APDS-9005 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet Description Features The APDS-9005 is a low cost analog-output ambient light photo sensor in miniature chipLED lead-free surface mount package. It consists of a photo sensor, whose spectral response is close to the CIE standard photopic observer, as show in figure 2. The APDS-9005 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly. • Spectral responsivity close to that of human eye Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS9005 ambient light photo sensor module. You can contact them through your local sales representatives for additional details. • Miniature ChipLED Leadfree surface-mount package Height – 0.55 mm Width – 1.60 mm Depth – 1.50 mm • Low sensitivity variation across various light sources • Recommended operating temperature : -40°C to 85°C • Vcc supply 1.8 to 5.5V • Lead-free package, RoHS compliance • Output linearity across wide illumination range Applications • Detection of ambient light to control display backlighting Mobile devices – Mobile phones, PDAs Computing devices – Notebooks, Webpads Consumer devices – TVs, Video Cameras, Digital Still Camera • Automatic Residential and Commercial Lighting Management • Electronic Signs and Signals Ordering Information I/O Pins Configuration Table Part Number Packaging Type Package APDS-9005-020 Tape and Reel Quantity 6-pins Chipled package 2500 Typical Application Circuit Pin Symbol Description 1 VCC VCC 2 NC No Connect 3 NC No Connect 4 Nc No Connect 5 NC No Connect 6 Iout Out 1 Normalized sensor spectral response 0.9 APDS-9005 EyeResponse Response (a.u.) 0.8 Figure 1. Typical application circuit for APDS-9005 Component Recommended Application Circuit Component RLOAD 1k ohm 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Note : Refer to Figure 11 for General Luminance Vs Typical Output Voltage for different RLOAD values 300 400 500 600 700 800 wavelength (nm) 900 1000 1100 Figure 2. Relative Spectral Response Vs Wavelength CAUTIONS : It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50 °C /W Parameter Symbol Min. Max. Units Storage Temperature TS -40 85 °C Operating temperature TA -40 85 °C Supply Voltage VCC 0 6 V Recommended Operating Conditions Parameter Symbol Min. Max. Units Supply Voltage VCC 1.8 5.5 V Conditions Electrical & Optical Specifications (Ta=25°C) Parameter Symbol Min. Typ. Max. Units Conditions Photo Current (I) I_PH1 28 40 52 uA Vcc =1.8V, Lux = 100 (2) Photo Current (II) I_PH2 - 44 - uA Vcc =1.8V, Lux = 100 (1) Dark Current I_DARK - 300 - nA Vcc = 3V, Lux = 0 Light Current Ratio I_PH3 / I_PH2 - 1.1 - - Rise Time Tr - 5 - ms Rl = 1Kohm, Lux = 100 Fall Time - 5 - ms R1 = 1Kohm, Lux=100 Peak sensitivity wavelength Tf l - 500 - nm Settling Time pulsed at Vcc Tset - 10 - ms Vcc pulsed = 0V to 3V; Rload = 2.4K ohms; Lux = 100 (2) Propagation delay Td - 5 - ms Rl = 1Kohm, Lux = 100 Storage delay Ts - 5 - ms R1 = 1Kohm, Lux=100 Saturation voltage Vsat 1.0 - - V R1 = 150Kohm, Lux = 100 Note : 1) Illuminance by incandescent lamp 2) White LED is used as light source Light Measurement Circuit and Waveforms sensor-outputattains~95%of itsvoltagemagnitudecorrespondstothesetlightlevel VCCPulsefromPG Tset SensorOutputatLoad AVG REL-IOUT Vs TEMP at 100LUX/1.8V Average I-Out Vs LUX at VCC=1.8V 450.0E-6 1.2 1 350.0E-6 300.0E-6 REL I-OUT Output Current [A] 400.0E-6 250.0E-6 200.0E-6 100.0E-6 0.2 50.0E-6 0 100 200 300 400 500 600 700 800 LUX 0 -40 900 1000 1100 20 40 60 80 100 Avg REL I-Out Vs VCC 1.5 1.4 1.0 1.3 1.2 REL I-OUT 0.8 REL I-OUT 0 Figure 4. Average relative Iout Vs Temp (Vcc = 1.8V, T=25°C, 100 Lux) AVG REL-IOUT Vs TEMP at 320LUX/1.8V 1.2 -20 TEMPERATURE [˚C] Figure 3. Average Iout Vs Lux (Vcc = 1.8V, T=25°C, White LED source) 0.6 