Freescale Semiconductor Technical Data DSP56321 Rev. 11, 2/2005 DSP56321 24-Bit Digital Signal Processor 3 16 6 6 Memory Expansion Area EFCOP Peripheral Expansion Area Address Generation Unit Six Channel DMA Unit DDB YDB XDB PDB GDB Internal Data Bus Switch EXTAL XTAL RESET PINIT/NMI YAB XAB PAB DAB Y Data RAM 80 K × 24 bits 24-Bit DSP56300 Core Bootstrap ROM Clock PLL Generator X Data RAM 80 K × 24 bits YM_EB ESSI XM_EB HI08 PIO_EB SCI Program RAM 32 K × 24 bits or 31 K × 24 bits and Instruction Cache 1024 × 24 bits PM_EB Triple Timer Program Interrupt Controller Program Decode Controller Program Address Generator Data ALU 24 × 24 + 56 →56-bit MAC Two 56-bit Accumulators 56-bit Barrel Shifter External Address Bus Switch External Bus Interface and I - Cache Control External Data Bus Switch Power Management 18 Address 10 The DSP56321 is intended for applications requiring a large amount of internal memory, such as networking and wireless infrastructure applications. The onboard EFCOP can accelerate general filtering applications, such as echo-cancellation applications, correlation, and general-purpose convolutionbased algorithms. Control 24 Data What’s New? Rev. 11 includes the following changes: • Adds lead-free packaging and part numbers. 5 JTAG OnCE™ DE MODA/IRQA MODB/IRQB MODC/IRQC MODD/IRQD Figure 1. DSP56321 Block Diagram The Freescale DSP56321, a member of the DSP56300 DSP family, supports networking, security encryption, and home entertainment using a high-performance, single-clock-cycle-per- instruction engine (DSP56000 codecompatible), a barrel shifter, 24-bit addressing, an instruction cache, and a direct memory access (DMA) controller (see Figure 1). The DSP56321 offers 275 million multiply- accumulates per second (MMACS) performance, attaining 550 MMACS when the EFCOP is in use. It operates with an internal 275 MHz clock with a 1.6 volt core and independent 3.3 volt input/output (I/O) power. By operating in parallel with the core, the EFCOP provides overall enhanced performance and signal quality with no impact on channel throughput or total channel support. This device is pin-compatible with the Freescale DSP56303, DSP56L307, DSP56309, and DSP56311. © Freescale Semiconductor, Inc., 2001, 2005. All rights reserved. Table of Contents Data Sheet Conventions .......................................................................................................................................ii Features...............................................................................................................................................................iii Target Applications ............................................................................................................................................. iv Product Documentation .......................................................................................................................................v Chapter 1 Signals/Connections 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 Chapter 2 Specifications 2.1 2.2 2.3 2.4 Chapter 3 Package Description .........................................................................................................................................3-2 MAP-BGA Package Mechanical Drawing .....................................................................................................3-10 Design Considerations 4.1 4.2 4.3 4.4 Appendix A Maximum Ratings.............................................................................................................................................2-1 Thermal Characteristics ....................................................................................................................................2-2 DC Electrical Characteristics............................................................................................................................2-2 AC Electrical Characteristics............................................................................................................................2-3 Packaging 3.1 3.2 Chapter 4 Power ................................................................................................................................................................1-3 Ground ..............................................................................................................................................................1-3 Clock.................................................................................................................................................................1-3 External Memory Expansion Port (Port A) ......................................................................................................1-4 Interrupt and Mode Control ..............................................................................................................................1-6 Host Interface (HI08)........................................................................................................................................1-7 Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-10 Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-11 Serial Communication Interface (SCI) ...........................................................................................................1-12 Timers .............................................................................................................................................................1-13 JTAG and OnCE Interface ..............................................................................................................................1-14 Thermal Design Considerations........................................................................................................................4-1 Electrical Design Considerations......................................................................................................................4-2 Power Consumption Considerations.................................................................................................................4-3 Input (EXTAL) Jitter Requirements .................................................................................................................4-4 Power Consumption Benchmark Data Sheet Conventions OVERBAR “asserted” “deasserted” Examples: Indicates a signal that is active when pulled low (For example, the RESET pin is active when low.) Means that a high true (active high) signal is high or that a low true (active low) signal is low Means that a high true (active high) signal is low or that a low true (active low) signal is high Signal/Symbol Logic State Signal State True Asserted PIN False Deasserted PIN True Asserted PIN False Deasserted Note: Values for VIL, VOL, VIH, and VOH are defined by individual product specifications. PIN Voltage VIL/VOL VIH /VOH VIH /VOH VIL/VOL DSP56321 Technical Data, Rev. 11 ii Freescale Semiconductor Features Table 1 lists the features of the DSP56321 device. Table 1. DSP56321 Features Feature Description High-Performance DSP56300 Core • 275 million multiply-accumulates per second (MMACS) (550 MMACS using the EFCOP in filtering applications) with a 275 MHz clock at 1.6 V core and 3.3 V I/O • Object code compatible with the DSP56000 core with highly parallel instruction set • Data arithmetic logic unit (Data ALU) with fully pipelined 24 × 24-bit parallel Multiplier-Accumulator (MAC), 56-bit parallel barrel shifter (fast shift and normalization; bit stream generation and parsing), conditional ALU instructions, and 24-bit or 16-bit arithmetic support under software control • Program control unit (PCU) with position independent code (PIC) support, addressing modes optimized for DSP applications (including immediate offsets), internal instruction cache controller, internal memoryexpandable hardware stack, nested hardware DO loops, and fast auto-return interrupts • Direct memory access (DMA) with six DMA channels supporting internal and external accesses; one-, two, and three-dimensional transfers (including circular buffering); end-of-block-transfer interrupts; and triggering from interrupt lines and all peripherals • Phase-lock loop (PLL) allows change of low-power divide factor (DF) without loss of lock and output clock with skew elimination • Hardware debugging support including on-chip emulation (OnCE) module, Joint Test Action Group (JTAG) test access port (TAP) Enhanced Filter Coprocessor (EFCOP) Internal Peripherals • Internal 24 × 24-bit filtering and echo-cancellation coprocessor that runs in parallel to the DSP core • Operation at the same frequency as the core (up to 275 MHz) • Support for a variety of filter modes, some of which are optimized for cellular base station applications: • Real finite impulse response (FIR) with real taps • Complex FIR with complex taps • Complex FIR generating pure real or pure imaginary outputs alternately • A 4-bit decimation factor in FIR filters, thus providing a decimation ratio up to 16 • Direct form 1 (DFI) Infinite Impulse Response (IIR) filter • Direct form 2 (DFII) IIR filter • Four scaling factors (1, 4, 8, 16) for IIR output • Adaptive FIR filter with true least mean square (LMS) coefficient updates • Adaptive FIR filter with delayed LMS coefficient updates • Enhanced 8-bit parallel host interface (HI08) supports a variety of buses (for example, ISA) and provides glueless connection to a number of industry-standard microcomputers, microprocessors, and DSPs • Two enhanced synchronous serial interfaces (ESSI), each with one receiver and three transmitters (allows six-channel home theater) • Serial communications interface (SCI) with baud rate generator • Triple timer module • Up to 34 programmable general-purpose input/output (GPIO) pins, depending on which peripherals are enabled DSP56321 Technical Data, Rev. 11 Freescale Semiconductor iii Table 1. DSP56321 Features (Continued) Feature Description : • 192 × 24-bit bootstrap ROM • 192 K × 24-bit RAM total • Program RAM, instruction cache, X data RAM, and Y data RAM sizes are programmable: Program RAM Size Internal Memories Instruction Cache Size X Data RAM Size* Y Data RAM Size* Instruction Cache MSW2 MSW1 MSW0 32 K × 24-bit 0 80 K × 24-bit 80 K × 24-bit disabled 0 0 0 31 K × 24-bit 1024 × 24-bit 80 K × 24-bit 80 K × 24-bit enabled 0 0 0 40 K × 24-bit 0 76 K × 24-bit 76 K × 24-bit disabled 0 0 1 39 K × 24-bit 1024 × 24-bit 76 K × 24-bit 76 K × 24-bit enabled 0 0 1 48 K × 24-bit 0 72 K × 24-bit 72 K × 24-bit disabled 0 1 0 47 K × 24-bit 1024 × 24-bit 72 K × 24-bit 72 K × 24-bit enabled 0 1 0 64 K × 24-bit 0 64 K × 24-bit 64 K × 24-bit disabled 0 1 1 63 K × 24-bit 1024 × 24-bit 64 K × 24-bit 64 K × 24-bit enabled 0 1 1 72 K × 24-bit 0 60 K × 24-bit 60 K × 24-bit disabled 1 0 0 71 K × 24-bit 1024 × 24-bit 60 K × 24-bit 60 K × 24-bit enabled 1 0 0 80 K × 24-bit 0 56 K × 24-bit 56 K × 24-bit disabled 1 0 1 79 K × 24-bit 1024 × 24-bit 56 K × 24-bit 56 K × 24-bit enabled 1 0 1 96 K × 24-bit 0 48 K × 24-bit 48 K × 24-bit disabled 1 1 0 95 K × 24-bit 1024 × 24-bit 48 K × 24-bit 48 K × 24-bit enabled 1 1 0 112 K × 24-bit 0 40 K × 24-bit 40 K × 24-bit disabled 1 1 1 111 K × 24-bit 1024 × 24-bit 40 K × 24-bit 40 K × 24-bit enabled 1 1 1 *Includes 12 K × 24-bit shared memory (that is, 24 K total memory shared by the core and the EFCOP) External Memory Expansion Power Dissipation Packaging • Data memory expansion to two 256 K × 24-bit word memory spaces using the standard external address lines • Program memory expansion to one 256 K × 24-bit words memory space using the standard external address lines • External memory expansion port • Chip select logic for glueless interface to static random access memory (SRAMs) • • • • Very low-power CMOS design Wait and Stop low-power standby modes Fully static design specified to operate down to 0 Hz (dc) Optimized power management circuitry (instruction-dependent, peripheral-dependent, and modedependent) • Molded array plastic-ball grid array (MAP-BGA) package in lead-free or lead-bearing versions. Target Applications DSP56321 applications require high performance, low power, small packaging, and a large amount of internal memory. The EFCOP can accelerate general filtering applications. Examples include: • • • • • • • Wireless and wireline infrastructure applications Multi-channel wireless local loop systems Security encryption systems Home entertainment systems DSP resource boards High-speed modem banks IP telephony DSP56321 Technical Data, Rev. 11 iv Freescale Semiconductor Product Documentation The documents listed in Table 2 are required for a complete description of the DSP56321 device and are necessary to design properly with the part. Documentation is available from a local Freescale distributor, a Freescale semiconductor sales office, or a Freescale Semiconductor Literature Distribution Center. For documentation updates, visit the Freescale DSP website. See the contact information on the back cover of this document. Table 2. DSP56321 Documentation Name Description Order Number DSP56321 Detailed functional description of the DSP56321 memory configuration, Reference Manual operation, and register programming DSP56321RM DSP56300 Family Detailed description of the DSP56300 family processor core and instruction set Manual DSP56300FM Application Notes See the DSP56321 product website Documents describing specific applications or optimized device operation including code examples DSP56321 Technical Data, Rev. 11 Freescale Semiconductor v DSP56321 Technical Data, Rev. 11 vi Freescale Semiconductor 1 Signals/Connections The DSP56321 input and output signals are organized into functional groups as shown in Table 1-1. Figure 1-1 diagrams the DSP56321 signals by functional group. The remainder of this chapter describes the signal pins in each functional group. Table 1-1. DSP56321 Functional Signal Groupings Number of Signals Functional Group Power (VCC) 20 Ground (GND) 66 Clock 2 18 Address bus Data bus Port A 1 24 Bus control 10 Interrupt and mode control 6 Host interface (HI08) Port B Enhanced synchronous serial interface (ESSI) 2 Ports C and D 4 Serial communication interface (SCI) Port E 16 3 12 3 Timer 3 OnCE/JTAG Port 6 Notes: 1. 2. 3. 4. 5. Port A signals define the external memory interface port, including the external address bus, data bus, and control signals. Port B signals are the HI08 port signals multiplexed with the GPIO signals. Port C and D signals are the two ESSI port signals multiplexed with the GPIO signals. Port E signals are the SCI port signals multiplexed with the GPIO signals. Eight signal lines are not connected internally. These are designated as no connect (NC) in the package description (see Chapter 3). There are also two reserved lines. Note: This chapter refers to a number of configuration registers used to select individual multiplexed signal functionality. See the DSP56321 Reference Manual for details on these configuration registers. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 1-1 Signals/Connections DSP56321 VCCQL VCCQH VCCA VCCD VCCC VCCH VCCS 5 3 3 4 2 2 Power Inputs: Core Logic I/O Address Bus Data Bus Bus Control HI08 ESSI/SCI/Timer Interrupt/ Mode Control 8 GND 66 EXTAL XTAL Grounds: Ground plane Clock Port A A[0–17] D[0–23] AA[0–3] RD WR TA BR BG BB 18 External Address Bus 24 External Data Bus 4 Host Interface (HI08) Port1 Enhanced Synchronous Serial Interface Port 0 (ESSI0) 2 3 Enhanced Synchronous Serial Interface Port 1 (ESSI1) 2 3 Serial Communications Interface (SCI) Port2 External Bus Control Timers3 OnCE/ JTAG Port Notes: 1. 2. 3. During Reset MODA MODB MODC MODD RESET PINIT After Reset IRQA IRQB IRQC IRQD RESET NMI Non-Multiplexed Bus H[0–7] HA0 HA1 HA2 HCS/HCS Single DS HRW HDS/HDS Single HR HREQ/HREQ HACK/HACK Multiplexed Bus HAD[0–7] HAS/HAS HA8 HA9 HA10 Double DS HRD/HRD HWR/HWR Double HR HTRQ/HTRQ HRRQ/HRRQ SC0[0–2] SCK0 SRD0 STD0 Port C GPIO PC[0–2] PC3 PC4 PC5 SC1[0–2] SCK1 SRD1 STD1 Port D GPIO PD[0–2] PD3 PD4 PD5 RXD TXD SCLK Port E GPIO PE0 PE1 PE2 TIO0 TIO1 TIO2 Port B GPIO PB[0–7] PB8 PB9 PB10 PB13 PB11 PB12 PB14 PB15 Timer GPIO TIO0 TIO1 TIO2 TCK TDI TDO TMS TRST DE The HI08 port supports a non-multiplexed or a multiplexed bus, single or double data strobe (DS), and single or double host request (HR) configurations. Since each of these modes is configured independently, any combination of these modes is possible. These HI08 signals can also be configured alternatively as GPIO signals (PB[0–15]). Signals with dual designations (for example, HAS/HAS) have configurable polarity. The ESSI0, ESSI1, and SCI signals are multiplexed with the Port C GPIO signals (PC[0–5]), Port D GPIO signals (PD[0–5]), and Port E GPIO signals (PE[0–2]), respectively. TIO[0–2] can be configured as GPIO signals. Figure 1-1. Signals Identified by Functional Group DSP56321 Technical Data, Rev. 11 1-2 Freescale Semiconductor Power 1.1 Power Table 1-2. Power Name Power Inputs Description VCCQL Quiet Core (Low) Power—An isolated power for the core processing and clock logic. This input must be isolated externally from all other chip power inputs. VCCQH Quiet External (High) Power—A quiet power source for I/O lines. This input must be tied externally to all other chip power inputs, except VCCQL. VCCA Address Bus Power—An isolated power for sections of the address bus I/O drivers. This input must be tied externally to all other chip power inputs, except VCCQL. VCCD Data Bus Power—An isolated power for sections of the data bus I/O drivers. This input must be tied externally to all other chip power inputs, except VCCQL. VCCC Bus Control Power—An isolated power for the bus control I/O drivers. This input must be tied externally to all other chip power inputs, except VCCQL. VCCH Host Power—An isolated power for the HI08 I/O drivers. This input must be tied externally to all other chip power inputs, except VCCQL. VCCS ESSI, SCI, and Timer Power—An isolated power for the ESSI, SCI, and timer I/O drivers. This input must be tied externally to all other chip power inputs, except VCCQL. Note: The user must provide adequate external decoupling capacitors for all power connections. 