TI TLV320AIC23BIPW

!"# #$! %$&'
Data Manual
February 2004
Digital Audio Products
SLWS106H
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Contents
Section
1
2
3
Title
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5
Terminal Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1
Absolute Maximum Ratings Over Operating Free-Air Temperature
Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3
Electrical Characteristics Over Recommended Operating
Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.1
ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.2
DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.3
Analog Line Input to Line Output (Bypass) . . . . . . . . . . . . .
2.3.4
Stereo Headphone Output . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.5
Analog Reference Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.6
Digital I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.7
Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4
Digital-Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.1
Audio Interface (Master Mode) . . . . . . . . . . . . . . . . . . . . . . .
2.4.2
Audio Interface (Slave-Mode) . . . . . . . . . . . . . . . . . . . . . . . .
2.4.3
Three-Wire Control Interface (SDIN) . . . . . . . . . . . . . . . . . .
2.4.4
Two-Wire Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . .
How to Use the TLV320AIC23B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
Control Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.1
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.2
2-Wire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.3
Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
Analog Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.1
Line Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.2
Microphone Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.3
Line Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.4
Headphone Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.5
Analog Bypass Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.6
Sidetone Insertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.1
Digital Audio-Interface Modes . . . . . . . . . . . . . . . . . . . . . . . .
Page
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iii
3.3.2
Audio Sampling Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−9
3.3.3
Digital Filter Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3−11
A Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A−1
iv
List of Illustrations
Figure
2−1
2−2
2−3
2−4
2−5
3−1
3−2
3−3
3−4
3−5
3−6
3−7
3−8
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3−10
3−11
3−12
3−13
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3−15
3−16
3−17
3−18
3−19
3−20
3−21
3−22
3−23
3−24
3−25
3−26
Title
System-Clock Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Master-Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Slave-Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Three-Wire Control Interface Timing Requirements . . . . . . . . . . . . . . . . . .
Two-Wire Control Interface Timing Requirements . . . . . . . . . . . . . . . . . . .
SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-Wire Compatible Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog Line Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Microphone Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Right-Justified Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Left-Justified Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2S Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DSP Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital De-Emphasis Filter Response − 44.1 kHz Sampling . . . . . . . . . . .
Digital De-Emphasis Filter Response − 48 kHz Sampling . . . . . . . . . . . .
ADC Digital Filter Response 0: USB Mode
(Group Delay = 12 Output Samples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Digital Filter Ripple 0: USB
(Group Delay = 20 Output Samples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Digital Filter Response 1: USB Mode Only . . . . . . . . . . . . . . . . . . . .
ADC Digital Filter Ripple 1: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . .
ADC Digital Filter Response 2: USB mode and Normal Modes
(Group Delay = 3 Output Samples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Digital Filter Ripple 2: USB Mode and Normal Modes . . . . . . . . . . .
ADC Digital Filter Response 3: USB Mode Only . . . . . . . . . . . . . . . . . . . .
ADC Digital Filter Ripple 3: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Response 0: USB Mode . . . . . . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Ripple 0: USB Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Response 1: USB Mode Only . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Ripple 1: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Response 2: USB Mode and Normal Modes . . . . . . . .
DAC Digital Filter Ripple 2: USB Mode and Normal Modes . . . . . . . . . . .
DAC Digital Filter Response 3: USB Mode Only . . . . . . . . . . . . . . . . . . . .
DAC Digital Filter Ripple 3: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . .
Page
2−5
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3−1
3−2
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v
vi
1 Introduction
The TLV320AIC23B is a high-performance stereo audio codec with highly integrated analog functionality. The
analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) within the TLV320AIC23B use multibit
sigma-delta technology with integrated oversampling digital interpolation filters. Data-transfer word lengths of 16, 20,
24, and 32 bits, with sample rates from 8 kHz to 96 kHz, are supported. The ADC sigma-delta modulator features
third-order multibit architecture with up to 90-dBA signal-to-noise ratio (SNR) at audio sampling rates up to 96 kHz,
enabling high-fidelity audio recording in a compact, power-saving design. The DAC sigma-delta modulator features
a second-order multibit architecture with up to 100-dBA SNR at audio sampling rates up to 96 kHz, enabling
high-quality digital audio-playback capability, while consuming less than 23 mW during playback only. The
TLV320AIC23B is the ideal analog input/output (I/O) choice for portable digital audio-player and recorder
applications, such as MP3 digital audio players.
Integrated analog features consist of stereo-line inputs with an analog bypass path, a stereo headphone amplifier,
with analog volume control and mute, and a complete electret-microphone-capsule biasing and buffering solution.
The headphone amplifier is capable of delivering 30 mW per channel into 32 Ω. The analog bypass path allows use
of the stereo-line inputs and the headphone amplifier with analog volume control, while completely bypassing the
codec, thus enabling further design flexibility, such as integrated FM tuners. A microphone bias-voltage output
provides a low-noise current source for electret-capsule biasing. The AIC23B has an integrated adjustable
microphone amplifier (gain adjustable from 1 to 5) and a programmable gain microphone amplifier (0 dB or 20 dB).
The microphone signal can be mixed with the output signals if a sidetone is required.
While the TLV320AIC23B supports the industry-standard oversampling rates of 256 fs and 384 fs, unique
oversampling rates of 250 fs and 272 fs are provided, which optimize interface considerations in designs using TI C54x
digital signal processors (DSPs) and universal serial bus (USB) data interfaces. A single 12-MHz crystal can supply
clocking to the DSP, USB, and codec. The TLV320AIC23B features an internal oscillator that, when connected to a
12-MHz external crystal, provides a system clock to the DSP and other peripherals at either 12 MHz or 6 MHz, using
an internal clock buffer and selectable divider. Audio sample rates of 48 kHz and compact-disc (CD) standard 44.1
kHz are supported directly from a 12-MHz master clock with 250 fs and 272 fs oversampling rates.
Low power consumption and flexible power management allow selective shutdown of codec functions, thus
extending battery life in portable applications. This design solution, coupled with the industry’s smallest package, the
TI proprietary MicroStar Junior using only 25 mm2 of board area, makes powerful portable stereo audio designs
easily realizable in a cost-effective, space-saving total analog I/O solution: the TLV320AIC23B.
1.1 Features
•
High-Performance Stereo Codec
−
−
−
−
−
•
Software Control Via TI McBSP-Compatible Multiprotocol Serial Port
−
−
•
90-dB SNR Multibit Sigma-Delta ADC (A-weighted at 48 kHz)
100-dB SNR Multibit Sigma-Delta DAC (A-weighted at 48 kHz)
1.42 V – 3.6 V Core Digital Supply: Compatible With TI C54x DSP Core Voltages
2.7 V – 3.6 V Buffer and Analog Supply: Compatible Both TI C54x DSP Buffer Voltages
8-kHz – 96-kHz Sampling-Frequency Support
2-wire-Compatible and SPI-Compatible Serial-Port Protocols
Glueless Interface to TI McBSPs
Audio-Data Input/Output Via TI McBSP-Compatible Programmable Audio Interface
−
−
−
I2S-Compatible Interface Requiring Only One McBSP for both ADC and DAC
Standard I2S, MSB, or LSB Justified-Data Transfers
16/20/24/32-Bit Word Lengths
MicroStar Junior is a trademark of Texas Instruments.