0.4 1.1 1 0.9 0.8 0.7 0.2 0.6 0 -40 0.5 -20 0 20 40 TEMPERATURE [˚C] 60 80 100 Figure 5. Relative Output Current Vs Temp (Vcc = 1.8V, 100 Lux) RISE TIME [Seconds] 18.0E-3 1 REL I-OUT 0.8 0.6 0.4 0.2 -50 1 2 3 VCC 4 5 6 AVG RISE TIME Vs LOAD RESISTANCE at VCC=1.8V 16.0E-3 14.0E-3 12.0E-3 10.0E-3 8.0E-3 6.0E-3 4.0E-3 2.0E-3 000.0E+0 0 -100 0 Figure 6. Relative Output Current Vs Vcc (Ta = 25°C, 100Lux) ANGULAR RESPONSE 1.2 0 50 ANGLE in DEGREE[˚] Figure 7. Relative Iout Vs Angle (Vcc = 1.8V, Ta = 25°C) 0.6 0.4 150.0E-6 000.0E+0 0.8 100 0 2000 4000 6000 8000 10000 LOAD RESISTANCE [Ohms] Figure 8. Average Rise Time Vs Load Resistance at Vcc = 1.8V 12000 AVG FALL TIME Vs LOAD RESISTANCE at VCC=1.8V 1.80E-02 900.0E-9 800.0E-9 1.40E-02 DarkCUrrent[A] FALL TIME [Seconds] 1.60E-02 1.20E-02 1.00E-02 8.00E-03 6.00E-03 4.00E-03 500.0E-9 400.0E-9 300.0E-9 0 2000 4000 6000 8000 LOAD RESISTANCE [Ohms] 10000 12000 000.0E+0 -40 RL=1kohm 1.2 RL=1.8kohm 1.0 RL=2.2kohm RL=2.7kohm 0.8 RL=3.3kohm 0.6 RL=4.3kohm 0.4 RL=5kohm RL=7.5kohm 0.2 0.0 RL=12kohm 0 100 200 300 400 500 600 700 800 Lux Figure 11. General Luminance vs Typical Output Voltage (Vcc = 1.8V, T = 25°C, Light Source = White LED) -20 0 20 40 60 TEMPERATURE [˚C] Figure 10. Dark current Vs temperature Average Vout vs Lux (Vcc = 1.8V, T = 25C, White LED Source) 1.4 Average Vout (V) 600.0E-9 100.0E-9 Figure 9. Average Fall Time Vs Load Resistance at Vcc = 1.8V 700.0E-9 200.0E-9 2.00E-03 0.00E+00 Average IDark Vs TEMP at VCC=1.8V 1.0E-6 900 1000 80 100 APDS-9005 Package Outline Top View Bottom View APDS-9005 Tape and Reel Dimension Moisture Proof Packaging Baking Conditions: All APDS-9005 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Units in A Sealed Mositure-Proof Package Package Temperature Time In Reel 60°C 48 hours In Bulk 100°C 4 hours Baking should only be done once. Recommended Storage Conditions: Package Is Opened (Unsealed) Package Is Opened less than 168 hours ? No Perform Recommended Baking Conditions Relative Humidity below 60% RH After removal from the bag, the parts should be soldered within 7 days and if stored at the recommended storage conditions. If times longer than 7 days are needed, the parts must be stored in a dry box. Yes Yes 10 °C to 30 °C Time from unsealing to soldering: Environment less than 30 deg C, and less than 60% RH ? No Baking Is Necessary Storage Temperature No Recommended Reflow Profile MAX 260˚C T - TEMPERATURE (˚C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 sec Above 217˚C 150 R5 R1 120 80 25 0 P1 HEAT UP 50 100 150 200 P3 SOLDER REFLOW P2 SOLDER PASTE DRY 250 P4 COOL DOWN Process Zone Symbol DT Maximum DT/Dtime or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 200°C to 255°C 3°C/s P3, R4 255°C to 200°C -6°C/s P4, R5 200°C to 25°C -6°C/s > 217°C 60s to 90s Cool Down Time maintained above 217°C Peak Temperature Time within 5°C of actual Peak Temperature Time 25°C to Peak Temperature 300 t-TIME (SECONDS) 260°C > 255°C 20s to 40s 25°C to 260°C 8mins The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. Process zone P1, the PC board and APDS-9005 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and APDS-9005 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS9005 pins to change dimensions evenly, putting minimal stresses on the APDS-9005. It is recommended to perform reflow soldering no more than twice. Appendix A: SMT Assembly Application Note 1.2 Recommended Metal Solder Stencil Aperture 1.0 Solder Pad, Mask and Metal Stencil Aperture Metal Stencil For Solder Paste Printing Stencil Aperture It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting. Aperture Opening Land Pattern 0.11 Solder Mask 1.6 PCBA 1.7 Unit: mm Figure A3. Solder Stencil Aperture Figure A1. Stencil and PCBA 1.3 Adjacent Land Keepout and Solder Mask Areas 1.1 Recommended Land Pattern Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. CL 0.4 The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. 