1.2 Ground Table 1-3. Name GND Grounds Description Ground—Connected to an internal device ground plane. Note: The user must provide adequate external decoupling capacitors for all GND connections. 1.3 Clock Table 1-4. Signal Name Type State During Reset Clock Signals Signal Description EXTAL Input Input External Clock/Crystal Input—Interfaces the internal crystal oscillator input to an external crystal or an external clock. XTAL Output Chip-driven Crystal Output—Connects the internal crystal oscillator output to an external crystal. If an external clock is used, leave XTAL unconnected. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 1-3 Signals/Connections 1.4 External Memory Expansion Port (Port A) Note: When the DSP56321 enters a low-power standby mode (stop or wait), it releases bus mastership and tristates the relevant Port A signals: A[0–17], D[0–23], AA[0–3], RD, WR, BB. 1.4.1 External Address Bus Table 1-5. Signal Name A[0–17] 1.4.2 Type Output State During Reset, Stop, or Wait Tri-stated Signal Description Address Bus—When the DSP is the bus master, A[0–17] are active-high outputs that specify the address for external program and data memory accesses. Otherwise, the signals are tri-stated. To minimize power dissipation, A[0–17] do not change state when external memory spaces are not being accessed. External Data Bus Table 1-6. Signal Name D[0–23] 1.4.3 External Address Bus Signals Type Input/ Output State During Reset Ignored Input External Data Bus Signals State During Stop or Wait Last state: Input: Ignored Output: Last value Signal Description Data Bus—When the DSP is the bus master, D[0–23] are active-high, bidirectional input/outputs that provide the bidirectional data bus for external program and data memory accesses. Otherwise, D[0–23] drivers are tristated. If the last state is output, these lines have weak keepers to maintain the last output state if all drivers are tristated. External Bus Control Table 1-7. Signal Name Type State During Reset, Stop, or Wait External Bus Control Signals Signal Description AA[0–3] Output Tri-stated Address Attribute—When defined as AA, these signals can be used as chip selects or additional address lines. The default use defines a priority scheme under which only one AA signal can be asserted at a time. Setting the AA priority disable (APD) bit (Bit 14) of the Operating Mode Register, the priority mechanism is disabled and the lines can be used together as four external lines that can be decoded externally into 16 chip select signals. RD Output Tri-stated Read Enable—When the DSP is the bus master, RD is an active-low output that is asserted to read external memory on the data bus (D[0–23]). Otherwise, RD is tri-stated. WR Output Tri-stated Write Enable—When the DSP is the bus master, WR is an active-low output that is asserted to write external memory on the data bus (D[0–23]). Otherwise, the signals are tri-stated. DSP56321 Technical Data, Rev. 11 1-4 Freescale Semiconductor External Memory Expansion Port (Port A) Table 1-7. Signal Name TA Type Input External Bus Control Signals (Continued) State During Reset, Stop, or Wait Ignored Input Signal Description Transfer Acknowledge—If the DSP56321 is the bus master and there is no external bus activity, or the DSP56321 is not the bus master, the TA input is ignored. The TA input is a data transfer acknowledge (DTACK) function that can extend an external bus cycle indefinitely. Any number of wait states (1, 2. . .infinity) can be added to the wait states inserted by the bus control register (BCR) by keeping TA deasserted. In typical operation, TA is deasserted at the start of a bus cycle, is asserted to enable completion of the bus cycle, and is deasserted before the next bus cycle. The current bus cycle completes one clock period after TA is asserted synchronous to CLKOUT. The number of wait states is determined by the TA input or by the BCR, whichever is longer. The BCR can be used to set the minimum number of wait states in external bus cycles. To use the TA functionality, the BCR must be programmed to at least one wait state. A zero wait state access cannot be extended by TA deassertion; otherwise, improper operation may result. BR Output Reset: Output (deasserted) State during Stop/Wait depends on BRH bit setting: • BRH = 0: Output (deasserted) • BRH = 1: Maintains last state (that is, if asserted, remains asserted) BG Input Ignored Input Bus Request—Asserted when the DSP requests bus mastership. BR is deasserted when the DSP no longer needs the bus. BR may be asserted or deasserted independently of whether the DSP56321 is a bus master or a bus slave. Bus “parking” allows BR to be deasserted even though the DSP56321 is the bus master. (See the description of bus “parking” in the BB signal description.) The bus request hold (BRH) bit in the BCR allows BR to be asserted under software control even though the DSP does not need the bus. BR is typically sent to an external bus arbitrator that controls the priority, parking, and tenure of each master on the same external bus. BR is affected only by DSP requests for the external bus, never for the internal bus. During hardware reset, BR is deasserted and the arbitration is reset to the bus slave state. Bus Grant—Asserted by an external bus arbitration circuit when the DSP56321 becomes the next bus master. When BG is asserted, the DSP56321 must wait until BB is deasserted before taking bus mastership. When BG is deasserted, bus mastership is typically given up at the end of the current bus cycle. This may occur in the middle of an instruction that requires more than one external bus cycle for execution. To ensure proper operation, the user must set the asynchronous bus arbitration enable (ABE) bit (Bit 13) in the Operating Mode Register. When this bit is set, BG and BB are synchronized internally. This adds a required delay between the deassertion of an initial BG input and the assertion of a subsequent BG input. BB Input/ Output Ignored Input Bus Busy—Indicates that the bus is active. Only after BB is deasserted can the pending bus master become the bus master (and then assert the signal again). The bus master may keep BB asserted after ceasing bus activity regardless of whether BR is asserted or deasserted. Called “bus parking,” this allows the current bus master to reuse the bus without rearbitration until another device requires the bus. BB is deasserted by an “active pull-up” method (that is, BB is driven high and then released and held high by an external pull-up resistor). Notes: 1. 2. See BG for additional information. BB requires an external pull-up resistor. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 1-5 Signals/Connections 1.5 Interrupt and Mode Control The interrupt and mode control signals select the chip operating mode as it comes out of hardware reset. After RESET is deasserted, these inputs are hardware interrupt request lines. Table 1-8. Signal Name Type State During Reset Schmitt-trigger Input Interrupt and Mode Control Signal Description MODA Input Mode Select A—MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into the Operating Mode Register when the RESET signal is deasserted. IRQA Input MODB Input IRQB Input MODC Input IRQC Input MODD Input IRQD Input RESET Input Schmitt-trigger Input Reset—Places the chip in the Reset state and resets the internal phase generator. The Schmitt-trigger input allows a slowly rising input (such as a capacitor charging) to reset the chip reliably. When the RESET signal is deasserted, the initial chip operating mode is latched from the MODA, MODB, MODC, and MODD inputs. The RESET signal must be asserted after powerup. PINIT Input Schmitt-trigger Input PLL Initial—During assertion of RESET, the value of PINIT determines whether the DPLL is enabled or disabled. NMI Input External Interrupt Request A—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during normal instruction processing. If the processor is in the STOP or WAIT standby state and IRQA is asserted, the processor exits the STOP or WAIT state. Schmitt-trigger Input Mode Select B—MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into the Operating Mode Register when the RESET signal is deasserted. External Interrupt Request B—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during normal instruction processing. If the processor is in the WAIT standby state and IRQB is asserted, the processor exits the WAIT state. Schmitt-trigger Input Mode Select C—MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into the Operating Mode Register when the RESET signal is deasserted. External Interrupt Request C—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during normal instruction processing. If the processor is in the WAIT standby state and IRQC is asserted, the processor exits the WAIT state. Schmitt-trigger Input Mode Select D—MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into the Operating Mode Register when the RESET signal is deasserted. External Interrupt Request D—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during normal instruction processing. If the processor is in the WAIT standby state and IRQD is asserted, the processor exits the WAIT state. Nonmaskable Interrupt—After RESET deassertion and during normal instruction processing, this Schmitt-trigger input is the negative-edge-triggered NMI request. DSP56321 Technical Data, Rev. 11 1-6 Freescale Semiconductor Host Interface (HI08) 1.6 Host Interface (HI08) The HI08 provides a fast, 8-bit, parallel data port that connects directly to the host bus. The HI08 supports a variety of standard buses and connects directly to a number of industry-standard microcomputers, microprocessors, DSPs, and DMA hardware. 1.6.1 Host Port Usage Considerations Careful synchronization is required when the system reads multiple-bit registers that are written by another asynchronous system. This is a common problem when two asynchronous systems are connected (as they are in the Host port). The considerations for proper operation are discussed in Table 1-9. Table 1-9. Host Port Usage Considerations Action Description Asynchronous read of receive byte registers When reading the receive byte registers, Receive register High (RXH), Receive register Middle (RXM), or Receive register Low (RXL), the host interface programmer should use interrupts or poll the Receive register Data Full (RXDF) flag that indicates data is available. This assures that the data in the receive byte registers is valid. Asynchronous write to transmit byte registers The host interface programmer should not write to the transmit byte registers, Transmit register High (TXH), Transmit register Middle (TXM), or Transmit register Low (TXL), unless the Transmit register Data Empty (TXDE) bit is set indicating that the transmit byte registers are empty. This guarantees that the transmit byte registers transfer valid data to the Host Receive (HRX) register. Asynchronous write to host vector The host interface programmer must change the Host Vector (HV) register only when the Host Command bit (HC) is clear. This practice guarantees that the DSP interrupt control logic receives a stable vector. 1.6.2 Host Port Configuration HI08 signal functions vary according to the programmed configuration of the interface as determined by the 16 bits in the HI08 Port Control Register. Table 1-10. Host Interface Type State During Reset1,2 H[0–7] Input/Output Ignored Input HAD[0–7] Input/Output Host Address—When the HI08 is programmed to interface with a multiplexed host bus and the HI function is selected, these signals are lines 0–7 of the bidirectional multiplexed Address/Data bus. Input or Output Port B 0–7—When the HI08 is configured as GPIO through the HI08 Port Control Register, these signals are individually programmed as inputs or outputs through the HI08 Data Direction Register. Signal Name PB[0–7] Signal Description Host Data—When the HI08 is programmed to interface with a non-multiplexed host bus and the HI function is selected, these signals are lines 0–7 of the bidirectional Data bus. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 1-7 Signals/Connections Table 1-10. Type State During Reset1,2 HA0 Input Ignored Input HAS/HAS Input Signal Name Host Interface (Continued) Signal Description Host Address Input 0—When the HI08 is programmed to interface with a nonmultiplexed host bus and the HI function is selected, this signal is line 0 of the host address input bus. Host Address Strobe—When the HI08 is programmed to interface with a multiplexed host bus and the HI function is selected, this signal is the host address strobe (HAS) Schmitt-trigger input. The polarity of the address strobe is programmable but is configured active-low (HAS) following reset. Port B 8—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. PB8 Input or Output HA1 Input HA8 Input Host Address 8—When the HI08 is programmed to interface with a multiplexed host bus and the HI function is selected, this signal is line 8 of the host address (HA8) input bus. PB9 Input or Output Port B 9—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. HA2 Input HA9 Input Host Address 9—When the HI08 is programmed to interface with a multiplexed host bus and the HI function is selected, this signal is line 9 of the host address (HA9) input bus. PB10 Input or Output Port B 10—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. Ignored Input Ignored Input Host Address Input 1—When the HI08 is programmed to interface with a nonmultiplexed host bus and the HI function is selected, this signal is line 1 of the host address (HA1) input bus. Host Address Input 2—When the HI08 is programmed to interface with a nonmultiplexed host bus and the HI function is selected, this signal is line 2 of the host address (HA2) input bus. HCS/HCS Input HA10 Input Host Address 10—When the HI08 is programmed to interface with a multiplexed host bus and the HI function is selected, this signal is line 10 of the host address (HA10) input bus. PB13 Input or Output Port B 13—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. HRW Input HRD/HRD Input PB11 Input or Output Ignored Input Ignored Input Host Chip Select—When the HI08 is programmed to interface with a nonmultiplexed host bus and the HI function is selected, this signal is the host chip select (HCS) input. The polarity of the chip select is programmable but is configured active-low (HCS) after reset. Host Read/Write—When the HI08 is programmed to interface with a singledata-strobe host bus and the HI function is selected, this signal is the Host Read/Write (HRW) input. Host Read Data—When the HI08 is programmed to interface with a doubledata-strobe host bus and the HI function is selected, this signal is the HRD strobe Schmitt-trigger input. The polarity of the data strobe is programmable but is configured as active-low (HRD) after reset. Port B 11—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. DSP56321 Technical Data, Rev. 11 1-8 Freescale Semiconductor Host Interface (HI08) Table 1-10. Type State During Reset1,2 HDS/HDS Input Ignored Input HWR/HWR Input Signal Name PB12 Output HTRQ/HTRQ Output PB14 Input HRRQ/HRRQ Output PB15 Notes: Input or Output 1. 2. Host Data Strobe—When the HI08 is programmed to interface with a singledata-strobe host bus and the HI function is selected, this signal is the host data strobe (HDS) Schmitt-trigger input. The polarity of the data strobe is programmable but is configured as active-low (HDS) following reset. Port B 12—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. Ignored Input Host Request—When the HI08 is programmed to interface with a single host request host bus and the HI function is selected, this signal is the host request (HREQ) output. The polarity of the host request is programmable but is configured as active-low (HREQ) following reset. The host request may be programmed as a driven or open-drain output. Transmit Host Request—When the HI08 is programmed to interface with a double host request host bus and the HI function is selected, this signal is the transmit host request (HTRQ) output. The polarity of the host request is programmable but is configured as active-low (HTRQ) following reset. The host request may be programmed as a driven or open-drain output. Port B 14—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. Input or Output HACK/HACK Signal Description Host Write Data—When the HI08 is programmed to interface with a doubledata-strobe host bus and the HI function is selected, this signal is the host write data strobe (HWR) Schmitt-trigger input. The polarity of the data strobe is programmable but is configured as active-low (HWR) following reset. Input or Output HREQ/HREQ Host Interface (Continued) Ignored Input Host Acknowledge—When the HI08 is programmed to interface with a single host request host bus and the HI function is selected, this signal is the host acknowledge (HACK) Schmitt-trigger input. The polarity of the host acknowledge is programmable but is configured as active-low (HACK) after reset. Receive Host Request—When the HI08 is programmed to interface with a double host request host bus and the HI function is selected, this signal is the receive host request (HRRQ) output. The polarity of the host request is programmable but is configured as active-low (HRRQ) after reset. The host request may be programmed as a driven or open-drain output. Port B 15—When the HI08 is configured as GPIO through the HI08 Port Control Register, this signal is individually programmed as an input or output through the HI08 Data Direction Register. In the Stop state, the signal maintains the last state as follows: • If the last state is input, the signal is an ignored input. • If the last state is output, these lines have weak keepers that maintain the last output state even if the drivers are tri-stated. The Wait processing state does not affect the signal state. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 1-9 Signals/Connections 1.7 Enhanced Synchronous Serial Interface 0 (ESSI0) Two synchronous serial interfaces (ESSI0 and ESSI1) provide a full-duplex serial port for serial communication with a variety of serial devices, including one or more industry-standard codecs, other DSPs, microprocessors, and peripherals that implement the Freescale serial peripheral interface (SPI). Table 1-11. Signal Name Type SC00 Input or Output PC0 Input or Output SC01 Input/Output PC1 Input or Output SC02 Input/Output PC2 Input or Output SCK0 Input/Output Enhanced Synchronous Serial Interface 0 State During Reset1,2 Ignored Input Signal Description Serial Control 0—For asynchronous mode, this signal is used for the receive clock I/O (Schmitt-trigger input). For synchronous mode, this signal is used either for transmitter 1 output or for serial I/O flag 0. Port C 0—The default configuration following reset is GPIO input PC0. When configured as PC0, signal direction is controlled through the Port C Direction Register. The signal can be configured as ESSI signal SC00 through the Port C Control Register. Ignored Input Serial Control 1—For asynchronous mode, this signal is the receiver frame sync I/O. For synchronous mode, this signal is used either for transmitter 2 output or for serial I/O flag 1. Port C 1—The default configuration following reset is GPIO input PC1. When configured as PC1, signal direction is controlled through the Port C Direction Register. The signal can be configured as an ESSI signal SC01 through the Port C Control Register. Ignored Input Serial Control Signal 2—The frame sync for both the transmitter and receiver in synchronous mode, and for the transmitter only in asynchronous mode. When configured as an output, this signal is the internally generated frame sync signal. When configured as an input, this signal receives an external frame sync signal for the transmitter (and the receiver in synchronous operation). Port C 2—The default configuration following reset is GPIO input PC2. When configured as PC2, signal direction is controlled through the Port C Direction Register. The signal can be configured as an ESSI signal SC02 through the Port C Control Register. Ignored Input Serial Clock—Provides the serial bit rate clock for the ESSI. The SCK0 is a clock input or output, used by both the transmitter and receiver in synchronous modes or by the transmitter in asynchronous modes. Although an external serial clock can be independent of and asynchronous to the DSP system clock, it must exceed the minimum clock cycle time of 6T (that is, the system clock frequency must be at least three times the external ESSI clock frequency). The ESSI needs at least three DSP phases inside each half of the serial clock. PC3 Input or Output SRD0 Input PC4 Input or Output Port C 3—The default configuration following reset is GPIO input PC3. When configured as PC3, signal direction is controlled through the Port C Direction Register. The signal can be configured as an ESSI signal SCK0 through the Port C Control Register. Ignored Input Serial Receive Data—Receives serial data and transfers the data to the ESSI Receive Shift Register. SRD0 is an input when data is received. Port C 4—The default configuration following reset is GPIO input PC4. When configured as PC4, signal direction is controlled through the Port C Direction Register. The signal can be configured as an ESSI signal SRD0 through the Port C Control Register. DSP56321 Technical Data, Rev. 11 1-10 Freescale Semiconductor Enhanced Synchronous Serial Interface 1 (ESSI1) Table 1-11. Signal Name State During Reset1,2 Type STD0 Output PC5 Input or Output Notes: 1. 2. Enhanced Synchronous Serial Interface 0 (Continued) Ignored Input Signal Description Serial Transmit Data—Transmits data from the Serial Transmit Shift Register. STD0 is an output when data is transmitted. Port C 5—The default configuration following reset is GPIO input PC5. When configured as PC5, signal direction is controlled through the Port C Direction Register. The signal can be configured as an ESSI signal STD0 through the Port C Control Register. In the Stop state, the signal maintains the last state as follows: • If the last state is input, the signal is an ignored input. • If the last state is output, these lines have weak keepers that maintain the last output state even if the drivers are tri-stated. The Wait processing state does not affect the signal state. 1.8 Enhanced Synchronous Serial Interface 1 (ESSI1) Table 1-12. Signal Name Type SC10 Input or Output PD0 Input or Output SC11 Input/Output PD1 Input or Output SC12 Input/Output PD2 Input or Output Enhanced Serial Synchronous Interface 1 State During Reset1,2 Ignored Input Signal Description Serial Control 0—For asynchronous mode, this signal is used for the receive clock I/O (Schmitt-trigger input). For synchronous mode, this signal is used either for transmitter 1 output or for serial I/O flag 0. Port D 0—The default configuration following reset is GPIO input PD0. When configured as PD0, signal direction is controlled through the Port D Direction Register. The signal can be configured as an ESSI signal SC10 through the Port D Control Register. Ignored Input Serial Control 1—For asynchronous mode, this signal is the receiver frame sync I/O. For synchronous mode, this signal is used either for Transmitter 2 output or for Serial I/O Flag 1. Port D 1—The default configuration following reset is GPIO input PD1. When configured as PD1, signal direction is controlled through the Port D Direction Register. The signal can be configured as an ESSI signal SC11 through the Port D Control Register. Ignored Input Serial Control Signal 2—The frame sync for both the transmitter and receiver in synchronous mode and for the transmitter only in asynchronous mode. When configured as an output, this signal is the internally generated frame sync signal. When configured as an input, this signal receives an external frame sync signal for the transmitter (and the receiver in synchronous operation). Port D 2—The default configuration following reset is GPIO input PD2. When configured as PD2, signal direction is controlled through the Port D Direction Register. The signal can be configured as an ESSI signal SC12 through the Port D Control Register. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 1-11 Signals/Connections Table 1-12. Signal Name SCK1 Type Input/Output Enhanced Serial Synchronous Interface 1 (Continued) State During Reset1,2 Ignored Input Signal Description Serial Clock—Provides the serial bit rate clock for the ESSI. The SCK1 is a clock input or output used by both the transmitter and receiver in synchronous modes or by the transmitter in asynchronous modes. Although an external serial clock can be independent of and asynchronous to the DSP system clock, it must exceed the minimum clock cycle time of 6T (that is, the system clock frequency must be at least three times the external ESSI clock frequency). The ESSI needs at least three DSP phases inside each half of the serial clock. PD3 Input or Output SRD1 Input PD4 Input or Output STD1 Output PD5 Input or Output Notes: 1. 2. Port D 3—The default configuration following reset is GPIO input PD3. When configured as PD3, signal direction is controlled through the Port D Direction Register. The signal can be configured as an ESSI signal SCK1 through the Port D Control Register. Ignored Input Serial Receive Data—Receives serial data and transfers the data to the ESSI Receive Shift Register. SRD1 is an input when data is being received. Port D 4—The default configuration following reset is GPIO input PD4. When configured as PD4, signal direction is controlled through the Port D Direction Register. The signal can be configured as an ESSI signal SRD1 through the Port D Control Register. Ignored Input Serial Transmit Data—Transmits data from the Serial Transmit Shift Register. STD1 is an output when data is being transmitted. Port D 5—The default configuration following reset is GPIO input PD5. When configured as PD5, signal direction is controlled through the Port D Direction Register. The signal can be configured as an ESSI signal STD1 through the Port D Control Register. In the Stop state, the signal maintains the last state as follows: • If the last state is input, the signal is an ignored input. • If the last state is output, these lines have weak keepers that maintain the last output state even if the drivers are tri-stated. The Wait processing state does not affect the signal state. 1.9 Serial Communication Interface (SCI) The SCI provides a full duplex port for serial communication with other DSPs, microprocessors, or peripherals such as modems. Table 1-13. Signal Name Type RXD Input PE0 Input or Output TXD Output PE1 Input or Output State During Reset1,2 Ignored Input Serial Communication Interface Signal Description Serial Receive Data—Receives byte-oriented serial data and transfers it to the SCI Receive Shift Register. Port E 0—The default configuration following reset is GPIO input PE0. When configured as PE0, signal direction is controlled through the Port E Direction Register. The signal can be configured as an SCI signal RXD through the Port E Control Register. Ignored Input Serial Transmit Data—Transmits data from the SCI Transmit Data Register. Port E 1—The default configuration following reset is GPIO input PE1. When configured as PE1, signal direction is controlled through the Port E Direction Register. The signal can be configured as an SCI signal TXD through the Port E Control Register. DSP56321 Technical Data, Rev. 11 1-12 Freescale Semiconductor Timers Table 1-13. Signal Name Type SCLK Input/Output PE2 Input or Output Notes: 1. 2. Serial Communication Interface (Continued) State During Reset1,2 Ignored Input Signal Description Serial Clock—Provides the input or output clock used by the transmitter and/or the receiver. Port E 2—The default configuration following reset is GPIO input PE2. When configured as PE2, signal direction is controlled through the Port E Direction Register. The signal can be configured as an SCI signal SCLK through the Port E Control Register. In the Stop state, the signal maintains the last state as follows: • If the last state is input, the signal is an ignored input. • If the last state is output, these lines have weak keepers that maintain the last output state even if the drivers are tri-stated. The Wait processing state does not affect the signal state. 1.10 Timers The DSP56321 has three identical and independent timers. Each timer can use internal or external clocking and can either interrupt the DSP56321 after a specified number of events (clocks) or signal an external device after counting a specific number of internal events. Table 1-14. Signal Name TIO0 Type Input or Output State During Reset1,2 Ignored Input Triple Timer Signals Signal Description Timer 0 Schmitt-Trigger Input/Output— When Timer 0 functions as an external event counter or in measurement mode, TIO0 is used as input. When Timer 0 functions in watchdog, timer, or pulse modulation mode, TIO0 is used as output. The default mode after reset is GPIO input. TIO0 can be changed to output or configured as a timer I/O through the Timer 0 Control/Status Register (TCSR0). TIO1 Input or Output Ignored Input Timer 1 Schmitt-Trigger Input/Output— When Timer 1 functions as an external event counter or in measurement mode, TIO1 is used as input. When Timer 1 functions in watchdog, timer, or pulse modulation mode, TIO1 is used as output. The default mode after reset is GPIO input. TIO1 can be changed to output or configured as a timer I/O through the Timer 1 Control/Status Register (TCSR1). TIO2 Input or Output Ignored Input Timer 2 Schmitt-Trigger Input/Output— When Timer 2 functions as an external event counter or in measurement mode, TIO2 is used as input. When Timer 2 functions in watchdog, timer, or pulse modulation mode, TIO2 is used as output. The default mode after reset is GPIO input. TIO2 can be changed to output or configured as a timer I/O through the Timer 2 Control/Status Register (TCSR2). Notes: 1. 2. In the Stop state, the signal maintains the last state as follows: • If the last state is input, the signal is an ignored input. • If the last state is output, these lines have weak keepers that maintain the last output state even if the drivers are tri-stated. The Wait processing state does not affect the signal state. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 1-13 Signals/Connections 1.11 JTAG and OnCE Interface The DSP56300 family and in particular the DSP56321 support circuit-board test strategies based on the IEEE® Std. 1149.1™ test access port and boundary scan architecture, the industry standard developed under the sponsorship of the Test Technology Committee of IEEE and the JTAG. The OnCE module provides a means to interface nonintrusively with the DSP56300 core and its peripherals so that you can examine registers, memory, or on-chip peripherals. Functions of the OnCE module are provided through the JTAG TAP signals. For programming models, see the chapter on debugging support in the DSP56300 Family Manual. Table 1-15. Signal Name JTAG/OnCE Interface Type State During Reset TCK Input Input Test Clock—A test clock input signal to synchronize the JTAG test logic. TDI Input Input Test Data Input—A test data serial input signal for test instructions and data. TDI is sampled on the rising edge of TCK and has an internal pull-up resistor. TDO Output Tri-stated Test Data Output—A test data serial output signal for test instructions and data. TDO is actively driven in the shift-IR and shift-DR controller states. TDO changes on the falling edge of TCK. TMS Input Input Test Mode Select—Sequences the test controller’s state machine. TMS is sampled on the rising edge of TCK and has an internal pull-up resistor. TRST Input Input Test Reset—Initializes the test controller asynchronously. TRST has an internal pull-up resistor. TRST must be asserted during and after power-up (see EB610/D for details). Input/ Output Input Debug Event—As an input, initiates Debug mode from an external command controller, and, as an open-drain output, acknowledges that the chip has entered Debug mode. As an input, DE causes the DSP56300 core to finish executing the current instruction, save the instruction pipeline information, enter Debug mode, and wait for commands to be entered from the debug serial input line. This signal is asserted as an output for three clock cycles when the chip enters Debug mode as a result of a debug request or as a result of meeting a breakpoint condition. The DE has an internal pull-up resistor. DE Signal Description This signal is not a standard part of the JTAG TAP controller. The signal connects directly to the OnCE module to initiate debug mode directly or to provide a direct external indication that the chip has entered Debug mode. All other interface with the OnCE module must occur through the JTAG port. DSP56321 Technical Data, Rev. 11 1-14 Freescale Semiconductor 2 Specifications The DSP56321 is fabricated in high-density CMOS with Transistor-Transistor Logic (TTL) compatible inputs and outputs. 2.1 Maximum Ratings CAUTION This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, normal precautions should be taken to avoid exceeding maximum voltage ratings. Reliability is enhanced if unused inputs are tied to an appropriate logic voltage level (for example, either GND or VCC). In the calculation of timing requirements, adding a maximum value of one specification to a minimum value of another specification does not yield a reasonable sum. A maximum specification is calculated using a worst case variation of process parameter values in one direction. The minimum specification is calculated using the worst case for the same parameters in the opposite direction. Therefore, a “maximum” value for a specification never occurs in the same device that has a “minimum” value for another specification; adding a maximum to a minimum represents a condition that can never exist. Table 2-1. Rating1 Supply Voltage3 Input/Output Supply Voltage 3 All input voltages Current drain per pin excluding VCC and GND Operating temperature range Storage temperature Notes: 1. 2. 3. Absolute Maximum Ratings Symbol Value1, 2 Unit VCCQL –0.1 to 2.25 V VCCQH –0.3 to 4.35 V VIN GND – 0.3 to VCCQH + 0.3 V I 10 mA TJ –40 to +100 °C TSTG –55 to +150 °C GND = 0 V, VCCQL = 1.6 V ± 0.1 V, VCCQH = 3.3 V ± 0.3 V, TJ = –40°C to +100°C, CL = 50 pF Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the maximum rating may affect device reliability or cause permanent damage to the device. Power-up sequence: During power-up, and throughout the DSP56321 operation, VCCQH voltage must always be higher or equal to VCCQL voltage. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-1 Specifications 2.2 Thermal Characteristics Table 2-2. Thermal Characteristics Thermal Resistance Characteristic Symbol MAP-BGA Value RθJA 44 Junction-to-ambient, natural convection, single-layer board (1s)1,2 Junction-to-ambient, natural convection, four-layer board (2s2p)1,3 RθJMA 25 (1s)1,3 RθJMA 35 Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p) 1,3 RθJMA 22 RθJB 13 RθJC 7 Junction-to-ambient, @200 ft/min air flow, single-layer board Junction-to-board4 5 Junction-to-case thermal resistance Notes: 1. 2. 3. 4. 5. Unit °C/W °C/W °C/W °C/W °C/W °C/W Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. Per JEDEC JESD51-6 with the board horizontal. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 2.3 DC Electrical Characteristics Table 2-3. Characteristics DC Electrical Characteristics7 Symbol Min Typ Max Unit 1.5 3.0 1.6 3.3 1.7 3.6 V V VIH VIHP 2.0 2.0 — — VCCQH + 0.3 VCCQH + 0.3 V V VIHX 0.8 × VCCQH — VCCQH V VIL VILP VILX –0.3 –0.3 –0.3 — — — 0.8 0.8 0.2 × VCCQH V V V Input leakage current IIN –10 — 10 µA High impedance (off-state) input current (@ 2.4 V / 0.4 V) ITSI –10 — 10 µA Output high voltage8 • TTL (IOH = –0.4 mA)6 • CMOS (IOH = –10 µA)6 VOH 2.4 VCCQH – 0.01 — — — — V V Output low voltage8 • TTL (IOL = 3.0 mA)6 • CMOS (IOL = 10 µA)6 VOL — — — — 0.4 0.01 V V Supply voltage1: • Core (VCCQL) • I/O (VCCQH , VCCA, VCCD, VCCC , VCCH, and VCCS) Input high voltage • D[0–23], BG, BB, TA • MOD/IRQ 2 RESET, PINIT/NMI and all JTAG/ESSI/SCI/Timer/HI08 pins • EXTAL9 Input low voltage • D[0–23], BG, BB, TA, MOD/IRQ2, RESET, PINIT • All JTAG/ESSI/SCI/Timer/HI08 pins • EXTAL9 DSP56321 Technical Data, Rev. 11 2-2 Freescale Semiconductor AC Electrical Characteristics Table 2-3. DC Electrical Characteristics7 Characteristics Symbol Internal supply current: • In Normal mode3 — at 200 MHz — at 220 MHz — at 240 MHz — at 275 MHz • In Wait mode4 • In Stop mode5 1. 