SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Features Description The SC1302A/B/C/D/E/F family are low cost dual low-side MOSFET drivers. These drivers accept TTL-compatible inputs and are capable of supplying high current outputs (> 2A peak) to external MOSFETs. Fast switching allows operation up to 1 MHz. The SC1302A/B/C is available in six configurations: SC1302A is a dual non-inverting, SC1302B is a dual inverting and SC1302C alone has an inverting plus one non-inverting output. Operating Voltage — +4.5V to +16.5V Fast rise and fall times (20ns typical with 1000pf load) Dual MOSFET driver Peak drive current — 2A propagation delay — 40ns 8-pin SOIC / MSOP lead free packages. This product is fully WEEE and RoHS compliant Enable/disable control TTL-compatible input Under voltage lockout with hysteresis Low shutdown supply current Over temperature protection ESD protection Dual inverting/non-inverting and inverting/non-inverting configurations The SC1302D/E/F is the derivative part from SC1302A/B/C with pin 1 (EN) and pin 8 (SHDN) internally tied to VCC. An under-voltage lockout circuit guarantees that the driver outputs are low when Vcc is less than 4.5V (typical). An internal temperature sensor shuts down the driver in the event of over temperature. Applications Switch-mode power supplies Battery powered applications Solenoid and motor drives Typical Application Circuit July 13, 2009 © 2009 Semtech Corporation 1 SC1302A/B/C/D/E/F Pin Configuration SC1302A/D (Dual Non-Inverting) Ordering Information Device Package Temperature Range (TJ) SOIC-8 -40°C to +125°C MSOP-8 -40°C to +125°C SC1302AISTRT SC1302BISTRT SC1302CISTRT SC1302DSTRT SC1302ESTRT 8-Pin SOIC (A/D) or MSOP (A only) SC1302B/E (Dual Inverting) SC1302FSTRT SC1302AIMSTRT SC1302BIMSTRT SC1302CIMSTRT Notes: (1) Available in tape and reel only. A reel contains 2,500 devices. (2) Lead-free package only. Device is WEEE and RoHS compliant. 8-Pin SOIC (B/E) or MSOP (B only) SC1302C/F (Inverting+Non-Inverting) Top Marking Information SOIC A/B/C 8-Pin SOIC (C/F) or MSOP (C only) Top Marking Information MSOP A/B/C X=A, B, C 302A = SC1302A yyww = Date Code X=A, B, C yyww = Date Code SOIC D/E/F X=D, E, F yyww = Date Code 2 SC1302A/B/C/D/E/F Absolute Maximum Ratings Recommended Operating Conditions Supply Voltage VCC (V) . . . . . . . . . . . . . . . . . . . . . . -0.3 to +20 Operating Temperature Range (°C) . . . . . . -40 < TJ < +125 Input Voltages (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to VCC Operating Supply Voltage (V) . . . . . . . . . . . . . . . -0.3 to 16.5 Peak Output Currents (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Enable Voltage SC1302A/B/C (V) . . . . . . . . . . . -0.3 to VCC Shutdown Voltage SC1302A/B/C (V) . . . . . . . . -0.3 to VCC Thermal Information Continuous Power Dissipation (W). . . . . . Internally limited Thermal Resistance, Junction to Ambient MSOP (°C/W). .206 ESD Protection Level (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal Resistance, Junction to Ambient SIOC (°C/W) . . .165 Maximum Junction Temperature (°C) . . . . . . . . . . . . . . +150 Storage Temperature Range (°C) . . . . . . . . . . . -65 to +150 Lead Temperature (Soldering)10s (°C) . . . . . . . . . . . . . +260 Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. DC Electrical Characteristics Unless otherwise specified, -40ºC < TA = TJ <125°C, VCC = 12V, VIN = 5V, VEN =5V (SC1302A/B/C), VSHDN = 5V (SC1302A/B/C) Parameter Symbol Conditions Quiescent Current IQ Quiescent Current Quiescent Current Min Typ Max Units VCC < VSTART 1 1.8 mA IQ VEN = VSHDN = 3V for SC1302A/B/C, VINA = VINB = 3V 5.7 8.1 mA IQ VSHDN = 0V for SC1302A/B/C 3 8 μA VSTART VSHDN = VEN = 3V for SC1302A/B/C, VINA = VINB = 3V 4.2 4.5 4.7 V VSHDN = VEN = 3V for SC1302A/B/C, VINA = VINB = 3V 250 320 475 mV 2.0 Supply Current Under-Voltage Lockout Threshold Voltage Hysteresis Enable for SC1302A/B/C Enable Voltage VEN 0 < VEN < VCC Disable Voltage VEN 0 < VEN < VCC Delay to Output(1) tD_EN EN from low to high 70 ns Delay to Output(1) tD_DIS EN from high to low 55 ns IEN 0 < VIN < VCC Enable Input Current V 0.8 10 14 19 V μA 3 SC1302A/B/C/D/E/F Electrical