TI OPA2356AIDGKT

OPA
OPA2
356
OPA
OPA356
OPA2356
2356
356
SBOS212A – NOVEMBER, 2001
200MHz, CMOS
OPERATIONAL AMPLIFIER
FEATURES
DESCRIPTION
● UNITY-GAIN BANDWIDTH: 450MHz
The OPAx356 series high-speed, voltage-feedback CMOS
operational amplifiers are designed for video and other
applications requiring wide bandwidth. The OPAx356 is unity
gain stable and can drive large output currents. Differential
gain is 0.02% and differential phase is 0.05°. Quiescent
current is only 8.3mA per channel.
● WIDE BANDWIDTH: 200MHz GBW
● HIGH SLEW RATE: 360V/µs
● LOW NOISE: 5.8nV/√Hz
● EXCELLENT VIDEO PERFORMANCE:
DIFF GAIN: 0.02%, DIFF PHASE: 0.05°
0.1dB GAIN FLATNESS: 75MHz
OPAx356 is optimized for operation on single or dual supplies as low as 2.5V (±1.25V) and up to 5.5V (±2.75V).
Common-mode input range for the OPAx356 extends 100mV
below ground and up to 1.5V from V+. The output swing is
within 100mV of the rails, supporting wide dynamic range.
● INPUT RANGE INCLUDES GROUND
● RAIL-TO-RAIL OUTPUT (within 100mV)
● LOW INPUT BIAS CURRENT: 3pA
● THERMAL SHUTDOWN
● SINGLE-SUPPLY OPERATING RANGE: 2.5V to 5.5V
● MicroSIZE PACKAGES
APPLICATIONS
● VIDEO PROCESSING
● ULTRASOUND
● OPTICAL NETWORKING, TUNABLE LASERS
● PHOTODIODE TRANSIMPEDANCE AMPS
The OPAx356 series is available in single (SOT23-5 and SO-8),
and dual (MSOP-8 and SO-8) versions. Multichannel versions
feature completely independent circuitry for lowest crosstalk and
freedom from interaction. All are specified over the extended
–40°C to +125°C range.
OPAx356 RELATED PRODUCTS
FEATURES
PRODUCT
200MHz, Rail-to-Rail Output, CMOS, Shutdown
38MHz, Rail-to-Rail Input/Output, CMOS
75MHz, Rail-to-Rail Output
150MHz, Rail-to-Rail Output
Differential Input/Output, 3.3V Supply
OPAx355
OPAx350
OPAx631
OPAx634
THS412x
● ACTIVE FILTERS
V+
● HIGH-SPEED INTEGRATORS
–VIN
● ANALOG-TO-DIGITAL (A/D) CONVERTER
INPUT BUFFERS
OPA356
Out
+VIN
● DIGITAL-TO-ANALOG (D/A) CONVERTER
OUTPUT AMPLIFIERS
V–
● BARCODE SCANNERS
● COMMUNICATIONS
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage, V+ to V– ................................................................... 7.5V
Signal Input Terminals, Voltage(2) .................... (V–) – 0.5V to (V+) + 0.5V
Current(2) ..................................................... 10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. –55°C to +150°C
Storage Temperature ...................................................... –65°C to +150°C
Junction Temperature .................................................................... +160°C
Lead Temperature (soldering, 10s) ............................................... +300°C
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals
that can swing more than 0.5V beyond the supply rails should be current limited
to 10mA or less. (3) Short-circuit to ground one amplifier per package.
PACKAGE/ORDERING INFORMATION
PRODUCT
OPA356AIDBV
PACKAGE-LEAD
PACKAGE
DESIGNATOR(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(2)
TRANSPORT
MEDIA, QUANTITY
OPA356AIDBVT
OPA356AIDBVR
Tape and Reel, 250
Tape and Reel, 3000
OPA356AID
OPA356AIDR
Rails, 100
Tape and Reel, 2500
OPA2356AIDGKT
OPA2356AIDGKR
Tape and Reel, 250
Tape and Reel, 2500
OPA2356AID
OPA2356AIDR
Rails, 100
Tape and Reel, 2500
SOT23-5
DBV
–40°C to +125°C
OAAI
"
"
"
"
"
OPA356AID
SO-8
D
–40°C to +125°C
OPA356A
"
"
"
"
"
OPA2356AIDGK
MSOP-8
DGK
–40°C to +125°C
AYI
"
"
"
"
"
OPA2356AID
SO-8
D
–40°C to +125°C
OPA2356A
"
"
"
"
"
NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com. (2) Models labeled with “T” indicate smaller quantity
tape and reel, “R” indicates large quantity tape and reel and “D” indicates rails of specified quantity.
