STMICROELECTRONICS STS8DNH3LL_08

STS8DNH3LL
Dual n-channel 30 V - 0.018 Ω - 8 A - SO-8
low gate charge STripFET™ III Power MOSFET
Features
Type
VDSS
RDS(on) max
ID
STS8DNH3LL
30 V
< 0.022 Ω
8A
■
Optimal RDS(on) x Qg trade-off @ 4.5 V
■
Conduction losses reduced
■
Switching losses reduced
S0-8
Application
■
Switching applications
Description
This product utilizes the latest advanced design
rules of ST’s proprietary STripFET™ technology
which is suitable for the most demanding DC-DC
converter applications where high efficiency is
required.
Table 1.
Figure 1.
Internal schematic diagram
Device summary
Order code
Marking
Package
Packaging
STS8DNH3LL
8DH3LL
SO-8
Tape & reel
June 2008
Rev 2
1/12
www.st.com
12
Contents
STS8DNH3LL
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
.......................... 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/12
................................................ 8
STS8DNH3LL
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage (vGS = 0)
30
V
VGS
Gate- source voltage
±16
V
ID
Drain current (continuous) at TC = 25°C
8
A
ID
Drain current (continuous) at TC = 100°C
5
A
Drain current (pulsed)
32
A
PTOT
Total dissipation at TC = 25°C
2
W
EAS(2)
Single pulse avalanche energy
100
mJ
Value
Unit
Thermal resistance junction-ambient max
62.5
°C/W
Thermal operating junction-ambient
150
°C
-55 to 150
°C
IDM
(1)
1. Pulse width limited by safe operating area
2. Starting TJ = 25 °C, ID = 6 A
Table 3.
Thermal data
Symbol
Rthj-a (1)
TJ
Tstg
Parameter
Storage temperature
1. When mounted on 1 inch² FR-4 board, 2 oz. Cu., t ≤ 10s
3/12
Electrical characteristics
2
STS8DNH3LL
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 4.
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Drain-source
Breakdown voltage
ID = 250 µA, VGS = 0
IDSS
Zero gate voltage
Drain current (VGS = 0)
VDS = Max rating
1
µA
IDSS
Zero gate voltage
Drain current (VGS = 0)
VDS =Max rating @125°C
10
µA
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 16 V
±100
nA
VGS(th)
Gate threshold voltage
VDS = VGS,ID = 250 µA
Static drain-source on
resistance
VGS = 10 V, ID = 4 A
0.018
0.022
RDS(on)
Ω
VGS = 4.5 V, ID = 4 A
0.020
0.025
Ω
Typ.
Max.
Unit
V(BR)DSS
Table 5.
Symbol
4/12
On/off states
30
V
1
V
Dynamic
Parameter
gfs
Forward
transconductance
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Test conditions
VDS = 15 V, ID = 4 A
VDS = 25 V, f = 1 MHz,
VGS = 0
VDD = 15 V, ID = 8 A,
VGS = 4.5 V
(see Figure 14)
Min.
8.5
S
857
pF
147
pF
20
pF
7
10
nC
2.5
nC
2.3
nC
STS8DNH3LL
Electrical characteristics
Table 6.
Symbol
Switching times
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on delay time
Rise time
VDD=15 V, ID=4 A, RG=4.7 Ω,
VGS= 4.5 V (see Figure 16)
12
14.5
ns
ns
td(off)
tf
Turn-off delay time
Fall time
VDD=15 V, ID=4 A, RG=4.7 Ω,
VGS= 4.5 V (see Figure 16)
23
8
ns
ns
Table 7.
Symbol
Source drain diode
Parameter
Test conditions
Min
Typ.
Max
Unit
ISD
Source-drain current
VDD=15 V, ID=4 A, RG=4.7 Ω,
VGS= 4.5 V
8
A
ISDM (1)
Source-drain current
(pulsed)
VDD=15 V, ID= 4A
RG=4.7 Ω, VGS=4.5 V
32
A
VSD (2)
Forward on voltage
ISD = 8 A, VGS = 0
1.5
V
trr
Qrr
IRRM
ISD = 8 A,VDD = 15 V
Reverse recovery time
di/dt = 100 A/µs,
Reverse recovery charge
T = 150°C
Reverse recovery current j
(see Figure 15)
15
5.7
0.76
ns
nC
A
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
5/12
Electrical characteristics
STS8DNH3LL
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Thermal resistance
Figure 4.
Output characteristics
Figure 5.
Transfer characteristics
Figure 6.
Static drain-source on resistance
Figure 7.
Normalized BVDSS vs temperature
6/12
STS8DNH3LL
Figure 8.
Electrical characteristics
Gate charge vs gate-source voltage Figure 9.
for Q1
Figure 10. Normalized gate threshold voltage
vs temperature for Q1
Capacitance variations
Figure 11. Normalized on resistance vs
temperature
Figure 12. Source-drain diode forward
characteristics
7/12
Test circuit
3
STS8DNH3LL
Test circuit
Figure 13. Switching times test circuit for
resistive load
Figure 14. Gate charge test circuit
Figure 15. Test circuit for inductive load
Figure 16. Unclamped Inductive load test
switching and diode recovery times
circuit
Figure 17. Unclamped inductive waveform
8/12
Figure 18. Switching time waveform
STS8DNH3LL
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
9/12
Package mechanical data
STS8DNH3LL
SO-8 MECHANICAL DATA
DIM.
mm.
MIN.
TYP
A
a1
inch
MAX.
TYP.
1.75
0.1
MAX.
0.068
0.25
a2
0.003
0.009
1.65
0.064
a3
0.65
0.85
0.025
0.033
b
0.35
0.48
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.25
0.5
0.010
0.019
D
4.8
5.0
0.188
0.196
E
5.8
6.2
0.228
c1
45 (typ.)
1.27
e
e3
3.81
0.150
3.8
4.0
0.14
L
0.4
1.27
0.015
S
0.244
0.050
F
M
10/12
MIN.
0.6
0.157
0.050
0.023
8 (max.)
STS8DNH3LL
5
Revision history
Revision history
Table 8.
Document revision history
Date
Revision
Changes
15-Jun-2004
1
First release
16-Jun-2008
2
Modified marking
11/12
STS8DNH3LL
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
12/12