2. 3. 4. 5. 6. 7. 8. 9. Typ Max Unit ICCW ICCS — — — — — — 190 200 210 235 25 15 — — — — — — mA mA mA mA mA mA CIN — — 10 pF ICCI Input capacitance6 Notes: Min Power-up sequence: During power-up, and throughout the DSP56321 operation, VCCQH voltage must always be higher or equal to VCCQL voltage. Refers to MODA/IRQA, MODB/IRQB, MODC/IRQC, and MODD/IRQD pins. Section 4.3 provides a formula to compute the estimated current requirements in Normal mode. To obtain these results, all inputs must be terminated (that is, not allowed to float). Measurements are based on synthetic intensive DSP benchmarks (see Appendix A). The power consumption numbers in this specification are 90 percent of the measured results of this benchmark. This reflects typical DSP applications. To obtain these results, all inputs must be terminated (that is, not allowed to float). To obtain these results, all inputs not disconnected at Stop mode must be terminated (that is, not allowed to float), and the DPLL and on-chip crystal oscillator must be disabled. Periodically sampled and not 100 percent tested. VCCQH = 3.3 V ± 0.3 V, VCQLC = 1.6 V ± 0.1 V; TJ = –40°C to +100 °C, CL = 50 pF This characteristic does not apply to XTAL. Driving EXTAL to the low VIHX or the high VILX value may cause additional power consumption (DC current). To minimize power consumption, the minimum VIHX should be no lower than 0.9 × VCCQH and the maximum VILX should be no higher than 0.1 × VCCQH . 2.4 AC Electrical Characteristics The timing waveforms shown in the AC electrical characteristics section are tested with a VIL maximum of 0.3 V and a VIH minimum of 2.4 V for all pins except EXTAL, which is tested using the input levels shown in Notes 7 and 9 of the previous table. AC timing specifications, which are referenced to a device input signal, are measured in production with respect to the 50 percent point of the respective input signal’s transition. DSP56321 output levels are measured with the production test machine VOL and VOH reference levels set at 0.4 V and 2.4 V, respectively. Note: Although the minimum value for the frequency of EXTAL is 0 MHz, the device AC test conditions are 16 MHz and rated speed with the DPLL enabled. 2.4.1 Internal Clocks Table 2-4. Internal Clocks Expression Characteristics Internal operating frequency • With DPLL disabled • With DPLL enabled Symbol Min Typ Max — — Ef/2 (Ef × MF)/(PDF × DF) — — — — 2 × ETC ETC × PDF × DF/MF — — — 0.49 × TC ETC — — 0.51 × TC f Internal clock cycle time • With DPLL disabled • With DPLL enabled TC Internal clock high period • With DPLL disabled • With DPLL enabled TH DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-3 Specifications Table 2-4. Internal Clocks (Continued) Expression Characteristics Symbol Internal clock low period • With DPLL disabled • With DPLL enabled Note: TL Min Typ Max — 0.49 × TC ETC — — 0.51 × TC Ef = External frequency; MF = Multiplication Factor = MFI + MFN/MFD; PDF = Predivision Factor; DF = Division Factor; TC = Internal clock cycle; ETC = External clock cycle; TH = Internal clock high; TL = Internal clock low 2.4.2 External Clock Operation The DSP56321 system clock is derived from the on-chip oscillator or is externally supplied. To use the on-chip oscillator, connect a crystal and associated resistor/capacitor components to EXTAL and XTAL; an example is shown in Figure 2-1. EXTAL Suggested Component Values: XTAL fOSC = 16–32 MHz R = 1 MΩ ± 10% C = 10 pF ± 10% R C XTAL1 Calculations are for a 16–32 MHz crystal with the following parameters: • shunt capacitance (C0) of 5.2–7.3 pF, • series resistance of 5–15 Ω, and • drive level of 2 mW. C Fundamental Frequency Crystal Oscillator Note: Make sure that in the PCTL Register: • XTLD (bit 2) = 0 Figure 2-1. Crystal Oscillator Circuits Table 2-5. External Clock Operation 200 MHz No. 1 2 3 Characteristics Frequency of EXTAL (EXTAL Pin Frequency)1 • With DPLL disabled • With DPLL enabled2 220 MHz 240 MHz 275 MHz Symbol Ef DEFR = PDF × PDFR EXTAL input high3 • With DPLL disabled (46.7%–53.3% duty cycle4) • With DPLL enabled (42.5%–57.5% duty cycle4) ETH EXTAL input low4 • With DPLL disabled (46.7%–53.3% duty cycle4) • With DPLL enabled (42.5%–57.5% duty cycle4) ETL Min Max Min Max Min Max Min Max 0 MHz 16 MHz 200 MHz 200 MHz 0 MHz 16 MHz 220 MHz 220 MHz 0 MHz 16 MHz 240 MHz 240 MHz 0 MHz 16 MHz 275 MHz 275 MHz 2.34 ns ∞ 2.12 ns ∞ 1.95 ns ∞ 1.70 ns ∞ 2.13 ns 35.9 ns 1.93 ns 35.9 ns 1.77 ns 35.9 ns 1.55 ns 35.9 ns 2.34 ns ∞ 2.12ns ∞ 1.95 ns ∞ 1.70 ns ∞ 2.13 ns 35.9 ns 1.93 ns 35.9 ns 1.77 ns 35.9 ns 1.55 ns 35.9 ns DSP56321 Technical Data, Rev. 11 2-4 Freescale Semiconductor AC Electrical Characteristics Table 2-5. External Clock Operation (Continued) 200 MHz No. 4 7 Characteristics EXTAL cycle time3 • With DPLL disabled • With DPLL enabled ETC Instruction cycle time = ICYC = ETC • With DPLL disabled • With DPLL enabled ICYC Notes: 1. 2. 3. 4. 220 MHz 240 MHz 275 MHz Symbol Min Max Min Max Min Max Min Max 5.0 ns 5.0 ns ∞ 62.5 ns 4.55 ns 4.55 ns ∞ 62.5 ns 4.17 ns 4.17 ns ∞ 62.5 ns 3.64 ns 3.64 ns ∞ 62.5 ns 10 ns 5.0 ns ∞ 1.6 µs 9.09 ns 4.55 ns ∞ 1.6 µs 8.33 ns 4.17 ns ∞ 1.6 µs 7.28 ns 3.64 ns ∞ 1.6 µs The rise and fall time of this external clock should be 2 ns maximum. Refer to Table 2-6 for a description of PDF and PDFR. Measured at 50 percent of the input transition. The indicated duty cycle is for the specified maximum frequency for which a part is rated. The minimum clock high or low time required for correction operation, however, remains the same at lower operating frequencies; therefore, when a lower clock frequency is used, the signal symmetry may vary from the specified duty cycle as long as the minimum high time and low time requirements are met. Note: If an externally-supplied square wave voltage source is used, disable the internal oscillator circuit after boot-up by setting XTLD (PCTL Register bit 2 = 1—see the DSP56321 Reference Manual). The external square wave source connects to EXTAL and XTAL is not used. Figure 2-2 shows the EXTAL input signal. VILX ETH ETL 2 3 4 Note: The midpoint is 0.5 (VIHX + VILX). ETC Figure 2-2. 2.4.3 VIHX Midpoint EXTAL External Input Clock Timing Clock Generator (CLKGEN) and Digital PLL (DPLL) Characteristics Table 2-6. CLKGEN and DPLL Characteristics 200 MHz Characteristics 220 MHz 240 MHz 275 MHz Symbol Unit Min Max Min Max Min Max Min Max Predivision factor PDF1 1 16 1 16 1 16 1 16 — Predivider output clock frequency range PDFR 16 32 16 32 16 32 16 32 MHz MF 5 15 5 15 5 15 5 15 — Multiplication factor integer part MFI1 5 15 5 15 5 15 5 15 — Multiplication factor numerator3 MFN 0 127 0 127 0 127 0 127 — Multiplication factor denominator MFD 1 128 1 128 1 128 1 128 — Double clock frequency range DDFR 160 400 160 440 160 480 160 550 MHz Phase lock-in time4 DPLT 6.85 1506 6.85 1506 6.85 1506 6.85 1506 µs Total multiplication factor2 DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-5 Specifications Table 2-6. CLKGEN and DPLL Characteristics (Continued) 200 MHz Characteristics 2.4.4 1. 2. 3. 4. 5. 6. 275 MHz Max Min Max Min Max Min Max Refer to the DSP56321 User’s Manual for a detailed description of register reset values. The total multiplication factor (MF) includes both integer and fractional parts (that is, MF = MFI + MFN/MFD). The numerator (MFN) should be less than the denominator (MFD). DPLL lock procedure duration is specified for the case when an external clock source is supplied to the EXTAL pin. Frequency-only Lock Mode or non-integer MF, after partial reset. Frequency and Phase Lock Mode, integer MF, after full reset. Reset, Stop, Mode Select, and Interrupt Timing Table 2-7. Reset, Stop, Mode Select, and Interrupt Timing5 200 MHz No. 240 MHz Unit Min Notes: 220 MHz Symbol Characteristics 220 MHz 240 MHz 275 MHz Expression Unit Min Max Min Max Min Max Min Max — — 26 — 26 — 26 — 26 ns 50 × ETC 250.0 — 227.5 — 208.5 — 182.0 — ns 1000 × ETC 5.0 — 4.55 — 4.17 — 3.64 — µs 75000 × ETC 75000 × ETC 2.5 × TC 2.5 × TC 0.375 0.375 12.5 17 — — — — 0.341 0.341 11.38 16 — — — — 0.313 0.313 10.43 15 — — — — 0.273 0.273 9.1 9.1 — — — — ms ms ns ns 3.25 × TC + 2.0 18.25 — — 180 16.77 — — 163 15.55 — — 150 13.82 — — 140 ns ns 13 Mode select setup time 30.0 — 30.0 — 30.0 — 30.0 — ns 14 Mode select hold time 0.0 — 0.0 — 0.0 — 0.0 — ns 15 Minimum edge-triggered interrupt request assertion width 4.0 — 4.0 — 4.0 — 4.0 — ns 16 Minimum edge-triggered interrupt request deassertion width 4.0 — 4.0 — 4.0 — 4.0 — ns 4.25 × TC + 2.0 23.25 — 21.24 — 19.72 — 17.45 — ns 7.25 × TC + 2.0 38.25 — 34.99 — 32.23 — 28.36 — ns 8.9 × TC 44.5 — 40.45 — 37.0 — 32.37 — ns (WS + 3.75) × TC – 10.94 — Note 7 — Note 7 — Note 7 — Note 7 ns 8 Delay from RESET assertion to all pins at reset value3 9 Required RESET duration4 • Power on, external clock generator, DPLL disabled • Power on, external clock generator, DPLL enabled • Power on, internal oscillator • During STOP, XTAL disabled • During STOP, XTAL enabled • During normal operation 10 Delay from asynchronous RESET deassertion to first external address output (internal reset deassertion) • Minimum • Maximum 17 Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to external memory access address out valid • Caused by first interrupt instruction fetch • Caused by first interrupt instruction execution 18 Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to general-purpose transfer output valid caused by first interrupt instruction execution 19 Delay from address output valid caused by first interrupt instruction execute to interrupt request deassertion for level sensitive fast interrupts1, 6, 7 DSP56321 Technical Data, Rev. 11 2-6 Freescale Semiconductor AC Electrical Characteristics Table 2-7. Reset, Stop, Mode Select, and Interrupt Timing5 200 MHz No. Characteristics 20 Delay from RD assertion to interrupt request deassertion for level sensitive fast interrupts1, 6, 7 (WS + 3.25) × TC – 10.94 24 Duration for IRQA assertion to recover from Stop state 25 Delay from IRQA assertion to fetch of first instruction (when exiting Stop)2, 3 DPLT + (128K × TC) • DPLL is not active during Stop (PCTL Bit 1 = 0) and Stop delay is enabled (Operating Mode Register Bit 6 = 0) • DPLL is not active during Stop DPLT + (23.75 ± 0.5) × (PCTL Bit 1 = 0) and Stop delay is TC not enabled (Operating Mode Register Bit 6 = 1) • DPLL is active during Stop (PCTL Bit 1 = 1; Implies No Stop Delay) (10.0 ± 1.75) × TC 29 Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to external memory (DMA source) access address out valid 240 MHz 275 MHz Unit Min Max Min Max Min Max Min Max — Note 7 — Note 7 — Note 7 — Note 7 ns — — Note 7 Note 7 — — Note 7 Note 7 — — Note 7 Note 7 — — Note 7 Note 7 ns ns 8.0 — 8.0 — 8.0 — 8.0 — ns 662.2 µs 209.9 ms 662.2 µs 209.9 ms 662.2 µs 209.9 ms 662.2 µs 209.9 ms — 6.9 188.8 6.9 188.8 6.9 188.8 6.9 188.8 µs 41.25 58.8 37.5 53.3 34.4 49.0 30.0 43.0 ns — 805.4 — 805.4 — 805.4 — µs — 150.1 — 150.1 — 150.1 — µs — 25 — 22.9 — 20.0 — ns 26 Duration of level sensitive IRQA assertion to ensure interrupt service (when exiting Stop)2, 3 DPLT + (128 K × TC ) • DPLL is not active during Stop 805.4 (PCTL bit 1 = 0) and Stop delay is enabled (Operating Mode Register Bit 6 = 0) • DPLL is not active during Stop DPLT + (20.5 ± 0.5) × TC 150.1 (PCTL bit 1 = 0) and Stop delay is not enabled (Operating Mode Register Bit 6 = 1) • DPLL is active during Stop ((PCTL 27.5 5.5 × TC bit 1 = 0; implies no Stop delay) 28 DMA Request Rate • Data read from HI08, ESSI, SCI • Data write to HI08, ESSI, SCI • Timer • IRQ, NMI (edge trigger) 220 MHz Expression 21 Delay from WR assertion to interrupt request deassertion for level sensitive fast interrupts1, 6, 7 • SRAM WS = 3 (WS + 3) × TC – 10.94 • SRAM WS ≥ 4 (WS + 2.5) × TC – 10.94 27 Interrupt Request Rate • HI08, ESSI, SCI, Timer • DMA • IRQ, NMI (edge trigger) • IRQ, NMI (level trigger) (CONTINUED) 12TC 8TC 8TC 12TC — — — — 60.0 40.0 40.0 60.0 — — — — 54.6 36.4 36.4 54.6 — — — — 50.0 33.4 33.4 50.0 — — — — 43.7 29.2 29.2 43.7 ns ns ns ns 6TC 7TC 2TC 3TC — — — — 30.0 35.0 10.0 15.0 — — — — 27.3 31.9 9.1 13.7 — — — — 25.0 29.2 8.3 12.5 — — — — 21.84 25.48 7.28 10.92 ns ns ns ns 4.25 × TC + 2.0 23.25 — 21.34 — 19.72 — 17.45 — ns DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-7 Specifications Table 2-7. Reset, Stop, Mode Select, and Interrupt Timing5 200 MHz No. Characteristics 1. 2. 3. 4. 5. 6. 7. 220 MHz 240 MHz 275 MHz Expression Unit Min Notes: (CONTINUED) Max Min Max Min Max Min Max When fast interrupts are used and IRQA, IRQB, IRQC, and IRQD are defined as level-sensitive, timings 19 through 21 apply to prevent multiple interrupt service. To avoid these timing restrictions, the deasserted Edge-triggered mode is recommended when fast interrupts are used. Long interrupts are recommended for Level-sensitive mode. This timing depends on several settings: • For DPLL disable, using internal oscillator (DPLL Control Register (PCTL) Bit 2 = 0) and oscillator disabled during Stop (PCTL Bit 1 = 0), a stabilization delay is required to assure that the oscillator is stable before programs are executed. Resetting the Stop delay (Operating Mode Register Bit 6 = 0) provides the proper delay. While Operating Mode Register Bit 6 = 1 can be set, it is not recommended, and these specifications do not guarantee timings for that case. • For DPLL disable, using internal oscillator (PCTL Bit 2 = 0) and oscillator enabled during Stop (PCTL Bit 1 = 1), no stabilization delay is required and recovery is minimal (Operating Mode Register Bit 6 setting is ignored). • For DPLL disable, using external clock (PCTL Bit 2 = 1), no stabilization delay is required and recovery time is defined by the PCTL Bit 1 and Operating Mode Register Bit 6 settings. • For DPLL enable, if PCTL Bit 1 is 0, the DPLL is shut down during Stop. Recovering from Stop requires the DPLL to lock. The DPLL lock procedure duration is defined in Table 2-6 and will be refined after silicon characterization. This procedure is followed by the stop delay counter. Stop recovery ends when the stop delay counter completes its count. • The DPLT value for DPLL disable is 0. Periodically sampled and not 100 percent tested. For an external clock generator, RESET duration is measured while RESET is asserted, VCC is valid, and the EXTAL input is active and valid. For an internal oscillator, RESET duration is measured while RESET is asserted and VCC is valid. The specified timing reflects the crystal oscillator stabilization time after power-up. This number is affected both by the specifications of the crystal and other components connected to the oscillator and reflects worst case conditions. When the VCC is valid, but the other “required RESET duration” conditions (as specified above) have not been yet met, the device circuitry is in an uninitialized state that can result in significant power consumption and heat-up. Designs should minimize this state to the shortest possible duration. VCCQH = 3.3 V ± 0.3 V, VCCQL = 1.6 V ± 0.1 V; TJ = –40°C to +100°C, C L = 50 pF. WS = number of wait states (measured in clock cycles, number of TC). Use the expression to compute a maximum value. VIH RESET 9 10 8 All Pins Reset Value First Fetch A[0–17] Figure 2-3. Reset Timing DSP56321 Technical Data, Rev. 11 2-8 Freescale Semiconductor AC Electrical Characteristics First Interrupt Instruction Execution/Fetch A[0–17] RD 20 WR 21 17 IRQA, IRQB, IRQC, IRQD, NMI 19 a) First Interrupt Instruction Execution General Purpose I/O 18 IRQA, IRQB, IRQC, IRQD, NMI b) General-Purpose I/O Figure 2-4. External Fast Interrupt Timing IRQA, IRQB, IRQC, IRQD, NMI 15 IRQA, IRQB, IRQC, IRQD, NMI 16 Figure 2-5. External Interrupt Timing (Negative Edge-Triggered) DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-9 Specifications VIH RESET 13 14 VIH MODA, MODB, MODC, MODD, PINIT VIH IRQA, IRQB, IRQC, IRQD, NMI VIL Figure 2-6. VIL Operating Mode Select Timing 24 IRQA 25 First Instruction Fetch A[0–17] Figure 2-7. Recovery from Stop State Using IRQA 26 IRQA 25 First IRQA Interrupt Instruction Fetch A[0–17] Figure 2-8. Recovery from Stop State Using IRQA Interrupt Service DMA Source Address A[0–17] RD WR 29 IRQA, IRQB, IRQC, IRQD, NMI First Interrupt Instruction Execution Figure 2-9. External Memory Access (DMA Source) Timing DSP56321 Technical Data, Rev. 11 2-10 Freescale Semiconductor AC Electrical Characteristics 2.4.5 External Memory Expansion Port (Port A) 2.4.5.1 SRAM Timing Table 2-8. No. Characteristics Symbol Expression1 SRAM Timing 200 MHz 220 MHz 240 MHz 275 MHz Unit Min Max Min Max Min Max Min Max (WS + 2) × TC −4.0 [3 ≤WS ≤7] (WS + 3) × TC −4.0 [WS ≥ 8] 21.0 51.0 — 46.0 — 41.9 — 36.0 — ns 0.75 × TC – 3.0 [WS = 3] 1.25 × TC – 3.0 [WS ≥ 4] 0.75 — 0.41 — 0.13 — –0.27 — ns 3.25 — 2.69 — 2.21 — 1.54 — ns WS × TC −4.0 [WS = 3] (WS − 0.5) × TC − 4.0 [WS ≥ 4] 11.0 — 9.65 — 8.51 — 6.9 — ns 13.5 — 11.93 — 10.6 — 8.72 — ns 1.25 × TC − 4.0 [3 ≤WS ≤7] 2.25 × TC − 4.0 [WS ≥ 8] 2.25 — 1.69 — 1.21 — 0.54 — ns 7.25 — 6.24 — 5.38 — 4.18 — ns tAA, tAC (WS + 0.75) × TC − 5.8 [WS ≥ 3] — 12.9 — 11.2 — 9.8 — 7.84 ns 105 RD assertion to input data valid tOE (WS + 0.25) × TC − 6.5 [WS ≥ 3] — 9.75 — 8.29 — 7.05 — 5.31 ns 106 RD deassertion to data not valid (data hold time) tOHZ 0.0 — 0.0 — 0.0 — 0.0 — ns 107 Address valid to WR deassertion2 tAW (WS + 0.75) × TC − 4.0 [WS ≥ 3] 14.75 — 13.06 — 11.64 — 9.63 — ns 108 Data valid to WR deassertion (data setup time) tDS (tDW ) (WS −0.25) × TC −5.4 [WS ≥ 3] 8.35 — 7.11 — 6.07 — 4.6 — ns 109 Data hold time from WR deassertion tDH 1.25 × TC − 4.0 [3 ≤WS ≤7] 2.25 × TC −4.0 [WS ≥ 8] 2.25 — 1.69 — 1.21 — 0.54 — ns 7.25 — 6.23 — 5.38 — 4.18 — ns –2.75 — –2.86 — –2.96 — –3.1 — ns 100 Address valid and AA assertion pulse width2 101 Address and AA valid to WR assertion 102 WR assertion pulse width 103 WR deassertion to address not valid 104 Address and AA valid to input data valid tRC, tWC tAS tWP tWR 0.25 × TC − 4.0 [WS = 3] –0.25 × TC −4.0 [WS ≥ 4] 18.8 16.9 15.0 ns 110 WR assertion to data active — –5.25 — –5.14 — –5.04 — –4.91 — ns 111 WR deassertion to data high impedance — 1.25 × TC 6.25 — 5.69 — 5.21 — 4.55 — ns 112 Previous RD deassertion to data active (write) — 2.25 × TC − 4.0 7.25 — 6.23 — 5.38 — 4.18 — ns 113 RD deassertion time — 1.75 × TC − 3.0 [3 ≤WS ≤7] 2.75 × TC − 3.0 [WS ≥ 8] 5.75 — 4.96 — 4.3 — 3.36 — ns 10.75 — 9.51 — 8.47 — 7.0 — ns 7.0 — 6.1 — 5.3 — 4.27 — ns 12.0 — 10.6 — 9.5 — 7.91 — ns 114 WR deassertion time4 — 2.0 × TC −3.0 [3 ≤WS ≤7] 3.0 × TC −3.0 [WS ≥ 8] DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-11 Specifications Table 2-8. No. Characteristics Symbol SRAM Timing (Continued) 200 MHz Expression1 220 MHz 240 MHz 275 MHz Unit Min Max Min Max Min Max Min Max 115 Address valid to RD assertion — 0.5 × TC −2.0 0.5 — 0.3 — 0.1 — –0.18 — ns 116 RD assertion pulse width — (WS + 0.25) × TC − 3.0 [WS ≥ 3] 13.25 — 11.59 — 10.55 — 8.81 — ns 117 RD deassertion to address not valid — 1.25 × TC − 4.0 [3 ≤WS ≤7] 2.25 × TC −4.0 [WS ≥ 8] 2.25 — 1.69 — 1.21 — 0.54 — ns 7.25 — 6.24 — 5.38 — 4.18 — ns 0.25 × TC + 2.0 3.25 — 3.14 — 3.04 — 2.91 — ns 0 — 0 — 0 — 0 — ns 118 TA setup before RD or WR deassertion5 — 119 TA hold after RD or WR deassertion — Notes: 1. 