PIN CONFIGURATIONS
Top View
OPA356
OPA2356
OPA356
NC(1)
Out 1
5
1
8
NC(1)
Out A
1
7
V+
–In A
2
6
Out
5
NC(1)
8
V+
7
Out B
6
–In B
5
+In B
V+
–In
2
V– 2
A
+In
+In 3
4
3
+In A
3
B
–In
V–
4
V–
4
SOT23
SO
MSOP, SO
NOTE: (1) NC means no internal connection.
2
OPA356, 2356
SBOS212A
ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Single Supply
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RF = 604Ω, RL = 150Ω, Connected to VS/2, unless otherwise noted.
OPA356AIDBV, AID,
OPA2356AIDGK, AID
PARAMETER
CONDITION
OFFSET VOLTAGE
Input Offset Voltage
VOS
dVOS/dT
PSRR
vs Temperature
vs Power Supply
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
MIN
±2
VS = +5V
Specified Temperature Range
Specified Temperature Range
VS = +2.7V to +5.5V, VCM = VS/2 – 0.15V
IB
IOS
NOISE
Input Noise Voltage Density
Current Noise Density
en
in
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
VCM
CMRR
f = 1MHz
f = 1MHz
OPA356
OPA2356
FREQUENCY RESPONSE
Small-Signal Bandwidth
Gain-Bandwidth Product
Bandwidth for 0.1dB Gain Flatness
Slew Rate
Rise-and-Fall Time
Settling Time, 0.1%
0.01%
Overload Recovery Time
Harmonic Distortion
2nd Harmonic
3rd Harmonic
Differential Gain Error
Differential Phase Error
Channel-to-Channel Crosstalk
OUTPUT
Voltage Output Swing from Rail
Voltage Output Swing from Rail
Voltage Output Swing from Rail
Ouput Current, Continuous(1)
Maximum Output Current, Peak(1)
Maximum Output Current, Peak(1)
Short Circuit Current
Closed-Loop Output Impedance
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
Quiescent Current (per amplifier)
OPA356, 2356
SBOS212A
f–3dB
f–3dB
f–3dB
f–3dB
GBW
f0.1dB
SR
OPA2356
IO
IO
IO
UNITS
±9
±7
±80
±350
mV
mV
µV/°C
µV/V
3
±1
±50
±50
pA
pA
±15
(V–) – 0.1
66
66
nV/√Hz
fA/√Hz
80
V
dB
dB
1013 || 1.5
1013 || 1.5
Ω || pF
Ω || pF
92
dB
dB
dB
G = +1, VO = 100mVp-p, RF = 0Ω
G = +2, VO = 100mVp-p, RL = 50Ω
G = +2, VO = 100mVp-p, RL = 150Ω
G = +2, VO = 100mVp-p, RL = 1kΩ
G = +10, RL = 1kΩ
G = +2, VO = 100mVp-p, RF = 560Ω
VS = +5V, G = +2, 4V Output Step
G = +2, VO = 200mVp-p, 10% to 90%
G = +2, VO = 2Vp-p, 10% to 90%
VS = +5V, G = +2, 2V Output Step
VS = +5V, G = +2, 2V Output Step
VIN • Gain = VS
450
100
170
200
200
75
300/–360
2.4
8
30
120
8
MHz
MHz
MHz
MHz
MHz
MHz
V/µs
ns
ns
ns
ns
ns
G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω
G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω
NTSC, RL = 150Ω
NTSC, RL = 150Ω
f = 5MHz
–81
–93
0.02
0.05
–90
dBc
dBc
%
degrees
dB
VS = +5V, RL = 150Ω, AOL > 84dB
VS = +5V, RL = 1kΩ
IO = ±100mA
0.2
0.1
0.8
VS = +5.5V, –0.1V < VCM < +4.0V
Specified Temperature Range
VS = +5V, 0.3V < VO < 4.7V
VS = +5V, 0.3V < VO < 4.7V
VS = +5V, 0.4V < VO < 4.6V
VS = +5V
VS = +3V
84
80
80
(V+) – 1.5
VS = +5V, IO = 0
Specified Temperature Range
1
±80
+250/ –200
0.02
2.7
VS
0.3
±60
±100
f < 100kHz
IQ
MAX
5.8
50
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
TYP
5.5
2.5 to 5.5
8.3
11
14
V
V
V
mA
mA
mA
mA
Ω
V
V
mA
mA
3
ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Single Supply (Cont.)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RF = 604Ω, RL = 150Ω, Connected to VS/2, unless otherwise noted.