Characteristics (continued) Unless otherwise specified, -40ºC < TA = TJ <125°C, VCC = 12V, VIN = 5V, VEN =5V (SC1302A/B/C), VSHDN = 5V (SC1302A/B/C) Parameter Symbol Conditions Min High Level Input Voltage VIH 0 < VIN < VCC 2.0 Low Level Input Voltage VIL 0 < VIN < VCC Typ Max Units Input 0 < VIN < VCC, Non-inverting Input(s) of SC1302A/C/D/F Input Current IIN V 13 0 < VIN < VCC, Inverting Input(s) of SC1302B/C/E/F 0.8 V 18.5 μA -8 μA Output IPK_SOURCE VOUT = 0.5V, tPW < 10 μs 1600 mA IPK_SINK VOUT = VCC - 0.5V, tPW < 10 μs 1600 mA Output Peak Current Shutdown for SC1302A/B/C SHDN Input Voltage High VSHDN SHDN Input Voltage Low VSHDN SHDN Pin current ISHDN 2 VSHDN = 5V V 32 0.3 V 40 μA Thermal Shutdown Over Temperature Trip Point (1) TJ_OT Hysteresis (1) 150 °C 10 °C AC Electrical Characteristics Unless otherwise specified, TA = TJ = 25ºC, VCC =12V, VEN = 5V, CL = 1000pF Parameter Symbol Conditions Min Typ Max Units Rise Time(1) tR See Timing Diagram 20 ns Fall Time(1) tF See Timing Diagram 20 ns Propagation Delay Time(1) tD1 TA = -40°C ~ 125°C 53 70 ns Propagation Delay Time(1) tD2 TA = -40°C ~ 125°C 41 60 ns Notes: (1) Guaranteed by design (2) Negative sign indicates that the input current flows out of the device. 4 SC1302A/B/C/D/E/F Typical Characteristics Rise and Fall Time vs. Capacitive Load Rise and Fall Time vs. Supply Voltage 25 CL = 1000pF; TA = 25°C 80 VCC = 12V; f = 200kHz; TA = 25°C 60 20 Time (ns) Time (ns) tf tr tf 40 tr 15 20 10 4 8 12 Supply Voltage (V) 0 16 100 Supply Current vs. Capacitive Load 40 Input Pin Current VCC = 12V One Driver Running; TA = 25°C 15 Non-inverting 10 30 5 IIN (uA) Supply Currnt (mA) 10000 1000 Capacitive Load (pF) 20 10 Inverting 0 200kHz -5 100kHz 0 100 -10 1000 Capacitive Load (pF) 10000 0 8 4 12 VIN (V) 5 SC1302A/B/C/D/E/F Pin Descriptions Pin # SC1302A/D SC1302B/E SC1302C/F Pin Function Enable/Disable Control — When the EN is driven low, both outputs are low. When left open, both outputs are low. Enable both drivers by tying EN pin to a voltage greater than 2V. No connection on versions D, E, and F. 1 EN/NC EN/NC EN/NC 2 INA INA INA TTL compatible input to driver A — When left open, Pin 7 is low. 3 GND GND GND Ground connection 4 INB INB INB TTL compatible input to driver B — When left open, Pin 5 is low. 5 OUTB OUTB OUTB 6 VCC VCC VCC 7 OUTA OUTA OUTA 8 SHDN/NC SHDN/NC SHDN/NC Output gate drive B for external MOSFET Supply: +4.5V to +16.5V supply. During UVLO the outputs are held low. Output gate drive A for external MOSFET Shutdown pin — Apply a voltage from 2V to VCC to enable device. Pull below 0.3V for low-power shut down. No connection on versions D, E, and F. 6 SC1302A/B/C/D/E/F Block Diagram SC1302B SC1302A VCC EN INA PRE DRIVER OUTA PREDRIVER OUTB BIAS BANDGAP SHDN BIAS INB GND SC1302C SC1302D VCC INA PRE DRIVER OUTA PREDRIVER OUTB BIAS BANDGAP BIAS INB GND SC1302E SC1302F 7 SC1302A/B/C/D/E/F Applications Information General Description The SC1302A/B/C/D/E/F is a high speed, high peak current dual MOSFET driver. It is designed to drive power MOSFETs with ultra-low rise/fall time and propagation delays. As the switching frequency of PWM controllers is increased to reduce power converters volume and cost, fast rise and fall times are necessary to minimize switching losses. While a discrete solution can achieve reasonable drive capability, implementing delay and other housekeeping functions necessary for safe operation can become cumbersome and costly. The SC1302A/B/C/D/E/F presents a total solution for the high-speed, high-power density applications. Wide input supply range of 4.5V to16.5V allows use in battery powered applications as well as distributed power systems. Supply Bypass and Layout For simplicity, it is assumed that the gate capacitance of a MOSFET is constant. The power delivered from the power supply can be estimated based on this simplification. The energy needed to charge the capacitor is given by the following equation E ON 1 uCu V2 2 where C is the load capacitance and V is the output voltage swing of the driver. During turn off, the same amount of energy is dumped to the ground. Therefore, the energy dissipated in one switching cycle