APDS-9003 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet Description Features The APDS-9003 is a low cost analog-output ambient light photo sensor in miniature chipLED lead-free surface mount package. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as shown in figure 2. The APDS-9003 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly. • Excellent responsivity Close responsivity to the human eye Application Support Information • ROHS compliant and Lead Free Package The Application Engineering Group is available to assist you with the application design associated with APDS9003 ambient light photo sensor module. You can contact them through your local sales representatives for additional details. Applications • Miniature ChipLed Leadfree surface-mount package: Height – 0.55mm Width – 1.60mm Depth – 1.50mm • Low sensitivity variation across various light sources • Operating temperature: -400C to 850C • Vcc supply 2.4 to 5.5V • Detection of ambient light to control display backlighting Mobile devices – Mobile phones, PDAs Computing devices – Notebooks, Webpads Consumer devices – TVs, Video Cameras, Digital Still Cameras • Automatic Residential and Commercial Lighting Management • Electronic Signs and Signals Ordering Information Part Number APDS-9003-020 Packaging Type Package Quantity Remarks Tape and Reel 6-pins Chipled package 2500 No Binning Binning Available Other binning options are available. Please contact your Avago Technologies representative for information on current available bins Typical Application Circuit 1.2 Relative Spectral Response Pin 1:VCC Pin 6:OUT APDS-9003 Pin 2,3,4,5 : NC RLOAD Component Recommended Application Circuit Component Rload 1kΩ Eye 1.0 APDS-9003 0.8 0.6 0.4 0.2 0 350 550 750 950 Wavelength (nm) 1150 Figure 2: Relative Spectral Response Vs Wavelength Figure 1: Typical application circuit for APDS-9003 I/O Pins Configuration Table Pin Symbol Description 1 VCC VCC 2 NC No Connect 3 NC No Connect 4 NC No Connect 5 NC No Connect 6 Out Out Absolute Maximum Ratings Parameter Symbol Min. Max. Units Storage Temperature TS -40 85 °C Supply Voltage VCC 0 6 V CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 2 Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA -40 85 °C Supply Voltage VCC 2.4 5.5 V Conditions Electrical & Optical Specifications (Ta=25°C) Parameter Symbol Min. Typ. Max. Units Conditions Output Current [4] I_OUT1 6.3 19 31 uA Vcc=3.0V,Lux=10 [Note 2] Output Current [4] I_OUT2 90 230 370 uA Vcc=3.0V,Lux=100 [Note 2] Output Current [4] I_OUT3 - 276 - uA Vcc=3.0V,Lux=100 [Note 1] Dark Current I_DARK - 50 160 nA Vcc=3.0V,Lux=0 Light Current Ratio I_OUT3 / I_OUT2 - 1.2 - - Rise Time Tr - 0.95 2 ms Vcc=3.0V,Lux=100,Rload=1k [Note 3] Fall Time Tf - 0.8 2 ms Vcc=3.0V,Lux=100,Rload=1k [Note 3] Supply Current Icc - 2.5 - mA Vcc=3.0V, LUX=1K [Note 3] Saturation Output Voltage Vo 2.2 2.32 - V - 620 - nm Peak Sensitivity Wavelength - Vcc=3.0V, LUX=100, Rload=1M Propagation Delay time td - 600 - us Vcc=3.0V, LUX=100,Rload=1k Storage Delay time ts - 200 - us Vcc=3.0V, LUX=100,Rload=1k Note: 1. Illuminance by CIE standard light source (Incandescent lamp) 2. Fluorescent light is used as light source. White LED is substituted in mass production. 3. White LED is used as light source. 4. Other binning options are available. Please contact your Avago Technologies representative for information on current available bins Light Measurement Circuit and Waveforms I_pulse Pin 1:VCC I_pulse Pin 6:OUT VOUT APDS-9003 90% 10% GND Pin 2,3,4,5 : NC RLOAD tr td 3 tf ts 2.5 1.10 Relative Iout 1.08 Relative output current Relative Iout(A) 2.0 1.5 1.0 0.5 Relative Iout -25 1.04 1.02 1.00 0.98 0 -50 1.06 0 25 50 75 100 0.96 Temp(C) 2 3 4 5 6 Vcc (V) Relative Output Current Vs Temp (Vcc = 3.0V, 100 Lux) Relative Output Current Vs Vcc (Ta =25C, 100 Lux) 1.20 4.0E-3 Relative output current Switching Time(sec) Relative Iout 1.00 0.80 0.60 0.40 3.5E-3 3.0E-3 2.5E-3 2.0E-3 1.5E-3 1.0E-3 0.20 500.0E-6 0.00 000.0E+0 -90 -60 -30 0 30 60 90 0 2000 Angle 4000 Relative Iout Vs Angle (Vcc=3V, Ta=25C) Average Trise Average Tfall Average Tpropagation_delay Average Tstoragedelay Switching Charecteristics (TA = 25C, Vcc = 3V) Average Iout Vs Lux (Vcc=3V, T=25C, White LED source) 10000 Average Iout (uA) Average Bin 1 Average Bin 2 1000 Average No Binning 100 10 1 10 100 Lux 1000 Average Iout Vs Lux (Vcc = 3V, T = 25C, White LED source) 4 6000 Rload (ohm) APDS-9003 Package Outline 3 2 1 Unit : mm Tolerance : `0.1 4 5 1.60`0.05 ; ;; ;; ;; ;;;;;;;;;; 0.25 0.07 ;;;; ;;;;; R0.15 Light receiving area (0.505mm x 0.360mm) 6 Marking 1.50`0.05 0.18`0.05 0.37`0.05 0.55`0.1 0.35 0.35 Pin Configuration 0.8 0.35 0.35 0.25 0.25 0.3 5 1. 2. 3. 4. 5. 