OPA356AIDBV, AID,
OPA2356AIDGK, AID
PARAMETER
CONDITION
MIN
THERMAL SHUTDOWN
Junction Temperature
Shutdown
Reset from Shutdown
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT23-5, MSOP-8
SO-8
TYP
MAX
°C
°C
160
140
–40
–55
–65
125
150
150
θJA
150
125
UNITS
°C
°C
°C
°C/W
°C/W
°C/W
NOTES: (1) See typical characteristic “Output Voltage Swing vs Output Current”.
4
OPA356, 2356
SBOS212A
TYPICAL CHARACTERISTICS
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
NON-INVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
INVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
6
3
VO = 0.1Vp-p
0
Normalized Gain (dB)
3
Normalized Gain (dB)
VO = 0.1Vp-p
G = +1
RF = 0
0
–3
G = +2
–6
G = +5
–9
G = +10
1M
–3
G = –5
–6
G = –10
–9
10M
Frequency (Hz)
100M
–15
100k
1G
NON-INVERTING SMALL-SIGNAL
STEP RESPONSE
1M
10M
Frequency (Hz)
100M
1G
NON-INVERTING LARGE-SIGNAL
STEP RESPONSE
G = +2
Output Voltage (500mV/div)
Output Voltage (50mV/div)
G = +2
Time (20ns/div)
Time (20ns/div)
0.1dB GAIN FLATNESS FOR VARIOUS RF
HARMONIC DISTORTION vs OUTPUT VOLTAGE
–50
VO = 0.1Vp-p
CL = 0pF
0.4
RF = 604Ω
0.3
0.2
0.1
0
–0.1
RF = 560Ω
–0.2
–0.3
RF = 500Ω
–0.4
–0.5
Harmonic Distortion (dBc)
0.5
Normalized Gain (dB)
G = –2
–12
–12
–15
100k
G = –1
f = 1MHz
RL = 200Ω
–60
–70
2nd Harmonic
–80
3rd Harmonic
–90
–100
1
OPA356, 2356
SBOS212A
10
Frequency (MHz)
100
0
1
2
Output Voltage (Vp-p)
3
4
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
HARMONIC DISTORTION vs NON-INVERTING GAIN
HARMONIC DISTORTION vs INVERTING GAIN
–50
VO = 2Vp-p
f = 1MHz
RL = 200Ω
–60
Harmonic Distortion (dBc)
Harmonic Distortion (dBc)
–50
–70
2nd Harmonic
–80
3rd Harmonic
–90
–100
VO = 2Vp-p
f = 1MHz
RL = 200Ω
–60
–70
2nd Harmonic
–80
3rd Harmonic
–90
–100
1
10
1
10
Gain (V/V)
Gain (V/V)
HARMONIC DISTORTION vs FREQUENCY
HARMONIC DISTORTION vs LOAD RESISTANCE
–50
VO = 2Vp-p
RL = 200Ω
–60
VO = 2Vp-p
f = 1MHz
Harmonic Distortion (dBc)
Harmonic Distortion (dBc)
–50
2nd Harmonic
–70
–80
3rd Harmonic
–90
–60
–70
–80
2nd Harmonic
–90
3rd Harmonic
–100
1M
Frequency (Hz)
100
1k
RL (Ω)
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
FREQUENCY RESPONSE FOR VARIOUS RL
3
10k
RL = 10kΩ
0
1k
Voltage Noise
Current Noise
100
10
–3
CL = 0pF
VO = 0.1Vp-p
RL = 50Ω
–6
RL = 150Ω
–9
RL = 1kΩ
–12
1
10
100
1k
10k
100k
Frequency (Hz)
6
10M
Normalized Gain (dB)
Voltage Noise (nV/√Hz), Current Noise (fA/√Hz)
–100
100k
1M
10M
100M
–15
100k
1M
10M
Frequency (Hz)
100M
1G
OPA356, 2356
SBOS212A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
FREQUENCY RESPONSE FOR VARIOUS CL
RECOMMENDED RS vs CAPACITIVE LOAD
9
120
100
CL = 47pF
3
80
0
RS (Ω)
Normalized Gain (dB)
CL = 100pF
RS = 0Ω
VO = 0.1Vp-p
6
–3
CL = 5.6pF
60
VIN
VO
40
CL
1kΩ
604Ω
–9
20
–12
–15
100k
3
0
1M
10M
Frequency (Hz)
100M
1G
1
90
VIN
RS
VO
OPA356
CL
CL = 47pF
RS = 36Ω
1kΩ
604Ω
–12
(1kΩ is
Optional)
604Ω
–PSRR
80
CL = 5.6pF
RS = 80Ω
CMRR, PSRR (dB)
–3
–9
100
100
CL = 100pF
RS = 24Ω
–6
10
Capacitive Load (pF)
COMMON-MODE REJECTION RATIO AND
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
G = +2
VO = 0.1Vp-p
0
(1kΩ is
Optional)
604Ω
FREQUENCY RESPONSE vs CAPACITIVE LOAD
Normalized Gain (dB)
RS
OPA356
–6
+PSRR
70
60
CMRR
50
40
30
20
10
