective number of bits (ENOB) is defined as: ENOB = ln (FSR/RMS noise)/ln(2) The Noise-Free Bits are defined as: Noise-Free Bits = ln (FSR/Peak-to-Peak Noise)/ln(2) Where: FSR (Full-Scale Range) = VREF/Gain. Table 1. Noise Performance for AVDD = 5V and VREF = 5V DATA RATE 10 80 (1) GAIN RMS NOISE (nV) PEAK-TO-PEAK NOISE (1) (nV) ENOB (RMS) 64 53 290 20.5 18 128 40 198 19.8 17.5 64 100 480 19.5 17.3 128 88 480 18.7 16.3 NOISE-FREE BITS Peak-to-peak data are based on direct measurement. Table 2. Noise Performance for AVDD = 3V and VREF = 3V DATA RATE 10 80 (1) 6 GAIN RMS NOISE (nV) PEAK-TO-PEAK NOISE (1) (nV) ENOB (RMS) 64 46 290 20.6 18 128 49 259 19.6 17.2 64 100 576 19.5 17 128 102 461 18.5 16.3 NOISE-FREE BITS Peak-to-peak data are based on direct measurement. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 TYPICAL CHARACTERISTICS At TA = +25°C, AVDD = DVDD = REFP = 5V, and REFN = AGND, unless otherwise noted. NOISE PLOT NOISE PLOT 4 3 PGA = 64 Data Rate = 80SPS 2 1 3 Output Code (LSB) Output Code (LSB) PGA = 64 Data Rate = 10SPS 2 1 0 -1 -2 -3 -4 -5 0 -6 0 200 400 600 800 1000 0 200 Time (Reading Number) 400 Figure 1. NOISE HISTOGRAM NOISE HISTOGRAM PGA = 64 Data Rate = 10SPS 350 PGA = 64 Data Rate = 80SPS 300 Occurrence 600 Occurrence 1000 400 700 500 400 300 250 200 150 100 200 50 100 0 0 1 2 3 -5 -4 -3 Output Code (LSB) -2 -1 0 1 2 Output Code (LSB) Figure 3. Figure 4. NOISE PLOT NOISE PLOT 0 8 PGA = 128 Data Rate = 10SPS PGA = 128 Data Rate = 80SPS 6 -1 4 Output Code (LSB) Output Code (LSB) 800 Figure 2. 900 800 600 Time (Reading Number) -2 -3 -4 2 0 -2 -4 -6 -5 -8 -6 -10 0 200 400 600 800 1000 0 Time (Reading Number) 200 400 600 800 1000 Time (Reading Number) Figure 5. Figure 6. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 7 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, AVDD = DVDD = REFP = 5V, and REFN = AGND, unless otherwise noted. NOISE HISTOGRAM NOISE HISTOGRAM 500 250 PGA = 128 Data Rate = 10SPS 450 PGA = 128 Data Rate = 80SPS 400 200 Occurrence Occurrence 350 300 250 200 150 100 150 100 50 50 0 0 -5 -4 -3 -2 0 -1 -7 -6 -5 -4 -3 -2 -1 0 Output Code (LSB) Figure 7. OFFSET vs TEMPERATURE 3 4 5 6 7 GAIN ERROR vs TEMPERATURE -0.02 800 600 PGA = 64 Data Rate = 10SPS -0.03 Gain Error (%) 400 Offset (nV) 2 Figure 8. 1000 200 0 -200 -0.04 -0.05 -400 -600 1 Output Code (LSB) PGA = 64 Data Rate = 10SPS -0.06 -800 -50 0 -25 25 50 75 100 -50 0 -25 Temperature (°C) 25 50 75 100 Temperature (°C) Figure 9. Figure 10. NOISE vs INPUT SIGNAL NOISE vs INPUT SIGNAL 50 120 PGA = 64 Data Rate = 80SPS 45 40 RMS Noise (nV) RMS Noise (nV) 100 35 30 25 20 15 80 60 10 5 PGA = 64 Data Rate = 10SPS 0 40 -40 8 -30 -20 -10 0 10 20 30 40 -40 -30 -20 -10 0 VIN (mV) VIN (mV) Figure 11. Figure 12. Submit Documentation Feedback 10 20 30 40 Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, AVDD = DVDD = REFP = 5V, and REFN = AGND, unless otherwise noted. INTEGRAL NONLINEARITY vs INPUT SIGNAL INTEGRAL NONLINEARITY vs INPUT SIGNAL 10 1.0 -20°C +25°C +70°C 5 0 -20°C INL (ppm) INL (ppm) 0.5 0 +85°C -0.5 -40°C -1.0 +25°C -5 -1.5 PGA = 64 Data Rate = 10SPS PGA = 128 Data Rate = 10SPS -40°C -10 +70°C +85°C -2.0 -40 -30 -20 -10 0 10 20 30 40 -20 0 -10 VIN (mV) 10 20 VIN (mV) Figure 13. Figure 14. ANALOG CURRENT vs TEMPERATURE (Normal Mode) DIGITAL CURRENT vs TEMPERATURE (Normal Mode) 1200 97 96 95 PGA = 64, 128 Digital Current (mA) Analog Current (mA) 1000 800 600 400 94 93 92 PGA = 128 91 90 200 89 PGA = 64 0 88 -50 -25 0 25 50 75 100 -50 -25 0 25 50 Temperature (°C) Temperature (°C) Figure 15. Figure 16. 75 100 DATA RATE vs TEMPERATURE Data Rate (SPS) 9.85 9.80 9.75 9.70 -50 -25 0 25 50 75 100 Temperature (°C) Figure 17. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 9 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 OVERVIEW The ADS1230 is a precision, 20-bit ADC that includes a low-noise PGA, internal oscillator, third-order delta-sigma (ΔΣ) modulator, and fourth-order digital filter. The ADS1230 provides a complete front-end solution for bridge sensor applications such as weigh scales, strain guages, and pressure sensors. Clocking can be supplied by an external clock or by a precision internal oscillator. Data can be output at 10SPS for excellent 50Hz and 60Hz rejection, or at 80SPS when higher speeds are needed. The ADS1230 is easy to configure, and all digital control is accomplished through dedicated pins; there are no registers to program. A simple two-wire serial interface retrieves the data. input ranges from 0mV to +39mV (Gain = 64) or 0mV to +19.5mV (Gain = 128). The inputs of the ADS1230 are protected with internal diodes connected to the power-supply rails. These diodes clamp the applied signal to prevent it from damaging the input circuitry. CAP 450W 18pF A1 R Gain = 1 or 2 F1 R1 A3 RF2 ADC RINT ANALOG INPUTS (AINP, AINN) A2 450W The input signal to be measured is applied to the input pins AINP and AINN. The ADS1230 accepts differential input signals, but can also measure unipolar signals. When measuring unipolar (or single-ended signals) with respect to ground, connect the negative input (AINN) to ground and connect the input signal to the positive input (AINP). Note that when the ADS1230 is configured this way, only half of the converter full-scale range is used, since only positive digital output codes are produced. LOW-NOISE PGA The ADS1230 features a low-drift, low-noise PGA that provides a complete front-end solution for bridge sensors. A simplified diagram of the PGA is shown in Figure 18. It consists of two chopper-stabilized amplifiers (A1 and A2) and three accurately-matched resistors (R1, RF1, and RF2), which construct a differential front-end stage with a gain of 64, followed by gain stage A3 (Gain = 1 or 2). The PGA inputs are equipped with an EMI filter, as shown in Figure 18. The cutoff frequency of the EMI filter is 19.6MHz. By using AVDD as the reference input, the bipolar input ranges from –39mV to +39mV (Gain = 64) or –19.5mV to +19.5mV (Gain = 128), and the unipolar 10 RINT AINP AINN 18pF CAP Figure 18. Simplified Diagram of the PGA Bypass Capacitor By applying a 0.1μF external capacitor (CEXT) across two capacitor pins combined with the internal 2kΩ resistor RINT (on-chip), a low-pass filter with a corner frequency of 720Hz is created to bandlimit the signal path before the modulator input. This low-pass filter serves two purposes. First, the input signal is bandlimited to prevent aliasing as well as to filter out the high-frequency noise. Second, it attenuates the chopping residue from the amplifier to improve temperature drift performance. It is not required to use high-quality capacitors (such as ceramic or tantalum capacitors) for a general application. However, high-quality capacitors such as poly are recommended for high-linearity applications. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 VOLTAGE REFERENCE INPUTS (REFP, REFN) CLOCK SOURCES The voltage reference used by the modulator is generated from the voltage difference between REFP and REFN: VREF = REFP – REFN. The reference inputs use a structure similar to that of the analog inputs. In order to increase the reference input impedance, a switching buffer circuitry is used to reduce the input equivalent capacitance. The reference drift and noise impact ADC performance. In order to achieve best results, pay close attention to the reference noise and drift specifications. A simplified diagram of the circuitry on the reference inputs is shown in Figure 19. The switches and capacitors can be modeled approximately using an effective impedance of: 1 Z EFF + 2f MODC BUF Where: fMOD = modulator sampling frequency (76.8kHz) CBUF = input capacitance of the buffer The ADS1230 can use an external clock source or internal oscillator to accommodate a wide variety of applications. Figure 20 shows the equivalent circuitry of the clock