2. 3. 4. 5. WS is the number of wait states specified in the BCR. The value is given for the minimum for a given category. (For example, for a category of [3 ≤WS ≤7] timing is specified for 3 wait states.) Three wait states is the minimum value otherwise. Timings 100 and 107 are guaranteed by design, not tested. All timings are measured from 0.5 × VCCQH to 0.5 × VCCQH. The WS number applies to the access in which the deassertion of WR occurs and assumes the next access uses a minimal number of wait states. Timing 118 is relative to the deassertion edge of RD or WR even if TA remains asserted. 100 A[0–17] AA[0–3] 113 117 116 RD 105 106 WR 104 118 119 TA Data In D[0–23] Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their state after a read or write operation. Figure 2-10. SRAM Read Access DSP56321 Technical Data, Rev. 11 2-12 Freescale Semiconductor AC Electrical Characteristics 100 A[0–17] AA[0–3] 107 101 102 103 WR 114 RD 119 118 TA 108 109 Data Out D[0–23] Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their state after a read or write operation. Figure 2-11. SRAM Write Access 2.4.5.2 Asynchronous Bus Arbitration Timings Table 2-9. Asynchronous Bus Timings 200 MHz No. Characteristics 250 BB assertion window from BG input deassertion. 251 Delay from BB assertion to BG assertion Notes: 1. 2. 220 MHz 240 MHz 275 Mhz Expression Uni t Min Max Min Max Min Max Min Max 2.5 × Tc + 5 — 17.5 — 16.4 — 15.4 — 14.1 ns 2 × Tc + 5 15 — 14.1 — 13.3 — 12.27 — ns Bit 13 in the Operating Mode Register must be set to enable Asynchronous Arbitration mode. To guarantee timings 250 and 251, it is recommended that you assert non-overlapping BG inputs to different DSP56300 devices (on the same bus), as shown in Figure 2-12, where BG1 is the BG signal for one DSP56300 device while BG2 is the BG signal for a second DSP56300 device. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-13 Specifications BG1 BB 250 BG2 251 250+251 Figure 2-12. Asynchronous Bus Arbitration Timing The asynchronous bus arbitration is enabled by internal synchronization circuits on BG and BB inputs. These synchronization circuits add delay from the external signal until it is exposed to internal logic. As a result of this delay, a DSP56300 part may assume mastership and assert BB, for some time after BG is deasserted. This is the reason for timing 250. Once BB is asserted, there is a synchronization delay from BB assertion to the time this assertion is exposed to other DSP56300 components that are potential masters on the same bus. If BG input is asserted before that time, and BG is asserted and BB is deasserted, another DSP56300 component may assume mastership at the same time. Therefore, some non-overlap period between one BG input active to another BG input active is required. Timing 251 ensures that overlaps are avoided. 2.4.6 Host Interface Timing Table 2-10. 200 MHz Characteristic10 No. 317 Read data strobe assertion width HACK assertion width Host Interface Timings1,2,12 220 MHz 240 MHz 275 MHz Expression 5 TC + 4.95 318 Read data strobe deassertion width5 HACK deassertion width 319 Read data strobe deassertion width5 after “Last Data Register” reads8,11, or between two consecutive CVR, ICR, or ISR reads3 HACK deassertion width after “Last Data Register” reads8,11 2.5 × TC + 3.3 320 Write data strobe assertion width6 Uni t Min Max Min Max Min Max Min Max 9.95 — 9.05 — 8.3 — 7.77 — ns 4.95 — 4.5 — 4.13 — 4.0 — ns 15.8 — 14.7 — 13.7 — 12.39 — ns 6.6 — 6.0 — 5.5 — 5.1 — ns 15.8 — 14.7 — 13.7 — 12.39 — ns 8.25 — 7.5 — 6.88 — 6.28 — ns 4.95 — 4.5 — 4.13 — 4.0 — ns width8 321 Write data strobe deassertion HACK write deassertion width • after ICR, CVR and “Last Data Register” writes • after IVR writes, or after TXH:TXM:TXL writes (with HLEND= 0), or after TXL:TXM:TXH writes (with HLEND = 1) 322 HAS assertion width 2.5 × TC + 3.3 DSP56321 Technical Data, Rev. 11 2-14 Freescale Semiconductor AC Electrical Characteristics Host Interface Timings1,2,12 (Continued) Table 2-10. No. 200 MHz Characteristic10 220 MHz 240 MHz 275 MHz Expression Uni t Min Max Min Max Min Max Min Max 0.0 — 0.0 — 0.0 — 0.0 — ns 324 Host data input setup time before write data strobe deassertion6 4.95 — 4.5 — 4.13 — 4.0 — ns 325 Host data input hold time after write data strobe deassertion6 1.65 — 1.5 — 1.38 — 1.23 — ns 326 Read data strobe assertion to output data active from high impedance5 HACK assertion to output data active from high impedance 1.65 — 1.5 — 1.38 — 1.23 — ns 327 Read data strobe assertion to output data valid5 HACK assertion to output data valid — 14.78 — 13.45 — 12.32 — 10.2 ns 328 Read data strobe deassertion to output data high impedance5 HACK deassertion to output data high impedance — 4.95 — 4.5 — 4.13 4.0 — ns 1.65 — 1.5 — 1.38 — 1.23 — ns 9.95 — 9.05 — 8.3 — 7.77 — ns 8 — 8 — 8 — 8 — ns — 17 — 16 — 15 — 14 ns 0.0 — 0.0 — 0.0 — 0.0 — ns 334 Address (HAD[0–7]) setup time before HAS deassertion (HMUX=1) 2.31 — 2.1 — 1.93 — 1.76 — ns 335 Address (HAD[0–7]) hold time after HAS deassertion (HMUX=1) 1.65 — 1.5 — 1.38 — 1.23 — ns 0 2.31 — — 0 2.1 — — 0 1.93 — — 0 1.76 — — ns ns 1.65 — 1.5 — 1.38 — 1.23 — ns 323 HAS deassertion to data strobe assertion4 329 Output data hold time after read data strobe deassertion5 Output data hold time after HACK deassertion 330 HCS assertion to read data strobe deassertion5 TC + 4.95 331 HCS assertion to write data strobe deassertion6 332 HCS assertion to output data valid 333 HCS hold time after data strobe deassertion 4 336 HA[8–10] (HMUX=1), HA[0–2] (HMUX=0), HR/W setup time before data strobe assertion4 • Read • Write 337 HA[8–10] (HMUX=1), HA[0–2] (HMUX=0), HR/W hold time after data strobe deassertion4 338 Delay from read data strobe deassertion to host request assertion for “Last Data Register” read5, 7, 8 TC + 2.64 7.64 — 7.19 — 6.81 — 6.28 — ns 339 Delay from write data strobe deassertion to host request assertion for “Last Data Register” write6, 7, 8 1.5 × TC + 2.64 10.14 — 9.47 — 8.9 — 8.1 — ns 340 Delay from data strobe assertion to host request deassertion for “Last Data Register” read or write (HROD=0) 4, 7, 8 — 12.14 — 11.04 — 10.12 — 9.0 ns 341 Delay from data strobe assertion to host request deassertion for “Last Data Register” read or write (HROD=1, open drain host request)4, 7, 8, 9 — 300.0 — 300.0 — 300.0 — 300.0 ns DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-15 Specifications Table 2-10. Characteristic10 No. Host Interface Timings1,2,12 (Continued) 200 MHz Min Notes: 220 MHz 240 MHz 275 MHz Expression Max Min Max Min Max Min Max Uni t See the Programmer’s Model section in the chapter on the HI08 in the DSP56321 Reference Manual. In the timing diagrams below, the controls pins are drawn as active low. The pin polarity is programmable. This timing is applicable only if two consecutive reads from one of these registers are executed. The data strobe is Host Read (HRD) or Host Write (HWR) in the Dual Data Strobe mode and Host Data Strobe (HDS) in the Single Data Strobe mode. 5. The read data strobe is HRD in the Dual Data Strobe mode and HDS in the Single Data Strobe mode. 6. The write data strobe is HWR in the Dual Data Strobe mode and HDS in the Single Data Strobe mode. 7. The host request is HREQ in the Single Host Request mode and HRRQ and HTRQ in the Double Host Request mode. 8. The “Last Data Register” is the register at address $7, which is the last location to be read or written in data transfers. This is RXL/TXL in the Big Endian mode (HLEND = 0; HLEND is the Interface Control Register bit 7—ICR[7]), or RXH/TXH in the Little Endian mode (HLEND = 1). 9. In this calculation, the host request signal is pulled up by a 4.7 kΩ resistor in the Open-drain mode. 10. VCCQH = 3.3 V ± 0.3 V, VCCQL = 1.6 V ± 0.1 V; TJ = –40°C to +100 °C, CL = 50 pF 11. This timing is applicable only if a read from the “Last Data Register” is followed by a read from the RXL, RXM, or RXH registers without first polling RXDF or HREQ bits, or waiting for the assertion of the HREQ signal. 12. After the external host writes a new value to the ICR, the HI08 will be ready for operation after three DSP clock cycles (3 × Tc). 1. 2. 3. 4. 317 318 HACK 328 327 326 329 H[0–7] HREQ Figure 2-13. Host Interrupt Vector Register (IVR) Read Timing Diagram DSP56321 Technical Data, Rev. 11 2-16 Freescale Semiconductor AC Electrical Characteristics HA[2–0] 336 337 333 330 HCS 336 337 HRW 317 HDS 318 328 332 319 327 329 326 H[7–0] 338 340 341 HREQ (single host request) HRRQ (double host request) Figure 2-14. Read Timing Diagram, Non-Multiplexed Bus, Single Data Strobe HA[2–0] 336 337 333 330 HCS 317 HRD 318 328 332 319 327 329 326 H[7–0] 340 338 341 HREQ (single host request) HRRQ (double host request) Figure 2-15. Read Timing Diagram, Non-Multiplexed Bus, Double Data Strobe DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-17 Specifications HA[2–0] 336 337 333 331 HCS 336 337 HRW 320 HDS 321 324 325 H[7–0] 339 340 341 HREQ (single host request) HTRQ (double host request) Figure 2-16. Write Timing Diagram, Non-Multiplexed Bus, Single Data Strobe HA[2–0] 336 337 333 331 HCS 320 HWR 321 324 325 H[7–0] 340 339 341 HREQ (single host request) HTRQ (double host request) Figure 2-17. Write Timing Diagram, Non-Multiplexed Bus, Double Data Strobe DSP56321 Technical Data, Rev. 11 2-18 Freescale Semiconductor AC Electrical Characteristics , HA[10–8] 336 322 HAS 337 323 336 337 HRW 317 HDS 334 318 335 319 327 328 329 HAD[7–0] Address Data 326 338 340 341 HREQ (single host request) HRRQ (double host request) Figure 2-18. Read Timing Diagram, Multiplexed Bus, Single Data Strobe HA[10–8] 336 322 HAS 337 323 317 HRD 334 318 335 319 327 328 329 HAD[7–0] Address Data 326 340 HREQ (single host request) HRRQ (double host request) Figure 2-19. 338 341 Read Timing Diagram, Multiplexed Bus, Double Data Strobe DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-19 Specifications HA[10–8] 336 322 HAS 337 323 336 337 HRW 320 HDS 334 324 321 335 HAD[7–0] 325 Data Address 340 339 341 HREQ (single host request) HTRQ (double host request) Figure 2-20. Write Timing Diagram, Multiplexed Bus, Single Data Strobe , HA[10–8] 336 322 HAS 337 323 320 HWR 334 324 321 335 HAD[7–0] 325 Data Address 340 339 341 HREQ (single host request) HTRQ (double host request) Figure 2-21. Write Timing Diagram, Multiplexed Bus, Double Data Strobe DSP56321 Technical Data, Rev. 11 2-20 Freescale Semiconductor AC Electrical Characteristics 2.4.7 SCI Timing Table 2-11. No. Characteristics1 SCI Timings 200 MHz Symbol 220 MHz 240 MHz 275 MHz Expression Uni t Min Max Min Max Min Max Min Max 16 × TC 80.0 — 72.8 — 66.7 — 58.0 — ns 401 Clock low period tSCC/2 − 10.0 30.0 — 26.4 — 23.4 — 19.0 — ns 402 Clock high period tSCC/2 − 10.0 30.0 — 26.4 — 23.4 — 19.0 — ns tSCC /4 + 0.5 × TC −17.0 5.5 — 3.5 — 1.76 — –0.68 — ns tSCC/4 −1.5 × TC 13 — 11.5 — 10 — 9.04 — ns 405 Input data setup time before clock rising edge (internal clock) tSCC/4 + 0.5 × TC + 25.0 47.5 — 45.5 — 43.8 — 41.32 — ns 406 Input data not valid before clock rising edge (internal clock) tSCC/4 + 0.5 × TC −5.5 — 17.0 — 15.0 — 13.8 — 10.81 ns — 32.0 — 32.0 — 32.0 — 32.0 ns 13.0 — 12.6 — 12.2 — 11.64 — ns 409 Input data setup time before clock rising edge (external clock) 0.0 — 0.0 — 0.0 — 0.0 — ns 410 Input data hold time after clock rising edge (external clock) 9.0 — 9.0 — 9.0 — 9.0 — ns 64 × TC 320.0 — 291.2 — 266.9 — 232.0 — ns 412 Clock low period tACC/2 − 10.0 150.0 — 135.6 — 123.5 — 106.0 — ns 413 Clock high period tACC/2 − 10.0 150.0 — 135.6 — 123.5 — 106.0 — ns 414 Output data setup to clock rising edge (internal clock) tACC/2 − 30.0 130.0 — 115.6 — 103.5 — 86.0 — ns 415 Output data hold after clock rising edge (internal clock) tACC/2 − 30.0 130.0 — 115.6 — 103.5 — 86.0 — ns 400 Synchronous clock cycle tSCC 2 403 Output data setup to clock falling edge (internal clock) 404 Output data hold after clock rising edge (internal clock) 407 Clock falling edge to output data valid (external clock) TC + 8.0 408 Output data hold after clock rising edge (external clock) 411 Asynchronous clock cycle Notes: 1. 2. 3. 4. tACC3 V CCQH = 3.3 V ± 0.3 V, VCCQL = 1.6 V ± 0.1 V; TJ = –40°C to +100 °C, CL = 50 pF. tSCC = synchronous clock cycle time (for internal clock, tSCC is determined by the SCI clock control register and TC ). tACC = asynchronous clock cycle time; value given for 1X Clock mode (for internal clock, tACC is determined by the SCI clock control register and TC). In the timing diagrams that follow, the SCLK is drawn using the clock falling edge as a the first reference. Clock polarity is programmable in the SCI Control Register (SCR). Refer to the DSP56321 Reference Manual for details. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-21 Specifications 400 402 401 SCLK (Output) 403 404 Data Valid TXD 405 406 Data Valid RXD a) Internal Clock 400 402 401 SCLK (Input) 407 408 TXD Data Valid 409 410 RXD Data Valid b) External Clock Figure 2-22. SCI Synchronous Mode Timing 411 413 412 1X SCLK (Output) 414 TXD 415 Data Valid Figure 2-23. SCI Asynchronous Mode Timing DSP56321 Technical Data, Rev. 11 2-22 Freescale Semiconductor AC Electrical Characteristics 2.4.8 ESSI0/ESSI1 Timing Table 2-12. No. Characteristics4, 6 ESSI Timings 200 MHz 220 MHz 240 MHz 275 MHz Symbol Expression Min Max Min Max Min Max Min Max 430 Clock cycle1 TECCX TECCI 6 × TC 8 × TC CondUnit ition5 30.0 40.0 — — 27.3 36.6 — — 25.0 33.3 — — 21.5 25.0 — — x ck i ck ns ns 431 Clock high period • For internal clock • For external clock TECCX/2 – 3.7 11.3 TECCI/2 – 10.0 10.0 — — 9.9 8.2 — — 8.8 6.7 — — 7.21 2.5 — — ns ns 432 Clock low period • For internal clock • For external clock TECCX/2 – 3.7 11.3 TECCI/2 − 10.0 10.0 — — 9.9 8.2 — — 8.8 6.7 — — 7.21 2.5 — — ns ns 433 RXC rising edge to FSR out (bit-length) high — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck a ns 434 RXC rising edge to FSR out (bit-length) low — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck a ns 435 RXC rising edge to FSR out (wordlength-relative) high2 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck a ns 436 RXC rising edge to FSR out (wordlength-relative) low2 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck a ns 437 RXC rising edge to FSR out (wordlength) high — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck a ns 438 RXC rising edge to FSR out (wordlength) low — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck a ns 439 Data in setup time before RXC (SCK in Synchronous mode) falling edge 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — x ck i ck ns 440 Data in hold time after RXC falling edge 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — x ck i ck ns 441 FSR input (bl, wr) high before RXC falling edge2 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — x ck i ck a ns 442 FSR input (wl) high before RXC falling edge 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — x ck i ck a ns 443 FSR input hold time after RXC falling edge 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — x ck i ck a ns 444 Flags input setup before RXC falling edge 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — x ck i ck s ns 445 Flags input hold time after RXC falling edge 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — x ck i ck s ns 446 TXC rising edge to FST out (bit-length) high — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 447 TXC rising edge to FST out (bit-length) low — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 448 TXC rising edge to FST out (wordlength-relative) high2 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 449 TXC rising edge to FST out (wordlength-relative) low2 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 450 TXC rising edge to FST out (wordlength) high — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-23 Specifications Table 2-12. Characteristics4, 6 No. ESSI Timings (Continued) 200 MHz 220 MHz 240 MHz 275 MHz Symbol Expression Min Max Min Max Min Max Min Max CondUnit ition5 451 TXC rising edge to FST out (wordlength) low — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 452 TXC rising edge to data out enable from high impedance — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 453 TXC rising edge to Transmitter 0 drive enable assertion — — 12.5 13.5 — — 12.5 13.5 — — 12.5 13.5 — — 12.5 13.5 x ck i ck ns 454 TXC rising edge to data out valid — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 455 TXC rising edge to data out high impedance3 — — 30.0 8.3 — — 30.0 8.3 — — 30.0 8.3 — — 30.0 8.3 x ck i ck ns 456 TXC rising edge to Transmitter 0 drive enable deassertion3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — x ck i ck ns 458 FST input (wl) to data out enable from high impedance — — 15.0 8.0 — — 15.0 8.0 — — 15.0 8.0 — — 15.0 8.0 x ck i ck ns 459 FST input (wl) to Transmitter 0 drive enable assertion — — 15.0 18.0 — — 15.0 18.0 — — 15.0 18.0 — — 15.0 18.0 x ck i ck ns 460 FST input (wl) setup time before TXC falling edge 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — 5.0 10.0 — — x ck i ck ns 461 FST input hold time after TXC falling edge 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — 3.8 5.0 — — x ck i ck ns 462 Flag output valid after TXC rising edge — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 — — 12.5 8.3 x ck i ck ns 457 FST input (bl, wr) setup time before TXC falling edge2 Notes: 1. 2. 3. 4. 5. 6. 7. For the internal clock, the external clock cycle is defined by the instruction cycle time (timing 7 in Table 2-5 on page 2-4) and the ESSI control register. TECCX must be ≥ TC × 3, in accordance with the note below Table 7-1 in the DSP56321 Reference Manual. TECCI must be ≥ TC × 4, in accordance with the explanation of CRA[PSR] and the ESSI Clock Generator Functional Block Diagram shown in Figure 7-3 of the DSP56321 Reference Manual. The word-length-relative frame sync signal waveform operates the same way as the bit-length frame sync signal waveform, but spreads from one serial clock before the first bit clock (same as the Bit Length Frame Sync signal) until the one before last bit clock of the first word in the frame. Periodically sampled and not 100 percent tested VCCQH = 3.3 V ± 0.3 V, VCCQL = 1.6 V ± 0.1 V; TJ = 0°C to +85°C, CL = 50 pF TXC (SCK Pin) = Transmit Clock RXC (SC0 or SCK Pin) = Receive Clock FST (SC2 Pin) = Transmit Frame Sync FSR (SC1 or SC2 Pin) Receive Frame Sync i ck = Internal Clock; x ck = External Clock i ck a = Internal Clock, Asynchronous Mode (asynchronous implies that TXC and RXC are two different clocks) i ck s = Internal Clock, Synchronous Mode (synchronous implies that TXC and RXC are the same clock) In the timing diagrams below, the clocks and frame sync signals are drawn using the clock falling edge as a the first reference. Clock and frame sync polarities are programmable in Control Register B (CRB). Refer to the DSP56321 Reference Manual for details. DSP56321 Technical Data, Rev. 11 2-24 Freescale Semiconductor AC Electrical Characteristics 430 431 432 TXC (Input/ Output) 446 447 FST (Bit) Out 450 451 FST (Word) Out 454 454 452 455 Last Bit First Bit Data Out 459 Transmitter 0 Drive Enable 457 453 456 461 FST (Bit) In 458 461 460 FST (Word) In 462 See Note Flags Out Note: In Network mode, output flag transitions can occur at the start of each time slot within the frame. In Normal mode, the output flag state is asserted for the entire frame period. Figure 2-24. ESSI Transmitter Timing DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-25 Specifications 430 431 RXC 432 (Input/ Output) 433 434 FSR (Bit) Out 437 438 FSR (Word) 440 Out 439 Last Bit First Bit Data In 443 441 FSR (Bit) In 443 442 FSR (Word) In 444 445 Flags In Figure 2-25. 2.4.9 ESSI Receiver Timing Timer Timing Table 2-13. No. Characteristics Timer Timings 200 MHz 220 MHz 240 MHz 240 MHz Min Max Min Max Min Max Min Max Expression Unit 480 TIO Low 2 × TC + 2.0 12.0 — 11.1 — 10.3 — 9.27 — ns 481 TIO High 2 × TC + 2.0 12.0 — 11.1 — 10.3 — 9.27 — ns 10.25 × TC + 10.0 61.2 5 — 56.6 4 — 52.7 4 — 47.2 7 — ns 486 Synchronous delay time from Timer input rising edge to the external memory address out valid caused by the first interrupt instruction execution Notes: 1. 2. 3. V CCQH = 3.3 V ± 0.3 V, V CCQL = 1.6 V ± 0.1 V; TJ = –40°C to +100 °C, CL = 50 pF The maximum frequency of pulses generated by a timer will be defined after device characterization is completed. In the timing diagrams below, TIO is drawn using the rising edge as the reference. TIO polarity is programmable in the Timer Control/Status Register (TCSR). Refer to the DSP56321 Reference Manual for details. DSP56321 Technical Data, Rev. 11 2-26 Freescale Semiconductor AC Electrical Characteristics TIO 480 Figure 2-26. 481 TIO Timer Event Input Restrictions TIO (Input) 486 Address First Interrupt Instruction Execution Figure 2-27. Timer Interrupt Generation 2.4.10 Considerations For GPIO Use The following considerations can be helpful when GPIO is used. 2.4.10.1 GPIO as Output • The time from fetch of the instruction that changes the GPIO pin to the actual change is seven core clock cycles, if the instruction is a one-cycle instruction and there are no pipeline stalls or any other pipeline delays. • The maximum rise or fall time of a GPIO pin is 13 ns (TTL levels, assuming that the maximum of 50 pF load limit is met). 2.4.10.2 GPIO as Input GPIO inputs are not synchronized with the core clock. When only one GPIO bit is polled, this lack of synchronization presents no problem, since the read value can be either the previous value or the new value of the corresponding GPIO pin. However, there is the risk of reading an intermediate state if: • Two or more GPIO bits are treated as a coupled group (for example, four possible status states encoded in two bits). • The read operation occurs during a simultaneous change of GPIO pins (for example, the change of 00 to 11 may happen through an intermediate state of 01 or 10). Therefore, when GPIO bits are read, the recommended practice is to poll continuously until two consecutive read operations have identical results. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-27 Specifications 2.4.11 JTAG Timing Table 2-14. JTAG Timing All frequencies No. Characteristics Unit Min Max 500 TCK frequency of operation (1/(TC × 3); absolute maximum 22 MHz) 0.0 22.0 MHz 501 TCK cycle time in Crystal mode 45.0 — ns 502 TCK clock pulse width measured at 1.6 V 20.0 — ns 503 TCK rise and fall times 0.0 3.0 ns 504 Boundary scan input data setup time 5.0 — ns 505 Boundary scan input data hold time 24.0 — ns 506 TCK low to output data valid 0.0 40.0 ns 507 TCK low to output high impedance 0.0 40.0 ns 508 TMS, TDI data setup time 5.0 — ns 509 TMS, TDI data hold time 25.0 — ns 510 TCK low to TDO data valid 0.0 44.0 ns 511 TCK low to TDO high impedance 0.0 44.0 ns 512 TRST assert time 100.0 — ns 513 TRST setup time to TCK low 40.0 — ns Notes: 1. 2. VCCQH = 3.3 V ± 0.3 V, VCCQL = 1.6 V ± 0.1 V; TJ = –40°C to +100 °C, CL = 50 pF. All timings apply to OnCE module data transfers because it uses the JTAG port as an interface. 501 TCK (Input) VIH 502 502 VM VM VIL 503 503 Figure 2-28. Test Clock Input Timing Diagram DSP56321 Technical Data, Rev. 11 2-28 Freescale Semiconductor AC Electrical Characteristics TCK (Input) VIH VIL 504 Data Inputs 505 Input Data Valid 506 Data Outputs Output Data Valid 507 Data Outputs 506 Data Outputs Output Data Valid Figure 2-29. TCK (Input) Boundary Scan (JTAG) Timing Diagram VIH VIL 508 TDI TMS (Input) 509 Input Data Valid 510 TDO (Output) Output Data Valid 511 TDO (Output) 510 TDO (Output) Output Data Valid Figure 2-30. Test Access Port Timing Diagram TCK (Input) 513 TRST (Input) 512 Figure 2-31. TRST Timing Diagram DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 2-29 Specifications 2.4.12 OnCE Module TimIng Table 2-15. OnCE Module Timing All Frequencies No. Characteristics Expression Unit Min Max 500 TCK frequency of operation (1/(TC × 3); maximum 22 MHz) Max 22.0 MHz 0.0 22.0 MHz 514 DE assertion time in order to enter Debug mode 1.5 × TC + 10.0 20.0 — ns 515 Response time when DSP56321 is executing NOP instructions from internal memory 5.5 × TC + 30.0 — 67.0 ns 516 Debug acknowledge assertion time 3 × TC + 5.0 25.0 — ns Note: VCCQH = 3.3 V ± 0.3 V, VCCQL = 1.6 V ± 0.1 V; TJ = –40°C to +100 °C, CL = 50 pF DE 514 515 Figure 2-32. 516 OnCE—Debug Request DSP56321 Technical Data, Rev. 11 2-30 Freescale Semiconductor 3 Packaging This section includes diagrams of the DSP56321 package pin-outs and tables showing how the signals described in Chapter 1 are allocated for the package. The DSP56321 is available in a 196-pin molded array plastic-ball grid array (MAP-BGA) package. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 3-1 Packaging 3.1 Package Description Top and bottom views of the MAP-BGA packages are shown in Figure 3-1 and Figure 3-2 with their pin-outs. Top View 1 2 3 4 5 A NC SC11 TMS TDO IRQB D23 VCCD D19 B SRD1 SC12 TDI TRST IRQD D21 D20 C SC02 STD1 TCK IRQA IRQC D22 D PINIT SC01 DE GND GND E STD0 VCCS SRD0 GND F RXD SC10 SC00 G SCK1 SCLK H VCCQH 6 7 8 9 10 11 D16 D14 D11 D17 D15 D13 VCCQL D18 VCCD GND GND GND GND GND GND GND GND GND TXD GND GND VCCQL SCK0 GND 12 13 14 D9 D7 NC D10 D8 D5 NC D12 VCCD D6 D3 D4 GND GND GND D1 D2 VCCD GND GND GND GND A17 A16 D0 GND GND GND GND GND VCCQH A14 A15 GND GND GND GND GND GND A13 VCCQL A12 GND GND GND GND GND GND GND VCCA A10 A11 J HACK HRW HDS GND GND GND GND GND GND GND GND A8 A7 A9 K VCCS HREQ TIO2 GND GND GND GND GND GND GND GND VCCA A5 A6 L HCS TIO1 TIO0 GND GND GND GND GND GND GND GND VCCA A3 A4 M HA1 HA2 HA0 VCCH H0 VCCQL VCCQH EXTAL Res’d NC WR RD A1 A2 N H6 H7 H4 H2 RESET GND AA3 NC VCCQL Res’d BR VCCC AA0 A0 P NC H5 H3 H1 NC GND AA2 XTAL VCCC TA BB AA1 BG NC Figure 3-1. DSP56321 MAP-BGA Package, Top View DSP56321 Technical Data, Rev. 11 3-2 Freescale Semiconductor Package Description Bottom View 14 13 NC D7 NC 12 11 10 9 8 7 D9 D11 D14 D16 D19 VCCD D5 D8 D10 D13 D15 D17 D4 D3 D6 VCCD D12 VCCD VCCD D2 D1 GND GND D0 A16 A17 GND A15 A14 VCCQH A12 VCCQL A11 5 4 3 2 1 D23 IRQB TDO TMS SC11 NC A D20 D21 IRQD TRST TDI SC12 SRD1 B D18 VCCQL D22 IRQC IRQA TCK STD1 SC02 C GND GND GND GND GND GND DE SC01 PINIT D GND GND GND GND GND GND GND SRD0 VCCS STD0 E GND GND GND GND GND GND GND GND SC00 SC10 RXD F A13 GND GND GND GND GND GND GND GND TXD SCLK SCK1 G A10 VCCA GND GND GND GND GND GND GND GND SCK0 VCCQL VCCQH H A9 A7 A8 GND GND GND GND GND GND GND GND HDS HRW HACK J A6 A5 VCCA GND GND GND GND GND GND GND GND TIO2 HREQ VCCS K A4 A3 VCCA GND GND GND GND GND GND GND GND TIO0 TIO1 HCS L A2 A1 RD WR NC Res’d EXTAL VCCQH VCCQL H0 VCCH HA0 HA2 HA1 M A0 AA0 VCCC BR Res’d VCCQL NC AA3 GND RESET H2 H4 H7 H6 N NC BG AA1 BB TA VCCC XTAL AA2 GND NC H1 H3 H5 NC P Figure 3-2. 6 DSP56321 MAP-BGA Package, Bottom View DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 3-3 Packaging Table 3-1. Ball No. Signal Name Signal List by Ball Number Ball No. Signal Name Ball No. Signal Name A1 Not Connected (NC) B12 D8 D9 GND A2 SC11 or PD1 B13 D5 D10 GND A3 TMS B14 NC D11 GND A4 TDO C1 SC02 or PC2 D12 D1 A5 MODB/IRQB C2 STD1 or PD5 D13 D2 A6 D23 C3 TCK D14 VCCD A7 VCCD C4 MODA/IRQA E1 STD0 or PC5 A8 D19 C5 MODC/IRQC E2 VCCS A9 D16 C6 D22 E3 SRD0 or PC4 A10 D14 C7 VCCQL E4 GND A11 D11 C8 D18 E5 GND A12 D9 C9 VCCD E6 GND A13 D7 C10 D12 E7 GND A14 NC C11 VCCD E8 GND B1 SRD1 or PD4 C12 D6 E9 GND B2 SC12 or PD2 C13 D3 E10 GND B3 TDI C14 D4 E11 GND B4 TRST D1 PINIT/NMI E12 A17 B5 MODD/IRQD D2 SC01 or PC1 E13 A16 B6 D21 D3 DE E14 D0 B7 D20 D4 GND F1 RXD or PE0 B8 D17 D5 GND F2 SC10 or PD0 B9 D15 D6 GND F3 SC00 or PC0 B10 D13 D7 GND F4 GND B11 D10 D8 GND F5 GND DSP56321 Technical Data, Rev. 11 3-4 Freescale Semiconductor Package Description Table 3-1. Ball No. Signal Name Signal List by Ball Number (Continued) Ball No. Signal Name Ball No. Signal Name F6 GND H3 SCK0 or PC3 J14 A9 F7 GND H4 GND K1 VCCS F8 GND H5 GND K2 HREQ/HREQ, HTRQ/HTRQ, or PB14 F9 GND H6 GND K3 TIO2 F10 GND H7 GND K4 GND F11 GND H8 GND K5 GND F12 VCCQH H9 GND K6 GND F13 A14 H10 GND K7 GND F14 A15 H11 GND K8 GND G1 SCK1 or PD3 H12 VCCA K9 GND G2 SCLK or PE2 H13 A10 K10 GND G3 TXD or PE1 H14 A11 K11 GND G4 GND J1 HACK/HACK, HRRQ/HRRQ, or PB15 K12 VCCA G5 GND J2 HRW, HRD/HRD, or PB11 K13 A5 G6 GND J3 HDS/HDS, HWR/HWR, or PB12 K14 A6 G7 GND J4 GND L1 HCS/HCS, HA10, or PB13 G8 GND J5 GND L2 TIO1 G9 GND J6 GND L3 TIO0 G10 GND J7 GND L4 GND G11 GND J8 GND L5 GND G12 A13 J9 GND L6 GND G13 VCCQL J10 GND L7 GND G14 A12 J11 GND L8 GND H1 VCCQH J12 A8 L9 GND H2 VCCQL J13 A7 L10 GND DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 3-5 Packaging Table 3-1. Ball No. Signal Name Signal List by Ball Number (Continued) Ball No. Signal Name Ball No. Signal Name L11 GND M13 A1 P1 NC L12 VCCA M14 A2 P2 H5, HAD5, or PB5 L13 A3 N1 H6, HAD6, or PB6 P3 H3, HAD3, or PB3 L14 A4 N2 H7, HAD7, or PB7 P4 H1, HAD1, or PB1 M1 HA1, HA8, or PB9 N3 H4, HAD4, or PB4 P5 NC M2 HA2, HA9, or PB10 N4 H2, HAD2, or PB2 P6 GND M3 HA0, HAS/HAS, or PB8 N5 RESET P7 AA2 M4 VCCH N6 GND P8 XTAL M5 H0, HAD0, or PB0 N7 AA3 P9 VCCC M6 VCCQL N8 NC P10 TA M7 VCCQH N9 VCCQL P11 BB M8 EXTAL N10 Reserved P12 AA1 M9 Reserved N11 BR P13 BG M10 NC N12 VCCC P14 NC M11 WR N13 AA0 M12 RD N14 A0 Note: Signal names are based on configured functionality. Most connections supply a single signal. Some connections provide a signal with dual functionality, such as the MODx/IRQx pins that select an operating mode after RESET is deasserted but act as interrupt lines during operation. Some signals have configurable polarity; these names are shown with and without overbars, such as HAS/HAS. Some connections have two or more configurable functions; names assigned to these connections indicate the function for a specific configuration. For example, connection N2 is data line H7 in non-multiplexed bus mode, data/address line HAD7 in multiplexed bus mode, or GPIO line PB7 when the GPIO function is enabled for this pin. Unlike the TQFP package, most of the GND pins are connected internally in the center of the connection array and act as heat sink for the chip. DSP56321 Technical Data, Rev. 11 3-6 Freescale Semiconductor Package Description Table 3-2. Signal List by Signal Name Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. A0 N14 BR N11 D9 A12 A1 M13 D0 E14 DE D3 A10 H13 D1 D12 EXTAL M8 A11 H14 D10 B11 GND D4 A12 G14 D11 A11 GND D5 A13 G12 D12 C10 GND D6 A14 F13 D13 B10 GND D7 A15 F14 D14 A10 GND D8 A16 E13 D15 B9 GND D9 A17 E12 D16 A9 GND D10 A2 M14 D17 B8 GND D11 A3 L13 D18 C8 GND E4 A4 L14 D19 A8 GND E5 A5 K13 D2 D13 GND E6 A6 K14 D20 B7 GND E7 A7 J13 D21 B6 GND E8 A8 J12 D22 C6 GND E9 A9 J14 D23 A6 GND E10 AA0 N13 D3 C13 GND E11 AA1 P12 D4 C14 GND F4 AA2 P7 D5 B13 GND F5 AA3 N7 D6 C12 GND F6 BB P11 D7 A13 GND F7 BG P13 D8 B12 GND F8 DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 3-7 Packaging Table 3-2. Signal List by Signal Name (Continued) Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. GND F9 GND K4 HA1 M1 GND F10 GND K5 HA10 L1 GND F11 GND K6 HA2 M2 GND G4 GND K7 HA8 M1 GND G5 GND K8 HA9 M2 GND G6 GND K9 HACK/HACK J1 GND G7 GND K10 HAD0 M5 GND G8 GND K11 HAD1 P4 GND G9 GND L4 HAD2 N4 GND G10 GND L5 HAD3 P3 GND G11 GND L6 HAD4 N3 GND H4 GND L7 HAD5 P2 GND H5 GND L8 HAD6 N1 GND H6 GND L9 HAD7 N2 GND H7 GND L10 HAS/HAS M3 GND H8 GND L11 HCS/HCS L1 GND H9 GND N6 HDS/HDS J3 GND H10 GND P6 HRD/HRD J2 GND H11 H0 M5 HREQ/HREQ K2 GND J4 H1 P4 HRRQ/HRRQ J1 GND J5 H2 N4 HRW J2 GND J6 H3 P3 HTRQ/HTRQ K2 GND J7 H4 N3 HWR/HWR J3 GND J8 H5 P2 IRQA C4 GND J9 H6 N2 IRQB A5 GND J10 H7 N2 IRQC C5 GND J11 HA0 M3 IRQD B5 DSP56321 Technical Data, Rev. 11 3-8 Freescale Semiconductor Package Description Table 3-2. Signal List by Signal Name (Continued) Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. MODA C4 PB4 N3 Reserved M9 MODB A5 PB5 P2 Reserved N10 MODC C5 PB6 N1 RESET N5 MODD B5 PB7 N2 RXD F1 NC A1 PB8 M3 SC00 F3 NC A14 PB9 M1 SC01 D2 NC B14 PC0 F3 SC02 C1 NC M10 PC1 D2 SC10 F2 NC N8 PC2 C1 SC11 A2 NC P1 PC3 H3 SC12 B2 NC P5 PC4 E3 SCK0 H3 NC P14 PC5 E1 SCK1 G1 NMI D1 PD0 F2 SCLK G2 PB0 M5 PD1 A2 SRD0 E3 PB1 P4 PD2 B2 SRD1 B1 PB10 M2 PD3 G1 STD0 E1 PB11 J2 PD4 B1 STD1 C2 PB12 J3 PD5 C2 TA P10 PB13 L1 PE0 F1 TCK C3 PB14 K2 PE1 G3 TDI B3 PB15 J1 PE2 G2 TDO A4 PB2 N4 PINIT D1 TIO0 L3 PB3 P3 RD M12 TIO1 L2 DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 3-9 Packaging Table 3-2. Signal List by Signal Name (Continued) Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. TIO2 K3 VCCC P9 VCCQL C7 TMS A3 VCCD A7 VCCQL G13 TRST B4 VCCD C9 VCCQL H2 TXD G3 VCCD C11 VCCQL M6 VCCA H12 VCCD D14 VCCQL N9 VCCA K12 VCCH M4 VCCS E2 VCCA L12 VCCQH F12 VCCS K1 VCCC N12 VCCQH H1 WR M11 VCCQH M7 XTAL P8 3.2 MAP-BGA Package Mechanical Drawing Figure 3-3. DSP56321 Mechanical Information, 196-pin MAP-BGA Package DSP56321 Technical Data, Rev. 11 3-10 Freescale Semiconductor Design Considerations 4 This section describes various areas to consider when incorporating the DSP56321 device into a system design. 4.1 Thermal Design Considerations An estimate of the chip junction temperature, T J, in ° C can be obtained from this equation: Equation 1: T J = T A + ( P D × R θJA ) Where: TA RθJA PD = = = ambient temperature °C package junction-to-ambient thermal resistance °C/W power dissipation in package Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a caseto-ambient thermal resistance, as in this equation: Equation 2: R θJA = R θJC + R θCA Where: RθJA RθJC RθCA = = = package junction-to-ambient thermal resistance °C/W package junction-to-case thermal resistance °C/W package case-to-ambient thermal resistance °C/W RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the device thermal performance may need the additional modeling capability of a system-level thermal simulation tool. The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal performance is adequate, a system-level model may be appropriate. A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance in plastic packages. • To minimize temperature variation across the surface, the thermal resistance is measured from the junction to the outside surface of the package (case) closest to the chip mounting area when that surface has a proper heat sink. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 4-1 Design Considerations • To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is measured from the junction to the point at which the leads attach to the case. • If the temperature of the package case (TT) is determined by a thermocouple, thermal resistance is computed from the value obtained by the equation (TJ – TT)/PD. As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using the first definition. From a practical standpoint, that value is also suitable to determine the junction temperature from a case thermocouple reading in forced convection environments. In natural convection, the use of the junction-to-case thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will yield an estimate of a junction temperature slightly higher than actual temperature. Hence, the new thermal metric, thermal characterization parameter or ΨJT, has been defined to be (TJ – TT)/PD. This value gives a better estimate of the junction temperature in natural convection when the surface temperature of the package is used. Remember that surface temperature readings of packages are subject to significant errors caused by inadequate attachment of the sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a 40gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy. 4.2 Electrical Design Considerations CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for example, either GND or VCC). Use the following list of recommendations to ensure correct DSP operation. • Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from the board ground to each GND pin. • Use at least four 0.01–0.1 µF bypass capacitors for VCCQL (core) and at least six 0.01–0.1 µF bypass capacitors for the other VCC (I/O) power connections positioned as closely as possible to the four sides of the package to connect the power sources to GND. • Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and GND pins are less than 0.5 inch per capacitor lead. • Use at least a four-layer PCB with two inner layers for VCC and GND. • Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal. This recommendation particularly applies to the address and data buses as well as the IRQA, IRQB, IRQC, IRQD, TA, and BG pins. Maximum PCB trace lengths on the order of 6 inches are recommended. DSP56321 Technical Data, Rev. 11 4-2 Freescale Semiconductor Power Consumption Considerations • Consider all device loads as well as parasitic capacitance due to PCB traces when you calculate capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VCC and GND circuits. • All inputs must be terminated (that is, not allowed to float) by CMOS levels except for the three pins with internal pull-up resistors (TRST, TMS, DE). • The following pins must be asserted during the power-up sequence: RESET and TRST. A stable EXTAL signal should be supplied before deassertion of RESET. If the VCC reaches the required level before EXTAL is stable or other “required RESET duration” conditions are met (see Table 2-7), the device circuitry can be in an uninitialized state that may result in significant power consumption and heat-up. Designs should minimize this condition to the shortest possible duration. • Ensure that during power-up, and throughout the DSP56321 operation, VCCQH is always higher or equal to the VCCQL voltage level. • If multiple DSP devices are on the same board, check for cross-talk or excessive spikes on the supplies due to synchronous operation of the devices. • The Port A data bus (D[0–23]), HI08, ESSI0, ESSI1, SCI, and timers all use internal keepers to maintain the last output value even when the internal signal is tri-stated. Typically, no pull-up or pull-down resistors should be used with these signal lines. However, if the DSP is connected to a device that requires pull-up resistors (such as an MPC8260), the recommended resistor value is 10 KΩ or less. If more than one DSP must be connected in parallel to the other device, the pull-up resistor value requirement changes as follows: — — — — — 2 DSPs = 5 KΩ (mask sets 0K91M and 1K91M)/7 KΩ (mask set 0K93M) or less 3 DSPs = 3 KΩ (mask sets 0K91M and 1K91M)/4 KΩ (mask set 0K93M) or less 4 DSPs = 2 KΩ (mask sets 0K91M and 1K91M)/3 KΩ (mask set 0K93M) or less 5 DSPs = 1.5 KΩ (mask sets 0K91M and 1K91M)/2 KΩ (mask set 0K93M) or less 6 DSPs = 1 KΩ (mask sets 0K91M and 1K91M)/1.5 KΩ (mask set 0K93M) or less Note: Refer to EB610/D DSP56321/DSP56321T Power-Up Sequencing Guidelines for detailed information about minimizing power consumption during startup. 4.3 Power Consumption Considerations Power dissipation is a key issue in portable DSP applications. Some of the factors affecting current consumption are described in this section. Most of the current consumed by CMOS devices is alternating current (ac), which is charging and discharging the capacitances of the pins and internal nodes. Current consumption is described by this formula: Equation 3: I = C × V × f Where: C V f = = = node/pin capacitance voltage swing frequency of node/pin toggle Example 4-1. Current Consumption For a Port A address pin loaded with 50 pF capacitance, operating at 3.3 V, with a 66 MHz clock, toggling at its maximum possible rate (33 MHz), the current consumption is expressed in Equation 4. DSP56321 Technical Data, Rev. 11 Freescale Semiconductor 4-3 Design Considerations Equation 4: I = 50 × 10 – 12 × 3.3 × 33 × 10 6 = 5.48 mA The maximum internal current (ICCImax) value reflects the typical possible switching of the internal buses on bestcase operation conditions—not necessarily a real application case. The typical internal current (ICCItyp) value reflects the average switching of the internal buses on typical operating conditions. Perform the following steps for applications that require very low current consumption: 1. Set the EBD bit when you are not accessing external memory. 2. Minimize external memory accesses, and use internal memory accesses. 3. Minimize the number of pins that are switching. 4. Minimize the capacitive load on the pins. 5. Connect the unused inputs to pull-up or pull-down resistors. 6. Disable unused peripherals. 7. Disable unused pin activity (for example, CLKOUT, XTAL). One way to evaluate power consumption is to use a current-per-MIPS measurement methodology to minimize specific board effects (that is, to compensate for measured board current not caused by the DSP). A benchmark power consumption test algorithm is listed in Appendix A. Use the test algorithm, specific test current measurements, and the following equation to derive the current-per-MIPS value. Equation 5: ⁄ MIPS = I ⁄ MHz = ( I typF2 – I typF1 ) ⁄ ( F2 – F1 ) Where: ItypF2 ItypF1 F2 F1 = = = = current at F2 current at F1 high frequency (any specified operating frequency) low frequency (any specified operating frequency lower than F2) Note: F1 should be significantly less than F2. For example, F2 could be 66 MHz and F1 could be 33 MHz. The degree of difference between F1 and F2 determines the amount of precision with which the current rating can be determined for an application. 4.4 Input (EXTAL) Jitter Requirements The allowed jitter on the frequency of EXTAL is 0.5 percent. If the rate of change of the frequency of EXTAL is slow (that is, it does not jump between the minimum and maximum values in one cycle) or the frequency of the jitter is fast (that is, it does not stay at an extreme value for a long time), then the allowed jitter can be 2 percent. The phase and frequency jitter performance results are valid only if the input jitter is less than the prescribed values. DSP56321 Technical Data, Rev. 11 4-4 Freescale Semiconductor Power Consumption Benchmark A The following benchmark program evaluates DSP56321 power use in a test situation. It enables the PLL, disables the external clock, and uses repeated multiply-accumulate (MAC) instructions with a set of synthetic DSP application data to emulate intensive sustained DSP operation. ;************************************************************************** ;************************************************************************** ;* * ;* CHECKS Typical Power Consumption * ;* * ;************************************************************************** page 200,55,0,0,0 nolist I_VEC EQU START EQU INT_PROG INT_XDAT INT_YDAT $000000; Interrupt vectors for program debug only $8000; MAIN (external) program starting address EQU $100 ; INTERNAL program memory starting address EQU $0; INTERNAL X-data memory starting address EQU $0; INTERNAL Y-data memory starting address INCLUDE "ioequ.asm" INCLUDE "intequ.asm" list org P:START ; movep #$0243FF,x:M_BCR ; ; Default: 2w.s (SRAM) ; movep #$00000F,x:M_PCTL ; BCR: Area 3 = 2 w.s (SRAM) ; XTAL disable ; PLL enable ; ; Load the program ; move #INT_PROG,r0 move #PROG_START,r1 do #(PROG_END-PROG_START),PLOAD_LOOP move p:(r1)+,x0 move x0,p:(r0)+ nop PLOAD_LOOP ; ; Load the X-data ; move #INT_XDAT,r0 move #XDAT_START,r1 do #(XDAT_END-XDAT_START),XLOAD_LOOP move p:(r1)+,x0 move x0,x:(r0)+ XLOAD_LOOP DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-1 Power Consumption Benchmark ; ; Load the Y-data ; move #INT_YDAT,r0 move #YDAT_START,r1 do #(YDAT_END-YDAT_START),YLOAD_LOOP move p:(r1)+,x0 move x0,y:(r0)+ YLOAD_LOOP ; jmp PROG_START move move move move ; clr clr move move move move bset ; sbr dor mac mac add mac mac move _end bra nop nop nop nop PROG_END nop nop XDAT_START ; org dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc INT_PROG #$0,r0 #$0,r4 #$3f,m0 #$3f,m4 a b #$0,x0 #$0,x1 #$0,y0 #$0,y1 #4,omr ; ebd #60,_end x0,y0,ax:(r0)+,x1 x1,y1,ax:(r0)+,x0 a,b x0,y0,ax:(r0)+,x1 x1,y1,a b1,x:$ff y:(r4)+,y1 y:(r4)+,y0 y:(r4)+,y0 sbr x:0 $262EB9 $86F2FE $E56A5F $616CAC $8FFD75 $9210A $A06D7B $CEA798 $8DFBF1 $A063D6 $6C6657 $C2A544 $A3662D $A4E762 $84F0F3 $E6F1B0 DSP56321 Technical Data, Rev. 11 A-2 Freescale Semiconductor dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc XDAT_END YDAT_START ; org dc dc dc dc dc dc dc dc dc dc dc $B3829 $8BF7AE $63A94F $EF78DC $242DE5 $A3E0BA $EBAB6B $8726C8 $CA361 $2F6E86 $A57347 $4BE774 $8F349D $A1ED12 $4BFCE3 $EA26E0 $CD7D99 $4BA85E $27A43F $A8B10C $D3A55 $25EC6A $2A255B $A5F1F8 $2426D1 $AE6536 $CBBC37 $6235A4 $37F0D $63BEC2 $A5E4D3 $8CE810 $3FF09 $60E50E $CFFB2F $40753C $8262C5 $CA641A $EB3B4B $2DA928 $AB6641 $28A7E6 $4E2127 $482FD4 $7257D $E53C72 $1A8C3 $E27540 y:0 $5B6DA $C3F70B $6A39E8 $81E801 $C666A6 $46F8E7 $AAEC94 $24233D $802732 $2E3C83 $A43E00 DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-3 Power Consumption Benchmark dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc YDAT_END $C2B639 $85A47E $ABFDDF $F3A2C $2D7CF5 $E16A8A $ECB8FB $4BED18 $43F371 $83A556 $E1E9D7 $ACA2C4 $8135AD $2CE0E2 $8F2C73 $432730 $A87FA9 $4A292E $A63CCF $6BA65C $E06D65 $1AA3A $A1B6EB $48AC48 $EF7AE1 $6E3006 $62F6C7 $6064F4 $87E41D $CB2692 $2C3863 $C6BC60 $43A519 $6139DE $ADF7BF $4B3E8C $6079D5 $E0F5EA $8230DB $A3B778 $2BFE51 $E0A6B6 $68FFB7 $28F324 $8F2E8D $667842 $83E053 $A1FD90 $6B2689 $85B68E $622EAF $6162BC $E4A245 ;************************************************************************** ; ; EQUATES for DSP56321 I/O registers and ports ; ;************************************************************************** page opt 132,55,0,0,0 mex DSP56321 Technical Data, Rev. 11 A-4 Freescale Semiconductor ioequ ident 1,0 ;-----------------------------------------------------------------------; ; EQUATES for I/O Port Programming ; ;-----------------------------------------------------------------------; Register Addresses M_HDR EQU $FFFFC9 M_HDDR EQU $FFFFC8 M_PCRC EQU $FFFFBF M_PRRC EQU $FFFFBE M_PDRC EQU $FFFFBD M_PCRD EQU $FFFFAF M_PRRD EQU $FFFFAE M_PDRD EQU $FFFFAD M_PCRE EQU $FFFF9F M_PRRE EQU $FFFF9E M_PDRE EQU $FFFF9D M_OGDB EQU $FFFFFC ; ; ; ; ; ; ; ; ; ; ; ; Host Host Port Port Port Port Port Port Port Port Port OnCE port GPIO data Register port GPIO direction Register C Control Register C Direction Register C GPIO Data Register D Control register D Direction Data Register D GPIO Data Register E Control register E Direction Register E Data Register GDB Register ;-----------------------------------------------------------------------; ; EQUATES for Host Interface ; ;-----------------------------------------------------------------------; Register Addresses M_HCR EQU $FFFFC2 M_HSR EQU $FFFFC3 M_HPCR EQU $FFFFC4 M_HBAR EQU $FFFFC5 M_HRX EQU $FFFFC6 M_HTX EQU $FFFFC7 ; ; ; ; ; ; Host Host Host Host Host Host Control Register Status Register Polarity Control Register Base Address Register Receive Register Transmit Register ; HCR bits definition M_HRIE EQU $0 M_HTIE EQU $1 M_HCIE EQU $2 M_HF2 EQU $3 M_HF3 EQU $4 ; ; ; ; ; Host Host Host Host Host Receive interrupts Enable Transmit Interrupt Enable Command Interrupt Enable Flag 2 Flag 3 ; HSR bits definition M_HRDF EQU $0 M_HTDE EQU $1 M_HCP EQU $2 M_HF0 EQU $3 M_HF1 EQU $4 ; ; ; ; ; Host Host Host Host Host Receive Data Full Receive Data Empty Command Pending Flag 0 Flag 1 ; HPCR bits definition M_HGEN EQU $0 M_HA8EN EQU $1 M_HA9EN EQU $2 M_HCSEN EQU $3 M_HREN EQU $4 M_HAEN EQU $5 M_HEN EQU $6 ; ; ; ; ; ; ; Host Host Host Host Host Host Host Port GPIO Enable Address 8 Enable Address 9 Enable Chip Select Enable Request Enable Acknowledge Enable Enable DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-5 Power Consumption Benchmark M_HOD EQU $8 M_HDSP EQU $9 M_HASP EQU $A M_HMUX EQU $B M_HD_HS EQU $C M_HCSP EQU $D M_HRP EQU $E M_HAP EQU $F ; ; ; ; ; ; ; ; Host Host Host Host Host Host Host Host Request Open Drain mode Data Strobe Polarity Address Strobe Polarity Multiplexed bus select Double/Single Strobe select Chip Select Polarity Request Polarity Acknowledge Polarity ;-----------------------------------------------------------------------; ; EQUATES for Serial Communications Interface (SCI) ; ;-----------------------------------------------------------------------; Register Addresses M_STXH EQU $FFFF97 M_STXM EQU $FFFF96 M_STXL EQU $FFFF95 M_SRXH EQU $FFFF9A M_SRXM EQU $FFFF99 M_SRXL EQU $FFFF98 M_STXA EQU $FFFF94 M_SCR EQU $FFFF9C M_SSR EQU $FFFF93 M_SCCR EQU $FFFF9B ; Transmit Data Register (high) Transmit Data Register (middle) Transmit Data Register (low) Receive Data Register (high) Receive Data Register (middle) Receive Data Register (low) Transmit Address Register Control Register Status Register Clock Control Register ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Word Select Mask (WDS0-WDS3) Word Select 0 Word Select 1 Word Select 2 SCI Shift Direction Send Break Wakeup Mode Select Receiver Wakeup Enable Wired-OR Mode Select SCI Receiver Enable SCI Transmitter Enable Idle Line Interrupt Enable SCI Receive Interrupt Enable SCI Transmit Interrupt Enable Timer Interrupt Enable Timer Interrupt Rate SCI Clock Polarity SCI Error Interrupt Enable (REIE) SCI Status Register Bit Flags M_TRNE EQU M_TDRE EQU M_RDRF EQU M_IDLE EQU M_OR EQU 4 M_PE EQU 5 M_FE EQU 6 M_R8 EQU 7 ; SCI SCI SCI SCI SCI SCI SCI SCI SCI SCI SCI Control Register Bit Flags M_WDS EQU $7 M_WDS0 EQU 0 M_WDS1 EQU 1 M_WDS2 EQU 2 M_SSFTD EQU 3 M_SBK EQU 4 M_WAKE EQU 5 M_RWU EQU 6 M_WOMS EQU 7 M_SCRE EQU 8 M_SCTE EQU 9 M_ILIE EQU 10 M_SCRIE EQU 11 M_SCTIE EQU 12 M_TMIE EQU 13 M_TIR EQU 14 M_SCKP EQU 15 M_REIE EQU 16 ; ; ; ; ; ; ; ; ; ; ; 0 1 2 3 ; ; ; ; ; ; ; ; Transmitter Empty Transmit Data Register Empty Receive Data Register Full Idle Line Flag Overrun Error Flag Parity Error Framing Error Flag Received Bit 8 (R8) Address SCI Clock Control Register DSP56321 Technical Data, Rev. 11 A-6 Freescale Semiconductor M_CD EQU $FFF M_COD EQU 12 M_SCP EQU 13 M_RCM EQU 14 M_TCM EQU 15 ; ; ; ; ; Clock Divider Mask (CD0-CD11) Clock Out Divider Clock Prescaler Receive Clock Mode Source Bit Transmit Clock Source Bit ;-----------------------------------------------------------------------; ; EQUATES for Synchronous Serial Interface (SSI) ; ;-----------------------------------------------------------------------; ; Register Addresses Of SSI0 M_TX00 EQU $FFFFBC ; SSI0 Transmit Data Register 0 M_TX01 EQU $FFFFBB ; SSIO Transmit Data Register 1 M_TX02 EQU $FFFFBA ; SSIO Transmit Data Register 2 M_TSR0 EQU $FFFFB9 ; SSI0 Time Slot Register M_RX0 EQU $FFFFB8 ; SSI0 Receive Data Register M_SSISR0 EQU $FFFFB7 ; SSI0 Status Register M_CRB0 EQU $FFFFB6 ; SSI0 Control Register B M_CRA0 EQU $FFFFB5 ; SSI0 Control Register A M_TSMA0 EQU $FFFFB4 ; SSI0 Transmit Slot Mask Register A M_TSMB0 EQU $FFFFB3 ; SSI0 Transmit Slot Mask Register B M_RSMA0 EQU $FFFFB2 ; SSI0 Receive Slot Mask Register A M_RSMB0 EQU $FFFFB1 ; SSI0 Receive Slot Mask Register B ; Register Addresses Of SSI1 M_TX10 EQU $FFFFAC ; SSI1 Transmit Data Register 0 M_TX11 EQU $FFFFAB ; SSI1 Transmit Data Register 1 M_TX12 EQU $FFFFAA ; SSI1 Transmit Data Register 2 M_TSR1 EQU $FFFFA9 ; SSI1 Time Slot Register M_RX1 EQU $FFFFA8 ; SSI1 Receive Data Register M_SSISR1 EQU $FFFFA7 ; SSI1 Status Register M_CRB1 EQU $FFFFA6 ; SSI1 Control Register B M_CRA1 EQU $FFFFA5 ; SSI1 Control Register A M_TSMA1 EQU $FFFFA4 ; SSI1 Transmit Slot Mask Register A M_TSMB1 EQU $FFFFA3 ; SSI1 Transmit Slot Mask Register B M_RSMA1 EQU $FFFFA2 ; SSI1 Receive Slot Mask Register A M_RSMB1 EQU $FFFFA1 ; SSI1 Receive Slot Mask Register B ; SSI Control Register A Bit Flags M_PM EQU $FF M_PSR EQU 11 M_DC EQU $1F000 M_ALC EQU 18 M_WL EQU $380000 M_SSC1 EQU 22 ; ; ; ; ; ; ; Prescale Modulus Select Mask (PM0-PM7) Prescaler Range Frame Rate Divider Control Mask (DC0-DC7) Alignment Control (ALC) Word Length Control Mask (WL0-WL7) Select SC1 as TR #0 drive enable (SSC1) SSI Control Register B Bit Flags M_OF EQU $3 M_OF0 EQU 0 M_OF1 EQU 1 M_SCD EQU $1C M_SCD0 EQU 2 M_SCD1 EQU 3 M_SCD2 EQU 4 M_SCKD EQU 5 M_SHFD EQU 6 M_FSL EQU $180 M_FSL0 EQU 7 ; ; ; ; ; ; ; ; ; ; ; Serial Output Flag Mask Serial Output Flag 0 Serial Output Flag 1 Serial Control Direction Mask Serial Control 0 Direction Serial Control 1 Direction Serial Control 2 Direction Clock Source Direction Shift Direction Frame Sync Length Mask (FSL0-FSL1) Frame Sync Length 0 DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-7 Power Consumption Benchmark M_FSL1 EQU 8 M_FSR EQU 9 M_FSP EQU 10 M_CKP EQU 11 M_SYN EQU 12 M_MOD EQU 13 M_SSTE EQU $1C000 M_SSTE2 EQU 14 M_SSTE1 EQU 15 M_SSTE0 EQU 16 M_SSRE EQU 17 M_SSTIE EQU 18 M_SSRIE EQU 19 M_STLIE EQU 20 M_SRLIE EQU 21 M_STEIE EQU 22 M_SREIE EQU 23 ; ; SSI Transmit Slot Bits Mask A (TS0-TS15) ; SSI Transmit Slot Bits Mask B (TS16-TS31) SSI Receive Slot Mask Register A M_SSRSA EQU $FFFF ; Serial Input Flag Mask Serial Input Flag 0 Serial Input Flag 1 Transmit Frame Sync Flag Receive Frame Sync Flag Transmitter Underrun Error FLag Receiver Overrun Error Flag Transmit Data Register Empty Receive Data Register Full SSI Transmit Slot Mask Register B M_SSTSB EQU $FFFF ; ; ; ; ; ; ; ; ; ; SSI Transmit Slot Mask Register A M_SSTSA EQU $FFFF ; Frame Sync Length 1 Frame Sync Relative Timing Frame Sync Polarity Clock Polarity Sync/Async Control SSI Mode Select SSI Transmit enable Mask SSI Transmit #2 Enable SSI Transmit #1 Enable SSI Transmit #0 Enable SSI Receive Enable SSI Transmit Interrupt Enable SSI Receive Interrupt Enable SSI Transmit Last Slot Interrupt Enable SSI Receive Last Slot Interrupt Enable SSI Transmit Error Interrupt Enable SI Receive Error Interrupt Enable SSI Status Register Bit Flags M_IF EQU $3 M_IF0 EQU 0 M_IF1 EQU 1 M_TFS EQU 2 M_RFS EQU 3 M_TUE EQU 4 M_ROE EQU 5 M_TDE EQU 6 M_RDF EQU 7 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; SSI Receive Slot Bits Mask A (RS0-RS15) SSI Receive Slot Mask Register B M_SSRSB EQU $FFFF ; SSI Receive Slot Bits Mask B (RS16-RS31) ;-----------------------------------------------------------------------; ; EQUATES for Exception Processing ; ;------------------------------------------------------------------------ ; Register Addresses M_IPRC EQU $FFFFFF M_IPRP EQU $FFFFFE ; ; Interrupt Priority Register Core ; Interrupt Priority Register Peripheral Interrupt Priority Register Core (IPRC) M_IAL EQU $7 ; IRQA Mode Mask DSP56321 Technical Data, Rev. 11 A-8 Freescale Semiconductor M_IAL0 EQU 0 M_IAL1 EQU 1 M_IAL2 EQU 2 M_IBL EQU $38 M_IBL0 EQU 3 M_IBL1 EQU 4 M_IBL2 EQU 5 M_ICL EQU $1C0 M_ICL0 EQU 6 M_ICL1 EQU 7 M_ICL2 EQU 8 M_IDL EQU $E00 M_IDL0 EQU 9 M_IDL1 EQU 10 M_IDL2 EQU 11 M_D0L EQU $3000 M_D0L0 EQU 12 M_D0L1 EQU 13 M_D1L EQU $C000 M_D1L0 EQU 14 M_D1L1 EQU 15 M_D2L EQU $30000 M_D2L0 EQU 16 M_D2L1 EQU 17 M_D3L EQU $C0000 M_D3L0 EQU 18 M_D3L1 EQU 19 M_D4L EQU $300000 M_D4L0 EQU 20 M_D4L1 EQU 21 M_D5L EQU $C00000 M_D5L0 EQU 22 M_D5L1 EQU 23 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; IRQA IRQA IRQA IRQB IRQB IRQB IRQB IRQC IRQC IRQC IRQC IRQD IRQD IRQD IRQD DMA0 DMA0 DMA0 DMA1 DMA1 DMA1 DMA2 DMA2 DMA2 DMA3 DMA3 DMA3 DMA4 DMA4 DMA4 DMA5 DMA5 DMA5 Mode Interrupt Priority Level (low) Mode Interrupt Priority Level (high) Mode Trigger Mode Mode Mask Mode Interrupt Priority Level (low) Mode Interrupt Priority Level (high) Mode Trigger Mode Mode Mask Mode Interrupt Priority Level (low) Mode Interrupt Priority Level (high) Mode Trigger Mode Mode Mask Mode Interrupt Priority Level (low) Mode Interrupt Priority Level (high) Mode Trigger Mode Interrupt priority Level Mask Interrupt Priority Level (low) Interrupt Priority Level (high) Interrupt Priority Level Mask Interrupt Priority Level (low) Interrupt Priority Level (high) Interrupt priority Level Mask Interrupt Priority Level (low) Interrupt Priority Level (high) Interrupt Priority Level Mask Interrupt Priority Level (low) Interrupt Priority Level (high) Interrupt priority Level Mask Interrupt Priority Level (low) Interrupt Priority Level (high) Interrupt priority Level Mask Interrupt Priority Level (low) Interrupt Priority Level (high) Interrupt Priority Register Peripheral (IPRP) M_HPL EQU $3 M_HPL0 EQU 0 M_HPL1 EQU 1 M_S0L EQU $C M_S0L0 EQU 2 M_S0L1 EQU 3 M_S1L EQU $30 M_S1L0 EQU 4 M_S1L1 EQU 5 M_SCL EQU $C0 M_SCL0 EQU 6 M_SCL1 EQU 7 M_T0L EQU $300 M_T0L0 EQU 8 M_T0L1 EQU 9 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Host Interrupt Priority Level Mask Host Interrupt Priority Level (low) Host Interrupt Priority Level (high) SSI0 Interrupt Priority Level Mask SSI0 Interrupt Priority Level (low) SSI0 Interrupt Priority Level (high) SSI1 Interrupt Priority Level Mask SSI1 Interrupt Priority Level (low) SSI1 Interrupt Priority Level (high) SCI Interrupt Priority Level Mask SCI Interrupt Priority Level (low) SCI Interrupt Priority Level (high) TIMER Interrupt Priority Level Mask TIMER Interrupt Priority Level (low) TIMER Interrupt Priority Level (high) ;-----------------------------------------------------------------------; ; EQUATES for TIMER ; ;-----------------------------------------------------------------------; Register Addresses Of TIMER0 M_TCSR0 EQU $FFFF8F ; Timer 0 Control/Status Register DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-9 Power Consumption Benchmark M_TLR0 EQU $FFFF8E M_TCPR0 EQU $FFFF8D M_TCR0 EQU $FFFF8C ; Register Addresses Of TIMER1 M_TCSR1 EQU M_TLR1 EQU M_TCPR1 EQU M_TCR1 EQU ; $FFFF8B $FFFF8A $FFFF89 $FFFF88 $FFFF87 $FFFF86 $FFFF85 $FFFF84 $FFFF83 $FFFF82 Control/Status Register Load Reg Compare Register Count Register ; ; ; ; ; ; TIMER2 Control/Status Register TIMER2 Load Reg TIMER2 Compare Register TIMER2 Count Register TIMER Prescaler Load Register TIMER Prescalar Count Register ; ; ; ; ; ; ; ; ; ; ; ; Timer Enable Timer Overflow Interrupt Enable Timer Compare Interrupt Enable Timer Control Mask (TC0-TC3) Inverter Bit Timer Restart Mode Direction Bit Data Input Data Output Prescaled Clock Enable Timer Overflow Flag Timer Compare Flag Timer Prescaler Register Bit Flags M_PS EQU $600000 M_PS0 EQU 21 M_PS1 EQU 22 ; M_TC0 M_TC1 M_TC2 M_TC3 TIMER1 TIMER1 TIMER1 TIMER1 Timer Control/Status Register Bit Flags M_TE EQU 0 M_TOIE EQU 1 M_TCIE EQU 2 M_TC EQU $F0 M_INV EQU 8 M_TRM EQU 9 M_DIR EQU 11 M_DI EQU 12 M_DO EQU 13 M_PCE EQU 15 M_TOF EQU 20 M_TCF EQU 21 ; ; ; ; ; Register Addresses Of TIMER2 M_TCSR2 EQU M_TLR2 EQU M_TCPR2 EQU M_TCR2 EQU M_TPLR EQU M_TPCR EQU ; ; TIMER0 Load Reg ; TIMER0 Compare Register ; TIMER0 Count Register Timer Control Bits EQU 4 EQU 5 EQU 6 EQU 7 ; Prescaler Source Mask ; ; ; ; Timer Timer Timer Timer Control Control Control Control 0 1 2 3 ;-----------------------------------------------------------------------; ; EQUATES for Direct Memory Access (DMA) ; ;-----------------------------------------------------------------------; M_DSTR M_DOR0 M_DOR1 M_DOR2 M_DOR3 Register Addresses Of DMA EQU FFFFF4 ; DMA Status Register EQU $FFFFF3 ; DMA Offset Register 0 EQU $FFFFF2 ; DMA Offset Register 1 EQU $FFFFF1 ; DMA Offset Register 2 EQU $FFFFF0 ; DMA Offset Register 3 DSP56321 Technical Data, Rev. 11 A-10 Freescale Semiconductor ; M_DSR0 M_DDR0 M_DCO0 M_DCR0 ; M_DSR1 M_DDR1 M_DCO1 M_DCR1 ; M_DSR2 M_DDR2 M_DCO2 M_DCR2 ; M_DSR3 M_DDR3 M_DCO3 M_DCR3 ; M_DSR4 M_DDR4 M_DCO4 M_DCR4 ; Register Addresses Of DMA0 EQU EQU EQU EQU $FFFFEF $FFFFEE $FFFFED $FFFFEC ; ; ; ; DMA0 DMA0 DMA0 DMA0 Source Address Register Destination Address Register Counter Control Register DMA1 DMA1 DMA1 DMA1 Source Address Register Destination Address Register Counter Control Register DMA2 DMA2 DMA2 DMA2 Source Address Register Destination Address Register Counter Control Register DMA3 DMA3 DMA3 DMA3 Source Address Register Destination Address Register Counter Control Register DMA4 DMA4 DMA4 DMA4 Source Address Register Destination Address Register Counter Control Register ; ; ; ; DMA5 DMA5 DMA5 DMA5 Source Address Register Destination Address Register Counter Control Register ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA Register Addresses Of DMA1 EQU EQU EQU EQU $FFFFEB $FFFFEA $FFFFE9 $FFFFE8 ; ; ; ; Register Addresses Of DMA2 EQU EQU EQU EQU $FFFFE7 $FFFFE6 $FFFFE5 $FFFFE4 ; ; ; ; Register Addresses Of DMA4 EQU EQU EQU EQU $FFFFE3 $FFFFE2 $FFFFE1 $FFFFE0 ; ; ; ; Register Addresses Of DMA4 EQU EQU EQU EQU $FFFFDF $FFFFDE $FFFFDD $FFFFDC ; ; ; ; Register Addresses Of DMA5 M_DSR5 M_DDR5 M_DCO5 M_DCR5 EQU EQU EQU EQU $FFFFDB $FFFFDA $FFFFD9 $FFFFD8 ; DMA Control Register M_DSS EQU $3 M_DSS0 EQU 0 M_DSS1 EQU 1 M_DDS EQU $C M_DDS0 EQU 2 M_DDS1 EQU 3 M_DAM EQU $3f0 M_DAM0 EQU 4 M_DAM1 EQU 5 M_DAM2 EQU 6 M_DAM3 EQU 7 M_DAM4 EQU 8 M_DAM5 EQU 9 M_D3D EQU 10 M_DRS EQU $F800 M_DCON EQU 16 M_DPR EQU $60000 Source Space Mask (DSS0-Dss1) Source Memory space 0 Source Memory space 1 Destination Space Mask (DDS-DDS1) Destination Memory Space 0 Destination Memory Space 1 Address Mode Mask (DAM5-DAM0) Address Mode 0 Address Mode 1 Address Mode 2 Address Mode 3 Address Mode 4 Address Mode 5 Three Dimensional Mode Request Source Mask (DRS0-DRS4) Continuous Mode Channel Priority DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-11 Power Consumption Benchmark M_DPR0 EQU 17 M_DPR1 EQU 18 M_DTM EQU $380000 M_DTM0 EQU 19 M_DTM1 EQU 20 M_DTM2 EQU 21 M_DIE EQU 22 M_DE EQU 23 ; ; ; ; ; ; ; ; ; DMA DMA DMA DMA DMA DMA DMA DMA Channel Priority Level (low) Channel Priority Level (high) Transfer Mode Mask (DTM2-DTM0) Transfer Mode 0 Transfer Mode 1 Transfer Mode 2 Interrupt Enable bit Channel Enable bit ; ; ; ; ; ; ; ; ; ; ; ; Channel Transfer Done Status MASK (DTD0-DTD5) DMA Channel Transfer Done Status 0 DMA Channel Transfer Done Status 1 DMA Channel Transfer Done Status 2 DMA Channel Transfer Done Status 3 DMA Channel Transfer Done Status 4 DMA Channel Transfer Done Status 5 DMA Active State DMA Active Channel Mask (DCH0-DCH2) DMA Active Channel 0 DMA Active Channel 1 DMA Active Channel 2 DMA Status Register M_DTD EQU $3F M_DTD0 EQU 0 M_DTD1 EQU 1 M_DTD2 EQU 2 M_DTD3 EQU 3 M_DTD4 EQU 4 M_DTD5 EQU 5 M_DACT EQU 8 M_DCH EQU $E00 M_DCH0 EQU 9 M_DCH1 EQU 10 M_DCH2 EQU 11 ;-----------------------------------------------------------------------; ; EQUATES for Enhanced Filter Co-Processor (EFCOP) ; ;-----------------------------------------------------------------------M_FDIR M_FDOR M_FKIR M_FCNT M_FCSR M_FACR M_FDBA M_FCBA M_FDCH EQU EQU EQU EQU EQU EQU EQU EQU EQU $FFFFB0 $FFFFB1 $FFFFB2 $FFFFB3 $FFFFB4 $FFFFB5 $FFFFB6 $FFFFB7 $FFFFB8 ; ; ; ; ; ; ; ; ; EFCOP EFCOP EFCOP EFCOP EFCOP EFCOP EFCOP EFCOP EFCOP Data Input Register Data Output Register K-Constant Register Filter Counter Control Status Register ALU Control Register Data Base Address Coefficient Base Address Decimation/Channel Register ;----------------------------------------------------------------------; ; EQUATES for Phase Locked Loop (PLL) ; ;---------------------------------------------------------------------; M_DMFR M_DPSC M_PCTL Register Addresses Of PLL EQU EQU EQU $FFFFD0 $FFFFD0 $FFFFD1 ; PLL Control Register ; PLL Control Register M_MFI M_MFN M_MFD M_PDF M_CPLM M_MFO M_CDF EQU EQU EQU EQU EQU EQU EQU $F $7F0 $3F800 $3C0000 22 23 $70 ; ; ; ; ; ; ; Multiplication Factor Intager Bits Mask (MFI0-MFI3) Multiplication Factor Bits Mask (MFN0-MFN6) Multiplication Factor Bits Mask (MFD0-MFD6) PreDivider Factor Bits Mask (PD0-PD3) Division Factor Bits Mask (DF0-DF2) DSP56321 Technical Data, Rev. 11 A-12 Freescale Semiconductor M_PCOD M_PSTP M_XTLD M_PEN EQU EQU EQU EQU 0 1 2 3 ; ; ; ; PLL Clock Output Disable Bit STOP Processing State Bit XTAL Disable Bit PLL Enable Bit ;-----------------------------------------------------------------------; ; EQUATES for BIU ; ;-----------------------------------------------------------------------; Register Addresses Of BIU M_BCR EQU $FFFFFB M_DCR EQU $FFFFFA M_AAR0 EQU $FFFFF9 M_AAR1 EQU $FFFFF8 M_AAR2 EQU $FFFFF7 M_AAR3 EQU $FFFFF6 M_IDR EQU $FFFFF5 ; Area 0 Wait Control Mask (BA0W0-BA0W4) Area 1 Wait Control Mask (BA1W0-BA14) Area 2 Wait Control Mask (BA2W0-BA2W2) Area 3 Wait Control Mask (BA3W0-BA3W3) Default Area Wait Control Mask (BDFW0-BDFW4) Bus State Bus Lock Hold Bus Request Hold ; ; ; ; ; ; ; ; ; In Page Wait States Bits Mask (BCW0-BCW1) Out Of Page Wait States Bits Mask (BRW0-BRW1) DRAM Page Size Bits Mask (BPS0-BPS1) Page Logic Enable Mastership Enable Refresh Enable Software Triggered Refresh Refresh Rate Bits Mask (BRF0-BRF7) Refresh prescaler Address Attribute Registers M_BAT EQU $3 M_BAAP EQU 2 M_BPEN EQU 3 M_BXEN EQU 4 M_BYEN EQU 5 M_BAM EQU 6 M_BPAC EQU 7 M_BNC EQU $F00 M_BAC EQU $FFF000 ; ; ; ; ; ; ; ; ; 0 1 2 3 DRAM Control Register M_BCW EQU $3 M_BRW EQU $C M_BPS EQU $300 M_BPLE EQU 11 M_BME EQU 12 M_BRE EQU 13 M_BSTR EQU 14 M_BRF EQU $7F8000 M_BRP EQU 23 ; Bus Control Register DRAM Control Register Address Attribute Register Address Attribute Register Address Attribute Register Address Attribute Register ID Register Bus Control Register M_BA0W EQU $1F M_BA1W EQU $3E0 M_BA2W EQU $1C00 M_BA3W EQU $E000 M_BDFW EQU $1F0000 M_BBS EQU 21 M_BLH EQU 22 M_BRH EQU 23 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Ext. Access Type and Pin Def. Bits Mask (BAT0-BAT1) Address Attribute Pin Polarity Program Space Enable X Data Space Enable Y Data Space Enable Address Muxing Packing Enable Number of Address Bits to Compare Mask (BNC0-BNC3) Address to Compare Bits Mask (BAC0-BAC11) control and status bits in SR M_CP EQU $c00000 M_CA EQU 0 M_V EQU 1 ; mask for CORE-DMA priority bits in SR ; Carry ; Overflow DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-13 Power Consumption Benchmark M_Z EQU 2 M_N EQU 3 M_U EQU 4 M_E EQU 5 M_L EQU 6 M_S EQU 7 M_I0 EQU 8 M_I1 EQU 9 M_S0 EQU 10 M_S1 EQU 11 M_SC EQU 13 M_DM EQU 14 M_LF EQU 15 M_FV EQU 16 M_SA EQU 17 M_CE EQU 19 M_SM EQU 20 M_RM EQU 21 M_CP0 EQU 22 M_CP1 EQU 23 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Zero Negative Unnormalized Extension Limit Scaling Bit Interupt Mask Bit 0 Interupt Mask Bit 1 Scaling Mode Bit 0 Scaling Mode Bit 1 Sixteen_Bit Compatibility Double Precision Multiply DO-Loop Flag DO-Forever Flag Sixteen-Bit Arithmetic Instruction Cache Enable Arithmetic Saturation Rounding Mode bit 0 of priority bits in SR bit 1 of priority bits in SR ; control and status bits in OMR M_CDP EQU $300; mask for CORE-DMA priority bits in OMR M_MA equ0 ; Operating Mode A M_MB equ1 ; Operating Mode B M_MC equ2 ; Operating Mode C M_MD equ3 ; Operating Mode D M_EBD EQU 4 ; External Bus Disable bit in OMR M_SD EQU 6 ; Stop Delay M_MS EQU 7 ; Memory Switch bit in OMR M_CDP0 EQU 8 ; bit 0 of priority bits in OMR M_CDP1 EQU 9 ; bit 1 of priority bits in OMR M_BEN EQU 10 ; Burst Enable M_TAS EQU 11 ; TA Synchronize Select M_BRT EQU 12 ; Bus Release Timing M_ATE EQU 15 ; Address Tracing Enable bit in OMR. M_XYS EQU 16 ; Stack Extension space select bit in OMR. M_EUN EQU 17 ; Extensed stack UNderflow flag in OMR. M_EOV EQU 18 ; Extended stack OVerflow flag in OMR. M_WRP EQU 19 ; Extended WRaP flag in OMR. M_SEN EQU 20 ; Stack Extension Enable bit in OMR. ;************************************************************************* ; ; EQUATES for DSP56321 interrupts ; ;************************************************************************* page opt intequ ident if 132,55,0,0,0 mex 1,0 @DEF(I_VEC) ;leave user definition as is. else I_VEC EQU $0 endif DSP56321 Technical Data, Rev. 11 A-14 Freescale Semiconductor ;-----------------------------------------------------------------------; Non-Maskable interrupts ;-----------------------------------------------------------------------I_RESET EQU I_VEC+$00 ; Hardware RESET I_STACK EQU I_VEC+$02 ; Stack Error I_ILL EQU I_VEC+$04 ; Illegal Instruction I_DBG EQU I_VEC+$06 ; Debug Request I_TRAP EQU I_VEC+$08 ; Trap I_NMI EQU I_VEC+$0A ; Non Maskable Interrupt ;-----------------------------------------------------------------------; Interrupt Request Pins ;-----------------------------------------------------------------------I_IRQA EQU I_VEC+$10 ; IRQA I_IRQB EQU I_VEC+$12 ; IRQB I_IRQC EQU I_VEC+$14 ; IRQC I_IRQD EQU I_VEC+$16 ; IRQD ;-----------------------------------------------------------------------; DMA Interrupts ;-----------------------------------------------------------------------I_DMA0 EQU I_VEC+$18 ; DMA Channel 0 I_DMA1 EQU I_VEC+$1A ; DMA Channel 1 I_DMA2 EQU I_VEC+$1C ; DMA Channel 2 I_DMA3 EQU I_VEC+$1E ; DMA Channel 3 I_DMA4 EQU I_VEC+$20 ; DMA Channel 4 I_DMA5 EQU I_VEC+$22 ; DMA Channel 5 ;-----------------------------------------------------------------------; Timer Interrupts ;-----------------------------------------------------------------------I_TIM0C EQU I_VEC+$24 ; TIMER 0 compare I_TIM0OF EQU I_VEC+$26 ; TIMER 0 overflow I_TIM1C EQU I_VEC+$28 ; TIMER 1 compare I_TIM1OF EQU I_VEC+$2A ; TIMER 1 overflow I_TIM2C EQU I_VEC+$2C ; TIMER 2 compare I_TIM2OF EQU I_VEC+$2E ; TIMER 2 overflow ;-----------------------------------------------------------------------; ESSI Interrupts ;-----------------------------------------------------------------------I_SI0RD EQU I_VEC+$30 ; ESSI0 Receive Data I_SI0RDE EQU I_VEC+$32 ; ESSI0 Receive Data w/ exception Status I_SI0RLS EQU I_VEC+$34 ; ESSI0 Receive last slot I_SI0TD EQU I_VEC+$36 ; ESSI0 Transmit data I_SI0TDE EQU I_VEC+$38 ; ESSI0 Transmit Data w/ exception Status I_SI0TLS EQU I_VEC+$3A ; ESSI0 Transmit last slot I_SI1RD EQU I_VEC+$40 ; ESSI1 Receive Data I_SI1RDE EQU I_VEC+$42 ; ESSI1 Receive Data w/ exception Status I_SI1RLS EQU I_VEC+$44 ; ESSI1 Receive last slot I_SI1TD EQU I_VEC+$46 ; ESSI1 Transmit data I_SI1TDE EQU I_VEC+$48 ; ESSI1 Transmit Data w/ exception Status I_SI1TLS EQU I_VEC+$4A ; ESSI1 Transmit last slot ;-----------------------------------------------------------------------; SCI Interrupts ;-----------------------------------------------------------------------I_SCIRD EQU I_VEC+$50 ; SCI Receive Data I_SCIRDE EQU I_VEC+$52 ; SCI Receive Data With Exception Status I_SCITD EQU I_VEC+$54 ; SCI Transmit Data I_SCIIL EQU I_VEC+$56 ; SCI Idle Line I_SCITM EQU I_VEC+$58 ; SCI Timer DSP56321 Technical Data, Rev. 11 Freescale Semiconductor A-15 Power Consumption Benchmark ;-----------------------------------------------------------------------; HOST Interrupts ;-----------------------------------------------------------------------I_HRDF EQU I_VEC+$60 ; Host Receive Data Full I_HTDE EQU I_VEC+$62 ; Host Transmit Data Empty I_HC EQU I_VEC+$64 ; Default Host Command ;----------------------------------------------------------------------; EFCOP Filter Interrupts ;----------------------------------------------------------------------I_FDIIE I_FDOIE EQU EQU I_VEC+$68 I_VEC+$6A ; EFilter input buffer empty ; EFilter output buffer full ;-----------------------------------------------------------------------; INTERRUPT ENDING ADDRESS ;-----------------------------------------------------------------------I_INTEND EQU I_VEC+$FF ; last address of interrupt vector space DSP56321 Technical Data, Rev. 11 A-16 Freescale Semiconductor Ordering Information Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order. Part DSP56321 Supply Voltage 1.6 V core 3.3 V I/O Package Type Molded Array Process-Ball Grid Array (MAP-BGA) Pin Count Core Frequency (MHz) Solder Spheres Order Number 196 200 Lead-free DSP56321VL200 Lead-bearing DSP56321VF200 Lead-free DSP56321VL220 Lead-bearing DSP56321VF220 Lead-free DSP56321VL240 Lead-bearing DSP56321VF240 Lead-free DSP56321VL275 Lead-bearing DSP56321VF275 220 240 275 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations not listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GMBH Technical Information Center Schatzbogen 7 81829 München, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T. Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 [email protected] Document Order No.: DSP56321 Rev. 11 2/2005 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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