–15
0
1M
10M
100M
Frequency (Hz)
1G
10k
1M
10M
Frequency (Hz)
100M
1G
COMPOSITE VIDEO
DIFFERENTIAL GAIN AND PHASE
OPEN-LOOP GAIN AND PHASE
0.40
180
160
0.35
RL = 1kΩ
140
120
dG/dP (%/degrees)
Open-Loop Phase (degrees)
Open-Loop Gain (dB)
100k
Phase
100
80
60
RL = 150Ω
40
Gain
0.30
0.25
0.20
dP
0.15
0.10
20
dG
0.05
0
0
–20
1k
10k
OPA356, 2356
SBOS212A
100k
1M
10M
Frequency (Hz)
100M
1G
1
2
3
Number of 150Ω Loads
4
7
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
FOR VS = 3V
INPUT BIAS CURRENT vs TEMPERATURE
3
10n
–55°C
Output Voltage (V)
Input Bias Current (pA)
25°C
1n
100
2
125°C
Continuous currents above
60mA are not recommended
125°C
1
10
–55°C
25°C
0
1
–55
–35
–15
5
25
45
65
Temperature (°C)
85
0
105 125 135
30
60
90
Output Current (mA)
120
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
FOR VS = 5V
SUPPLY CURRENT vs TEMPERATURE
5
14
25°C
12
–55°C
4
VS = 5.5V
Output Voltage (V)
Supply Current (mA)
150
10
8
6
VS = 2.5V
VS = 3V
4
125°C
3
Continuous currents above
60mA are not recommended
2
125°C
VS = 5V
1
2
–55°C
25°C
0
0
–55
–35
–15
5
25
45
65
Temperature (°C)
85
0
105 125 135
CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY
50
100
150
Output Current (mA)
200
250
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
100
6
10
5
Output Voltage (Vp-p)
Output Impedance (Ω)
VS = 5.5V
1
OPA356
0.1
604Ω
ZO
0.01
3
VS = 2.7V
2
1
604Ω
0.001
0
10k
8
Maximum Output
Voltage without
Slew-Rate
Induced Distortion
4
100k
1M
10M
Frequency (Hz)
100M
1G
1
10
Frequency (MHz)
100
OPA356, 2356
SBOS212A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN vs TEMPERATURE
OUTPUT SETTLING TIME TO 0.1%
110
0.2
VO = 2Vp-p
RL = 1kΩ
100
Open-Loop Gain (dB)
Output Error (%)
0.1
0
–0.1
–0.2
90
RL = 150Ω
80
70
–0.3
60
–0.4
0
5
10
15
20 25
30
Time (ns)
35
40
45
–55
50
–35
–15
25
45
65
Temperature (°C)
85
105 125 135
COMMON-MODE REJECTION RATIO AND
POWER-SUPPLY REJECTION RATIO vs TEMPERATURE
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
100
20
18
Power-Supply Rejection Ratio
90
16
CMRR, PSRR (dB)
Percent of Amplifiers (%)
5
14
12
10
8
6
80
Common-Mode Rejection Ratio
70
60
4
2
50
0
–55
–9 –8 –7 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6 7 8 9
Offset Voltage (mV)
–35
–15
5
25
45
65
Temperature (°C)
85
105 125 135
CHANNEL-TO-CHANNEL CROSSTALK
Crosstalk, Input-Referred (dB)
0
–20
–40
–60
–80
OPA2356
(dual)
–100
–120
100k
1M
10M
100M
Frequency (Hz)
OPA356, 2356
SBOS212A
9
APPLICATIONS INFORMATION
The OPAx356 series is a CMOS, high-speed, voltage feedback, operational amplifier designed for video and other
general-purpose applications. It is available as a single or
dual op amp.
The amplifier features a 200MHz gain bandwidth and
360V/µs slew rate, but it is unity-gain stable and can be
operated as a +1V/V voltage follower.
Its input common-mode voltage range includes ground, allowing the OPAx356 to be used in virtually any single-supply
application up to a supply voltage of +5.5V.
PCB LAYOUT
Good high-frequency PC board layout techniques should be
employed for the OPAx356. Generous use of ground planes,
short direct signal traces, and a suitable bypass capacitor
located at the V+ pin will assure clean, stable operation.
