HSDL - 9100 Surface-Mount Proximity Sensor Data Sheet Description Features The HSDL-9100 is an analog-output reflective sensor with an integrated high efficiency infrared emitter and photodiode housed in a small form factor SMD package. The optical proximity sensor is housed in a specially designed metal-shield to ensure excellent optical isolation resulting in low optical cross-talk. • Excellent optical isolation resulting in near zero optical cross-talk HSDL-9100 is a class of its own with its small form SMD package and at a detection range from near zero to 60mm. It is specifically optimized for size, performance and ease of design in mobile constrained applications such as mobile phones and notebooks. • High efficiency emitter and high sensitivity photodiode for high signal-to-noise ratio • Low cost & lead-free miniature surface-mount package Height – 2.70 mm Width – 2.75 mm Length – 7.10 mm • Detect objects from near zero to 60mm HSDL-9100 has extremely low dark current and high signal to noise ratio (SNR) where high SNR is achieved with a pair of highly efficient infrared emitter and highly sensitive detector. • Low dark current Application Support Information Applications The Application Engineering Group is available to assist you with the application design associated with HSDL-9100 Proximity Sensor. You can contact them through your local sales representatives for additional details. • Mobile phones • Guaranteed Temperature Performance -40°C to 85°C • Lead-free and RoHS Compliant • Notebooks • Industrial Control • Printers, Photocopiers and Facsimile machines • Home Appliances • Vending Machines Order Information Part Number Packaging Type Package Quantity HSDL-9100-001 Tape and Reel PCB Substrate, moulded package 500 HSDL-9100-021 Tape and Reel PCB Substrate, moulded package 2500 Block Layout Pins Configuration Table Photodiode LED Pin Symbol Description Notes 1 LED_A DET_K 1 LED_A LED Anode 1 LED_K DET_A 2 LED_K LED Cathode - 3 DET_A Photodiode Anode - 4 DET_K Photodiode Cathode - TOP VIEW Figure 1. Block Layout of HSDL-9100 Notes: Voltage to supply across the LED; VLED Absolute Maximum Ratings (Ta=25°C) Ratings Parameter Symbol Min. Max Units Emitter Continuous Forward Current IDC - 100 mA Coupled Total Power Dissipation (refer to Figure 1) Operating Temperature Storage Temperature Reflow Soldering Temperature PTOT TOP TSTG TSOL -40 -40 - 165 +85 +100 260 mW °C °C °C Electrical-Optical Characteristics (Ta=25°C) Ratings Parameter Symbol Test Condition Min Typ Max Units Emitter Forward Voltage Reverse Voltage Peak Wavelength Spectrum Width of Half Value VF VR lp Dp IF = 100mA IR = 10uA IF = 20mA IF = 20mA 5 - 1.50 940 50 1.65 - V V nm nm Detector Dark Current Forward Voltage Reverse Breakdown Voltage IDark VF VBR VR = 10V, L** =0 IF = 10mA , L=0 IR = 100uA, L =0 0.5 - 2 - 10 1.3 35 nA V V IO Refer to Fig 2 Refer Note 1 Refer to Fig 3 RL = 50W RL = 50W RL = 5.1KW RL = 5.1KW - 0.1 5 50 50 6 6 200 - mA mm nA ns ns ms ms Coupled Output Current Peak Output Distance Operating Cross Talk Current Rise Time (LED) Fall Time (LED) Rise Time (Photodiode) Fall Time (Photodiode) DO IFD TRL TFL TRD TRD ** L = 0 (zero light condition) Note: 1. ILed = 300mA Pulse, 5% Duty Cycle (Kodak 18% Reflectance Gray Card) Output Current Test Condition (Ta=25°C) Dark Current Test Condition (Ta=25°C) LIGHT SEALED DARK BOX D KODAK GRAY CARD 1% REFLECTION LED PHOTODIODE IF LED IO IF PHOTODIODE IDARK Figure 2. Test Condition used are D = 5mm 18% Gray Card, ILED = 300mA Pulse, 5% Duty Cycle Figure 3. Test Condition used are ILED = 300mA Pulse, 5% Duty Cycle Response Time Test Condition (Ta=25°C) mm KODAK GRAY CARD 1% REFLECTION LED IF PHOTODIODE 0% IO R LED PULSE GENERATOR RL Figure 4. Response Time Test Condition INPUT OUTPUT 10% SCOPE TR TF Typical Characteristics Power Dissipation Vs Temperature 00 0 10 0 10 0 10 0 10 Power (mW) Forward Current LED Forward Current Vs Temperature 100 0 0 100 0 0 0 0 0 10 0 0 0 0 10 0 0 0 0 0 0 0 0 0 10 0 0 Temperature (˚C) LED Forward Current Vs Forward Voltage @ Across Temperature - 0.1 1 - .0E 0 Forward Current (A) 0.1 Forward Current (A) E 0.0 0.0 0.0 0.0 10 0 0 (Photodiode) Forward Current Vs Forward Voltage@Across Temp - - .0E - .0E 0 - .0E 0 - .0E 0 0 0 0. 0. 0. 0. 1 1. 1. +0 .0E 0 1. 0 00 Forward Voltage (V) Forward Current (A) Vs Temperature (degC) @Vcc=1V and 1.V 0.1 + 0.0 0.0 0.0 1V 0.0 1.V 0.0 0.0 0.0 0.01 0 -0 -0 0 0 0 Temperature (˚C) 0 0 100 Response Time (us) 0.0 Forward Current (A) 0 0 0.0 0 0 0 Temperature (˚C) E 1.0 0 + .0 0E 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ 0.0 0 0 E+ .0 0 0 E+0 0.0 0 0 E+ 0.0 0 E+0 0.0 0 10 E+ 0.1 0.0 00 0. 0. 0. 0. 1 Forward Voltage (V) 1. 1. 1. (Photodiode) Rise/Fall Time Vs Load Resistance@Room Temp, ILED=00mA Pulse (Rise (Fall) Mean (Fall) 1 10 100 Load Resistance (kohm) 1000 10000 1.0 E (Photodiode) Dark Current Vdet = //V vs Across Temperature Output Voltage vs Distance @ Room Temp and RL = 100K Ohm ILED = 100mA, 00mA and 00mA Pulse V E+ 1.0 V 00mA 00mA 100mA 1.0 E 10 .0E - Output Voltage (mV) Dark Current (A) 10 0.0 E V -0 -0 0 0 0 0 0 .0E 10 0 E+ 1.0 mm mm mm 00 00 10 0 0 0 0 0 0 100 10 00 00 0 Distance (mm) The diagram below illustrates the explanation of edge distance. Edge detection is labeled as D in the diagram below. Output Voltage Vs Edge Distance @ Room Temp and RL=100K Ohm ILED=00mA, D=//mm 00 Output Voltage (mV) 0 +0 100 Temperature (˚C) 1000 +0 .0E 0 10 00 00 00 00 1% Reflection Gray Card 00 100 0 -10 - - - - 0 Edge Distance (mm) Distance = D(mm) LED Distance = -D(mm) PIN mm .0 Mounting Centre . Tx 0.1 . Rx 1. . . 1. 1.1 R1 R0. HSDL-9100 Package Outline UNIT: mm Tolerance: ± 0.mm 0. . . . . . 0. .1 1.1 LED Cathode 0. . Photodiode Anode LED Anode Figure 5. Package outline dimensions 0. Photodiode Cathode 1.55±0.05 1.75 Rx Anode Tx Cathode 2±0.1 4±0.1 B 7.5 Rx Cathode Tx Anode 1.5 2.78±0.07 16 7.35±0.1 B-B Section 0.35 5˚ (MAX) HSDL-9100-021 Tape and Reel Dimensions 8±0.1 A A 2.95±0.1 B PROGRESSIVE DIRECTION EMPTY PARTS MOUNTED UNIT: MM LEADER (400 mm MIN.) (40 mm MIN.) EMPTY (40 mm MIN.) OPTION # "B" "C" QUANTITY 001 178 60 500 021 330 80 2500 UNIT: mm DETAIL A 2.0 ± 0.5 B C 16.4 +2 0 � 13.0 ± � 0.5 � R 1.0 LABEL DETAIL A Figure 6. Tape and Reel Dimensions 21 ± � 0.8 � 2.0 ± � 0.5 � HSDL-9100 Moisture Proof Packaging Baking Conditions Chart All HSDL-9100 options are shipped in moisture proof package. Once opened, moisture absorption begins. Units in A Sealed Moisture-Proof Package This part is compliant to JEDEC Level 4. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In reels In bulk Temp Time 60 °C ≥ 48hours 100 °C ≥ 4hours 125 °C ≥ 2 hours 150 °C ≥ 1 hour Baking should only be done once. Environment less than deg C, and less than 0% RH Yes No Baking Is Necessary Package Is Opened less Than hours Yes No Perform Recommended Baking Conditions Recommended Storage Conditions STORAGE TEMPERATURE 10°C to 30°C Relative Humidity below 60% RH Time from unsealing to soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. Package Is Opened (Unsealed) Figure 7. Baking conditions chart No Recommended Reflow Profile The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-9100 castellation pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4°C per second to allow for even heating of both the PC board and HSDL-9100 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and HSDL9100 castellations to change dimensions evenly, putting minimal stresses on the HSDL-9100 transceiver. MAX 0C T - TEMPERATURE (˚C) Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. R 0 0 00 10 R 0 sec MAX Above 0 C 10 R1 10 R R 0 0 P1 HEAT UP 100 0 10 P SOLDER PASTE DRY P SOLDER REFLOW 00 0 P COOL DOWN 00 t-TIME (SECONDS) Figure 8. Reflow graph Process Zone D T Maximum T/time D Heat Up P1, R1 25°C to 160°C 4°C/s Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s P3, R3P3, R4 200°C to 255°C (260°C at 10 seconds max) 255°C to 200°C 4°C/s -6°C/s P4, R5 200°C to 25°C -6°C/s Solder Reflow Cool Down Symbol D Recommended land pattern Appendix A: HSDL-9100 SMT Assembly Application Note Component placement 0. FIDUCIAL FIDUCIAL Recommended Metal solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See Table 1 below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern. Table 1. Combinations of metal stencil aperture and metal stencil thickness Aperture size (mm) Stencil thickness, t (mm) Length, l Width, w 0.152 1.60+/-0.05 0.55+/-0.05 0.127 1.92 0.55+/-0.05 Adjacent Land Keep out and Solder Mask Areas Adjacent land keep out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2mm.It is recommended that two fiducial crosses be placed at mid length of the pads for unit alignment. Also do take note that there should not be any electrical routing with the component placement compartment. 1. 0. 1. Mounting Center . . Figure 10. Recommended land pattern t Apertures as per Land Dimensions l w Figure 11. Solder stencil aperture Dim. mm h 4.15 l 11 k 5.5 j 3.5 k Component placement j Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended h Solder Pad, Mask and Metal Stencil Metal stencil for solder paste printing Mounting Center Solder Mask Stencil Aperture l Land Pattern Solder Mask PCBA Figure 9. Stencil and PCBA 10 Figure 12. Keep-out area Appendix B: General Application Guide for the HSDL-9100 Description Interface to the Recommended I/O chip The Proximity sensor has several possible applications for multimedia product, Automation, and Personal handled. The proximity sensor is basically made up of the emitter (infrared LED) and detector (photodiode). The block diagram of the sensor is shown in Figure 13. The emitter will emit IR light pulse. This light travels out in the field of view and will either hit an object or continue. No light will be reflected when no object is detected. On the other hand, the detector will detect the reflected IR light when it hits the object. The HSDL-9100 is general interface with the GPIO pin of the controller chipset. The LED_A, pin1 is connected to the PWM port alternatively the external timer circuitry can be used to drive the LED. The DET_K, pin 4 is interface to the signal conditioning before driving the GPIO port. Figure 14 shows the hardware reference design with HSDL-9100. Photodiode Photodiode anode LED cathode 1 Photodiode cathode LED anode LED Figure 13. Proximity sensor block diagram (refer to Pins Configuration Table) Key Pad STN/TFT LCD Panel LCD Control Touch Panel Peripherial interface A/D IrDA interface Mobile Application chipset Memory Expansion Logic Bus Driver AC sound PCM Sound IS Audio Input Memory I/F Baseband controller ROM IR Transceiver Power Management GPIO PWM Antenna FLASH SDRAM *IR LED driver Signal Conditional HSDL-100 * The LED can be driven by the PWM output or the external timer circuitry. Figure 14. Mobile Application Platform 11 The next section discusses interfacing configuration with general processor including the recommended signal conditional circuitry. The DET_K pin of HSDL-9100 is connected to the filter circuit then to the comparator before interfacing with the GPIO pin. The filter circuit is implement to provide the ambient light filter. The PWM is pulse to drive the LED_K pin alternative the external timer 555 can also be replaced. The detector distance can be varies with the increase/decrease of the LED current supply. Interfacing circuitry with signal conditional circuitry VCC HSDL-100 LEDA LEDK PWM DETK DETA VCC 0 Ohm VCC K Ohm BC K Ohm 0 pf 10 Ohm GND BCB K Ohm GND 1M Ohm VCC GND k Ohm GPIO controller chipset 00 Ohm GND Signal conditioning circuitry Figure 15. HSDL9100 configuration with controller chipset For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. 5989-3179EN - March 29, 2006