6. VCC NC NC NC NC OUT ; APDS-9003 Tape and Reel Dimension Unit : mm 1.75`0.05 4.00`0.10 .1 0 +0 .50 2.00`0.05 n1 3 4`0.1 3.5`0.05 3~Max 1.75`0.10 0.70`0.05 Marking n1.00`0.1 1.65`0.05 PROGRESSIVE DIRECTION Material of Carrier Tape : Conductive Polystrene Material of Cover Tape : PVC Method of Cover : Heat Sensitive Adhesive (40 mm MIN) (400 mm MIN) PARTS MOUNTED LEADER EMPTY (40 mm MIN) "B" "C" 178 75 18.4 (max.) UNIT : mm 0.50 2.0` DETAIL A C Di a. 13 .0` 0.5 R1.0 LABEL 20.2(min.) 0 DETAIL A 15.4 (max) 6 1 4 5 6 Orentation in the Tape and Reel 3~Max EMPTY 2 ; ;; ;; ;; ;; ;; ; ;;;;;;;;;;;; ;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;; ;;;;; 8`0.10 0.25`0.03 B Moisture Proof Packaging Baking Conditions: All APDS-9003 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Units in A Sealed Mositure-Proof Package Package Temperature Time In Reel 60°C 48 hours In Bulk 100°C 4 hours Baking should only be done once. Recommended Storage Conditions: Package Is Opened (Unsealed) Storage Temperature Relative Humidity 10°C to 30°C below 60% RH Time from unsealing to soldering: After removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. If times longer than 168 hours are needed, the parts must be stored in a dry box. Environment less than 30 deg C, and less than 60% RH ? Yes No Baking Is Necessary Yes Package Is Opened less than 168 hours ? No Perform Recommended Baking Conditions 7 No Recommended Reflow Profile The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9003 castellation pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4°C per second to allow for even heating of both the PC board and APDS-9003 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9003 castellations to change dimensions evenly, putting minimal stresses on the APDS-9003. MAX 260C T - TEMPERATURE ( C) 255 R3 230 220 200 180 R2 R4 60 sec MAX Above 220 C 160 R1 120 R5 80 25 0 50 P1 HEAT UP 100 P2 SOLDER PASTE DRY 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN ∆T Heat Up P1, R1 25°C to 160°C 4°C/s Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s Solder Reflow P3, R3 P3, R4 200°C to 255°C (260°C at 10 seconds max) 255°C to 200°C 4°C/s -6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s 8 t-TIME (SECONDS) Maximum ∆T/ time Symbol Process Zone 300 Appendix A: SMT Assembly Application Note 1.0 1.2 Recommended Metal Solder Stencil Aperture Solder Pad, Mask and Metal Stencil Aperture Metal Stencil For Solder Paste Printing Stencil Aperture Land Pattern It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting. Aperture Opening Solder Mask 0.11 PCBA 1.6 1.7 Unit: mm Figure 1: Stencil and PCBA Figure 3: Solder Stencil Aperture 1.1 Recommended Land Pattern 1.3 Adjacent Land Keepout and Solder Mask Areas CL Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. 0.4 The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. 0.3 Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. 2.6 0.45 0.9 Mounting Center 2. 0.4 0.2 Figure 2: Recommended Land Pattern 0.4 Unit: mm 0.2 MIN. Figure 4: Adjacent Land Keepout and Solder Mask Areas 9 Appendix B: Optical Window Design for APDS-9003 2.0 Optical Window Dimensions To ensure that the performance of the APDS-9003 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS9003. This minimum dimension that is recommended will ensure at least a ±35° light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure 5a and 5b illustrate the two types of window that we have recommended which could either be a flat window or a flat window with light pipe. Table 1 and Fgure 6 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585. D1 Top View T WD L D2 D1 Z APDS-9003 Light Receving Area Figure 6: Recommended Window Dimensions WD: Working Distance between window front panel & APDS-9003 D1: Window Diameter T: Thickness L: Length of Light Pipe D2: Light Pipe Diameter Z: Figure 5(a): Window Size Determination for Flat Window Figure 5(b): Window Design of Flat Window with Light Guide 10 Distance between window rear panel and APDS9003 Table 1: Recommended dimension for optical window WD (T+L+Z) Flat Window (L=0.0) Flat window with Light Pipe (D2=1.5; Z =0.5) Z D1 D1 L 1.5 0.5 2.25 - - 2.0 1.0 3.25 - - 2.5 1.5 4.25 - - 3.0 2.0 5.00 2.5 1.5 All dimensions are in mm The window should be placed directly on top of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5mm to optimize the performance of APDS-9003. 2.1 Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. Table 2: Recommended Plastic Materials Material number Visible light transmission Refractive index Makrolon LQ2647 87% 1.587 Makrolon LQ3147 87% 1.587 Makrolon LQ3187 85% 1.587 11 Appendix C: General Application Guide for APDS-9003 The APDS-9003 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. APDS-9003 consists of a photo sensor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9003 can easily be integrated into systems that use ADC input which is available for sampling of the external source, as shown in figure 7 below. Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. APDS9003 allows a saturation output voltage of typically 2.32V @ VCC=3V. Light source e.g. fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10uF, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples. The amount of converted voltage, Vout, is mainly dependant proportionally on the photo current which generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increase the output voltage. Brightness is measured as “LUX” unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for “LUX” measurement. Light sources with the same LUX level appear at the same brightness to the human eyes. Vcc 1 Light Source 6 Vout A/D APDS-9003 2,3,4,5 C RL microcontroller NC Figure 7: Configuration of APDS-9003 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. AV01-0238EN - June 8, 2006