1−1
−
−
−
•
Integrated Total Electret-Microphone Biasing and Buffering Solution
−
−
−
•
Low-Noise MICBIAS pin at 3/4 AVDD for Biasing of Electret Capsules
Integrated Buffer Amplifier With Tunable Fixed Gain of 1 to 5
Additional Control-Register Selectable Buffer Gain of 0 dB or 20 dB
Stereo-Line Inputs
−
−
Integrated Programmable Gain Amplifier
Analog Bypass Path of Codec
•
ADC Multiplexed Input for Stereo-Line Inputs and Microphone
•
Stereo-Line Outputs
−
Analog Stereo Mixer for DAC and Analog Bypass Path
•
Volume Control With Mute on Input and Output
•
Highly Efficient Linear Headphone Amplifier
−
•
•
23-mW Power Consumption During Playback Mode
Standby Power Consumption <150 µW
Power-Down Power Consumption <15 µW
Industry’s Smallest Package: 32-Pin TI Proprietary MicroStar Junior
−
−
•
30 mW into 32 Ω From a 3.3-V Analog Supply Voltage
Flexible Power Management Under Total Software Control
−
−
−
1−2
Audio Master/Slave Timing Capability Optimized for TI DSPs (250/272 fs), USB mode
Industry-Standard Master/Slave Support Provided Also (256/384 fs), Normal mode
Glueless Interface to TI McBSPs
25 mm2 Total Board Area
28-Pin TSSOP Also Is Available (62 mm2 Total Board Area)
Ideally Suitable for Portable Solid-State Audio Players and Recorders
1.2 Functional Block Diagram
VMID
VMID
AVDD
1.0X
50 kΩ
DSPcodec
TLV320AIC23B
VDAC
1.0X
VADC
50 kΩ
1.0X
AGND
CS
Control
Interface
1.5X
MICBIAS
SDIN
SCLK
MODE
12 to −34.5 dB,
1.5 dB Steps
Σ−∆
ADC
2:1
MUX
Line
Mute
RLINEIN
Bypass Mute,
Mute 0 dB, 20 dB
50 kΩ
10 kΩ
VADC
MICIN
VMID
12 to −34 dB,
1.5 dB Steps
HPVDD
HPGND
Headphone
Driver
6 to −73 dB,
1 dB Steps
Σ−∆
ADC
2:1
MUX
Line
Mute
LLINEIN
Side Tone
Mute
BVDD
DGND
Bypass
Mute
Σ
RHPOUT
DVDD
Digital
Filters
Σ−∆
DAC
ROUT
VDAC
LOUT
Σ
LHPOUT
Headphone
Driver
6 to −73 dB,
1 dB Steps
Σ−∆
DAC
CLKIN
Divider
(1x, 1/2x)
LRCIN
XTI/MCLK
XTO
OSC
CLKOUT
Divider
(1x, 1/2x)
CLKOUT
Digital
Audio
Interface
DIN
LRCOUT
DOUT
BCLK
NOTE: MCLK, BCLK, and SCLK are all asynchronous to each other.
1−3
1.3 Terminal Assignments
NC
XTO
DVDD
DGND
BVDD
CLKOUT
BCLK
DIN
NC
GQE/ZQE PACKAGE
(TOP VIEW)
25 24 23 22 21 20 19 18 17
29
13
MODE
LHPOUT
30
12
CS
RHPOUT
31
11
LLINEIN
HPGND
32
10
RLINEIN
1
2
3
4
5
6
7
8
9
NC
HPVDD
MICIN
SDIN
MICBIAS
LRCOUT
14
VMID
SCLK
28
AGND
DOUT
15
AVDD
XTI/MCLK
27
ROUT
16
LOUT
26
NC
LRCIN
RHD PACKAGE
(TOP VIEW)
1−4
CLKOUT
BVDD
DGND
DVDD
XTO
XTI/MCLK
27
26
25
24
23
22
19
MODE
LROUT
4
18
CS
HPVDD
5
17
LLNEIN
LHPOUT
6
16
RUNEIN
RHPOUT
7
15
MICIN
14
3
MICBIAS
DOUT
13
SDIN
VMID
20
12
2
AGND
LRCIN
11
SCLK
AVDD
21
10
1
ROUT
DIN
9
DGND
DVDD
XTO
XTI/MCLK
SCLK
SDIN
MODE
CS
LLINEIN
RLINEIN
MICIN
MICBIAS
VMID
AGND
LOUT
28
27
26
25
24
23
22
21
20
19
18
17
16
15
8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
HPGND
BVDD
CLKOUT
BCLK
DIN
LRCIN
DOUT
LRCOUT
HPVDD
LHPOUT
RHPOUT
HPGND
LOUT
ROUT
AVDD
BCLK
PW PACKAGE
(TOP VIEW)
28
NC − No internal connection
1.4 Ordering Information
PACKAGE
TA
32-Pin
MicroStar Junior GQE/ZQE
28-Pin
TSSOP PW
28-Pin
PQFP RHD
−10°C to 70°C
TLV320AIC23BGQE/ZQE
TLV320AIC23BPW
TLV320AIC23BRHD
−40°C to 85°C
TLV320AIC23BIGQE/ZQE
TLV320AIC23BIPW
TLV320AIC23BIRHD
1.5 Terminal Functions
TERMINAL
NO.
NAME
I/O
DESCRIPTION
GQE/
ZQE
PW
RHD
AGND
5
15
12
Analog supply return
AVDD
4
14
11
BCLK
23
3
28
Analog supply input. Voltage level is 3.3 V nominal.
I2S serial-bit clock. In audio master mode, the AIC23B generates this signal and sends it to the
DSP. In audio slave mode, the signal is generated by the DSP.
BVDD
21
1
26
CLKOUT
22
2
27
O
Clock output. This is a buffered version of the XTI input and is available in 1X or 1/2X frequencies
of XTI. Bit 07 in the sample rate control register controls frequency selection.
CS
12
21
18
I
DIN
24
4
1
I
Control port input latch/address select. For SPI control mode this input acts as the data latch
control. For 2-wire control mode this input defines the seventh bit in the device address field.
See Section 3.1 for details.
I2S format serial data input to the sigma-delta stereo DAC
DGND
20
28
25
DOUT
27
6
3
O
Digital supply return
I2S format serial data output from the sigma-delta stereo ADC
DVDD
19
27
24
Digital supply input. Voltage range is 1.4 V to 3.6 V.
HPGND
32
11
8
Analog headphone amplifier supply return
HPVDD
29
8
5
LHPOUT
30
9
6
O
Left stereo mixer-channel amplified headphone output. Nominal 0-dB output level is 1 VRMS.
Gain of –73 dB to 6 dB is provided in 1-dB steps.
LLINEIN
11
20
17
I
Left stereo-line input channel. Nominal 0-dB input level is 1 VRMS. Gain of –34.5 dB to 12 dB is
provided in 1.5-dB steps.
LOUT
2
12
9
O
LRCIN
26
5
2
I/O
Left stereo mixer-channel line output. Nominal output level is 1.0 VRMS.
I2S DAC-word clock signal. In audio master mode, the AIC23B generates this framing signal
and sends it to the DSP. In audio slave mode, the signal is generated by the DSP.
LRCOUT
28
7
4
I/O
I2S ADC-word clock signal. In audio master mode, the AIC23B generates this framing signal
and sends it to the DSP. In audio slave mode, the signal is generated by the DSP.
MICBIAS
7
17
14
O
Buffered low-noise-voltage output suitable for electret-microphone-capsule biasing. Voltage
level is 3/4 AVDD nominal.
MICIN
8
18
15
I
Buffered amplifier input suitable for use with electret-microphone capsules. Without external
resistors a default gain of 5 is provided. See Section 2.3.1.2 for details.
MODE
13
22
19
I
Serial-interface-mode input. See Section 3.1 for details.
NC
I/O
Buffer supply input. Voltage range is from 2.7 V to 3.6 V.
Analog headphone amplifier supply input. Voltage level is 3.3 V nominal.
1, 9
17, 25
Not Used—No internal connection
RHPOUT
31
10
7
O
Right stereo mixer-channel amplified headphone output. Nominal 0-dB output level is 1 VRMS.
Gain of −73 dB to 6 dB is provided in 1-dB steps.
RLINEIN
10
19
16
I
Right stereo-line input channel. Nominal 0-dB input level is 1 VRMS. Gain of –34.5 dB to 12 dB is
provided in 1.5-dB steps.
ROUT
3
13
10
O
Right stereo mixer-channel line output. Nominal output level is 1.0 VRMS.
1−5
1.5
Terminal Functions (continued)
TERMINAL
NO.
I/O
DESCRIPTION
21
I
Control-port serial-data clock. For SPI and 2-wire control modes this is the serial-clock input.
See Section 3.1 for details.
23
20
I
Control-port serial-data input. For SPI and 2-wire control modes this is the serial-data input and
also is used to select the control protocol after reset. See Section 3.1 for details.
6
16
13
I
Midrail voltage decoupling input. 10-µF and 0.1-µF capacitors should be connected in parallel to
this terminal for noise filtering. Voltage level is 1/2 AVDD nominal.
XTI/MCLK
16
25
22
I
Crystal or external-clock input. Used for derivation of all internal clocks on the AIC23B.
XTO
18
26
23
O
Crystal output. Connect to external crystal for applications where the AIC23B is the audio timing
master. Not used in applications where external clock source is used.
NAME
GQE/
ZQE
PW
RHD
SCLK
15
24
SDIN
14
VMID
1−6
2 Specifications
2.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless
otherwise noted)†
Supply voltage range, AVDD to AGND, DVDD to DGND, BVDD to DGND, HPVDD to HPGND
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to + 3.63 V
Analog supply return to digital supply return, AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to + 3 .63 V
Input voltage range, all input signals: Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to DVDD + 0.3 V
Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to AVDD + 0.3 V
Case temperature for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Operating free-air temperature range, TA: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −10°C to 70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: DVDD may not exceed BVDD + 0.3V; BVDD may not exceed AVDD + 0.3V or HPVDD + 0.3.
2.2 Recommended Operating Conditions
MIN
NOM
MAX
Analog supply voltage, AVDD, HPVDD (see Note 2)
2.7
3.3
3.6
V
Digital buffer supply voltage, BVDD (see Note 2)
2.7
3.3
3.6
V
Digital core supply voltage, DVDD (see Note 2)
1.42
1.5
3.6
V
Analog input voltage, full scale − 0dB (AVDD = 3.3 V)
UNIT
1
VRMS
kΩ
CLKOUT digital output load capacitance
20
pF
All other digital output load capacitance
10
pF
Stereo-line output load capacitance
50
Stereo-line output load resistance
10
Headphone-amplifier output load resistance
XTI master clock Input
ADC or DAC conversion rate
Operating free-air temperature, TA
Ω
0
pF
18.43
MHz
96
kHz
Commercial
−10
70
Industrial
−40
85
°C
NOTE 2: Digital voltage values are with respect to DGND; analog voltage values are with respect to AGND.
2−1
2.3 Electrical Characteristics Over Recommended Operating Conditions, AVDD,
HPVDD, BVDD = 3.3 V, DVDD = 1.5 V, Slave Mode, XTI/MCLK = 256fs, fs = 48 kHz
(unless otherwise stated)
2.3.1
ADC
2.3.1.1 Line Input to ADC
PARAMETER
TEST CONDITIONS
MIN
Input signal level (0 dB)
TYP
MAX
1
fs = 48 kHz (3.3 V)
fs = 48 kHz (2.7 V)
Signal-to-noise ratio, A-weighted, 0-dB gain (see Notes 3
and 4)
85
90
dB
90
Dynamic range, A-weighted, −60-dB full-scale input (see
Note 4)
AVDD = 3.3 V
AVDD = 2.7 V
Total harmonic distortion, −1-dB input, 0-dB gain
AVDD = 3.3 V
AVDD = 2.7 V
Power supply rejection ratio
1 kHz, 100 mVpp
50
dB
ADC channel separation
1 kHz input tone
90
dB
Programmable gain
1 kHz input tone, RSOURCE < 50 Ω
Programmable gain step size
Monotonic
Mute attenuation
0 dB, 1 kHz input tone
Input resistance
85
UNIT
VRMS
90
dB
90
–80
dB
80
–34.5
12
1.5
dB
80
12 dB Input gain
10
0 dB input gain
30
Input capacitance
dB
dB
20
kΩ
35
10
pF
NOTES: 3. Ratio of output level with 1-kHz full-scale input, to the output level with the input short circuited, measured A-weighted over a 20-Hz
to 20-kHz bandwidth using an audio analyzer.
4. All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter
results in higher THD + N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass
filter removes out-of-band noise, which, although not audible, may affect dynamic specification values.
2.3.1.2 Microphone Input to ADC, 0-dB Gain, fs = 8 kHz (40-KΩ Source Impedance, see Section 1.2,
Functional Block Diagram)
PARAMETER
TEST CONDITIONS
MIN
Input signal level (0 dB)
TYP
1.0
MAX
UNIT
VRMS
80
Signal-to-noise ratio, A-weighted, 0-dB gain (see Notes 3 and 4)
AVDD = 3.3 V
AVDD = 2.7 V
AVDD = 3.3 V
AVDD = 2.7 V
80
Dynamic range, A-weighted, −60-dB full-scale input (see Note 4)
Total harmonic distortion, −1-dB input, 0-dB gain
AVDD = 3.3 V
AVDD = 2.7 V
Power supply rejection ratio
1 kHz, 100 mVpp
50
dB
Programmable gain boost
1 kHz input tone, RSOURCE < 50 Ω
20
dB
Microphone-path gain
MICBOOST = 0, RSOURCE < 50 Ω
14
dB
Mute attenuation
0 dB, 1 kHz input tone
Input resistance
Input capacitance
85
84
dB
85
84
dB
–60
−60
dB
60
80
dB
8
14
kΩ
10
pF
NOTES: 3. Ratio of output level with 1-kHz full-scale input, to the output level with the input short circuited, measured A-weighted over a 20-Hz
to 20-kHz bandwidth using an audio analyzer.
4. All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter
results in higher THD + N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass
filter removes out-of-band noise, which, although not audible, may affect dynamic specification values.
2−2
2.3.1.3 Microphone Bias
PARAMETER
TEST CONDITIONS
Bias voltage
MIN
TYP
MAX
3/4 AVDD − 100 m
3/4 AVDD
3/4 AVDD + 100 m
V
3
mA
Bias-current source
Output noise voltage
2.3.2
1 kHz to 20 kHz
UNIT
25
nV/√Hz
DAC
2.3.2.1 Line Output, Load = 10 kΩ, 50 pF
PARAMETER
TEST CONDITIONS
MIN
0-dB full-scale output voltage (FFFFFF)
MAX
1.0
Signal-to-noise ratio, A-weighted, 0-dB gain (see Notes 3, 4, and 5)
AVDD = 3.3 V
AVDD = 2.7 V
Dynamic range, A-weighted (see Note 4)
AVDD = 3.3 V
AVDD = 2.7 V
AVDD = 3.3 V
Total harmonic distortion
AVDD = 2.7 V
Power supply rejection ratio
TYP
fs = 48kHz
fs = 48 kHz
90
100
dB
100
85
90
dB
TBD
1 kHz, 0 dB
–88
–80
1 kHz, −3 dB
−92
−86
1 kHz, 0 dB
−85
1 kHz, −3 dB
−88
1 kHz, 100 mVpp
DAC channel separation
UNIT
VRMS
dB
dB
50
dB
100
dB
NOTES: 3. Ratio of output level with 1-kHz full-scale input, to the output level with the input short circuited, measured A-weighted over a 20-Hz
to 20-kHz bandwidth using an audio analyzer.
4. All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter
results in higher THD + N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass
filter removes out-of-band noise, which, although not audible, may affect dynamic specification values.
5. Ratio of output level with 1-kHz full-scale input, to the output level with all zeros into the digital input, measured A-weighted over
a 20-Hz to 20-kHz bandwidth.
2.3.3
Analog Line Input to Line Output (Bypass)
PARAMETER
TEST CONDITIONS
MIN
0-dB full-scale output voltage
Signal-to-noise ratio, A-weighted, 0-dB gain (see Notes 3 and 4)
TYP
MAX
1.0
AVDD = 3.3 V
AVDD = 2.7 V
AVDD = 3.3 V
Total harmonic distortion
AVDD = 2.7 V
90
UNIT
VRMS
95
dB
95
1 kHz, 0 dB
–86
–80
1 kHz, −3 dB
−92
−86
1 kHz, 0 dB
−86
1 kHz, −3 dB
−92
dB
dB
Power supply rejection ratio
1 kHz, 100 mVpp
50
dB
DAC channel separation (left to right)
1 kHz, 0 dB
80
dB
NOTES: 3. Ratio of output level with 1-kHz full-scale input, to the output level with the input short circuited, measured A-weighted over a 20-Hz
to 20-kHz bandwidth using an audio analyzer.
4. All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter
results in higher THD + N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass
filter removes out-of-band noise, which, although not audible, may affect dynamic specification values.
2−3
2.3.4
Stereo Headphone Output
PARAMETER
TEST CONDITIONS
MIN
0-dB full-scale output voltage
TYP
MAX
1.0
Maximum output power, PO
RL = 32 Ω
30
RL = 16 Ω
40
Signal-to-noise ratio, A-weighted (see Note 4)
AVDD = 3.3 V
90
Total harmonic distortion
AVDD = 3.3 V,
1 kHz output
Power supply rejection ratio
1 kHz, 100 mVpp
Programmable gain
1 kHz output
mW
97
dB
PO = 10 mW
PO = 20 mW
0.1
1.0
50
1 kHz output
%
dB
−73
6
Programmable-gain step size
Mute attenuation
UNIT
VRMS
dB
1
dB
80
dB
NOTE 4: All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter results
in higher THD + N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes
out-of-band noise, which, although not audible, may affect dynamic specification values.
2.3.5
Analog Reference Levels
PARAMETER
MIN
TYP
Reference voltage
AVDD/2 − 50 mV
Divider resistance
40
2.3.6
VIL
VIH
Input low level
VOL
VOH
Output low level
V
60
kΩ
TYP
MAX
UNIT
0.3 × BVDD
V
0.7 × BVDD
V
0.1 × BVDD
0.9 × BVDD
Output high level
V
V
Supply Current
Total supply current,
No input signal
TEST CONDITIONS
MIN
TYP
Record and playback (all active)
20
24
26
Record and playback (osc, clk, and MIC output powered down)
16
18
20
Line playback only
6
7.5
9
Record only
11
13.5
15
Analog bypass (line in to line out)
4
4.5
6
1.5
3
Power down, DVDD = 1.5 V,
AVDD = BVDD = HPVDD = 3.3 V
2−4
AVDD/2 + 50 mV
50
MIN
Input high level
PARAMETER
ITOT
UNIT
Digital I/O
PARAMETER
2.3.7
MAX
Oscillator enabled
Oscillator disabled
0.8
0.01
MAX
UNIT
mA
2.4 Digital-Interface Timing
PARAMETER
MIN
High
18
Low
18
tw(1)
tw(2)
System-clock pulse duration, MCLK/XTI
tc(1)
System-clock period, MCLK/XTI
MAX
Propagation delay, CLKOUT
UNIT
ns
54
Duty cycle, MCLK/XTI
tpd(1)
TYP
ns
40/60%
60/40%
0
10
ns
tc(1)
tw(1)
tw(2)
MCLK/XTI
tpd(1)
CLKOUT
CLKOUT
(Div 2)
Figure 2−1. System-Clock Timing Requirements
2.4.1
Audio Interface (Master Mode)
PARAMETER
MIN
TYP
MAX
UNIT
tpd(2)
tpd(3)
Propagation delay, LRCIN/LRCOUT
0
10
ns
Propagation delay, DOUT
0
10
ns
tsu(1)
th(1)
Setup time, DIN
10
ns
Hold time, DIN
10
ns
BCLK
tpd(2)
LRCIN
LRCOUT
tpd(3)
DOUT
DIN
tsu(1)
th(1)
Figure 2−2. Master-Mode Timing Requirements
2−5
2.4.2
Audio Interface (Slave-Mode)
PARAMETER
tw(3)
tw(4)
Pulse duration, BCLK
MIN
High
20
Low
20
TYP
MAX
UNIT
ns
tc(2)
tpd(4)
Clock period, BCLK
50
tsu(2)
th(2)
Setup time, DIN
10
ns
Hold time, DIN
10
ns
tsu(3)
th(3)
Setup time, LRCIN
10
ns
Hold time, LRCIN
10
ns
Propagation delay, DOUT
0
tc(2)
tw(4)
tw(3)
BCLK
LRCIN
LRCOUT
tsu(2)
th(3)
tsu(3)
DIN
tpd(2)
th(2)
DOUT
Figure 2−3. Slave-Mode Timing Requirements
2−6
ns
10
ns
2.4.3
Three-Wire Control Interface (SDIN)
PARAMETER
tw(5)
tw(6)
Clock pulse duration, SCLK
MIN
High
20
Low
20
TYP
MAX
UNIT
ns
tc(3)
tsu(4)
Clock period, SCLK
80
ns
Clock rising edge to CS rising edge, SCLK
60
ns
tsu(5)
th(4)
Setup time, SDIN to SCLK
20
ns
20
ns
tw(7)
tw(8)
Hold time, SCLK to SDIN
Pulse duration, CS
High
20
Low
20
ns
tw(8)
CS
tc(3)
tw(5)
tw(6)
tsu(4)
SCLK
tsu(5)
th(4)
LSB
DIN
Figure 2−4. Three-Wire Control Interface Timing Requirements
2.4.4
Two-Wire Control Interface
PARAMETER
tw(9)
Clock pulse duration, SCLK
tw(10)
MIN
High
1.3
Low
600
f(sf)
Clock frequency, SCLK
th(5)
tsu(6)
Hold time (start condition)
600
Setup time (start condition)
600
th(6)
tsu(7)
Data hold time
tr
tf
Rise time, SDIN, SCLK
tsu(8)
Setup time (stop condition)
tsp
Pulse width of spikes suppressed by input filter
TYP
MAX
µs
ns
0
400
ns
100
600
tw(9)
tw(10)
ns
ns
Fall time, SDIN, SCLK
0
kHz
ns
900
Data setup time
UNIT
300
ns
300
ns
ns
50
ns
tsp
SCLK
th(5)
th(6)
tsu(7)
tsu(8)
DIN
Figure 2−5. Two-Wire Control Interface Timing Requirements
2−7
2−8
3 How to Use the TLV320AIC23B
3.1 Control Interfaces
The TLV320AIC23B has many programmable features. The control interface is used to program the registers of the
device. The control interface complies with SPI (three-wire operation) and two-wire operation specifications. The
state of the MODE terminal selects the control interface type. The MODE pin must be hardwired to the required level.
3.1.1
MODE
INTERFACE
0
2-wire
1
SPI
SPI
In SPI mode, SDIN carries the serial data, SCLK is the serial clock and CS latches the data word into the
TLV320AIC23B. The interface is compatible with microcontrollers and DSPs with an SPI interface.
A control word consists of 16 bits, starting with the MSB. The data bits are latched on the rising edge of SCLK. A rising
edge on CS after the 16th rising clock edge latches the data word into the AIC (see Figure 3-1).
The control word is divided into two parts. The first part is the address block, the second part is the data block:
B[15:9]
B[8:0]
Control Address Bits
Control Data Bits
CS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SCLK
SDIN
B15 B14 B13 B12 B11 B10 B9
B8
B7
B6
B5
MSB
B4
B3
B2
B1
B0
LSB
Figure 3−1. SPI Timing
3.1.2
2-Wire
In 2-wire mode, the data transfer uses SDIN for the serial data and SCLK for the serial clock. The start condition is
a falling edge on SDIN while SCLK is high. The seven bits following the start condition determine which device on
the 2-wire bus receives the data. R/W determines the direction of the data transfer. The TLV320AIC23B is a write only
device and responds only if R/W is 0. The device operates only as a slave device whose address is selected by setting
the state of the CS pin as follows.
CS STATE
(Default = 0)
ADDRESS
0
0011010
1
0011011
3−1
The device that recognizes the address responds by pulling SDIN low during the ninth clock cycle, acknowledging
the data transfer. The control follows in the next two eight-bit blocks. The stop condition after the data transfer is a
rising edge on SDIN when SCLK is high (see Figure 3-2).
The 16-bit control word is divided into two parts. The first part is the address block, the second part is the data block:
B[15:9]
B[8:0]
Control Address Bits
Control Data Bits
Start
Stop
1
SCLK
7
ADDR
SDI
8
9
1
8
9
R/W ACK B15 − B8 ACK
1
8
9
B7 − B0 ACK
Figure 3−2. 2-Wire Compatible Timing
3.1.3
Register Map
The TLV320AIC23B has the following set of registers, which are used to program the modes of operation.
ADDRESS
REGISTER
0000000
Left line input channel volume control
0000001
Right line input channel volume control
0000010
Left channel headphone volume control
0000011
Right channel headphone volume control
0000100
Analog audio path control
0000101
Digital audio path control
0000110
Power down control
0000111
Digital audio interface format
0001000
Sample rate control
0001001
Digital interface activation
0001111
Reset register
Left line input channel volume control (Address: 0000000)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
LRS
LIM
X
X
LIV4
LIV3
LIV2
LIV1
LIV0
Default
0
1
0
0
1
0
1
1
1
LRS
LIM
LIV[4:0]
X
3−2
Left/right line simultaneous volume/mute update
Simultaneous update
0 = Disabled
1 = Enabled
Left line input mute
0 = Normal
1 = Muted
Left line input volume control (10111 = 0 dB default)
11111 = +12 dB down to 00000 = –34.5 dB in 1.5-dB steps
Reserved
Right Line Input Channel Volume Control (Address: 0000001)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
RLS
RIM
X
X
RIV4
RIV3
RIV2
RIV1
RIV0
Default
0
1
0
0
1
0
1
1
1
RLS
Right/left line simultaneous volume/mute update
Simultaneous update
0 = Disabled
1 = Enabled
Right line input mute
0 = Normal
1 = Muted
Right line input volume control (10111 = 0 dB default)
11111 = +12 dB down to 00000 = –34.5 dB in 1.5-dB steps
Reserved
RIM
RIV[4:0]
X
Left Channel Headphone Volume Control (Address: 0000010)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
LRS
LZC
LHV6
LHV5
LHV4
LHV3
LHV2
LHV1
LHV0
Default
0
1
1
1
1
1
0
0
1
LRS
Left/right headphone channel simultaneous volume/mute update
Simultaneous update
0 = Disabled
1 = Enabled
Left-channel zero-cross detect
Zero-cross detect
0 = Off
1 = On
Left Headphone volume control (1111001 = 0 dB default)
1111111 = +6 dB, 79 steps between +6 dB and −73 dB (mute), 0110000 = −73 dB (mute),
any thing below 0110000 does nothing − you are still muted
LZC
LHV[6:0]
Right Channel Headphone Volume Control (Address: 0000011)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
RLS
RZC
RHV6
RHV5
RHV4
RHV3
RHV2
RHV1
RHV0
Default
0
1
1
1
1
1
0
0
1
RLS
Right/left headphone channel simultaneous volume/mute Update
Simultaneous update
0 = Disabled
1 = Enabled
Right-channel zero-cross detect
Zero-cross detect
0 = Off
1 = On
Right headphone volume control (1111001 = 0 dB default)
1111111 = +6 dB, 79 steps between +6 dB and −73 dB (mute), 0110000 = −73 dB (mute),
any thing below 0110000 does nothing − you are still muted
RZC
RHV[6:0]
Analog Audio Path Control (Address: 0000100)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
STA2
STA1
STA0
STE
DAC
BYP
INSEL
MICM
MICB
Default
0
0
0
0
0
1
0
1
0
STA[2:0] and STE
DAC
BYP
DAC select
Bypass
STE
STA2
STA1
STA0
ADDED SIDETONE
1
1
X
X
0 dB
1
0
0
0
−6 dB
1
0
0
1
−9 dB
1
0
1
0
−12 dB
1
0
1
1
−18 dB
0
X
X
X
Disabled
0 = DAC off
0 = Disabled
1 = DAC selected
1 = Enabled
3−3
INSEL
MICM
MICB
Input select for ADC
Microphone mute
Microphone boost
X
Reserved
0 = Line
0 = Normal
0=dB
1 = Microphone
1 = Muted
1 = 20dB
Digital Audio Path Control (Address: 0000101)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
X
X
X
X
DACM
DEEMP1
DEEMP0
ADCHP
Default
0
0
0
0
0
1
0
0
0
DACM
DEEMP[1:0]
ADCHP
X
DAC soft mute
De-emphasis control
ADC high-pass filter
Reserved
0 = Disabled
00 = Disabled
1 = Disabled
1 = Enabled
01 = 32 kHz
0 = Enabled
10 = 44.1 kHz 11 = 48 kHz
Power Down Control (Address: 0000110)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
OFF
CLK
OSC
OUT
DAC
ADC
MIC
LINE
Default
0
0
0
0
0
0
1
1
1
OFF
CLK
OSC
OUT
DAC
ADC
MIC
LINE
X
Device power
Clock
Oscillator
Outputs
DAC
ADC
Microphone input
Line input
Reserved
0 = On
0 = On
0 = On
0 = On
0 = On
0 = On
0 = On
0 = On
1 = Off
1 = Off
1 = Off
1 = Off
1 = Off
1 = Off
1 = Off
1 = Off
Digital Audio Interface Format (Address: 0000111)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
X
MS
LRSWAP
LRP
IWL1
IWL0
FOR1
FOR0
Default
0
0
0
0
0
0
0
0
1
MS
LRSWAP
LRP
Master/slave mode
DAC left/right swap
DAC left/right phase
IWL[1:0]
FOR[1:0]
Input bit length
Data format
X
Reserved
0 = Slave
1 = Master
0 = Disabled
1 = Enabled
0 = Right channel on, LRCIN high
1 = Right channel on, LRCIN low
DSP mode
1 = MSB is available on 2nd BCLK rising edge after LRCIN rising edge
0 = MSB is available on 1st BCLK rising edge after LRCIN rising edge
00 = 16 bit
01 = 20 bit
10 = 24 bit
11 = 32 bit
11 = DSP format, frame sync followed by two data words
10 = I2S format, MSB first, left – 1 aligned
01 = MSB first, left aligned
00 = MSB first, right aligned
NOTES: 1. In Master mode, the TLV320AIC23B supplies the BCLK, LRCOUT, and LRCIN. In Slave mode, BCLK, LRCOUT, and LRCIN are
supplied to the TLV320AIC23B.
2. In normal mode, BCLK = MCLK/4 for all sample rates except for 88.2 kHz and 96 kHz. For 88.2 kHz and 96 kHz sample rate,
BCLK = MCLK.
3. In USB mode, bit BCLK = MCLK
3−4
Sample Rate Control (Address: 0001000)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
CLKOUT
CLKIN
SR3
SR2
SR1
SR0
BOSR
USB/Normal
Default
0
0
0
1
0
0
0
0
0
CLKIN
CLKOUT
SR[3:0]
BOSR
Clock input divider
0 = MCLK
1 = MCLK/2
Clock output divider
0 = MCLK
1 = MCLK/2
Sampling rate control (see Sections 3.3.2.1 AND 3.3.2.2)
Base oversampling rate
USB mode:
0 = 250 fs
1 = 272 fs
Normal mode:
0 = 256 fs
1 = 384 fs
Clock mode select:
0 = Normal
1 = USB
Reserved
USB/Normal
X
Digital Interface Activation (Address: 0001001)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
RES
RES
X
X
X
X
X
ACT
Default
0
0
0
0
0
0
0
0
0
ACT
X
Activate interface
Reserved
0 = Inactive
1 = Active
Reset Register (Address: 0001111)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
RES
RES
RES
RES
RES
RES
RES
RES
RES
Default
0
0
0
0
0
0
0
0
0
RES
Write 000000000 to this register triggers reset
3.2 Analog Interface
3.2.1
Line Inputs
The TLV320AIC23B has line inputs for the left and the right audio channels (RLINEIN and LLINEIN). Both line inputs
have independently programmable volume controls and mutes. Active and passive filters for the two channels
prevent high frequencies from folding back into the audio band.
The line-input gain is logarithmically adjustable from 12 dB to –34.5 dB in 1.5-dB steps. The ADC full-scale range
is 1.0 VRMS at AVDD = 3.3 V. The full-scale range tracks linearly with analog supply voltage AVDD. To avoid distortions,
it is important not to exceed the full-scale range.
The gain is independently programmable on both left and right line-inputs. To reduce the number of software write
cycles required. Both channels can be locked to the same value by setting the RLS and LRS bits (see Section 3.1.3).
The line inputs are biased internally to VMID. When the line inputs are muted or the device is set to standby mode,
the line inputs are kept biased to VMID using special antithump circuitry. This reduces audible clicks that otherwise
might be heard when reactivating the inputs.
For interfacing to a CD system, the line input should be scaled to 1 VRMS to avoid clipping, using the circuit shown
in Figure 3-3.
Where:
R1 = 5 kΩ
R2 = 5 kΩ
C1 = 47 pF
C2 = 470 nF
R1
C2
CDIN
+
LINEIN
R
2
C1
AGND
Figure 3−3. Analog Line Input Circuit
R1 and R2 divide the input signal by two, reducing the 2 VRMS from the CD player to the nominal 1 VRMS of the AIC23B
inputs. C1 filters high-frequency noise, and C2 removes any dc component from the signal.
3−5
3.2.2
Microphone Input
MICIN is a high-impedance, low-capacitance input that is compatible with a wide range of microphones. It has a
programmable volume control and a mute function. Active and passive filters prevent high frequencies from folding
back into the audio band.
The MICIN signal path has two gain stages. The first stage has a nominal gain of G1 = 50 k/10 k = 5. By adding an
external resistor (RMIC) in series with MICIN, the gain of the first stage can be adjusted by G1 = 50 k/(10 k + RMIC).
For example, RMIC = 40 k gives a gain of 0 dB. The second stage has a software programmable gain of 0 dB or 20
dB (see Section 3.1.3).
50 kΩ
10 kΩ
MICIN
To ADC
VMID
0 dB/20 dB
Figure 3−4. Microphone Input Circuit
The microphone input is biased internally to VMID. When the line inputs are muted, the MICIN input is kept biased
to VMID using special antithump circuitry. This reduces audible clicks that may otherwise be heard when reactivating
the input.
The MICBIAS output provides a low-noise reference voltage suitable for biasing electret type microphones and the
associated external resistor biasing network. The maximum source current capability is 3 mA. This limits the smallest
value of external biasing resistors that safely can be used.
The MICBIAS output is not active in standby mode.
3.2.3
Line Outputs
The TLV320AIC23B has two low-impedance line outputs (LLINEOUT and RLINEOUT) capable of driving line loads
with 10-kΩ and 50-pF impedances.
The DAC full-scale output voltage is 1.0 VRMS at AVDD = 3.3 V. The full-scale range tracks linearly with the analog
supply voltage AVDD. The DAC is connected to the line outputs via a low-pass filter that removes out-of-band
components. No further external filtering is required in most applications.
The DAC outputs, line inputs, and the microphone signal are summed into the line outputs. These sources can be
switched off independently. For example, in bypass mode, the line inputs are routed to the line outputs, bypassing
the ADC and the DAC. If sidetone is enabled, the microphone signal is routed to both line outputs via a four-step
programmable attenuation circuit.
The line outputs are muted by either muting the DAC (analog) or soft muting (digital) and disabling the bypass and
sidetone paths (see Section 3.1.3).
3.2.4
Headphone Output
The TLV320AIC23B has stereo headphone outputs (LHPOUT and RHPOUT), and is designed to drive 16-Ω or 32-Ω
headphones. The headphone output includes a high-quality volume control and mute function.
The headphone volume is logarithmically adjustable from 6 dB to –73 dB in 1-dB steps. Writing 000000 to the
volume-control registers (see Section 3.1.3) mutes the headphone output. When the headphone output is muted or
the device is placed in standby mode, the dc voltage is maintained at the outputs to prevent audible clicks.
A zero-cross detection circuit is provided under the control of the LZC and RZC bits. If this circuit is enabled, the
volume-control values are updated only when the input signal to the gain stage is close to the analog ground level.
3−6
This minimizes audible clicks as the volume is changed or the device is muted. This circuit has no time-out, so, if only
dc levels are being applied to the gain stage input of more than 20 mV, the gain is not updated.
The gain is independently programmable on the left and right channels. Both channels can be locked to the same
value by setting the RLS and LRS bits (see Section 3.1.3).
3.2.5
Analog Bypass Mode
The TLV320AIC23B includes a bypass mode in which the analog line inputs are directly routed to the analog line
outputs, bypassing the ADC and DAC. This is enabled by selecting the bypass bit in the analog audio path control
register[see Section 3.1.3).
For a true bypass mode, the output from the DAC and the sidetone should be disabled. The line input and headphone
output volume controls and mutes are still operational in bypass mode. Therefore the line inputs, DAC output, and
microphone input can be summed together. The maximum signal at any point in the bypass path must be no greater
than 1.0Vrms at AVDD=3.3V to avoid clipping and distortion. This amplitude tracks linearly with AVDD.
3.2.6
Sidetone Insertion
The TLV320AIC23B has a sidetone insertion made where the microphone input is routed to the line and headphone
outputs. This is useful for telephony and headset applications. The attenuation of the sidetone signal may be set to
−6 dB, −9 dB, −12 dB, −15 dB, or 0dB, by software selection (see Section 3.1.3). If this mode is used to sum the
microphone input with the DAC output and line inputs, care must be taken not to exceed signal level to avoid clipping
and distortion.
3.3 Digital Audio Interface
3.3.1
Digital Audio-Interface Modes
The TLV320AIC23B supports four audio-interface modes.
•
•
•
•
Right justified
Left justified
I2S mode
DSP mode
The four modes are MSB first and operate with a variable word width between 16 to 32 bits (except right-justified
mode, which does not support 32 bits).
The digital audio interface consists of clock signal BCLK, data signals DIN and DOUT, and synchronization signals
LRCIN and LRCOUT. BCLK is an output in master mode and an input in slave mode.
3.3.1.1 Right-Justified Mode
In right-justified mode, the LSB is available on the rising edge of BCLK, preceding a falling edge on LRCIN or LRCOUT
(see Figure 3-5).