source. The CLK_DETECT block determines whether the crystal oscillator/external clock signal is applied to the CLKIN pin so that the internal oscillator is bypassed or activated. When the CLKIN pin frequency is above ~200kHz, the CLK_DETECT output goes low and shuts down the internal oscillator. When the CLKIN pin frequency is below ~200kHz, the CLK_DETECT output goes high and activates the internal oscillator. It is highly recommended to hard-wire the CLKIN pin to ground when the internal oscillator is chosen. CLKIN Internal Oscillator S0 For the ADS1230: 1 Z EFF + + 500MW (2)(76.8kHz)(13fF) REFP EN S1 S MUX To ADC Figure 20. Equivalent Circuitry of the Clock Source REFN AVDD AVDD ESD Protection CBUF CLK_DETECT An external clock may be used by driving the CLKIN pin directly. The Electrical Characteristics table shows the allowable frequency range. The clock input may be driven with 5V logic, regardless of the DVDD or AVDD voltage. ZEFF = 500MW(1) (1) fMOD = 76.8kHz Figure 19. Simplified Reference Input Circuitry ESD diodes protect the reference inputs. To prevent these diodes from turning on, make sure the voltages on the reference pins do not go below GND by more than 100mV, and likewise, do not exceed AVDD by 100mV: GND – 100mV < (REFP or REFN) < AVDD + 100mV Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 11 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 FREQUENCY RESPONSE 0 Data Rate = 10SPS 4 -50 Gain (dB) The ADS1230 uses a sinc digital filter with the frequency response (fCLK = 4.9152MHz) shown in Figure 21. The frequency response repeats at multiples of the modulator sampling frequency of 76.8kHz. The overall response is that of a low-pass filter with a –3dB cutoff frequency of 3.32Hz with the SPEED pin tied low (10SPS data rate) and 11.64Hz with the SPEED pin tied high (80SPS data rate). -100 0 fCLK = 4.9152MHz -20 -150 0 -40 20 30 40 50 60 70 80 90 100 Frequency (Hz) -60 Gain (dB) 10 (a) -80 -100 -50 -120 Data Rate = 10SPS -140 -180 -200 0 38.4 76.8 Frequency (kHz) Gain (dB) -160 -100 Figure 21. Frequency Response To help see the response at lower frequencies, Figure 22(a) illustrates the response out to 100Hz, when the data rate = 10SPS. Notice that signals at multiples of 10Hz are rejected, and therefore simultaneous rejection of 50Hz and 60Hz is achieved. The benefit of using a sinc4 filter is that every frequency notch has four zeros on the same location. This response, combined with the low drift internal oscillator, provides an excellent normal-mode rejection of line-cycle interference. Figure 22(b) shows the same plot, but zooms in on the 50Hz and 60Hz notches with the SPEED pin tied low (10SPS data rate). With only a ±3% variation of the internal oscillator, over 100dB of normal-mode rejection is achieved. 12 -150 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Frequency (Hz) (b) Figure 22. Frequency Response Out To 100Hz The ADS1230 data rate and frequency response scale directly with clock frequency. For example, if fCLK increases from 4.9152MHz to 6.144MHz when the SPEED pin is tied high, the data rate increases from 80SPS to 100SPS, while notches also increase from 80Hz to 100Hz. Note that these changes are only possible when the external clock source is applied. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 SETTLING TIME DATA FORMAT In certain instances, large changes in input will require settling time. For example, an external multiplexer in front of the ADS1230 can put large changes in input voltage by simply switching the multiplexer input channels. Abrupt changes in the input will require four data conversion cycles to settle. When continuously converting, five readings may be necessary in order to settle the data. If the change in input occurs in the middle of the first conversion, four more full conversions of the fully-settled input are required to get fully-settled data. Discard the first four readings because they contain only partially-settled data. Figure 23 illustrates the settling time for the ADS1230 in Continuous Conversion mode. The ADS1230 outputs 20 bits of data in binary two’s complement format. The least significant bit (LSB) has a weight of 0.5VREF/(219 – 1). The positive full-scale input produces an output code of 7FFFFh and the negative full-scale input produces an output code of 800000h. The output clips at these codes for signals exceeding full-scale. Table 4 summarizes the ideal output codes for different input signals. The ADS1230 is a 20-bit ADC. After data conversion is completed, applying 20 SCLKs retrieves 20 bits of data (MSB first). However, if the SCLKs continue to be applied after 20 bits of data are retrieved, the DOUT pin outputs four 1s for the 21st through the 24th SCLK, as shown in Figure 24. DATA RATE Table 4. Ideal Output Code vs Input Signal(1) The ADS1230 data rate is set by the SPEED pin, as shown in Table 3. When SPEED is low, the data rate is nominally 10SPS. This data rate provides the lowest noise, and also has excellent rejection of both 50Hz and 60Hz line-cycle interference. For applications requiring fast data rates, setting SPEED high selects a data rate of nominally 80SPS. Table 3. Data Rate Settings INPUT SIGNAL VIN (AINP – AINN) IDEAL OUTPUT ≥ +0.5VREF/Gain 7FFFFh 19 – 1) 00001h 0 00000h (–0.5VREF/Gain)/(219 – 1) FFFFFh ≤ –0.5VREF/Gain 80000h (+0.5VREF/Gain)/(2 (1) DATA RATE SPEED PIN Internal Oscillator or 4.9152MHz Crystal External Oscillator 0 10SPS fCLKIN / 491,520 1 80SPS fCLKIN / 61,440 Excludes effects of noise, INL, offset, and gain errors. Abrupt Change in External VIN VIN 2nd Conversion; VIN settled, but digital filter unsettled. 1st Conversion; includes unsettled VIN. Start of Conversion DRDY/DOUT 4th Conversion; VIN settled, but digital filter unsettled. 3rd Conversion; VIN settled, but digital filter unsettled. 5th Conversion; VIN and digital filter both settled. Conversion Time Figure 23. Settling Time in Continuous Conversion Mode Data Data Ready New Data Ready MSB DRDY/DOUT SCLK LSB 19 18 1 2 17 3 0 20 1 21 2 22 4 3 23 24 Figure 24. Data Retrieval Format Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 13 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 DATA READY/DATA OUTPUT (DRDY/DOUT) DATA RETRIEVAL This digital output pin serves two purposes. First, it indicates when new data are ready by going low. Afterwards, on the first rising edge of SCLK, the DRDY/DOUT pin changes function and begins outputting the conversion data, most significant bit (MSB) first. Data are shifted out on each subsequent SCLK rising edge. After all 20 bits have been retrieved, the pin can be forced high with an additional SCLK. It then stays high until new data are ready. This configuration is useful when polling on the status of DRDY/DOUT to determine when to begin data retrieval. The ADS1230 continuously converts the analog input signal. To retrieve data, wait until DRDY/DOUT goes low, as shown in Figure 25. After DRDY/DOUT goes low, begin shifting out the data by applying SCLKs. Data are shifted out MSB first. It is not required to shift out all 20 bits of data, but the data must be retrieved before new data are updated (within tCONV) or else the data will be overwritten. Avoid data retrieval during the update period (tUPDATE). If 24 SCLKs have been applied, DRDY/DOUT will be high since the last four bits have been appended by '1'. However, if only 20 SCLKs have been applied, DRDY/DOUT remains at the state of the last bit shifted out until it is taken high (see tUPDATE), indicating that new data are being updated. To avoid having DRDY/DOUT remain in the state of the last bit, the 21st SCLK can be applied to force DRDY/DOUT high, as shown in Figure 26. This technique is useful when a host controlling the device is polling DRDY/DOUT to determine when data are ready. SERIAL CLOCK INPUT (SCLK) This digital input shifts serial data out with each rising edge. This input has built-in hysteresis, but care should still be taken to ensure a clean signal. Glitches or slow-rising signals can cause unwanted additional shifting. For this reason, it is best to make sure the rise and fall times of SCLK are both less than 50ns. 14 Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 Data a) 20 Bits of Data Retrieval New Data Ready Data Ready MSB DRDY/DOUT LSB 19 17 18 0 tPD tHT tDS tSCLK tUPDATE 1 SCLK 20 tSCLK tCONV Data b) 24 Bits of Data Retrieval New Data Ready Data Ready MSB DRDY/DOUT LSB 19 18 17 0 4 tHT tPD tDS tUPDATE tSCLK 1 SCLK 3 2 1 20 21 22 23 24 tSCLK tCONV Figure 25. Data Retrieval Timing SYMBOL tDS DESCRIPTION MIN DRDY/DOUT low to first SCLK rising edge tSCLK SCLK rising edge to new data bit valid: propagation delay tHT SCLK rising edge to old data bit valid: hold time 0 Data updating: no readback allowed 39 (1) Conversion time (1/data rate) UNITS ns 100 tPD tCONV(1) MAX 0 SCLK positive or negative pulse width tUPDATE(1) TYP ns 50 ns ns μs SPEED = 1 12.5 ms SPEED = 0 100 ms Value given for fCLK = 4.9152MHz. For different fCLK frequencies, scale proportional to CLK period. Data Data Ready New Data Ready DRDY/DOUT 19 18 17 1 SCLK 0 20 21 21st SCLK to Force DRDY/DOUT High Figure 26. Data Retrieval with DRDY/DOUT Forced High Afterwards Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 15 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 OFFSET CALIBRATION During this time, the analog input pins are disconnected within the ADC and the appropriate signal is applied internally to perform the calibration. When the calibration is completed, DRDY/DOUT goes low, indicating that new data are ready. The first conversion after a calibration is fully settled and valid for use. The offset calibration takes exactly the same time as specified in (tCAL) immediately after the falling edge of the 26th SCLK. Offset calibration can be initiated at any time to remove the ADS1230 inherited offset error. To initiate offset calibration, apply at least two additional SCLKs after retrieving 20 bits of data plus four bits of '1'. Figure 27 shows the timing pattern. The 25th SCLK keeps DRDY/DOUT high. The falling edge of the 26th SCLK begins the calibration cycle. Additional SCLK pulses may be sent after the 26th SCLK; however, activity on SCLK should be minimized during offset calibration for best results. Data Ready After Calibration DRDY/DOUT 19 18 17 0 1 2 3 19 4 Calibration Begins SCLK 1 20 21 22 23 24 25 26 tCAL Figure 27. Offset-Calibration Timing SYMBOL tCAL (1) (1) 16 DESCRIPTION First data ready after calibration MIN MAX UNITS SPEED = 1 101.28 101.29 ms SPEED = 0 801.02 801.03 ms Value given for fCLK = 4.9152MHz. For different fCLK frequencies, scale proportional to CLK period. Expect a ±3% variation when an internal oscillator is used. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 STANDBY MODE When tSTANDBY has passed with SCLK held high, Standby mode activates. DRDY/DOUT stays high when Standby mode begins. SCLK must remain high to stay in Standby mode. To exit Standby mode (wakeup), set SCLK low. The first data after exiting Standby mode is valid. Standby mode dramatically reduces power consumption by shutting down most of the circuitry. In Standby mode, the entire analog circuitry is powered down and only the clock source circuitry is awake to reduce the wake-up time from the Standby mode. To enter Standby mode, simply hold SCLK high after DRDY/DOUT goes low; see Figure 28. Standby mode can be initiated at any time during readback; it is not necessary to retrieve all 20 bits of data beforehand. Data Ready Standby Mode DRDY/DOUT SCLK 19 18 17 0 1 Start Conversion 19 20 tDSS tSTANDBY tS_RDY Figure 28. Standby Mode Timing (can be used for single conversions) SYMBOL tDSS (1) tSTANDBY (1) tS_RDY (1) (1) DESCRIPTION MIN MAX UNITS SCLK high after DRDY/DOUT goes low SPEED = 1 to activate Standby mode SPEED = 0 0 12.44 ms 0 99.94 ms SPEED = 1 20 SPEED = 0 20 SPEED = 1 52.51 52.51 ms SPEED = 0 401.8 401.8 ms Standby mode activation time Data ready after exiting Standby mode μs μs Value given for fCLK = 4.9152MHz. For different fCLK frequencies, scale proportional to CLK period. Expect a ±3% variation when an internal oscillator is used. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 17 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 STANDBY MODE WITH OFFSET-CALIBRATION To force an offset-calibration with Standby mode, shift 25 SCLKs and bring the SCLK pin high to enter Standby mode. Offset-calibration then begins after wake-up; Figure 29 shows the appropriate timing. Note the extra time needed after wake-up for calibration before data are ready. The first data after Standby mode with offset-calibration is fully settled and can be used right away. Offset-calibration can be set to run immediately after exiting Standby mode. This option is useful when the ADS1230 is put in Standby mode for long periods of time, and offset-calibration is desired afterwards to compensate for temperature or supply voltage changes. Standby Mode DRDY/DOUT SCLK 19 18 17 0 1 20 1 21 2 22 3 23 Data Ready After Calibration Begin Calibration 4 24 19 25 tSTANDBY tSC_RDY Figure 29. Standby Mode with Offset-Calibration Timing (can be used for single conversions) SYMBOL tSC_RDY (1) (1) 18 DESCRIPTION Data ready after exiting Standby mode and calibration MIN MAX UNITS SPEED = 1 103 103 ms SPEED = 0 803 803 ms Value given for fCLK = 4.9152MHz. For different fCLK frequencies, scale proportional to CLK period. Expect a ±3% variation when an internal oscillator is used. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 POWER-UP SEQUENCE blank When powering up the ADS1230, AVDD and DVDD must be powered up before the PDWN pin goes high, as shown in Figure 30. If PDWN is not controlled by a microprocessor, a simple RC delay circuit must be implemented, as shown in Figure 31. AVDD DVDD PDWN ³ 10ms POWER-DOWN MODE Power-Down mode shuts down the entire ADC circuitry and reduces the total power consumption close to zero. To enter Power-Down mode, simply hold the PDWN pin low. Power-Down mode also resets the entire circuitry to free the ADC circuitry from locking up to an unknown state. Power-Down mode can be initiated at any time during readback; it is not necessary to retrieve all 20 bits of data beforehand. Figure 32 shows the wake-up timing from Power-Down mode. Figure 30. Power-Up Timing Sequence DVDD(1) 1.2kW 2.2nF blank Connect to ADS1230 PDWN pin NOTE: (1) AVDD must be powered up at least 10ms before PDWN goes high. blank blank Figure 31. RC Delay Circuit Start Conversion Power-Down Mode tPDWN Data Ready CLK Source Wakeup PDWN DRDY/DOUT tTS_RDY tWAKEUP SCLK Figure 32. Wake-Up Timing from Power-Down Mode SYMBOL (1) DESCRIPTION tWAKEUP Wake-up time after Power-Down mode tPDWN (1) PDWN pulse width MIN Internal clock External clock 26 TYP UNITS 7.95 μs 0.16 μs μs Value given for fCLK = 4.9152MHz. For different fCLK frequencies, scale proportional to CLK period. Expect a ±3% variation when an internal oscillator is used. Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 19 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 APPLICATION EXAMPLES FS ǒFS Ǔ LC Noise−Free Counts + ǒ2 BITEffǓ AD Weigh Scale System Figure 33 shows a typical ADS1230 hook-up as part of a weigh scale system. In this setup, the ADS1230 is configured at a 10SPS data rate. Note that the internal oscillator is used by grounding the CLKIN pin. The user can also apply a 4.9152MHz clock to the CLKIN pin. For a typical 2mV/V load cell, the maximum output signal is approximately 10mV for a single +5V excitation voltage. The ADS1230 can achieve 17.5 noise-free bits at 10SPS when PGA = 128. With the extra software filtering/averaging (typically done by a microprocessor), an extra bit can be expected. Where: BITEFF = effective noise-free bits (17.5 + 1 bit from software filtering/averaging) FSLC = full-scale output of the load cell (10mV) FSAD = full-scale input of the ADS1230 (39mV, when PGA = 128) Therefore: Noise−Free Counts + ǒ2 (17.5)1)Ǔ 10mV + 95, 058 39mV ǒ Ǔ With +5V supply voltage, 95,058 noise-free counts can be expected from the ADS1230. 2.7V to 5.3V 3V 0.1mF 12 1 AVDD VDD DVDD 10 REFP 5 CAP 16 DRDY/DOUT 0.1mF 6 - 15 CAP SCLK 14 + ADS1230 7 8 MSP430x4xx or Other Microprocessor PDWN AINP AINN GAIN 4 3 CLKIN 13 SPEED 9 REFN AGND 11 GND DGND 2, 4 Figure 33. Weigh Scale Application 20 Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 SUMMARY OF SERIAL INTERFACE WAVEFORMS Data a) 20 Bits of Data Retrieval New Data Ready Data Ready MSB DRDY/DOUT LSB 19 17 18 0 tPD tHT tDS tSCLK tUPDATE 1 SCLK 20 tSCLK tCONV Data b) 24 Bits of Data Retrieval New Data Ready Data Ready MSB DRDY/DOUT LSB 19 18 17 0 3 2 1 4 tHT tPD tDS tUPDATE tSCLK 1 SCLK 20 21 22 23 24 tSCLK tCONV c) Data Retrieval with DRDY/DOUT Forced High Afterwards Data Data Ready New Data Ready DRDY/DOUT 19 18 17 0 1 SCLK 20 21 21st SCLK to Force DRDY/DOUT High d) Standby Mode/Single Conversions Data Ready Standby Mode DRDY/DOUT SCLK 19 18 17 1 0 Start Conversion 19 20 tDSS tSTANDBY tS_RDY Figure 34. Summary of Data Retrieval Waveforms Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 21 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 21st SCLK to Force DRDY/DOUT High Data Ready After Calibration a) Offset Calibration Timing DRDY/DOUT 18 19 17 0 1 2 3 19 4 Calibration Begins 1 SCLK 21 20 22 23 24 25 26 tCAL Data Ready b) Standby Mode/Single Conversions DRDY/DOUT 19 SCLK Standby Mode 18 17 0 1 Start Conversion 20 tDSS tSTANDBY tS_RDY Standby Mode c) Standby Mode/Single Conversions with Offset Calibration DRDY/DOUT SCLK 19 19 18 1 17 0 20 1 21 2 22 3 23 Data Ready After Calibration Begin Calibration 4 24 19 25 tSTANDBY tSC_RDY Figure 35. Summary of Standby Mode and Calibration Waveforms 22 Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 ADS1230 www.ti.com SBAS366A – OCTOBER 2006 – REVISED JULY 2007 Revision History Changes from Original (October 2006) to Revision A .................................................................................................... Page • • • • • • • Deleted min and max values for Data Rate Internal Oscillator.............................................................................................. 3 Changed Normal Mode Rejection format and added min values .......................................................................................... 3 Changed Voltage Reference Input section .......................................................................................................................... 11 Changed Figure 19 ............................................................................................................................................................. 11 Deleted second sentence of Serial Clock Input (SCLK) section.......................................................................................... 14 Added Power-Up Sequence section with new text and two new figures (Figure 30 and Figure 31) .................................. 19 Changed Figure 33 ............................................................................................................................................................. 20 Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): ADS1230 23 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) ADS1230IPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS1230IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS1230IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS1230IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device ADS1230IPWR Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS1230IPWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. 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