Large areas of copper also provide a means of dissipating
heat that is generated within the amplifier in normal operation.
Sockets are definitely not recommended for use with any
high-speed amplifier.
A 10µF ceramic bypass capacitor is the minimum recommended value; adding a 1µF or larger tantalum capacitor in
parallel can be beneficial when driving a low-resistance load.
Providing adequate bypass capacitance is essential to achieving very low harmonic and intermodulation distortion.
Parameters that vary significantly over supply voltage or
temperature are shown in the “Typical Characteristics” section of this data sheet.
OUTPUT DRIVE
The OPAx356 output stage is capable of driving a standard
back-terminated 75Ω video cable. By back-terminating a
transmission line, it does not exhibit a capacitive load to its
driver. A properly back-terminated 75Ω cable does not appear as capacitance; it presents only a 150Ω resistive load to
the OPAx356 output.
The output stage can supply high short-circuit current (typically over 200mA). Therefore, an on-chip thermal shutdown
circuit is provided to protect the OPAx356 from dangerously
high junction temperatures. At 160°C, the protection circuit
will shut down the amplifier. Normal operation will resume
when the junction temperature cools to below 140°C.
NOTE: It is not recommended to run a continuous DC current
in excess of ±60mA. Refer to the graph of “Output Voltage
Swing vs Output Current”, shown in the “Typical Characteristics” section of this data sheet.
INPUT AND ESD PROTECTION
All OPAx356 pins are static protected with internal ESD
protection diodes tied to the supplies, as shown in Figure 1.
These diodes will provide overdrive protection if the current
is externally limited to 10mA by the source or by a resistor.
OPERATING VOLTAGE
The OPAx356 is specified over a power-supply range of
+2.7V to +5.5V (±1.35 to ±2.75V). However, the supply
voltage may range from +2.5V to +5.5V (±1.25V to ±2.75V).
Supply voltages higher than 7.5V (absolute maximum) can
permanently damage the amplifier.
+V CC
External
Pin
Internal
Circuitry
–V CC
FIGURE 1. Internal ESD Protection.
10
OPA356, 2356
SBOS212A
PACKAGE DRAWINGS
MPDS018D – FEBRUARY 1996 – REVISED JANUARY 2001
DBV (R-PDSO-G5)
PLASTIC SMALL-OUTLINE
0,50
0,30
0,95
5
0,20 M
4
1,70
1,50
1
0,15 NOM
3,00
2,60
3
Gage Plane
3,00
2,80
0,25
0°–8°
0,55
0,35
Seating Plane
1,45
0,95
0,05 MIN
0,10
4073253-4/F 10/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC MO-178
OPA356, 2356
SBOS212A
11
PACKAGE DRAWINGS (Cont.)
MPDS028B – JUNE 1997 – REVISED SEPTEMBER 2001
DGK (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
0,65
8
0,08 M
5
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
1
0°– 6°
4
3,05
2,95
0,69
0,41
Seating Plane
1,07 MAX
0,15
0,05
0,10
4073329/C 08/01
NOTES: A.
B.
C.
D.
12
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC MO-187
OPA356, 2356
SBOS212A
PACKAGE DRAWINGS (Cont.)
MSOI002B – JANUARY 1995 – REVISED SEPTEMBER 2001
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
0.050 (1,27)
8
0.010 (0,25)
5
0.008 (0,20) NOM
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
1
4
0.010 (0,25)
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
0.004 (0,10)
0.069 (1,75) MAX
PINS **
0.004 (0,10)
8
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047/E 09/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
Falls within JEDEC MS-012
OPA356, 2356
SBOS212A
13
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
OPA2356AID
ACTIVE
SOIC
D
8
100
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2356AIDG4
ACTIVE
SOIC
D
8
100
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2356AIDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2356AIDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2356AIDGKT
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2356AIDGKTG4
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2356AIDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2356AIDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AID
ACTIVE
SOIC
D
8
100
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AIDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AIDBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AIDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AIDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AIDG4
ACTIVE
SOIC
D
8
100
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AIDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA356AIDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
7-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
OPA2356AIDGKR
DGK
8
CAR
0
0
5.3
3.4
1.4
8
12
Q1
OPA2356AIDR
D
8
CRS
0
0
6.4
5.2
2.1
8
12
Q1
OPA356AIDR
D
8
CRS
0
0
6.4
5.2
2.1
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
OPA2356AIDGKR
DGK
8
CAR
346.0
346.0
29.0
OPA2356AIDR
D
8
CRS
342.9
336.6
20.6
OPA356AIDR
D
8
CRS
342.9
336.6
20.6
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated