FREESCALE DSP56371

Freescale Semiconductor
Data Sheet: Technical Data
DSP56371
Rev. 4.1, 1/2007
DSP56371 Data Sheet
1
Introduction
The DSP56371 is a high density CMOS device with
5.0-V compatible inputs and outputs.
NOTE
This document contains information on a
new product. Specifications and
information herein are subject to change
without notice.
Finalized specifications may be published after further
characterization and device qualifications are completed.
For software or simulation models (for example, IBIS
files), contact sales or go to www.freescale.com.
2
DSP56371 Overview
2.1
Introduction
Table of Contents
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
DSP56371 Overview. . . . . . . . . . . . . . . . . . . . . . . 1
Signal/Connection Descriptions . . . . . . . . . . . . . 10
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . 33
Power Requirements . . . . . . . . . . . . . . . . . . . . . 34
Thermal Characteristics . . . . . . . . . . . . . . . . . . . 35
DC Electrical Characteristics . . . . . . . . . . . . . . . 36
AC Electrical Characteristics. . . . . . . . . . . . . . . . 37
Internal Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . 37
External Clock Operation . . . . . . . . . . . . . . . . . . 38
Reset, Stop, Mode Select, and Interrupt Timing . 39
Serial Host Interface SPI Protocol Timing. . . . . . 42
Serial Host Interface (SHI) I2C Protocol Timing . 47
Enhanced Serial Audio Interface Timing. . . . . . . 49
Digital Audio Transmitter Timing. . . . . . . . . . . . . 54
Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
JTAG Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Package Information . . . . . . . . . . . . . . . . . . . . . . 58
Design Considerations . . . . . . . . . . . . . . . . . . . . 64
Electrical Design Considerations . . . . . . . . . . . . 65
Power Consumption Benchmark . . . . . . . . . . . . 67
This manual describes the DSP56371 24-bit digital
signal processor (DSP), its memory, operating modes
and peripheral modules. The DSP56371 is a member of
© Freescale Semiconductor, Inc., 2004, 2005, 2006, 2007. All rights reserved.
DSP56371 Overview
the DSP56300 family of programmable CMOS DSPs. The DSP56371 is targeted to applications that
require digital audio compression/decompression, sound field processing, acoustic equalization and other
digital audio algorithms. Changes in core functionality specific to the DSP56371 are also described in this
manual. See Figure 1. for the block diagram of the DSP56371.
2
5
12
12
11
Memory Expansion Area
EFCOP
2
PIO_EB
DAX
Program
RAM
4K × 24
X Data
RAM
36K × 24
Y Data
RAM
48K × 24
ROM
64K × 24
ROM
32K × 24
ROM
32K × 24
Peripheral
Expansion Area
Address
Generation
Unit
Six Channel
DMA Unit
YAB
XAB
PAB
DAB
YM_EB
GPIO
XM_EB
ESAI_1
ESAI
Interface Interface
PM_EB
Triple
Timer
SHI
Interface
24-Bit
Bootstrap
ROM
DSP56300
Core
DDB
YDB
XDB
PDB
GDB
Internal
Data
Bus
Switch
Clock
Generator
EXTAL
RESET
PINIT/NMI
Power
Mgmt.
PLL
Program
Interrupt
Controller
Program
Decode
Controller
Program
Address
Generator
Data ALU
24 × 24+56→56-bit MAC
Two 56-bit Accumulators
56-bit Barrel Shifter
4
JTAG
OnCE™
MODA/IRQA
MODB/IRQB
MODC/IRQC
MODD/IRQD
Figure 1. DSP56371 Block Diagram
2.2
DSP56300 Core Description
The DSP56371 uses the DSP56300 core, a high-performance, single clock cycle per instruction engine that
provides up to twice the performance of Motorola's popular DSP56000 core family while retaining code
compatibility with it.
DSP56371 Data Sheet, Rev. 4.1
2
Freescale Semiconductor
DSP56371 Overview
The DSP56300 core family offers a new level of performance in speed and power, provided by its rich
instruction set and low power dissipation, thus enabling a new generation of wireless, telecommunications
and multimedia products. For a description of the DSP56300 core, see Section 2.4 DSP56300 Core
Functional Blocks. Significant architectural enhancements to the DSP56300 core family include a barrel
shifter, 24-bit addressing, an instruction patch module and direct memory access (DMA).
The DSP56300 core family members contain the DSP56300 core and additional modules. The modules
are chosen from a library of standard pre-designed elements such as memories and peripherals. New
modules may be added to the library to meet customer specifications. A standard interface between the
DSP56300 core and the on-chip memory and peripherals supports a wide variety of memory and
peripheral configurations. Refer to DSP56371 User’s Manual, Memory Configuration section.
Core features are described fully in the DSP56300 Family Manual. Pinout, memory and peripheral
features are described in this manual.
• DSP56300 modular chassis
— 181 Million Instructions Per Second (MIPS) with a 181 MHz clock at an internal logic supply
(QVDDL) of 1.25 V
— Object Code Compatible with the 56K core
— Data ALU with a 24 x 24 bit multiplier-accumulator and a 56-bit barrel shifter. 16-bit
arithmetic support
— Program Control with position independent code support and instruction patch support
— EFCOP running concurrently with the core, capable of executing 181 million filter taps per
second at peak performance
— Six-channel DMA controller
— Low jitter, PLL based clocking with a wide range of frequency multiplications (1 to 255),
predivider factors (1 to 31) and power saving clock divider (2i: i=0 to 7). Reduces clock noise.
— Internal address tracing support and OnCE for Hardware/Software debugging
— JTAG port
— Very low-power CMOS design, fully static design with operating frequencies down to DC
— STOP and WAIT low-power standby modes
• On-chip Memory Configuration
— 48Kx24 Bit Y-Data RAM and 32Kx24 Bit Y-Data ROM
— 36Kx24 Bit X-Data RAM and 32Kx24 Bit X-Data ROM
— 64Kx24 Bit Program and Bootstrap ROM
— 4Kx24 Bit Program RAM.
— PROM patching mechanism
— Up to 32Kx24 Bit from Y Data RAM and 8Kx24 Bit from X Data RAM can be switched to
Program RAM resulting in up to 44Kx24 Bit of Program RAM.
• Peripheral modules
— Enhanced Serial Audio Interface (ESAI): up to 4 receivers and up to 6 transmitters, master or
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
3
DSP56371 Overview
—
—
—
—
—
—
2.3
slave. I2S, left justified, right justified, Sony, AC97, network and other programmable
protocols
Enhanced Serial Audio Interface I (ESAI_1): up to 4 receivers and up to 6 transmitters, master
or slave. I2S, left justified, right justified, Sony, AC97, network and other programmable
protocols
Serial Host Interface (SHI): SPI and I2C protocols, multi master capability in I2C mode,
10-word receive FIFO, support for 8, 16 and 24-bit words
Triple Timer module (TEC).
11 dedicated GPIO pins
Digital Audio Transmitter (DAX): 1 serial transmitter capable of supporting the SPDIF,
IEC958, CP-340 and AES/EBU digital audio formats
Pins of unused peripherals (except SHI) may be programmed as GPIO lines
DSP56371 Audio Processor Architecture
This section defines the DSP56371 audio processor architecture. The audio processor is composed of the
following units:
• The DSP56300 core is composed of the Data ALU, Address Generation Unit, Program Controller,
DMA Controller, Memory Module Interface, Peripheral Module Interface and the On-Chip
Emulator (OnCE). The DSP56300 core is described in the document <st-blue>DSP56300 24-Bit
Digital Signal Processor Family Manual, Motorola publication DSP56300FM/AD.
• Phased Lock Loop and Clock Generator
• Memory modules
• Peripheral modules. The peripheral modules are defined in the following sections.
Memory sizes in the block diagram are defaults. Memory may be differently partitioned, according to the
memory mode of the chip. See Section 2.4.7 On-Chip Memory for more details about memory size.
2.4
DSP56300 Core Functional Blocks
The DSP56300 core provides the following functional blocks:
• Data arithmetic logic unit (Data ALU)
• Address generation unit (AGU)
• Program control unit (PCU)
• DMA controller (with six channels)
• Instruction patch controller
• PLL-based clock oscillator
• OnCE module
• Memory
DSP56371 Data Sheet, Rev. 4.1
4
Freescale Semiconductor
DSP56371 Overview
In addition, the DSP56371 provides a set of on-chip peripherals, described in Section 2.5 Peripheral
Overview.
2.4.1
Data ALU
The Data ALU performs all the arithmetic and logical operations on data operands in the DSP56300 core.
The components of the Data ALU are as follows:
• Fully pipelined 24-bit × 24-bit parallel multiplier-accumulator (MAC)
• Bit field unit, comprising a 56-bit parallel barrel shifter (fast shift and normalization; bit stream
generation and parsing)
• Conditional ALU instructions
• 24-bit or 16-bit arithmetic support under software control
• Four 24-bit input general purpose registers: X1, X0, Y1, and Y0
• Six Data ALU registers (A2, A1, A0, B2, B1 and B0) that are concatenated into two general
purpose, 56-bit accumulators (A and B), accumulator shifters
• Two data bus shifter/limiter circuits
2.4.1.1
Data ALU Registers
The Data ALU registers can be read or written over the X memory data bus (XDB) and the Y memory data
bus (YDB) as 24- or 48-bit operands (or as 16- or 32-bit operands in 16-bit arithmetic mode). The source
operands for the Data ALU, which can be 24, 48, or 56 bits (16, 32, or 40 bits in 16-bit arithmetic mode),
always originate from Data ALU registers. The results of all Data ALU operations are stored in an
accumulator.
All the Data ALU operations are performed in two clock cycles in pipeline fashion so that a new
instruction can be initiated in every clock, yielding an effective execution rate of one instruction per clock
cycle. The destination of every arithmetic operation can be used as a source operand for the immediately
following arithmetic operation without a time penalty (for example, without a pipeline stall).
2.4.1.2
Multiplier-Accumulator (MAC)
The MAC unit comprises the main arithmetic processing unit of the DSP56300 core and performs all of
the calculations on data operands. In the case of arithmetic instructions, the unit accepts as many as three
input operands and outputs one 56-bit result of the following form- Extension:Most Significant
Product:Least Significant Product (EXT:MSP:LSP).
The multiplier executes 24-bit × 24-bit, parallel, fractional multiplies, between two’s-complement signed,
unsigned, or mixed operands. The 48-bit product is right-justified and added to the 56-bit contents of either
the A or B accumulator. A 56-bit result can be stored as a 24-bit operand. The LSP can either be truncated
or rounded into the MSP. Rounding is performed if specified.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
5
DSP56371 Overview
2.4.2
Address Generation Unit (AGU)
The AGU performs the effective address calculations using integer arithmetic necessary to address data
operands in memory and contains the registers used to generate the addresses. It implements four types of
arithmetic: linear, modulo, multiple wrap-around modulo and reverse-carry. The AGU operates in parallel
with other chip resources to minimize address-generation overhead.
The AGU is divided into two halves, each with its own Address ALU. Each Address ALU has four sets of
register triplets, and each register triplet is composed of an address register, an offset register and a
modifier register. The two Address ALUs are identical. Each contains a 24-bit full adder (called an offset
adder).
A second full adder (called a modulo adder) adds the summed result of the first full adder to a modulo
value that is stored in its respective modifier register. A third full adder (called a reverse-carry adder) is
also provided.
The offset adder and the reverse-carry adder are in parallel and share common inputs. The only difference
between them is that the carry propagates in opposite directions. Test logic determines which of the three
summed results of the full adders is output.
Each Address ALU can update one address register from its respective address register file during one
instruction cycle. The contents of the associated modifier register specifies the type of arithmetic to be used
in the address register update calculation. The modifier value is decoded in the Address ALU.
2.4.3
Program Control Unit (PCU)
The PCU performs instruction prefetch, instruction decoding, hardware DO loop control and exception
processing. The PCU implements a seven-stage pipeline and controls the different processing states of the
DSP56300 core. The PCU consists of the following three hardware blocks:
• Program decode controller (PDC)
• Program address generator (PAG)
• Program interrupt controller
The PDC decodes the 24-bit instruction loaded into the instruction latch and generates all signals necessary
for pipeline control. The PAG contains all the hardware needed for program address generation, system
stack and loop control. The Program interrupt controller arbitrates among all interrupt requests (internal
interrupts, as well as the five external requests: IRQA, IRQB, IRQC, IRQD and NMI) and generates the
appropriate interrupt vector address.
PCU features include the following:
•
•
•
•
•
•
Position independent code support
Addressing modes optimized for DSP applications (including immediate offsets)
On-chip instruction cache controller
On-chip memory-expandable hardware stack
Nested hardware DO loops
Fast auto-return interrupts
DSP56371 Data Sheet, Rev. 4.1
6
Freescale Semiconductor
DSP56371 Overview
The PCU implements its functions using the following registers:
• PC—program counter register
• SR—Status register
• LA—loop address register
• LC—loop counter register
• VBA—vector base address register
• SZ—stack size register
• SP—stack pointer
• OMR—operating mode register
• SC—stack counter register
The PCU also includes a hardware system stack (SS).
2.4.4
Internal Buses
To provide data exchange between blocks, the following buses are implemented:
• Peripheral input/output expansion bus (PIO_EB) to peripherals
• Program memory expansion bus (PM_EB) to program memory
• X memory expansion bus (XM_EB) to X memory
• Y memory expansion bus (YM_EB) to Y memory
• Global data bus (GDB) between registers in the DMA, AGU, OnCE, PLL, BIU and PCU, as well
as the memory-mapped registers in the peripherals
• DMA data bus (DDB) for carrying DMA data between memories and/or peripherals
• DMA address bus (DAB) for carrying DMA addresses to memories and peripherals
• Program Data Bus (PDB) for carrying program data throughout the core
• X memory Data Bus (XDB) for carrying X data throughout the core
• Y memory Data Bus (YDB) for carrying Y data throughout the core
• Program address bus (PAB) for carrying program memory addresses throughout the core
• X memory address bus (XAB) for carrying X memory addresses throughout the core
• Y memory address bus (YAB) for carrying Y memory addresses throughout the core
All internal buses on the DSP56300 family members are 24-bit buses. See Figure 1.
2.4.5
Direct Memory Access (DMA)
The DMA block has the following features:
• Six DMA channels supporting internal and external accesses
• One-, two- and three-dimensional transfers (including circular buffering)
• End-of-block-transfer interrupts
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
7
DSP56371 Overview
•
Triggering from interrupt lines and all peripherals
2.4.6
PLL-based Clock Oscillator
The clock generator in the DSP56300 core is composed of two main blocks: the PLL, which performs
clock input division, frequency multiplication, skew elimination and the clock generator (CLKGEN),
which performs low-power division and clock pulse generation. PLL-based clocking:
• Allows change of low-power divide factor (DF) without loss of lock
• Provides output clock with skew elimination
• Provides a wide range of frequency multiplications (1 to 255), predivider factors (1 to 31), PLL
feedback multiplier (2 or 4), output divide factor (1, 2 or 4), and a power-saving clock divider
(2i: i = 0 to 7) to reduce clock noise
The PLL allows the processor to operate at a high internal clock frequency using a low frequency clock
input. This feature offers two immediate benefits:
• A lower frequency clock input reduces the overall electromagnetic interference generated by a
system.
• The ability to oscillate at different frequencies reduces costs by eliminating the need to add
additional oscillators to a system.
NOTE
The PLL will momentarily overshoot the target frequency when the PLL is first enabled or
when the VCO frequency is modified. It is important that when modifying the PLL
frequency or enabling the PLL that the two-step procedure defined in Section 3, DSP56371
Overview be followed.
2.4.7
On-Chip Memory
The memory space of the DSP56300 core is partitioned into program memory space, X data memory space
and Y data memory space. The data memory space is divided into X and Y data memory in order to work
with the two Address ALUs and to feed two operands simultaneously to the Data ALU. Memory space
includes internal RAM and ROM and can not be expanded off-chip.
There is an instruction patch module. The patch module is used to patch program ROM. The memory
switch mode is used to increase the size of program RAM as needed (switch from X data RAM and/or Y
data RAM).
There are on-chip ROMs for program and bootstrap memory (64K x 24-bit), X ROM (32K x 24-bit) and
Y ROM (32K x 24-bit).
More information on the internal memory is provided in the DSP56371 User’s Manual, Memory section.
2.4.8
Off-Chip Memory Expansion
Memory cannot be expanded off-chip. There is no external memory bus.
DSP56371 Data Sheet, Rev. 4.1
8
Freescale Semiconductor
DSP56371 Overview
2.5
Peripheral Overview
The DSP56371 is designed to perform a wide variety of fixed-point digital signal processing functions. In
addition to the core features previously discussed, the DSP56371 provides the following peripherals:
• As many as 39 dedicate or user-configurable general purpose input/output (GPIO) signals
• Timer/event counter (TEC) module, containing three independent timers
• Memory switch mode in on-chip memory
• Four external interrupt/mode control lines and one external non-maskable interrupt line
• Enhanced serial audio interface (ESAI) with up to four receivers and up to six transmitters, master
or slave, using the I2S, Sony, AC97, network and other programmable protocols
• A second enhanced serial audio interface (ESAI_1) with up to four receivers and up to six
transmitters, master or slave, using the I2S, Sony, AC97, network and other programmable
protocols.
•
•
2.5.1
Serial host interface (SHI) using SPI and I2C protocols, with multi-master capability, 10-word
receive FIFO and support for 8-, 16- and 24-bit words
A Digital audio transmitter (DAX): a serial transmitter capable of supporting the SPDIF, IEC958,
CP-340 and AES/EBU digital audio formats
General Purpose Input/Output (GPIO)
The DSP56371 provides 11 dedicated GPIO and 28 programmable signals that can operate either as GPIO
pins or peripheral pins (ESAI, ESAI_1, DAX, and TEC). The signals are configured as GPIO after
hardware reset. Register programming techniques for all GPIO functionality among these interfaces are
very similar and are described in the following sections.
2.5.2
Triple Timer (TEC)
This section describes a peripheral module composed of a common 21-bit prescaler and three independent
and identical general purpose 24-bit timer/event counters, each one having its own register set.
Each timer can use internal or external clocking and can interrupt the DSP after a specified number of
events (clocks). Two of the three timers can signal an external device after counting internal events. Each
timer can also be used to trigger DMA transfers after a specified number of events (clocks) occurred. Two
of the three timers connect to the external world through bidirectional pins (TIO0, TIO1). When a TIO pin
is configured as input, the timer functions as an external event counter or can measure external pulse
width/signal period. When a TIO pin is used as output the timer is functioning as either a timer, a watchdog
or a Pulse Width Modulator. When a TIO pin is not used by the timer it can be used as a General Purpose
Input/Output Pin. Refer to DSP56371 User’s Manual, Triple Timer Module section.
2.5.3
Enhanced Serial Audio Interface (ESAI)
The ESAI provides a full-duplex serial port for serial communication with a variety of serial devices
including one or more industry-standard codecs, other DSPs, microprocessors and peripherals that
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
9
Signal/Connection Descriptions
implement the Motorola SPI serial protocol. The ESAI consists of independent transmitter and receiver
sections, each with its own clock generator. It is a superset of the DSP56300 family ESSI peripheral and
of the DSP56000 family SAI peripheral. For more information on the ESAI, refer to DSP56371 User’s
Manual, Enhanced Serial Audio Interface (ESAI) section.
2.5.4
Enhanced Serial Audio Interface 1 (ESAI_1)
The ESAI_1 is a second ESAI interface. The ESAI_1 is functionally identical to ESAI. For more
information on the ESAI_1, refer to DSP56371 User’s Manual, Enhanced Serial Audio Interface (ESAI_1)
section.
2.5.5
Serial Host Interface (SHI)
The SHI is a serial input/output interface providing a path for communication and program/coefficient data
transfers between the DSP and an external host processor. The SHI can also communicate with other serial
peripheral devices. The SHI can interface directly to either of two well-known and widely used
synchronous serial buses: the Motorola serial peripheral interface (SPI) bus and the Philips
inter-integrated-circuit control (I2C) bus. The SHI supports either the SPI or I2C bus protocol, as required,
from a slave or a single-master device. To minimize DSP overhead, the SHI supports single-, double- and
triple-byte data transfers. The SHI has a 10-word receive FIFO that permits receiving up to 30 bytes before
generating a receive interrupt, reducing the overhead for data reception. For more information on the SHI,
refer to DSP56371 User’s Manual, Serial Host Interface section.
2.5.6
Digital Audio Transmitter (DAX)
The DAX is a serial audio interface module that outputs digital audio data in the AES/EBU, CP-340 and
IEC958 formats. For more information on the DAX, refer to DSP56371 User’s Manual, Digital Audio
section.
3
Signal/Connection Descriptions
3.1
Signal Groupings
The input and output signals of the DSP56374 are organized into functional groups, which are listed in
Table 1. and illustrated in Figure 2.
The DSP56374 is operated from a 1.25 V and 3.3 V supply; however, some of the inputs can tolerate 5.0
V. A special notice for this feature is added to the signal descriptions of those inputs.
DSP56371 Data Sheet, Rev. 4.1
10
Freescale Semiconductor
Signal/Connection Descriptions
Table 1. DSP56374 Functional Signal Groupings
Number of
Signals
Detailed
Description
Power (VDD)
12
Table 2
Ground (GND)
12
Table 3
Scan Pins
1
Table 4
Clock and PLL
2
Table 5
Interrupt and mode control
5
Table 6
SHI
5
Table 7
Port C1
12
Table 8
Port
E2
12
Table 9
SPDIF Transmitter (DAX)
Port
D3
2
Table 10
Dedicated GPIO
Port F4
11
Table 11
Timer
2
Table 12
JTAG/OnCE Port
4
Table 13
Functional Group
ESAI
ESAI_1
Note:
1.
2.
3.
4.
Port C signals are the GPIO port signals which are multiplexed with the ESAI signals.
Port E signals are the GPIO port signals which are multiplexed with the ESAI_1 signals.
Port D signals are the GPIO port signals which are multiplexed with the DAX signals.
Port F signals are the dedicated GPIO port signals.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
11
Signal/Connection Descriptions
Pinout (80 pin package)
GPIO
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
Port F
SPDIF TRANSMITTER (DAX)
Port D
MOSI/HA0
SS/HA2
MISO/HDA
SCK/SCL
SHI
HREQ
Port C
TIO0
TIO1
TIMER
SCKT
FST
HCKT
SCKR
ESAI
FSR
HCKR
SDO0
SDO1
SDO2/SDI3
ADO [PD1]
ACI [PD0]
INTERRUPTS
IRQA/MODA
IRGB/MODB
IRQC/MODC
IRQD/MODD
RESET
SDO3/SDI2
SDO4/SDI1
SDO5/SDI0
Port E
PLL AND CLOCK
EXTAL
NMI/PINIT
PLL_VDD(3)
PLL_GND(3)
SCKT_1
FST_1
HCKT_1
SCKR_1
ESAI_1
FSR_1
HCKR_1
SDO0_1
SDO1_1
SDO2_1/SDI3_1
CORE POWER
CORE_VDD (4)
CORE_GND (4)
SDO3_1/SDI2_1
SDO4_1/SDI1_1
SDO5_1/SDI0_1
OnCE/JTAG
TDI
TCLK
TDO
TMS
PERIPHERAL I/O POWER
IO_VDD (5)
IO_GNDS (5)
SCAN
SCAN
Figure 2. Signals Identified by Functional Group
DSP56371 Data Sheet, Rev. 4.1
12
Freescale Semiconductor
Signal/Connection Descriptions
3.2
Power
Table 2. Power Inputs
Power Name
Description
PLLA_VDD (1) PLL Power— The voltage (3.3 V) should be well-regulated and the input should be provided with an
PLLP_VDD(1) extremely low impedance path to the 3.3 VDD power rail. The user must provide adequate external
decoupling capacitors.
PLLD_VDD (1) PLL Power— The voltage (1.25 V) should be well-regulated and the input should be provided with
an extremely low impedance path to the 1.25 VDD power rail. The user must provide adequate
external decoupling capacitors.
CORE_VDD (4) Core Power—The voltage (1.25 V) should be well-regulated and the input should be provided with
an extremely low impedance path to the 1.25 VDD power rail. The user must provide adequate
decoupling capacitors.
SHI, ESAI, ESAI_1, DAX and Timer I/O Power —The voltage (3.3 V) should be well-regulated and
the input should be provided with an extremely low impedance path to the 3.3 VDD power rail. This
is an isolated power for the SHI, ESAI, ESAI_1, DAX and Timer I/O. The user must provide adequate
external decoupling capacitors.
ESAI
61
62
63
64
65
66
67
68
DAX
ESAI_1
60
1
59
2
58
3
57
4
56
5
55
6
54
7
53
8
52
9
51
10
50
11
49
Int/Mod
12
13
GPIO
48
47
14
46
15
45
16
44
17
43
PLL
18
Timer
20
OnCE
SHI
42
41
FST_PE4
SDO5_SDI0_PE6
SDO4_SDI1_PE7
SDO3_SDI2_PE8
SDO2_SDI3_PE9
SDO1_PE10
SDO0_PE11
CORE_GND
CORE_VDD
MODB_IRQA
MODB_IRQB
MODC_IRQC
MODD_IRQD
RESET_B
PINIT_NMI
EXTAL
PLLD_VDD
PLLD_GND
PLLP_GND
PLLP_VDD
40
39
38
37
36
35
34
33
32
31
30
27
26
25
24
23
22
21
PF9
SCAN
PF10
IO_GND
IO_VDD
TIO0_PB0
TIO1_PB1
CORE_GND
CORE_VDD
TDO
TDI
TCK
TMS
MOSI_HA0
MISO_SDA
SCK_SCL
SS_HA2
HREQ
PLLA_VDD
PLLA_GND
29
19
28
SDO5_SDI0_PC7
IO_GND
IO_VDD
SDO3_SDI2_PC8
SDO2_SDI3_PC9
SDO1_PC10
SDO0_PC11
CORE_VDD
PF8
PF6
PF7
CORE_GND
PF2
PF3
PF4
PF5
IO_VDD
PF1
PF0
IO_GND
69
70
71
72
73
74
75
76
77
78
79
0
8
SDO5_SDI0_PC6
FST_PC4
FSR_PC1
SCKT_PC3
SCKR_PC0
IO_VDD
IO_GND
HCKT_PC5
HCKR_PC2
CORE_VDD
ACI_PD0
ADO_PD1
CORE_GND
HCKR_PE2
HCKT_PE5
IO_GND
IO_VDD
SCKR_PE0
SCKT_PE3
FSR_PE1
IO_VDD (5)
1.25V
3.3V
Figure 3. VDD Connections
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
13
Signal/Connection Descriptions
3.3
Ground
Table 3. Grounds
Ground Name
PLLA_GND(1)
PLLP_GND(1)
Description
PLL Ground—The PLL ground should be provided with an extremely low-impedance path to
ground. The user must provide adequate external decoupling capacitors.
PLLD_GND(1) PLL Ground—The PLL ground should be provided with an extremely low-impedance path to
ground. The user must provide adequate external decoupling capacitors.
CORE_GND (4) Core Ground—The Core ground should be provided with an extremely low-impedance path to
ground. This connection must be tied externally to all other chip ground connections. The user must
provide adequate external decoupling capacitors.
IO_GND (5)
3.4
SHI, ESAI, ESAI_1, DAX and Timer I/O Ground—IO_GND is an isolated ground for the SHI, ESAI,
ESAI_1, DAX and Timer I/O. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
SCAN
Table 4. SCAN Signals
Signal
Name
Type
State
During
Reset
SCAN
Input
Input
Signal Description
SCAN—Manufacturing test pin. This pin should be pulled low.
Internal Pull down resistor.
3.5
Clock and PLL
Table 5. Clock and PLL Signals
Signal
Name
Type
State
during
Reset
EXTAL
Input
Input
Signal Description
External Clock Input—An external clock source must be connected to EXTAL in
order to supply the clock to the internal clock generator and PLL.
This input is 5 V tolerant.
PINIT/NMI
Input
Input
PLL Initial/Nonmaskable Interrupt—During assertion of RESET, the value of
PINIT/NMI is written into the PLL Enable (PEN) bit of the PLL control register,
determining whether the PLL is enabled or disabled. After RESET de assertion
and during normal instruction processing, the PINIT/NMI Schmitt-trigger input is
a negative-edge-triggered nonmaskable interrupt (NMI) request internally
synchronized to internal system clock.
Internal Pull up resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
14
Freescale Semiconductor
Signal/Connection Descriptions
3.6
Interrupt and Mode Control
The interrupt and mode control signals select the chip’s operating mode as it comes out of hardware reset.
After RESET is deasserted, these inputs are hardware interrupt request lines.
Table 6. Interrupt and Mode Control
Signal Name
Type
State
During
Reset
MODA/IRQA
Input
Input
Signal Description
Mode Select A/External Interrupt Request A—MODA/IRQA is an active-low
Schmitt-trigger input, internally synchronized to the DSP clock. MODA/IRQA
selects the initial chip operating mode during hardware reset and becomes a
level-sensitive or negative-edge-triggered, maskable interrupt request input
during normal instruction processing. MODA, MODB, MODC and MODD select
one of 16 initial chip operating modes, latched into the OMR when the RESET
signal is deasserted. If the processor is in the stop standby state and the
MODA/IRQA pin is pulled to GND, the processor will exit the stop state.
Internal Pull up resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
15
Signal/Connection Descriptions
Table 6. Interrupt and Mode Control (continued)
Signal Name
Type
State
During
Reset
MODB/IRQB
Input
Input
Signal Description
Mode Select B/External Interrupt Request B—MODB/IRQB is an active-low
Schmitt-trigger input, internally synchronized to the DSP clock. MODB/IRQB
selects the initial chip operating mode during hardware reset and becomes a
level-sensitive or negative-edge-triggered, maskable interrupt request input
during normal instruction processing. MODA, MODB, MODC and MODD select
one of 16 initial chip operating modes, latched into OMR when the RESET signal
is deasserted.
Internal Pull up resistor.
This input is 5 V tolerant.
MODC/IRQC
Input
Input
Mode Select C/External Interrupt Request C—MODC/IRQC is an active-low
Schmitt-trigger input, internally synchronized to the DSP clock. MODC/IRQC
selects the initial chip operating mode during hardware reset and becomes a
level-sensitive or negative-edge-triggered, maskable interrupt request input
during normal instruction processing. MODA, MODB, MODC and MODD select
one of 16 initial chip operating modes, latched into OMR when the RESET signal
is deasserted.
Internal Pull up resistor.
This input is 5 V tolerant.
MODD/IRQD
Input
Input
Mode Select D/External Interrupt Request D—MODD/IRQD is an active-low
Schmitt-trigger input, internally synchronized to the DSP clock. MODD/IRQD
selects the initial chip operating mode during hardware reset and becomes a
level-sensitive or negative-edge-triggered, maskable interrupt request input
during normal instruction processing. MODA, MODB, MODC and MODD select
one of 16 initial chip operating modes, latched into OMR when the RESET signal
is deasserted.
Internal Pull up resistor.
This input is 5 V tolerant.
RESET
Input
Input
Reset—RESET is an active-low, Schmitt-trigger input. When asserted, the chip
is placed in the Reset state and the internal phase generator is reset. The
Schmitt-trigger input allows a slowly rising input (such as a capacitor charging)
to reset the chip reliably. When the RESET signal is deasserted, the initial chip
operating mode is latched from the MODA, MODB, MODC and MODD inputs.
The RESET signal must be asserted during power up. A stable EXTAL signal
must be supplied while RESET is being asserted.
Internal Pull up resistor.
This input is 5 V tolerant.
3.7
Serial Host Interface
The SHI has five I/O signals that can be configured to allow the SHI to operate in either SPI or I2C mode.
DSP56371 Data Sheet, Rev. 4.1
16
Freescale Semiconductor
Signal/Connection Descriptions
Table 7. Serial Host Interface Signals
Signal
Name
Signal Type
State
during
Reset
Signal Description
SCK
Input or
output
Tri-stated SPI Serial Clock—The SCK signal is an output when the SPI is configured as a
master and a Schmitt-trigger input when the SPI is configured as a slave. When
the SPI is configured as a master, the SCK signal is derived from the internal SHI
clock generator. When the SPI is configured as a slave, the SCK signal is an
input, and the clock signal from the external master synchronizes the data
transfer. The SCK signal is ignored by the SPI if it is defined as a slave and the
slave select (SS) signal is not asserted. In both the master and slave SPI devices,
data is shifted on one edge of the SCK signal and is sampled on the opposite
edge where data is stable. Edge polarity is determined by the SPI transfer
protocol.
SCL
Input or
output
I2C Serial Clock—SCL carries the clock for I2C bus transactions in the I2C mode.
SCL is a Schmitt-trigger input when configured as a slave and an open-drain
output when configured as a master. SCL should be connected to VDD through a
pull-up resistor.
This signal is tri-stated during hardware, software and individual reset. Thus,
there is no need for an external pull-up in this state.
Internal Pull up resistor.
This input is 5 V tolerant.
MISO
Input or
output
SDA
Input or
open-drain
output
Tri-stated SPI Master-In-Slave-Out—When the SPI is configured as a master, MISO is the
master data input line. The MISO signal is used in conjunction with the MOSI
signal for transmitting and receiving serial data. This signal is a Schmitt-trigger
input when configured for the SPI Master mode, an output when configured for
the SPI Slave mode, and tri-stated if configured for the SPI Slave mode when SS
is deasserted. An external pull-up resistor is not required for SPI operation.
I2C Data and Acknowledge—In I2C mode, SDA is a Schmitt-trigger input when
receiving and an open-drain output when transmitting. SDA should be connected
to VDD through a pull-up resistor. SDA carries the data for I2C transactions. The
data in SDA must be stable during the high period of SCL. The data in SDA is
only allowed to change when SCL is low. When the bus is free, SDA is high. The
SDA line is only allowed to change during the time SCL is high in the case of start
and stop events. A high-to-low transition of the SDA line while SCL is high is a
unique situation, and it is defined as the start event. A low-to-high transition of
SDA while SCL is high is a unique situation defined as the stop event.
This signal is tri-stated during hardware, software and individual reset. Thus,
there is no need for an external pull-up in this state.
Internal Pull up resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
17
Signal/Connection Descriptions
Table 7. Serial Host Interface Signals (continued)
Signal
Name
Signal Type
MOSI
Input or
output
HA0
Input
State
during
Reset
Signal Description
Tri-stated SPI Master-Out-Slave-In—When the SPI is configured as a master, MOSI is the
master data output line. The MOSI signal is used in conjunction with the MISO
signal for transmitting and receiving serial data. MOSI is the slave data input line
when the SPI is configured as a slave. This signal is a Schmitt-trigger input when
configured for the SPI Slave mode.
I2C Slave Address 0—This signal uses a Schmitt-trigger input when configured
for the I2C mode. When configured for I2C slave mode, the HA0 signal is used to
form the slave device address. HA0 is ignored when configured for the I2C master
mode.
This signal is tri-stated during hardware, software and individual reset. Thus,
there is no need for an external pull-up in this state.
Internal Pull up resistor.
This input is 5 V tolerant.
SS
Input
Tri-stated SPI Slave Select—This signal is an active low Schmitt-trigger input when
configured for the SPI mode. When configured for the SPI Slave mode, this signal
is used to enable the SPI slave for transfer. When configured for the SPI master
mode, this signal should be kept deasserted (pulled high). If it is asserted while
configured as SPI master, a bus error condition is flagged. If SS is deasserted,
the SHI ignores SCK clocks and keeps the MISO output signal in the
high-impedance state.
HA2
Input
I2C Slave Address 2—This signal uses a Schmitt-trigger input when configured
for the I2C mode. When configured for the I2C Slave mode, the HA2 signal is used
to form the slave device address. HA2 is ignored in the I2C master mode.
This signal is tri-stated during hardware, software and individual reset. Thus,
there is no need for an external pull-up in this state.
Internal Pull up resistor.
This input is 5 V tolerant.
HREQ
Input or
Output
Tri-stated Host Request—This signal is an active low Schmitt-trigger input when
configured for the master mode but an active low output when configured for the
slave mode.
When configured for the slave mode, HREQ is asserted to indicate that the SHI
is ready for the next data word transfer and deasserted at the first clock pulse of
the new data word transfer. When configured for the master mode, HREQ is an
input. When asserted by the external slave device, it will trigger the start of the
data word transfer by the master. After finishing the data word transfer, the master
will await the next assertion of HREQ to proceed to the next transfer.
This signal is tri-stated during hardware, software, personal reset, or when the
HREQ1–HREQ0 bits in the HCSR are cleared. There is no need for an external
pull-up in this state.
Internal Pull up resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
18
Freescale Semiconductor
Signal/Connection Descriptions
3.8
Enhanced Serial Audio Interface
Table 8. Enhanced Serial Audio Interface Signals
Signal
Name
Signal Type
HCKR
Input or output
PC2
Input, output, or
disconnected
State during
Reset
GPIO
disconnected
Signal Description
High Frequency Clock for Receiver—When programmed as an
input, this signal provides a high frequency clock source for the
ESAI receiver as an alternate to the DSP core clock. When
programmed as an output, this signal can serve as a
high-frequency sample clock (for example, for external digital to
analog converters [DACs]) or as an additional system clock.
Port C2—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
HCKT
Input or output
PC5
Input, output, or
disconnected
GPIO
disconnected
High Frequency Clock for Transmitter—When programmed as
an input, this signal provides a high frequency clock source for the
ESAI transmitter as an alternate to the DSP core clock. When
programmed as an output, this signal can serve as a high
frequency sample clock (for example, for external DACs) or as an
additional system clock.
Port C5—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
19
Signal/Connection Descriptions
Table 8. Enhanced Serial Audio Interface Signals (continued)
Signal
Name
Signal Type
FSR
Input or output
State during
Reset
GPIO
disconnected
Signal Description
Frame Sync for Receiver—This is the receiver frame sync
input/output signal. In the asynchronous mode (SYN=0), the FSR
pin operates as the frame sync input or output used by all the
enabled receivers. In the synchronous mode (SYN=1), it operates
as either the serial flag 1 pin (TEBE=0), or as the transmitter
external buffer enable control (TEBE=1, RFSD=1).
When this pin is configured as serial flag pin, its direction is
determined by the RFSD bit in the RCCR register. When
configured as the output flag OF1, this pin will reflect the value of
the OF1 bit in the SAICR register, and the data in the OF1 bit will
show up at the pin synchronized to the frame sync in normal mode
or the slot in network mode. When configured as the input flag IF1,
the data value at the pin will be stored in the IF1 bit in the SAISR
register, synchronized by the frame sync in normal mode or the slot
in network mode.
PC1
Input, output, or
disconnected
Port C1—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
FST
Input or output
PC4
Input, output, or
disconnected
GPIO
disconnected
Frame Sync for Transmitter—This is the transmitter frame sync
input/output signal. For synchronous mode, this signal is the frame
sync for both transmitters and receivers. For asynchronous mode,
FST is the frame sync for the transmitters only. The direction is
determined by the transmitter frame sync direction (TFSD) bit in the
ESAI transmit clock control register (TCCR).
Port C4—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
20
Freescale Semiconductor
Signal/Connection Descriptions
Table 8. Enhanced Serial Audio Interface Signals (continued)
Signal
Name
Signal Type
SCKR
Input or output
State during
Reset
GPIO
disconnected
Signal Description
Receiver Serial Clock—SCKR provides the receiver serial bit
clock for the ESAI. The SCKR operates as a clock input or output
used by all the enabled receivers in the asynchronous mode
(SYN=0), or as serial flag 0 pin in the synchronous mode (SYN=1).
When this pin is configured as serial flag pin, its direction is
determined by the RCKD bit in the RCCR register. When
configured as the output flag OF0, this pin will reflect the value of
the OF0 bit in the SAICR register, and the data in the OF0 bit will
show up at the pin synchronized to the frame sync in normal mode
or the slot in network mode. When configured as the input flag IF0,
the data value at the pin will be stored in the IF0 bit in the SAISR
register, synchronized by the frame sync in normal mode or the slot
in network mode.
PC0
Input, output, or
disconnected
Port C0—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SCKT
Input or output
PC3
Input, output, or
disconnected
GPIO
disconnected
Transmitter Serial Clock—This signal provides the serial bit rate
clock for the ESAI. SCKT is a clock input or output used by all
enabled transmitters and receivers in synchronous mode, or by all
enabled transmitters in asynchronous mode.
Port C3—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO5
Output
SDI0
Input
PC6
Input, output, or
disconnected
GPIO
disconnected
Serial Data Output 5—When programmed as a transmitter, SDO5
is used to transmit data from the TX5 serial transmit shift register.
Serial Data Input 0—When programmed as a receiver, SDI0 is
used to receive serial data into the RX0 serial receive shift register.
Port C6—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
21
Signal/Connection Descriptions
Table 8. Enhanced Serial Audio Interface Signals (continued)
Signal
Name
Signal Type
SDO4
Output
SDI1
Input
PC7
Input, output, or
disconnected
State during
Reset
Signal Description
GPIO
disconnected
Serial Data Output 4—When programmed as a transmitter, SDO4
is used to transmit data from the TX4 serial transmit shift register.
Serial Data Input 1—When programmed as a receiver, SDI1 is
used to receive serial data into the RX1 serial receive shift register.
Port C7—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO3
Output
SDI2
Input
PC8
Input, output, or
disconnected
GPIO
disconnected
Serial Data Output 3—When programmed as a transmitter, SDO3
is used to transmit data from the TX3 serial transmit shift register.
Serial Data Input 2—When programmed as a receiver, SDI2 is
used to receive serial data into the RX2 serial receive shift register.
Port C8—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO2
Output
SDI3
Input
PC9
Input, output, or
disconnected
GPIO
disconnected
Serial Data Output 2—When programmed as a transmitter, SDO2
is used to transmit data from the TX2 serial transmit shift register
Serial Data Input 3—When programmed as a receiver, SDI3 is
used to receive serial data into the RX3 serial receive shift register.
Port C9—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
22
Freescale Semiconductor
Signal/Connection Descriptions
Table 8. Enhanced Serial Audio Interface Signals (continued)
Signal
Name
Signal Type
SDO1
Output
PC10
Input, output, or
disconnected
State during
Reset
Signal Description
GPIO
disconnected
Serial Data Output 1—SDO1 is used to transmit data from the TX1
serial transmit shift register.
Port C10—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO0
Output
PC11
Input, output, or
disconnected
GPIO
disconnected
Serial Data Output 0—SDO0 is used to transmit data from the TX0
serial transmit shift register.
Port C11—When the ESAI is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
23
Signal/Connection Descriptions
3.9
Enhanced Serial Audio Interface_1
Table 9. Enhanced Serial Audio Interface_1 Signals
Signal Name
Signal Type
HCKR_1
Input or output
PE2
Input, output, or
disconnected
State during
Reset
GPIO
disconnected
Signal Description
High Frequency Clock for Receiver—When programmed as an
input, this signal provides a high frequency clock source for the
ESAI_1 receiver as an alternate to the DSP core clock. When
programmed as an output, this signal can serve as a
high-frequency sample clock (for example, for external digital to
analog converters [DACs]) or as an additional system clock.
Port E2—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
HCKT_1
Input or output
PE5
Input, output, or
disconnected
GPIO
disconnected
High Frequency Clock for Transmitter—When programmed as
an input, this signal provides a high frequency clock source for
the ESAI_1 transmitter as an alternate to the DSP core clock.
When programmed as an output, this signal can serve as a high
frequency sample clock (for example, for external DACs) or as an
additional system clock.
Port E5—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
24
Freescale Semiconductor
Signal/Connection Descriptions
Table 9. Enhanced Serial Audio Interface_1 Signals
Signal Name
Signal Type
FSR_1
Input or output
State during
Reset
GPIO
disconnected
Signal Description
Frame Sync for Receiver_1—This is the receiver frame sync
input/output signal. In the asynchronous mode (SYN=0), the
FSR_1 pin operates as the frame sync input or output used by all
the enabled receivers. In the synchronous mode (SYN=1), it
operates as either the serial flag 1 pin (TEBE=0), or as the
transmitter external buffer enable control (TEBE=1, RFSD=1).
When this pin is configured as serial flag pin, its direction is
determined by the RFSD bit in the RCCR_1 register. When
configured as the output flag OF1, this pin will reflect the value of
the OF1 bit in the SAICR_1 register, and the data in the OF1 bit
will show up at the pin synchronized to the frame sync in normal
mode or the slot in network mode. When configured as the input
flag IF1, the data value at the pin will be stored in the IF1 bit in the
SAISR register, synchronized by the frame sync in normal mode
or the slot in network mode.
PE1
Input, output, or
disconnected
Port E1—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
FST_1
Input or output
PE4
Input, output, or
disconnected
GPIO
disconnected
Frame Sync for Transmitter_1—This is the transmitter frame
sync input/output signal. For synchronous mode, this signal is the
frame sync for both transmitters and receivers. For asynchronous
mode, FST_1 is the frame sync for the transmitters only. The
direction is determined by the transmitter frame sync direction
(TFSD) bit in the ESAI_1 transmit clock control register
(TCCR_1).
Port E4—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
25
Signal/Connection Descriptions
Table 9. Enhanced Serial Audio Interface_1 Signals
Signal Name
Signal Type
SCKR_1
Input or output
State during
Reset
GPIO
disconnected
Signal Description
Receiver Serial Clock_1—SCKR_1 provides the receiver serial
bit clock for the ESAI_1. The SCKR_1 operates as a clock input
or output used by all the enabled receivers in the asynchronous
mode (SYN=0), or as serial flag 0 pin in the synchronous mode
(SYN=1).
When this pin is configured as serial flag pin, its direction is
determined by the RCKD bit in the RCCR_1 register. When
configured as the output flag OF0, this pin will reflect the value of
the OF0 bit in the SAICR_1 register, and the data in the OF0 bit
will show up at the pin synchronized to the frame sync in normal
mode or the slot in network mode. When configured as the input
flag IF0, the data value at the pin will be stored in the IF0 bit in the
SAISR_1 register, synchronized by the frame sync in normal
mode or the slot in network mode.
PE0
Input, output, or
disconnected
Port E0—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SCKT_1
Input or output
PE3
Input, output, or
disconnected
GPIO
disconnected
Transmitter Serial Clock_1—This signal provides the serial bit
rate clock for the ESAI_1. SCKT_1 is a clock input or output used
by all enabled transmitters and receivers in synchronous mode,
or by all enabled transmitters in asynchronous mode.
Port E3—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO5_1
Output
GPIO
disconnected
Serial Data Output 5_1—When programmed as a transmitter,
SDO5_1 is used to transmit data from the TX5 serial transmit shift
register.
SDI0_1
Input
Serial Data Input 0_1—When programmed as a receiver,
SDI0_1 is used to receive serial data into the RX0 serial receive
shift register.
PE6
Input, output, or
disconnected
Port E6—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
26
Freescale Semiconductor
Signal/Connection Descriptions
Table 9. Enhanced Serial Audio Interface_1 Signals
State during
Reset
Signal Name
Signal Type
SDO4_1
Output
SDI1_1
Input
Serial Data Input 1_1—When programmed as a receiver,
SDI1_1 is used to receive serial data into the RX1 serial receive
shift register.
PE7
Input, output, or
disconnected
Port E7—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
GPIO
disconnected
Signal Description
Serial Data Output 4_1—When programmed as a transmitter,
SDO4_1 is used to transmit data from the TX4 serial transmit shift
register.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO3_1
Output
GPIO
disconnected
Serial Data Output 3—When programmed as a transmitter,
SDO3_1 is used to transmit data from the TX3 serial transmit shift
register.
SDI2_1
Input
Serial Data Input 2—When programmed as a receiver, SDI2_1
is used to receive serial data into the RX2 serial receive shift
register.
PE8
Input, output, or
disconnected
Port E8—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO2_1
Output
GPIO
disconnected
Serial Data Output 2—When programmed as a transmitter,
SDO2_1 is used to transmit data from the TX2 serial transmit shift
register.
SDI3_1
Input
Serial Data Input 3—When programmed as a receiver, SDI3_1
is used to receive serial data into the RX3 serial receive shift
register.
PE9
Input, output, or
disconnected
Port E9—When the ESAI_1 is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
27
Signal/Connection Descriptions
Table 9. Enhanced Serial Audio Interface_1 Signals
Signal Name
Signal Type
SDO1_1
Output
PE10
Input, output, or
disconnected
State during
Reset
Signal Description
GPIO
disconnected
Serial Data Output 1—SDO1_1 is used to transmit data from the
TX1 serial transmit shift register.
Port E10—When the ESAI_1 is configured as GPIO, this signal
is individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
SDO0_1
Output
PE11
Input, output, or
disconnected
GPIO
disconnected
Serial Data Output 0—SDO0_1 is used to transmit data from the
TX0 serial transmit shift register.
Port E11—When the ESAI_1 is configured as GPIO, this signal
is individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
28
Freescale Semiconductor
Signal/Connection Descriptions
3.10 SPDIF Transmitter Digital Audio Interface
Table 10. Digital Audio Interface (DAX) Signals
Signal
Name
Type
ACI
Input
PD0
Input,
output, or
disconnected
State During
Reset
GPIO
Disconnected
Signal Description
Audio Clock Input—This is the DAX clock input. When
programmed to use an external clock, this input supplies the DAX
clock. The external clock frequency must be 256, 384, or 512
times the audio sampling frequency (256 × Fs, 384 × Fs or 512 ×
Fs, respectively).
Port D0—When the DAX is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
ADO
Output
PD1
Input,
output, or
disconnected
GPIO
Disconnected
Digital Audio Data Output—This signal is an audio and
non-audio output in the form of AES/SPDIF, CP340 and IEC958
data in a biphase mark format.
Port D1—When the DAX is configured as GPIO, this signal is
individually programmable as input, output, or internally
disconnected.
The default state after reset is GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
29
Signal/Connection Descriptions
3.11 Dedicated GPIO Interface
Table 11. Dedicated GPIO Signals
Signal
Name
PF0
Type
Input,
output, or
disconnected
State During
Reset
GPIO
disconnected
Signal Description
Port F0—this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF1
Input,
output, or
disconnected
GPIO
disconnected
Port F1— this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF2
Input,
output, or
disconnected
GPIO
disconnected
Port F2— this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF3
Input,
output, or
disconnected
GPIO
disconnected
Port F3—this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF4
Input,
output, or
disconnected
GPIO
disconnected
Port F4— this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF5
Input,
output, or
disconnected
GPIO
disconnected
Port F5—this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF6
Input,
output, or
disconnected
GPIO
disconnected
Port F6—this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
30
Freescale Semiconductor
Signal/Connection Descriptions
Table 11. Dedicated GPIO Signals (continued)
Signal
Name
PF7
Type
Input,
output, or
disconnected
State During
Reset
GPIO
disconnected
Signal Description
Port F7— this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF8
Input,
output, or
disconnected
GPIO
disconnected
Port F8— this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF9
Input,
output, or
disconnected
GPIO
disconnected
Port F9— this signal is individually programmable as input, output,
or internally disconnected. The default state after reset is GPIO
disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
PF10
Input,
output, or
disconnected
GPIO
disconnected
Port F10— this signal is individually programmable as input,
output, or internally disconnected. The default state after reset is
GPIO disconnected.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
31
Signal/Connection Descriptions
3.12 Timer
Table 12. Timer Signal
Signal
Name
TIO0
Type
Input or
Output
State
during
Reset
Signal Description
GPIO Input Timer 0 Schmitt-Trigger Input/Output—When timer 0 functions as an
external event counter or in measurement mode, TIO0 is used as input.
When timer 0 functions in watchdog, timer, or pulse modulation mode,
TIO0 is used as output.
The default mode after reset is GPIO input. This can be changed to
output or configured as a timer input/output through the timer 0
control/status register (TCSR0). If TIO0 is not being used, it is
recommended to either define it as GPIO output immediately at the
beginning of operation or leave it defined as GPIO input but connected
to VDD through a pull-up resistor in order to ensure a stable logic level
at this input.
Internal Pull down resistor.
This input is 5 V tolerant.
TIO1
Input or
Output
GPIO Input Timer 1 Schmitt-Trigger Input/Output—When timer 1 functions as an
external event counter or in measurement mode, TIO1 is used as input.
When timer 1 functions in watchdog, timer, or pulse modulation mode,
TIO1 is used as output.
The default mode after reset is GPIO input. This can be changed to
output or configured as a timer input/output through the timer 1
control/status register (TCSR1). If TIO1 is not being used, it is
recommended to either define it as GPIO output immediately at the
beginning of operation or leave it defined as GPIO input but connected
to Vdd through a pull-up resistor in order to ensure a stable logic level at
this input.
Internal Pull down resistor.
This input is 5 V tolerant.
DSP56371 Data Sheet, Rev. 4.1
32
Freescale Semiconductor
Maximum Ratings
3.13 JTAG/OnCE Interface
Table 13. JTAG/OnCE Interface
Signal
Name
Signal
Type
State
during
Reset
TCK
Input
Input
Signal Description
Test Clock—TCK is a test clock input signal used to synchronize the JTAG
test logic. It has an internal pull-up resistor.
Internal Pull up resistor.
This input is 5 V tolerant.
TDI
Input
Input
Test Data Input—TDI is a test data serial input signal used for test instructions
and data. TDI is sampled on the rising edge of TCK and has an internal pull-up
resistor.
Internal Pull up resistor.
This input is 5 V tolerant.
TDO
Output
Tri-state
Test Data Output—TDO is a test data serial output signal used for test
instructions and data. TDO is tri-statable and is actively driven in the shift-IR
and shift-DR controller states. TDO changes on the falling edge of TCK.
TMS
Input
Input
Test Mode Select—TMS is an input signal used to sequence the test
controller’s state machine. TMS is sampled on the rising edge of TCK and has
an internal pull-up resistor.
Internal Pull up resistor.
This input is 5 V tolerant.
4
Maximum Ratings
CAUTION
This device contains circuitry protecting against damage due to high static voltage or
electrical fields. However, normal precautions should be taken to avoid exceeding
maximum voltage ratings. Reliability of operation is enhanced if unused inputs are pulled
to an appropriate logic voltage level (for example, either GND or VDD). The suggested
value for a pull-up or pull-down resistor is 4.7 kΩ.
NOTE
In the calculation of timing requirements, adding a maximum value of one specification to
a minimum value of another specification does not yield a reasonable sum. A maximum
specification is calculated using a worst case variation of process parameter values in one
direction. The minimum specification is calculated using the worst case for the same
parameters in the opposite direction. Therefore, a “maximum” value for a specification will
never occur in the same device that has a “minimum” value for another specification;
adding a maximum to a minimum represents a condition that can never exist.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
33
Power Requirements
Table 14. Maximum Ratings
Rating1
Value1, 2
Unit
−0.3 to + 1.6
V
VPLLP_VDD,
VIO_VDD,
VPLLA_VDD,
−0.3 to + 4.0
V
VIN
GND − 0.3 to 5.5V
V
I
12
mA
SCK_SCL
ISCK
16
mA
ACI_PD0,ADO_PD1
IDAX
24
mA
Ijtag
24
mA
TJ
–40 to +115
TSTG
−55 to +125
°C
°C
Symbol
Supply Voltage
VCORE_VDD,
VPLLD_VDD
All “5.0V tolerant” input voltages
Current drain per pin excluding VDD and GND
(Except for pads listed below)
TDO
Operating temperature
range3
Storage temperature
Note:
1. GND = 0 V; TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL = 50PF
2. Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress
beyond the maximum rating may affect device reliability or cause permanent damage to the device.
3. Operating temperature qualified for automotive applications.
5
Power Requirements
To prevent high current conditions due to possible improper sequencing of the power supplies, the
connection shown below is recommended to be made between the DSP56371 IO_VDD and CORE_VDD
power pins.
IO VDD
CORE VDD
External
Schottky
Diode
To prevent a high current condition upon power up, the IOVDD must be applied ahead of the CORE VDD
as shown below if the external Schottky is not used.
CORE VDD
IO VDD
DSP56371 Data Sheet, Rev. 4.1
34
Freescale Semiconductor
Thermal Characteristics
6
Thermal Characteristics
Table 15. Thermal Characteristics
Characteristic
Symbol
TQFP Value
Unit
Natural Convection, Junction-to-ambient thermal
resistance1,2
RθJA or θJA
39
°C/W
Junction-to-case thermal resistance3
RθJC or θJC
18.25
°C/W
Note:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
7
DC Electrical Characteristics
Table 16. DC ELECTRICAL CHARACTERISTICS4
Characteristics
Supply voltages
• Core (core_vdd)
• PLL (plld_vdd)
Supply voltages
• Vio_vdd
• PLL (pllp_vdd)
• PLL (plla_vdd)
Symbol
Min
Typ
Max
Unit
VDD
1.2
1.25
1.31
V
VDDIO
3.14
3.3
3.461
V
VIH
2.0
—
VIO_VDD+2V
V
Input high voltage
• All pins
Note: All 3.3 V supplies must rise prior to the rise of the 1.25 V supplies to avoid a high current condition and
possible system damage.
Input low voltage
• All pins
VIL
–0.3
—
0.8
V
Input leakage current (All pins)
IIN
—
—
84
µA
Clock pin Input Capacitance (EXTAL)
CIN
High impedance (off-state) input current
(@ 3.46 V)
ITSI
–84
—
84
µA
Output high voltage
IOH = -5 mA
VOH
2.4
—
—
V
Output low voltage
IOL = 5 mA
VOL
—
—
0.4
V
ICCI
—
99
200
mA
Internal supply current1 at internal clock of
181MHz
• In Normal mode
3.749
pF
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
35
AC Electrical Characteristics
Table 16. DC ELECTRICAL CHARACTERISTICS4
Characteristics
• In Wait mode
• In Stop mode
3
Input capacitance4
Symbol
Min
Typ
Max
Unit
ICCW
—
48
150
mA
ICCS
—
2.5
82
mA
CIN
—
—
10
pF
Note:
1. Section 3, Power Consumption Considerations provides a formula to compute the estimated current requirements in
Normal mode. In order to obtain these results, all inputs must be terminated (for example, not allowed to float).
Measurements are based on synthetic intensive DSP benchmarks. The power consumption numbers in this
specification are 90% of the measured results of this benchmark. This reflects typical DSP applications. Typical internal
supply current is measured with VCORE_VDD = 1.25V, VDD_IO = 3.3V at TJ = 25°C. Maximum internal supply current is
measured with VCORE_VDD = 1.30 V, VIO_VDD) = 3.46V at TJ = 115°C.
2. In order to obtain these results, all inputs, which are not disconnected at Stop mode, must be terminated (for example,
not allowed to float).
3. Periodically sampled and not 100% tested
4. TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL=50pF
8
AC Electrical Characteristics
The timing waveforms shown in the AC electrical characteristics section are tested with a VIL maximum
of 0.8V and a VIH minimum of 2.0V for all pins. AC timing specifications, which are referenced to a
device input signal, are measured in production with respect to the 50% point of the respective input
signal’s transition. DSP56371 output levels are measured with the production test machine VOL and VOH
reference levels set at 1.0V and 1.8V, respectively.
NOTE
Although the minimum value for the frequency of EXTAL is 0 MHz (PLL bypassed), the
device AC test conditions are 5 MHz and rated speed.
DSP56371 Data Sheet, Rev. 4.1
36
Freescale Semiconductor
Internal Clocks
9
Internal Clocks
Table 17. INTERNAL CLOCKS
No.
Characteristics
Symbol
Min
Typ
Max
UNIT
Condition
5
—
20
MHZ
Fref = FN/NR
1
Comparison Frequency
Fref1
2
Input Clock Frequency
FIN
3
Output clock Frequency (with
PLL enabled)2,3
4
Output clock Frequency (with
PLL disabled)2,3
5
Duty Cycle
Fref*NR
NR is input divider
value
(1000/Etc × MF x FM)/
(PDF × DF x OD)
FOUT
75
Tc
13.3
FOUT
Tc
—
1000/Etc
—
40
50
—
MHZ
ns
FOUT = FVCO/NO
where NO is output
divider value
—
MHZ
—
60
%
FVCO=300MHZ
~600MHZ
Note:
1 See users manual for definition.
2 DF = Division Factor
Ef = External frequency
MF = Multiplication Factor
PDF = Predivision Factor
FM= Feedback Multiplier
OD = Output Divider
Tc = internal clock period
3 Maximum frequency will vary depending on the ordered part number.
10
External Clock Operation
The DSP56371 system clock is an externally supplied square wave voltage source connected to EXTAL
(see Figure 4.).
.
VIH
Midpoint
EXTAL
VIL
ETH
ETL
6
7
8
Note:
ETC
The midpoint is 0.5 (VIH + VIL).
Figure 4. External Clock Timing
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
37
Reset, Stop, Mode Select, and Interrupt Timing
Table 18. Clock Operation 150 and 181 MHz Values
150 MHz
No.
Characteristics
181 MHz
Symbol
Min
Max
Min
Max
6
EXTAL input high 1,2
(40% to 60% duty cycle)
Eth
3.33ns
100ns
2.75ns
100ns
7
EXTAL input low1,2
(40% to 60% duty cycle)
Etl
3.33ns
100ns
2.75ns
100ns
8
EXTAL cycle time2
• With PLL disabled
• With PLL enabled
Etc
6.66ns
6.66ns
inf
200ns
5.52ns
5.52ns
inf
200ns
Instruction cycle time= ICYC = TC3
• With PLL disabled
• With PLL enabled
Icyc
6.66ns
6.66ns
inf
13.0ns
5.52ns
5.52ns
inf
13.0ns
9
Note:
1.
2.
3.
4.
11
Measured at 50% of the input transition
The maximum value for PLL enabled is given for minimum VCO and maximum MF.