0.3 Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. 2.6 0.45 0.9 Mounting Center 2.7 0.4 Unit: mm 0.2 0.4 0.2 MIN. Figure A2. Recommended Land Pattern Figure A4 Adjacent Land Keepout and Solder Mask Areas 10 Appendix B: Optical Window Design for APDS-9005 2.0 Optical Window Dimensions To ensure that the performance of the APDS-9005 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9005. This minimum dimension that is recommended will ensure at least a ±35° light reception cone. Table 1 and Figure B3 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585. D1 Top View T WD If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure B1 and B2 illustrate the two types of window that we have recommended which could either be a flat window or a flat window with light pipe. Figure B1. Window Size Determination for Flat Window D2 D1 L Z APDS-9005 LightRecevingArea Figure B3. Recommended Window Dimensions WD: Working Distance between window front panel & APDS-9005 D1: Window Diameter T: Thickness L: Length of Light Pipe D2: Light Pipe Diameter Z: Distance between window rear panel and APDS-9005 Table 1. Recommended minimum dimension for optical window WD (T+L+Z) 1.5 2.0 2.5 3.0 Flat Window (L=0.0) Z 0.5 1.0 1.5 2.0 D1 2.05 2.75 3.45 4.15 Flat window with Light Pipe D1/D2 2.0/1.2 T/L/Z 1.0/1.5/0.5 All dimensions are in mm The window should be placed directly on top of the light receiving area (active area) of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.2mm to optimize the performance of APDS-9005. The recommended minimum window dimension is based on the assumption that the center of the window and the center of the light receiving of the photo sensor are the same. It is recommended that the tolerance for assembly be considered as well. The recommended minimum window size which will take into account of the assembly tolerance is defined as: D1 (min + assembly tolerance) = D1min + 2*(assembly tolerance) (Dimensions are in mm) Figure B2. Window Design of Flat Window with Light Guide 11 D2 (min + assembly tolerance) = D2min + 2*(assembly tolerance) (Dimensions are in mm) 2.1 Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. Table 2. Recommended Plastic Materials Material number Makrolon LQ2647 Makrolon LQ3147 Makrolon LQ3187 Visible light transmission 87% 87% 85% Refractive index 1.587 1.587 1.587 Appendix C : General Application Guide for APDS-9005 The APDS-9005 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. APDS-9005 consists of a photo sensor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9005 can easily be integrated into systems that use ADC input which is available for sampling of the external source, as shown in figure C1 below. The amount of converted voltage, Vout, is mainly dependant proportionally on the photo current which generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increase the output voltage. Brightness is measured as “LUX” unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for “LUX” measurement. Light sources with the same LUX level appear at the same brightness to the human eyes. Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. Light source e.g. fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10uF, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples. Vcc 1 Light Source 6 2,3,4,5 A/D C NC Figure C1. Configuration of APDS-9005 For product information and a complete list of distributors, please go to our web site: Vout APDS-9005 www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0598EN AV02-0080EN - January 16, 2007 RL microcontroller