1/fs
LRCIN/
LRCOUT
BCLK
Left Channel
DIN/
0
n
n−1
Right Channel
1
0
n
n−1
1
0
DOUT
MSB
LSB
Figure 3−5. Right-Justified Mode Timing
3.3.1.2 Left-Justified Mode
In left-justified mode, the MSB is available on the rising edge of BCLK, following a rising edge on LRCIN or LRCOUT
(see Figure 3-6)
3−7
1/fs
LRCIN/
LRCOUT
BCLK
Left Channel
DIN/
n
n−1
1
Right Channel
0
n
n−1
1
0
n
DOUT
MSB
LSB
Figure 3−6. Left-Justified Mode Timing
3.3.1.3 I2S Mode
In I2S mode, the MSB is available on the second rising edge of BCLK, after the falling edge on LRCIN or LRCOUT
(see Figure 3-7).
1/fs
LRCIN/
LRCOUT
BCLK
1BCLK
DIN/
DOUT
Left Channel
n
n−1
1
MSB
Right Channel
0
n
n−1
1
0
LSB
Figure 3−7. I2S Mode Timing
3.3.1.4 DSP Mode
The DSP mode is compatible with the McBSP ports of TI DSPs. LRCIN and LRCOUT must be connected to the Frame
Sync signal of the McBSP. A falling edge on LRCIN or LRCOUT starts the data transfer. The left-channel data consists
of the first data word, which is immediately followed by the right channel data word (see Figure 3-8). Input word length
is defined by the IWL register. Figure 3−8 shows LRP = 1 (default LRP = 0).
LRCIN/
LRCOUT
BCLK
Left Channel
DIN/
DOUT
n
MSB
n−1
1
Right Channel
0
n
n−1
LSB MSB
Figure 3−8. DSP Mode Timing
3−8
1
0
LSB
3.3.2
Audio Sampling Rates
The TLV320AIC23B can operate in master or slave clock mode. In the master mode, the TLV320AIC23B clock and
sampling rates are derived from a 12-MHz MCLK signal. This 12-MHz clock signal is compatible with the USB
specification. The TLV320AIC23B can be used directly in a USB system.
In the slave mode, an appropriate MCLK or crystal frequency and the sample rate control register settings control
the TLV320AIC23B clock and sampling rates.
The settings in the sample rate control register control the clock mode and sampling rates.
Sample Rate Control (Address: 0001000)
BIT
D8
D7
D6
D5
D4
D3
D2
D1
D0
Function
X
CLKOUT
CLKIN
SR3
SR2
SR1
SR0
BOSR
USB/Normal
Default
0
0
0
1
0
0
0
0
0
CLKOUT
CLKIN
SR[3:0]
BOSR
USB/Normal
X
Clock output divider
0 = MCLK
1 = MCLK/2
Clock input divider
0 = MCLK
1 = MCLK/2
Sampling rate control (see Sections 3.3.2.1 and 3.3.2.2)
Base oversampling rate
USB mode:
0 = 250 fs
1 = 272 fs
Normal mode:
0 = 256 fs
1 = 384 fs
Clock mode select:
0 = Normal
1 = USB
Reserved
The clock circuit of the AIC23B has two internal dividers. The first, controlled by CLKIN, applies to the sampling-rate
generator of the codec. The second, controlled by CLKOUT, applies only to the CLKOUT terminal. By setting CLKIN
to 1, the entire codec is clocked with half the frequency, effectively dividing the resulting sampling rates by two. The
following sampling-rate tables are based on CLKIN = MCLK.
3.3.2.1 USB-Mode Sampling Rates (MCLK = 12 MHz)
In the USB mode, the following ADC and DAC sampling rates are available:
SAMPLING RATE†
SAMPLING-RATE CONTROL SETTINGS
ADC
(kHz)
DAC
(kHz)
FILTER TYPE
SR3
SR2
SR1
SR0
BOSR
96
96
3
0
1
1
1
0
88.2
88.2
2
1
1
1
1
1
48
48
0
0
0
0
0
0
44.1
44.1
1
1
0
0
0
1
32
32
0
0
1
1
0
0
8.021
8.021
1
1
0
1
1
1
8
8
0
0
0
1
1
0
48
8
0
0
0
0
1
0
44.1
8.021
1
1
0
0
1
1
8
48
0
0
0
1
0
0
8.021
44.1
1
1
0
1
0
1
† The sampling rates are derived from the 12-MHz master clock. The available oversampling rates do not produce exactly 8-kHz, 44.1-kHz, and
88.2-kHz sampling rates, but 8.021 kHz, 44.117 kHz, and 88.235 kHz, respectively. See Figures 3−17 through 3−34 for filter responses
3−9
3.3.2.2 Normal-Mode Sampling Rates
In normal mode, the following ADC and DAC sampling rates, depending on the MCLK frequency, are available:
MCLK = 12.288 MHz
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
ADC
(kHz)
DAC
(kHz)
FILTER TYPE
SR3
SR2
SR1
SR0
BOSR
96
96
2
0
1
1
1
0
48
48
1
0
0
0
0
0
32
32
1
0
1
1
0
0
8
8
1
0
0
1
1
0
48
8
1
0
0
0
1
0
8
48
1
0
0
1
0
0
MCLK = 11.2896 MHz
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
ADC
(kHz)
DAC
(kHz)
FILTER TYPE
88.2
88.2
44.1
44.1
8.021
44.1
8.021
SR3
SR2
SR1
SR0
BOSR
2
1
1
1
1
0
1
1
0
0
0
0
8.021
1
1
0
1
1
0
8.021
1
1
0
0
1
0
44.1
1
1
0
1
0
0
MCLK = 18.432 MHz
SAMPLING RATE
SAMPLING-RATE CONTROL SETTINGS
ADC
(kHz)
DAC
(kHz)
FILTER TYPE
SR3
SR2
SR1
SR0
BOSR
96
96
2
0
1
1
1
1
48
48
1
0
0
0
0
1
32
32
1
0
1
1
0
1
8
8
1
0
0
1
1
1
48
8
1
0
0
0
1
1
8
48
1
0
0
1
0
1
MCLK = 16.9344 MHz
SAMPLING RATE
3−10
SAMPLING-RATE CONTROL SETTINGS
ADC
(kHz)
DAC
(kHz)
FILTER TYPE
SR3
SR2
SR1
SR0
BOSR
88.2
88.2
2
1
1
1
1
1
44.1
44.1
1
1
0
0
0
1
8.021
8.021
1
1
0
1
1
1
44.1
8.021
1
1
0
0
1
1
8.021
44.1
1
1
0
1
0
1
3.3.3
Digital Filter Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ADC Filter Characteristics ( TI DSP 250 fs Mode Operation )
Passband
±0.05 dB
Stopband
−6 dB
0.416 fs
Hz
0.5 fs
Stopband attenuation
Hz
±0.05
Passband ripple
f > 0.584 fs
−60
dB
dB
ADC Filter Characteristics ( TI DSP 272 fs and Normal Mode Operation )
Passband
±0.05 dB
Stopband
−6 dB
0.4535 fs
Hz
0.5 fs
Stopband attenuation
Hz
±0.05
Passband ripple
dB
f > 0.5465 fs
−60
dB
−3 dB,
fs = 44.1 kHz
fs = 48 kHz
3.7
Hz
4.0
Hz
−0.5 dB, fs = 44.1 kHz
−0.5 dB, fs = 48 kHz
10.4
Hz
11.3
Hz
−0.1 dB
21.6
Hz
23.5
Hz
ADC High-Pass Filter Characteristics
−3 dB,
Corner frequency
fs = 44.1 kHz
−0.1 dB, fs = 48 kHz
DAC Filter Characteristics (48-kHz Sampling Rate)
Passband
±0.03 dB
Stopband
−6 dB
0.416 fs
Hz
0.5 fs
±0.03
Passband ripple
Stopband attenuation
Hz
f > 0.584 fs
−50
dB
dB
DAC Filter Characteristics (44.1-kHz Sampling Rate)
Passband
±0.03 dB
Stopband
−6 dB
0.4535 fs
Hz
0.5 fs
±0.03
Passband ripple
Stopband attenuation
Hz
f > 0.5465 fs
−50
dB
dB
3−11
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
0
Filter Response − dB
−2
−4
−6
−8
−10
0
0.1
0.2
0.3
0.4
0.5
Normalized Audio Sampling Frequency
Figure 3−9. Digital De-Emphasis Filter Response − 44.1 kHz Sampling
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
0
Filter Response − dB
−2
−4
−6
−8
−10
0
0.10
0.20
0.30
0.40
0.50
Normalized Audio Sampling Frequency
Figure 3−10. Digital De-Emphasis Filter Response − 48 kHz Sampling
3−12
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
2
1.5
2.5
3
Normalized Audio Sampling Frequency
Figure 3−11. ADC Digital Filter Response 0: USB Mode
(Group Delay = 12 Output Samples)
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.10
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−0.10
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency
Figure 3−12. ADC Digital Filter Ripple 0: USB
(Group Delay = 20 Output Samples)
3−13
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2.5
2
3
Normalized Audio Sampling Frequency
Figure 3−13. ADC Digital Filter Response 1: USB Mode Only
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.10
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−0.10
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
Normalized Audio Sampling Frequency
Figure 3−14. ADC Digital Filter Ripple 1: USB Mode Only
3−14
0.45
0.5
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
2.5
3
Normalized Audio Sampling Frequency
Figure 3−15. ADC Digital Filter Response 2: USB mode and Normal Modes
(Group Delay = 3 Output Samples)
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.4
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency
Figure 3−16. ADC Digital Filter Ripple 2: USB Mode and Normal Modes
3−15
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
2.5
3
Normalized Audio Sampling Frequency
Figure 3−17. ADC Digital Filter Response 3: USB Mode Only
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.4
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
Normalized Audio Sampling Frequency
Figure 3−18. ADC Digital Filter Ripple 3: USB Mode Only
3−16
0.45
0.50
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
Normalized Audio Sampling Frequency
2.5
3
Figure 3−19. DAC Digital Filter Response 0: USB Mode
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.10
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−0.10
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency
Figure 3−20. DAC Digital Filter Ripple 0: USB Mode
3−17
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
2.5
3
Normalized Audio Sampling Frequency
Figure 3−21. DAC Digital Filter Response 1: USB Mode Only
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.10
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−0.10
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
Normalized Audio Sampling Frequency
Figure 3−22. DAC Digital Filter Ripple 1: USB Mode Only
3−18
0.45
0.5
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
2.5
3
Normalized Audio Sampling Frequency
Figure 3−23. DAC Digital Filter Response 2: USB Mode and Normal Modes
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.4
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency
Figure 3−24. DAC Digital Filter Ripple 2: USB Mode and Normal Modes
3−19
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
10
−10
−30
−50
−70
−90
0
0.5
1
1.5
2
2.5
3
Normalized Audio Sampling Frequency
Figure 3−25. DAC Digital Filter Response 3: USB Mode Only
FILTER RESPONSE
vs
NORMALIZED AUDIO SAMPLING FREQUENCY
Filter Response − dB
0.4
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Normalized Audio Sampling Frequency
Figure 3−26. DAC Digital Filter Ripple 3: USB Mode Only
The delay between the converter is a function of the sample rate. The group delays for the AIC23B are shown in the
following table. Each delay is one LR clock (1/sample rate).
Table 3−1. Group Dealys
FILTER
3−20
GROUP DELAY
DAC type 0
11
DAC type 1
18
DAC type 2
5
DAC type 3
5
ADC type 0
12
ADC type 1
20
ADC type 2
3
ADC type 3
6
Appendix A
Mechanical Data
GQE/ZQE (S-PBGA-N80)
PLASTIC BALL GRID ARRAY
5,10
SQ
4,90
4,00 TYP
0,50
J
0,50
H
G
F
E
D
C
B
A
1
0,68
0,62
2
3
4
5
6
7
8
9
1,00 MAX
Seating Plane
0,35
0,25
NOTES: A.
B.
C.
D.
∅ 0,05 M
0,21
0,11
0,08
4200461/C 10/00
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
MicroStar Junior BGA configuration
Falls within JEDEC MO-225
MicroStar Junior is a trademark of Texas Instruments.
A−1
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°−ā 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
A−2
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
RHD (S−PQFP−N28)
PLASTIC QUAD FLATPACK
5,00
A
B
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉÉ
5,00
28
1
PIN 1
INDEX AREA
1,00
0,80
0,20 REF
C
SEATING PLANE
0,08 C
3,25
SQ
3,00
PIN 1
IDENTIFIER
0,05 MAX
1
0,65
28 0,45
0,435
28
0,18
0,435
4 3,00
0,18
0,50
EXPOSED THERMAL
DIE PAD
D
28
0,30
0,18
0,10 M C A B
4204400/A 05/02
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
QFN (Quad Flatpack No−Lead) Package configuration.
The Package thermal performance may be enhanced by bonding the thermal die pad to
an external thermal plane. This pad is electrically and thermally connected to the backside
of the die and possibly selected ground leads.
E. Package complies to JEDEC MO-220.
A−3
A−4
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLV320A23BIRHDRG4
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BGQE
ACTIVE
VFBGA
GQE
80
360
TBD
SNPB
Level-2A-235C-4 WKS
TLV320AIC23BGQER
ACTIVE
VFBGA
GQE
80
2500
TBD
SNPB
Level-2A-235C-4 WKS
TLV320AIC23BIGQE
ACTIVE
VFBGA
GQE
80
360
TBD
SNPB
Level-2A-235C-4 WKS
TLV320AIC23BIGQER
ACTIVE
VFBGA
GQE
80
2500
TBD
SNPB
Level-2A-235C-4 WKS
TLV320AIC23BIPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BIPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BIPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320AIC23BIRHD
ACTIVE
QFN
RHD
28
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BIRHDR
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BIZQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQE
80
360
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
TLV320AIC23BIZQER
PREVIEW
BGA MI
CROSTA
R JUNI
OR
ZQE
80
2500
TBD
Call TI
TLV320AIC23BPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BRHD
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BRHDG4
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BRHDR
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BZQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQE
80
360
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
TLV320AIC23BZQER
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQE
80
2500
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
73
(1)
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2005
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLV320A23BIRHDRG4
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
TLV320AIC23BGQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQE
80
360
TLV320AIC23BGQER
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQE
80
TLV320AIC23BIGQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQE
TLV320AIC23BIGQER
ACTIVE
BGA MI
CROSTA
R JUNI
OR
TLV320AIC23BIPW
ACTIVE
TLV320AIC23BIPWG4
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-2-260C-1 YEAR
TBD
SNPB
Level-2A-235C-4 WKS
2500
TBD
SNPB
Level-2A-235C-4 WKS
80
360
TBD
SNPB
Level-2A-235C-4 WKS
GQE
80
2500
TBD
SNPB
Level-2A-235C-4 WKS
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320AIC23BIPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320AIC23BIPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320AIC23BIRHD
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BIRHDG4
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BIRHDR
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BIZQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQE
80
360
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
TLV320AIC23BIZQER
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQE
80
2500
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
TLV320AIC23BPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320AIC23BPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV320AIC23BPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BRHD
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BRHDG4
ACTIVE
QFN
RHD
28
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLV320AIC23BRHDR
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BRHDRG4
ACTIVE
QFN
RHD
28
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC23BZQE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQE
80
360
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
TLV320AIC23BZQER
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQE
80
2500
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265