The maximum value for PLL enabled is given for minimum VCO and maximum DF.
The indicated duty cycle is for the specified maximum frequency for which a part is rated. The minimum clock high or low
time required for correct operation, however, remains the same at lower operating frequencies; therefore, when a lower
clock frequency is used, the signal symmetry may vary from the specified duty cycle as long as the minimum high time
and low time requirements are met.
Reset, Stop, Mode Select, and Interrupt Timing
Table 19. Reset, Stop, Mode Select, and Interrupt Timing
No.
Characteristics
Expression
Min
Max
Unit
10
Delay from RESET assertion to all output pins at
reset value3
—
—
11
ns
11
Required RESET duration4
• Power on, external clock generator, PLL
disabled
2 x TC
11.1
—
ns
2 x TC
11.1
--
ns
TC
—
5.5
ns
2× TC
(2xTC)+TLOCK
11.1
5.0
—
ns
ms
• Power on, external clock generator, PLL
enabled
12
13
Syn reset setup time from RESET
• Maximum
Syn reset de assert delay time
• Minimum
• Maximum(PLL enabled)
14
Mode select setup time
10.0
—
ns
15
Mode select hold time
10.0
—
ns
16
Minimum edge-triggered interrupt request
assertion width
2 xTC
11.1
—
ns
17
Minimum edge-triggered interrupt request
deassertion width
2 xTC
11.1
—
ns
DSP56371 Data Sheet, Rev. 4.1
38
Freescale Semiconductor
Reset, Stop, Mode Select, and Interrupt Timing
Table 19. Reset, Stop, Mode Select, and Interrupt Timing (continued)
No.
Characteristics
Expression
Min
10 xTC + 5
60.0
9+(128K× TC)
704
—
us
• PLL is active during Stop and Stop delay is not
enabled
(OMR Bit 6 = 1)
25× TC
138
—
ns
• PLL is not active during Stop and Stop delay is
enabled (OMR Bit 6 = 0)
9+(128KxTC)+Tlock
5.7
ms
• PLL is not active during Stop and Stop delay is
not enabled (OMR Bit 6 = 1)
(25 x TC)+Tlock
5
ms
18
Delay from interrupt trigger to interrupt code
execution.
19
Duration of level sensitive IRQA assertion to
ensure interrupt service (when exiting Stop)2, 3
• PLL is active during Stop and Stop delay is
enabled
(OMR Bit 6 = 0)
20
• Delay from IRQA, IRQB, IRQC, IRQD, NMI
assertion to general-purpose transfer output
valid caused by first interrupt instruction
execution
21
Interrupt Requests Rate
• ESAI, ESAI_1, SHI, DAX, Timer
12 x TC
• DMA
22
10 x TC + 3.0
Max
Unit
ns
59.0
ns
—
—
ns
8 x TC
—
—
ns
• IRQ, NMI (edge trigger)
8 x TC
—
—
ns
• IRQ (level trigger)
12 c TC
—
—
ns
DMA Requests Rate
• Data read from ESAI, ESAI_1, SHI, DAX
6 x TC
—
—
ns
• Data write to ESAI, ESAI_1, SHI, DAX
7 x TC
—
—
ns
• Timer
2 x TC
—
—
ns
• IRQ, NMI (edge trigger)
3 x TC
—
—
ns
Note:
1. When using fast interrupts and IRQA, IRQB, IRQC, and IRQD are defined as level-sensitive, timings 19 through 21 apply
to prevent multiple interrupt service. To avoid these timing restrictions, the deasserted Edge-triggered mode is
recommended when using fast interrupts. Long interrupts are recommended when using Level-sensitive mode.
2. For PLL disable, using external clock (PCTL Bit 13 = 0), no stabilization delay is required and recovery time will be
defined by the OMR Bit 6 settings.
For PLL enable, (if bit 12 of the PCTL register is 0), the PLL is shutdown during Stop. Recovering from Stop requires the
PLL to get locked. The PLL lock procedure duration, PLL Lock Cycles (PLC), may be in the range of 0.5 ms.
3. Periodically sampled and not 100% tested
4. RESET duration is measured during the time in which RESET is asserted, VDD is valid, and the EXTAL input is active and
valid. When the VDD is valid, but the other “required RESET duration” conditions (as specified above) have not been yet
met, the device circuitry will be in an uninitialized state that can result in significant power consumption and heat-up.
Designs should minimize this state to the shortest possible duration.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
39
Reset, Stop, Mode Select, and Interrupt Timing
VIH
RESET
11
13
10
All Pins
Reset Value
Figure 5. Reset Timing
VIH
RESET
14
15
MODA, MODB,
MODC, MODD,
PINIT
VIH
VIH
VIL
VIL
IRQA, IRQB,
IRQD, NMI
Figure 6. Recovery from Stop State Using IRQA Interrupt Service
IRQA, IRQB,
IRQC, IRQD,
NMI
16
IRQA, IRQB,
IRQC, IRQD,
NMI
17
Figure 7. External Interrupt Timing (Negative Edge-Triggered)
DSP56371 Data Sheet, Rev. 4.1
40
Freescale Semiconductor
Serial Host Interface SPI Protocol Timing
19
IRQA, IRQB,
IRQC, IRQD,
NMI
18
a) First Interrupt Instruction Execution
General
Purpose
I/O
20
IRQA, IRQB,
IRQC, IRQD,
NMI
b) General Purpose I/O
Figure 8. External Fast Interrupt Timing
12
Serial Host Interface SPI Protocol Timing
Table 20. Serial Host Interface SPI Protocol Timing
Characteristics1,3,4
No.
Mode
Expressions
Min
Max
Unit
23
Minimum serial clock cycle = tSPICC(min)
Master
10.0 x TC + 9
64.0
—
ns
24
Serial clock high period
Master
—
29.5
—
ns
Slave
2.0 x TC + 19.6
27.5
—
ns
Master
—
29.5
—
ns
Slave
2.0 x TC + 19.6
27.5
—
ns
Master
—
—
10
ns
Slave
—
—
10
ns
SS assertion to first SCK edge
CPHA = 0
Slave
2.0 x TC + 12.6
34.4
—
ns
CPHA = 1
Slave
—
10.0
—
ns
28
Last SCK edge to SS not asserted
Slave
—
12.0
—
ns
29
Data input valid to SCK edge (data input set-up time)
Master/Slave
—
0
—
ns
30
SCK last sampling edge to data input not valid
Master/Slave
3.0 x TC
22.4
—
ns
31
SS assertion to data out active
Slave
—
5
—
ns
32
SS deassertion to data high impedance2
Slave
—
—
9
ns
33
SCK edge to data out valid
(data out delay time)
Master/Slave
3.0 x TC + 26.1
50.0
100
ns
25
26
27
Serial clock low period
Serial clock rise/fall time
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
41
Serial Host Interface SPI Protocol Timing
Table 20. Serial Host Interface SPI Protocol Timing (continued)
Characteristics1,3,4
No.
Mode
Expressions
Min
Max
Unit
34
SCK edge to data out not valid
(data out hold time)
Master/Slave
2.0 x TC
12.0
—
ns
35
SS assertion to data out valid
(CPHA = 0)
Slave
—
—
15.0
ns
36
First SCK sampling edge to HREQ output deassertion
Slave
3.0 x TC + 30
50
—
ns
37
Last SCK sampling edge to HREQ output not
deasserted (CPHA = 1)
Slave
4.0 x TC
52.2
—
ns
38
SS deassertion to HREQ output not deasserted
(CPHA = 0)
Slave
3.0 x TC + 30
46.6
—
ns
39
SS deassertion pulse width (CPHA = 0)
Slave
2.0 x TC
12.7
—
ns
40
HREQ in assertion to first SCK edge
Master
0.5 x TSPICC + 3.0
x TC + 5
63.0
—
ns
41
HREQ in deassertion to last SCK sampling edge
(HREQ in set-up time) (CPHA = 1)
Master
—
0
—
ns
42
First SCK edge to HREQ in not asserted
(HREQ in hold time)
Master
—
0
—
ns
43
HREQ assertion width
Master
3.0 x TC
20.0
ns
Note:
1.
2.
3.
4.
5.
VCORE_VDD = 1.2 5 ± 0.05 V; TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL = 50 pF
Periodically sampled, not 100% tested
All times assume noise free inputs
All times assume internal clock frequency of 150 MHz
Equation applies when the result is positive TC
Figure 9. SPI Master Timing (CPHA = 0)
DSP56371 Data Sheet, Rev. 4.1
42
Freescale Semiconductor
Serial Host Interface SPI Protocol Timing
SS
(Input)
25
23
24
26
26
SCK (CPOL = 0)
(Output)
23
24
26
25
26
SCK (CPOL = 1)
(Output)
29
30
MISO
(Input)
MSB
Valid
LSB
Valid
34
33
MOSI
(Output)
30
29
MSB
LSB
40
42
HREQ
(Input)
43
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
43
Serial Host Interface SPI Protocol Timing
SS
(Input)
25
23
24
26
26
SCK (CPOL = 0)
(Output)
24
23
26
25
26
SCK (CPOL = 1)
(Output)
29
29
30
MISO
(Input)
30
MSB
Valid
LSB
Valid
33
MOSI
(Output)
34
MSB
LSB
40
41
42
HREQ
(Input)
43
Figure 10. SPI Master Timing (CPHA = 1)
DSP56371 Data Sheet, Rev. 4.1
44
Freescale Semiconductor
Serial Host Interface SPI Protocol Timing
SS
(Input)
25
23
24
26
28
26
39
SCK (CPOL = 0)
(Input)
27
23
24
26
25
26
SCK (CPOL = 1)
(Input)
35
33
34
31
MISO
(Output)
34
32
MSB
LSB
29
29
30
MOSI
(Input)
MSB
Valid
30
LSB
Valid
36
38
HREQ
(Output)
Figure 11. SPI Slave Timing (CPHA = 0)
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
45
Serial Host Interface (SHI) I2C Protocol Timing
SS
(Input)
25
23
24
28
26
26
SCK (CPOL = 0)
(Input)
27
24
26
25
26
SCK (CPOL = 1)
(Input)
33
33
34
32
31
MISO
(Output)
MSB
LSB
29
29
30
30
MSB
Valid
MOSI
(Input)
LSB
Valid
37
36
HREQ
(Output)
Figure 12. SPI Slave Timing (CPHA = 1)
Serial Host Interface (SHI) I2C Protocol Timing
13
Table 21. SHI I2C Protocol Timing
Standard I2C*
Characteristics1
No.
Symbol/
Expression
Standard
Fast-Mode
Min
Max
Min
Max
Unit
44
SCL clock frequency
FSCL
—
100
—
400
kHz
44
SCL clock cycle
TSCL
10
—
2.5
—
µs
45
Bus free time
TBUF
4.7
—
1.3
—
µs
46
Start condition set-up time
TSUSTA
4.7
—
0.6
—
µs
47
Start condition hold time
THD;STA
4.0
—
0.6
—
µs
48
SCL low period
TLOW
4.7
—
1.3
—
µs
49
SCL high period
THIGH
4.0
—
1.3
—
µs
50
SCL and SDA rise time
TR
—
5
—
5
ns
51
SCL and SDA fall time
TF
—
5
—
5
ns
DSP56371 Data Sheet, Rev. 4.1
46
Freescale Semiconductor
Serial Host Interface (SHI) I2C Protocol Timing
Table 21. SHI I2C Protocol Timing (continued)
Standard I2C*
Symbol/
Expression
Characteristics1
No.
Standard
Fast-Mode
Min
Max
Min
Max
Unit
52
Data set-up time
TSU;DAT
250
—
100
—
ns
53
Data hold time
THD;DAT
0.0
—
0.0
0.9
µs
54
DSP clock frequency
FOSC
10.6
—
28.5
—
MHz
55
SCL low to data out valid
TVD;DAT
—
3.4
—
0.9
µs
56
Stop condition setup time
TSU;STO
4.0
—
0.6
—
µs
57
HREQ in deassertion to last SCL edge (HREQ in
set-up time)
tSU;RQI
0.0
—
0.0
—
ns
58
First SCL sampling edge to HREQ output
deassertion
—
52
—
52
ns
52
—
52
—
ns
0.5 × TI2CCP
-0.5 × TC - 21
4327
—
927
—
ns
tHO;RQI
0.0
—
0.0
—
ns
TNG;RQO
4 × TC + 30
59
Last SCL edge to HREQ output not deasserted
TAS;RQO
2 × TC + 30
60
HREQ in assertion to first SCL edge
61
First SCL edge to HREQ in not asserted
(HREQ in hold time.)
TAS;RQI
Note:
1.
2.
3.
4.
5.
VCORE_VDD = 1.2 5 ± 0.05 V; TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL = 50 pF
Pull-up resistor: R P (min) = 1.5 kOhm
Capacitive load: C b (max) = 50 pF
All times assume noise free inputs
All times assume internal clock frequency of 180MHz
13.1 Programming the Serial Clock
The programmed serial clock cycle, T I CCP, is specified by the value of the HDM[7:0] and HRS bits of the
HCKR (SHI clock control register).
2
The expression for T I CCP is
2
T I2CCP = [TC × 2 × (HDM[7:0] + 1) × (7 × (1 – HRS) + 1)]
Eqn. 1
where
— HRS is the pre-scaler rate select bit. When HRS is cleared, the fixed
divide-by-eight pre-scaler is operational. When HRS is set, the pre-scaler is bypassed.
— HDM[7:0] are the divider modulus select bits. A divide ratio from 1 to 256 (HDM[7:0] = $00
to $FF) may be selected.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
47
Enhanced Serial Audio Interface Timing
In I2C mode, the user may select a value for the programmed serial clock cycle from
6 × TC (if HDM[7:0] = $02 and HRS = 1)
Eqn. 2
4096 × TC (if HDM[7:0] = $FF and HRS = 0)
Eqn. 3
to
The programmed serial clock cycle (TI CCP ), SCL rise time (TR), should be chosen in order to achieve the
desired SCL serial clock cycle (TSCL), as shown in Table 22.
2
44
46
49
48
SCL
50
53
51
45
52
SDA
MSB
Stop Start
47
LSB
58
61
ACK
55
Stop
56
57
60
59
HREQ
Figure 13. I2C Timing
14
Enhanced Serial Audio Interface Timing
Table 22. Enhanced Serial Audio Interface Timing
No.
Characteristics1, 2, 3
62 Clock cycle5
63 Clock high period
• For internal clock
Symbol
Expression
Min
Max
Condition4
Unit
tSSICC
4 × Tc
22.3
—
x ck
ns
4 × Tc
22.3
—
i ck
2 × Tc
12.0
—
2 × Tc
12.0
—
2 × Tc
12.0
—
2 × Tc
12.0
—
tSSICCH
• For external clock
64 Clock low period
• For internal clock
tSSICCL
• For external clock
ns
ns
65 SCKR edge to FSR out (bl) high
—
—
—
—
37.0
22.0
x ck
i ck a
ns
66 SCKR edge to FSR out (bl) low
—
—
—
—
37.0
22.0
x ck
i ck a
ns
DSP56371 Data Sheet, Rev. 4.1
48
Freescale Semiconductor
Enhanced Serial Audio Interface Timing
Table 22. Enhanced Serial Audio Interface Timing (continued)
Symbol
Expression
Min
Max
Condition4
Unit
67 SCKR edge to FSR out (wr) high6
—
—
—
—
39.0
24.0
x ck
i ck a
ns
68 SCKR edge to FSR out (wr) low6
—
—
—
—
39.0
24.0
x ck
i ck a
ns
69 SCKR edge to FSR out (wl) high
—
—
—
—
36.0
21.0
x ck
i ck a
ns
70 SCKR edge to FSR out (wl) low
—
—
—
—
37.0
22.0
x ck
i ck a
ns
71 Data in setup time before SCKR (SCK in
synchronous mode) edge
—
—
12.0
19.0
—
—
x ck
i ck
ns
72 Data in hold time after SCKR edge
—
—
5.0
3.0
—
—
x ck
i ck
ns
73 FSR input (bl, wr) high before SCKR edge 6
—
—
2.0
23.0
—
—
x ck
i ck a
ns
74 FSR input (wl) high before SCKR edge
—
—
2.0
23.0
—
—
x ck
i ck a
ns
75 FSR input hold time after SCKR edge
—
—
3.0
0.0
—
—
x ck
i ck a
ns
76 Flags input setup before SCKR edge
—
—
0.0
19.0
—
—
x ck
i ck s
ns
77 Flags input hold time after SCKR edge
—
—
6.0
0.0
—
—
x ck
i ck s
ns
78 SCKT edge to FST out (bl) high
—
—
—
—
29.0
15.0
x ck
i ck
ns
79 SCKT edge to FST out (bl) low
—
—
—
—
31.0
17.0
x ck
i ck
ns
80 SCKT edge to FST out (wr) high6
—
—
—
—
31.0
17.0
x ck
i ck
ns
81 SCKT edge to FST out (wr) low6
—
—
—
—
33.0
19.0
x ck
i ck
ns
82 SCKT edge to FST out (wl) high
—
—
—
—
30.0
16.0
x ck
i ck
ns
83 SCKT edge to FST out (wl) low
—
—
—
—
31.0
17.0
x ck
i ck
ns
84 SCKT edge to data out enable from high
impedance
—
—
—
—
31.0
17.0
x ck
i ck
ns
85 SCKT edge to transmitter #0 drive enable
assertion
—
—
—
—
34.0
20.0
x ck
i ck
ns
86 SCKT edge to data out valid
—
—
—
—
26.5
21.0
x ck
i ck
ns
87 SCKT edge to data out high impedance7
—
—
—
—
31.0
16.0
x ck
i ck
ns
No.
Characteristics1, 2, 3
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
49
Enhanced Serial Audio Interface Timing
Table 22. Enhanced Serial Audio Interface Timing (continued)
Symbol
Expression
Min
Max
Condition4
Unit
88 SCKT edge to transmitter #0 drive enable
deassertion7
—
—
—
—
34.0
20.0
x ck
i ck
ns
89 FST input (bl, wr) setup time before SCKT
edge6
—
—
2.0
21.0
—
—
x ck
i ck
ns
90 FST input (wl) setup time before SCKT edge
—
—
2.0
21.0
—
—
x ck
i ck
ns
91 FST input hold time after SCKT edge
—
—
4.0
0.0
—
—
x ck
i ck
ns
92 FST input (wl) to data out enable from high
impedance
—
—
—
27.0
—
ns
93 FST input (wl) to transmitter #0 drive enable
assertion
—
—
—
31.0
—
ns
94 Flag output valid after SCKT edge
—
—
—
—
32.0
18.0
x ck
i ck
ns
95 HCKR/HCKT clock cycle
—
2 x TC
13.4
—
ns
96 HCKT input edge to SCKT output
—
—
—
18.0
ns
97 HCKR input edge to SCKR output
—
—
—
18.0
ns
No.
Characteristics1, 2, 3
Note:
1. VCORE_VDD = 1.25 ± 0.05 V; TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL = 50 pF
2. SCKT(SCKT pin) = transmit clock
SCKR(SCKR pin) = receive clock
FST(FST pin) = transmit frame sync
FSR(FSR pin) = receive frame sync
HCKT(HCKT pin) = transmit high frequency clock
HCKR(HCKR pin) = receive high frequency clock
3. bl = bit length
wl = word length
wr = word length relative
4. i ck = internal clock
x ck = external clock
i ck a = internal clock, asynchronous mode
(asynchronous implies that SCKT and SCKR are two different clocks)
i ck s = internal clock, synchronous mode
(synchronous implies that SCKT and SCKR are the same clock)
5. For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.
6. The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync signal
waveform, but spreads from one serial clock before first bit clock (same as bit length frame sync signal), until the one before last bit
clock of the first word in frame.
7. Periodically sampled and not 100% tested
8. ESAI_1 specs match those of ESAI_0
DSP56371 Data Sheet, Rev. 4.1
50
Freescale Semiconductor
Enhanced Serial Audio Interface Timing
62
SCKT
(Input/Output)
63
64
78
79
FST (Bit) Out
83
84
FST (Word) Out
87
87
85
88
Data Out
First Bit
Last Bit
92
Transmitter #0
Drive Enable
90
86
89
94
FST (Bit) In
91
94
93
FST (Word) In
95
See Note
Flags Out
Note:
In network mode, output flag transitions can occur at the start of each time slot within the frame. In
normal mode, the output flag state is asserted for the entire frame period. Figure 14 is drawn
assuming positive polarity bit clock (TCKP=0) and positive frame sync polarity (TFSP=0).
Figure 14. ESAI Transmitter Timing
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
51
Enhanced Serial Audio Interface Timing
62
63
64
SCKR
(Input/Output)
65
66
FSR (Bit)
Out
69
70
FSR (Word)
Out
72
71
Data In
First Bit
Last Bit
75
73
FSR (Bit)
In
74
FSR (Word)
In
76
75
77
Flags In
Note:
Figure 15 is drawn assuming positive polarity bit clock (RCKP=0) and positive
frame sync polarity (RFSP=0).
Figure 15. ESAI Receiver Timing
HCKT
SCKT (output)
96
97
Note: Figure 16 is drawn assuming positive polarity high frequency clock (THCKP=0) and positive bit clock polarity
(TCKP=0).
Figure 16. ESAI HCKT Timing
DSP56371 Data Sheet, Rev. 4.1
52
Freescale Semiconductor
Digital Audio Transmitter Timing
HCKR
96
SCKR (output)
98
Note: Figure 17 is drawn assuming positive polarity high frequency clock (RHCKP=0) and positive bit clock polarity
(RCKP=0).
Figure 17. ESAI HCKR Timing
15
Digital Audio Transmitter Timing
Table 23. Digital Audio Transmitter Timing
181 MHz
No.
Characteristic
Expression
Unit
Min
Max
1 / (2 x TC)
—
90
MHz
2 × TC
11.1
—
ns
99
ACI frequency (see note)
100
ACI period
101
ACI high duration
0.5 × TC
2.8
—
ns
102
ACI low duration
0.5 × TC
2.8
—
ns
103
ACI rising edge to ADO valid
1.5 × TC
—
8.3
ns
Note:
1. In order to assure proper operation of the DAX, the ACI frequency should be less than 1/2 of theDSP56371
internal clock frequency. For example, if the DSP56371 is running at 181 MHz internally, the ACI frequency
should be less than 90MHz.
ACI
100
101
102
103
ADO
Figure 18. Digital Audio Transmitter Timing
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
53
Timer Timing
16
Timer Timing
Table 24. Timer Timing
181 MHz
No.
Characteristics
Expression
Unit
Min
Max
104
TIO Low
2 × TC + 2.0
13
—
ns
105
TIO High
2 × TC + 2.0
13
—
ns
Note:
1. VCORE_VDD = 1.25 V
± 0.05 V; TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL = 50 pF
TIO
104
105
Figure 19. TIO Timer Event Input Restrictions
17
GPIO Timing
Table 25. GPIO Timing
Characteristics1
No.
Expression
Min
Max
Unit
106
FOSC edge to GPIO out valid (GPIO out delay time)
—
7
ns
107
FOSC edge to GPIO out not valid (GPIO out hold time)
—
7
ns
108
FOSC In valid to EXTAL edge (GPIO in set-up time)
2
—
ns
109
FOSC edge to GPIO in not valid (GPIO in hold time)
0
—
ns
110
Minimum GPIO pulse high width (except Port F)
TC + 13
19
—
ns
111
Minimum GPIO pulse low width (except Port F)
TC + 13
19
ns
112
Minimum GPIO pulse low width (Port F)
6 x TC
33.3
ns
113
Minimum GPIO pulse high width (Port F)
6 x TC
33.3
ns
114
GPIO out rise time
—
—
13
ns
115
GPIO out fall time
—
—
13
ns
Note:
1. VCORE_VDD = 1.25 V ± 0.05 V; TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL = 50 pF
2. PLL Disabled, EXTAL driven by a square wave
Figure 20. GPIO Timing
DSP56371 Data Sheet, Rev. 4.1
54
Freescale Semiconductor
JTAG Timing
18
JTAG Timing
Table 26. JTAG Timing
All frequencies
No.
Characteristics
Unit
Min
Max
116
TCK frequency of operation (1/(TC × 6); maximum 22 MHz)
0.0
22.0
MHz
117
TCK cycle time
45.0
—
ns
118
TCK clock pulse width
20.0
—
ns
119
TCK rise and fall times
0.0
10.0
ns
120
TCK low to output data valid
0.0
40.0
ns
121
TCK low to output high impedance
0.0
40.0
ns
122
TMS, TDI data setup time
5.0
—
ns
123
TMS, TDI data hold time
25.0
—
ns
124
TCK low to TDO data valid
0.0
44.0
ns
125
TCK low to TDO high impedance
0.0
44.0
ns
Note:
VCORE_VDD = 1.25 V ± 0.05 V; TJ = –40°C to 115°C for 150 MHz; TJ = 0°C to 100°C for 181 MHz; CL = 50 pF
All timings apply to OnCE module data transfers because it uses the JTAG port as an interface.
117
TCK
(Input)
VIH
118
118
VM
VM
VIL
119
119
Figure 21. Test Clock Input Timing Diagram
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
55
JTAG Timing
TCK
(Input)
VIH
VIL
122
Data
Inputs
123
Input Data Valid
120
Data
Outputs
Output Data Valid
121
Data
Outputs
120
Data
Outputs
Output Data Valid
Figure 22. Debugger Port Timing Diagram
TCK
(Input)
VIH
VIL
122
TDI
TMS
(Input)
123
Input Data Valid
124
TDO
(Output)
Output Data Valid
125
TDO
(Output)
124
TDO
(Output)
Output Data Valid
Figure 23. Test Access Port Timing Diagram
DSP56371 Data Sheet, Rev. 4.1
56
Freescale Semiconductor
Package Information
19
Package Information
IO_VDD
SCKR_PE0
SCKT_PE3
FSR_PE1
62
61
IO_GND
65
63
HCKT_PE5
66
DAX
64
HCKR_PE2
67
CORE_VDD
71
CORE_GND
HCKR_PC2
72
ADO_PD1
HCKT_PC5
73
68
IO_GND
74
ACI_PD0
IO_VDD
69
SCKR_PC0
75
ESAI
70
SCKT_PC3
FSR_PC1
78
76
FST_PC4
79
77
SDO5_SDI0_PC6
80
.
ESAI_1
SDO4_SDI1_PC7
1
60
FST_PE4
IO_GND
2
59
SDO5_SDI0_PE6
IO_VDD
3
58
SDO4_SDI1_PE7
SDO3_SDI2_PC8
4
57
SDO3_SDI2_PE8
SDO2_SDI3_PC9
5
56
SDO2_SDI3_PE9
SDO1_PC10
6
55
SDO1_PE10
SDO0_PC11
7
54
SDO0_PE11
CORE_VDD
8
53
CORE_GND
PF8
9
52
CORE_VDD
PF6
10
51
MODA_IRQA
PF7
11
50
MODB_IRQB
CORE_GND
12
49
MODC_IRQC
PF2
13
48
MODD_IRQD
PF3
14
47
RESET_B
PF4
15
46
PINIT_NMI
PF5
16
45
EXTAL
IO_VDD
17
44
PLLD_VDD
PF1
18
43
PLLD_GND
PF0
19
42
PLLP_GND
GND
20
41
PLLP_VDD
Int/Mod
GPIO
PLL
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
TIO1_PB1
CORE_GND
CORE_VDD
TDO
TDI
TCK
TMS
MOSI_HA0
MISO_SDA
SCK_SCL
SS_HA2
HREQ
PLLA_VDD
PLLA_GND
24
IO_GND
TIO0_PB0
23
PF10
SHI
25
22
SCAN
OnCE
IO_VDD
21
PF9
Timer
Figure 24. DSP56371 Pinout
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
57
Package Information
Table 27. Signal Identification by Pin Number
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
1
SDO4_SDI1_PC7
21
PF9
41
PLLP_VDD
61
FSR_PE1
2
IO_GND
22
SCAN
42
PLLP_GND
62
SCKT_PE3
3
IO_VDD
23
PF10
43
PLLD_GND
63
SCKR_PE0
4
SDO3_SDI2_PC8
24
IO_GND
44
PLLD_VDD
64
IO_VDD
5
SDO2_SDI3_PC9
25
IO_VDD
45
EXTAL
65
IO_GND
6
SDO1_PC10
26
TI0_PB0
46
PINIT_NMI
66
HCKT_PE5
7
SDO0_PC11
27
TI0_PB1
47
RESET_B
67
HCKR_PE2
8
CORE_VDD
28
CORE_GND
48
MODD_IRQD
68
CORE_GND
9
PF8
29
CORE_VDD
49
MODC_IRQC
69
ADO_PD1
10
PF6
30
TDO
50
MODB_IRQB
70
ADI_PD0
11
PF7
31
TDI
51
MODA_IRQA
71
CORE_VDD
12
CORE_GND
32
TCK
52
CORE_VDD
72
HCKR_PC2
13
PF2
33
TMS
53
CORE_GND
73
HCKT2_PC5
14
PF3
34
MOSI_HA0
54
SDO0_PE11
74
IO_GND
15
PF4
35
MISO_SDA
55
SDO1_PE10
75
IO_VDD
16
PF5
36
SCK_SCL
56
SDO2_SDI3_PE9
76
SCKR_PC0
17
IO_VDD
37
SS_HA2
57
SDO3_SDI2_PE8
77
SCKT_PC3
18
PF1
38
HREQ
58
SDO4_SDI1_PE7
78
FSR_PC1
19
PF0
39
PLLA_VDD
59
SDO5_SD10_PE6
79
FST_PC4
20
GND
40
PLLA_GND
60
FST_PE4
80
SDO5_SDI10_PC6
DSP56371 Data Sheet, Rev. 4.1
58
Freescale Semiconductor
Package Information
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
59
Package Information
DSP56371 Data Sheet, Rev. 4.1
60
Freescale Semiconductor
Package Information
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
61
Package Information
DSP56371 Data Sheet, Rev. 4.1
62
Freescale Semiconductor
Design Considerations
20
Design Considerations
20.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
T J = T A + ( P D × R θJA )
Where:
Eqn. 4
TA=ambient temperature °C
RqJA=package junction-to-ambient thermal resistance °C/W
PD=power dissipation in package W
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance.
R θJA = R θJC + R θCA
Where:
Eqn. 5
RθJA=package junction-to-ambient thermal resistance °C/W
RθJC=package junction-to-case thermal resistance °C/W
RθCA=package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether
the thermal performance is adequate, a system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the junction-to-case thermal
resistance in plastic packages.
• To minimize temperature variation across the surface, the thermal resistance is measured from the
junction to the outside surface of the package (case) closest to the chip mounting area when that
surface has a proper heat sink.
• To define a value approximately equal to a junction-to-board thermal resistance, the thermal
resistance is measured from the junction to where the leads are attached to the case.
• If the temperature of the package case (TT) is determined by a thermocouple, the thermal
resistance is computed using the value obtained by the equation
(TJ – TT)/PD.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
63
Electrical Design Considerations
As noted above, the junction-to-case thermal resistances quoted in this data sheet are determined using the
first definition. From a practical standpoint, that value is also suitable for determining the junction
temperature from a case thermocouple reading in forced convection environments. In natural convection,
using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple
reading on the case of the package will estimate a junction temperature slightly hotter than actual
temperature. Hence, the new thermal metric, thermal characterization parameter or ΨJT, has been defined
to be (TJ – TT)/PD. This value gives a better estimate of the junction temperature in natural convection
when using the surface temperature of the package. Remember that surface temperature readings of
packages are subject to significant errors caused by inadequate attachment of the sensor to the surface and
to errors caused by heat loss to the sensor. The recommended technique is to attach a 40-gauge
thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
21
Electrical Design Considerations
CAUTION
This device contains circuitry protecting against damage due to high static voltage or
electrical fields. However, normal precautions should be taken to avoid exceeding
maximum voltage ratings. Reliability of operation is enhanced if unused inputs are tied to
an appropriate logic voltage level (for example, either GND or VCC). The suggested value
for a pull-up or pull-down resistor is 10 k ohm.
Use the following list of recommendations to assure correct DSP operation:
• Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from
the board ground to each GND pin.
• Use at least six 0.01–0.1 µF bypass capacitors positioned as close as possible to the four sides of
the package to connect the VCC power source to GND.
• Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and
GND pins are less than 1.2 cm (0.5 inch) per capacitor lead.
• Route the DVDD pin carefully to minimize noise.
• Use at least a four-layer PCB with two inner layers for VCC and GND.
• Because the DSP output signals have fast rise and fall times, PCB trace lengths should be
minimal. This recommendation particularly applies to the IRQA, IRQB, IRQC, and IRQD pins.
Maximum PCB trace lengths on the order of 15 cm (6 inches) are recommended.
• Consider all device loads as well as parasitic capacitance due to PCB traces when calculating
capacitance. This is especially critical in systems with higher capacitive loads that could create
higher transient currents in the VCC and GND circuits.
• Take special care to minimize noise levels on the VCCP and GNDP pins.
• If multiple DSP56371 devices are on the same board, check for cross-talk or excessive spikes on
the supplies due to synchronous operation of the devices.
• RESET must be asserted when the chip is powered up. A stable EXTAL signal must be supplied
before deassertion of RESET.
DSP56371 Data Sheet, Rev. 4.1
64
Freescale Semiconductor
Electrical Design Considerations
•
At power-up, ensure that the voltage difference between the 3.3 V tolerant pins and the chip VCC
never exceeds a 3.00 V.
21.1 Power Consumption Considerations
Power dissipation is a key issue in portable DSP applications. Some of the factors which affect current
consumption are described in this section. Most of the current consumed by CMOS devices is alternating
current (ac), which is charging and discharging the capacitances of the pins and internal nodes.
Current consumption is described by the following formula:
I = C×V×f
where
Eqn. 6
C=node/pin capacitance
V=voltage swing
f=frequency of node/pin toggle
Power Consumption Example
For a GPIO address pin loaded with 50 pF capacitance, operating at 3.3 V, and with a 150 MHz clock, toggling at
its maximum possible rate (75 MHz), the current consumption is
I = 50 x 10 – 12 x 3.3 x 75 x 10 6 = 12.375mA
Eqn. 7
The maximum internal current (ICCImax) value reflects the typical possible switching of the internal buses
on best-case operation conditions, which is not necessarily a real application case. The typical internal
current (ICCItyp) value reflects the average switching of the internal buses on typical operating conditions.
For applications that require very low current consumption, do the following:
• Minimize the number of pins that are switching.
• Minimize the capacitive load on the pins.
One way to evaluate power consumption is to use a current per MIPS measurement methodology to
minimize specific board effects (for example, to compensate for measured board current not caused by the
DSP). Use the test algorithm, specific test current measurements, and the following equation to derive the
current per MIPS value.
I/MIPS = I/MHz = (ItypF2 - ItypF1)/(F2 - F1)
where :
Eqn. 8
ItypF2=current at F2
ItypF1=current at F1
F2=high frequency (any specified operating frequency)
F1=low frequency (any specified operating frequency lower than F2)
NOTE
F1 should be significantly less than F2. For example, F2 could be 66 MHz and F1 could be
33 MHz. The degree of difference between F1 and F2 determines the amount of precision
with which the current rating can be determined for an application.
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
65
Power Consumption Benchmark
22
Power Consumption Benchmark
The following benchmark program permits evaluation of DSP power usage in a test situation.
;***********************************;********************************
;* ;* CHECKS Typical Power Consumption
;********************************************************************
ORG P:$000800
move #$000000,r1
move #$000000,r0
do #1024,ldmem
move r1,p:(r0)
move r1,y:(r0)+
ldmem nop
move #0,b1
;jmp $FF2AE0
;org
move
move
move
move
move
P:$FF2AE0
b1,y:>$100
#$FF,B
#>$AF080,X0
#>$FF2AD6,r0
#$0,r1
dor #6,loop1
move p:(r0)+,x1
move x0,p:(r1)+
move x1,p:(r1)+
nop
loop1
move #$0,vba
move #$0,sp
move #$0,sc
reset
move #$FFFFFF,m0
move m0,m1
move m0,m2
move m0,m3
move m0,m4
move m0,m5
move m0,m6
move m0,m7
move #>$102,ep
move #>$18,sz
move #>$110000,omr
DSP56371 Data Sheet, Rev. 4.1
66
Freescale Semiconductor
Power Consumption Benchmark
move #$300,sr
movep #>$F02000,X:$FFFFFF
movep #$187,X:$FFFFFE
;then sets up BCR and AAR registers
;then sets up PORTB and HDI08 PORT
andi #$FC,mr
;start running ROM intialisation stage
;jsr $FF1C7E
; Set green HLX zone table
jsr $FF1D64
; Run GPIONil function
jsr $FF2F82
; Initialise Green HLX
jsr $FF1FA1
; Disable DAX
move #>$15F,x1
move x1,P:$FF0D7F
; Run Green HLX
jmp $FF1FDB
nop
nop
nop
nop
nop
nop
dor forever,endprog
nop
nop
endprog nop
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
67
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
[email protected]
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
[email protected]
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
[email protected]
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
[email protected]
DSP56371
Rev. 4.1, 1/2007
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2004, 2005, 2006, 2007. All rights reserved.