is: ETOTAL = C x V2 A 4.7μF to 10μF tantalum bypass capacitor with low ESR (equivalent series resistance) and an additional 0.1μF ceramic capacitor in parallel are recommended as a supply bypass to control switching and supply transients. The power dissipation due to the gate driving actions is given by: As with any high speed, high current circuit, proper layout is critical in achieving optimum performance of the SC1302A/B/C/D/E/F. Attention should be paid to the proper placement of the driver, the switching MOSFET, and the bypass capacitors. where, f is the switching frequency. With VCC = 12V, C = 1nF and f = 200kHz, the power dissipation per output is: The driver should be placed as close as possible to the external MOSFETs to eliminate the possibility of oscillation caused by trace inductance and the MOSFET gate capacitance. A resistor in the range of 10ohm could be used in series with the gate drive to damp the ringing if the drive output path is not short enough. The bypass capacitors should also be placed closely between VCC and GND of the driver. A Schottky diode may be used to connect the ground and the output pin to avoid latch-ups in some applications. Drive Capability and Power Dissipation The SC1302A/B/C/D/E/F is able to deliver 1.6A peak current for driving capacitive loads, such as MOSFETs. Fast switching of the MOSFETs significantly reduces switching losses for high frequency applications. Thermal stress is reduced and system reliability is improved. PGATE = f x C x V2 PGATE =(200kHz) x (1nF) x (12)2 = 29mW The corresponding supply current is: I PGATE VCC 29mW 12 V 2.4mA Thermal Information The driver’s junction temperature must be kept within the rated limit at any time. The application system has to effectively remove the heat generated in the driver in order for proper functions and performance. If the junction temperature reaches 150°C, the internal protection circuit will be triggered to shut down the gate driver. The power dissipation of the SC1302A/B/C/D/E/F should be derated according to the following formula: PowerDissipation 125qC T A TjA where TA = ambient temperature. 8 SC1302A/B/C/D/E/F Timing Diagram 5V Input 0V 90% 10% tF tR 90% Non - inverting Output 90% 10% 10% SC1302A Inverting Output tF SC1302B tR 90% 90% 10% t D1 10% t D2 9 SC1302A/B/C/D/E/F Outline Drawing — MSOP-8 DIMENSIONS e/2 DIM A A A1 A2 b c D N 2X E/2 E1 PIN 1 D E1 E e E INDICATOR ccc C L L1 N 01 aaa 1 2 2X N/2 TIPS e D C A A1 C .000 .030 .009 .003 .114 .114 NOM - MILLIMETERS MAX .043 .006 .037 .015 .009 .122 .122 .118 .118 .193 BSC .026 BSC .016 .024 .032 (.037) 0° 8 - MIN - NOM - 0.00 0.75 0.22 0.08 2.90 2.90 MAX 1.10 0.15 0.95 0.38 0.23 3.10 3.10 3.00 3.00 4.90 BSC 0.65 BSC 0.40 0.60 0.80 (.95) 8° 8 - 0° .004 .005 .010 8° 0.10 0.13 0.25 H A2 SEATING PLANE MIN - bbb ccc B aaa INCHES bxN bbb C A-B D c GAGE PLANE 0.25 L (L1) 01 DETAIL A SIDE VIEW SEE DETAIL A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-187, VARIATION AA. AND -B- TO BE DETERMINED AT DATUM PLANE -H- 10 SC1302A/B/C/D/E/F Land Pattern — MSOP-8 X DIMENSIONS (C) G Y Z DIM INCHES MILLIMETERS C (.161) (4.10) G .098 2.50 P .026 0.65 X .016 0.40 Y .063 1.60 Z .224 5.70 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 11 SC1302A/B/C/D/E/F Outline Drawing — SO-8 DIMENSIONS A N 2X DIM D e E1 1 h L L1 N 01 aaa ccc C e/2 B MIN 1.35 0.10 1.25 0.31 0.17 4.80 3.80 MAX .069 .010 .065 .020 .010 .197 .157 NOM - MAX 1.75 0.25 1.65 0.51 0.25 5.00 4.00 4.90 3.90 6.00 BSC 1.27 BSC 0.25 0.50 1.04 0.40 0.72 (1.04) 8° 0° 8 - 8° 0.10 0.25 0.20 .004 .010 .008 C A2 SEATING PLANE 8 - 0° bbb ccc D aaa NOM - .193 .154 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) D E1 E e E 2 2X N/2 TIPS MIN .053 .004 .049 .012 .007 .189 .150 A A1 A2 b c E/2 MILLIMETERS INCHES C h A A1 bxN bbb h H C A-B D c GAGE PLANE 0.25 L (L1) SEE DETAIL A SIDE VIEW 01 DETAIL A NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. 12 SC1302A/B/C/D/E/F Land Pattern — SO-8 X DIMENSIONS (C) G Y Z DIM INCHES MILLIMETERS C (.205) (5.20) G .118 3.00 P .050 1.27 X .024 0.60 Y .087 2.20 Z .291 7.40 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111 Fax: (805) 498-3804 www.semtech.com 13