Freescale Semiconductor
Technical Data
MPX2300DT1
Rev. 6, 10/2004
High Volume Pressure Sensor
For Disposable Applications
Freescale Semiconductor has developed a low cost, high volume, miniature pressure
sensor package which is ideal as a sub--module component or a disposable unit. The
unique concept of the Chip Pak allows great flexibility in system design while allowing an
economic solution for the designer. This new chip carrier package uses Freescale
Semiconductor’s unique sensor die with its piezoresistive technology, along with the
added feature of on--chip, thin--film temperature compensation and calibration.
NOTE: Freescale Semiconductor is also offering the Chip Pak package in
application--specific configurations, which will have an “SPX” prefix, followed by a
four--digit number, unique to the specific customer.
MPX2300DT1
MPX2301DT1
Freescale Semiconductor Preferred Device
PRESSURE SENSORS
0 to 300 mmHg (0 to 40 kPa)
Features
• Low Cost
CHIP PAK PACKAGE
• Integrated Temperature Compensation and Calibration
• Ratiometric to Supply Voltage
• Polysulfone Case Material (Medical, Class V Approved)
• Provided in Easy--to--Use Tape and Reel
Application Examples
MPX2300/1DT1
CASE 423A
• Medical Diagnostics
• Infusion Pumps
• Blood Pressure Monitors
PIN NUMBER
• Pressure Catheter Applications
• Patient Monitoring
1
VS
3
S--
2
S+
4
Gnd
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak
(pressure is applied to the backside of the device). Front side die and wire protection
must be provided in the customer’s housing. Use caution when handling the devices
during all processes.
Freescale
Semiconductor ’s
MPX2300DT1/
MPX2301DT1 Pressure Sensors have been designed for
medical usage by combining the performance of Freescale
Semiconductor’s shear stress pressure sensor design and
the use of biomedically approved materials. Materials with a
proven history in medical situations have been chosen to
provide a sensor that can be used with confidence in
applications, such as invasive blood pressure monitoring. It
can be sterilized using ethylene oxide. The portions of the
pressure sensor that are required to be biomedically
approved are the rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
A silicone dielectric gel covers the silicon piezoresistive
sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class
V requirements. The properties of the gel allow it to transmit
pressure uniformly to the diaphragm surface, while isolating
the internal electrical connections from the corrosive effects
of fluids, such as saline solution. The gel provides electrical
isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of
Medical Instrumentation (AAMI) Standard for blood pressure
transducers. A biomedically approved opaque filler in the gel
prevents bright operating room lights from affecting the performance of the sensor. The MPX2301DT1 is a reduced gel
option.
Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value.
© Freescale Semiconductor, Inc., 2004. All rights reserved.
Sensor Device Data
Freescale Semiconductor
1
MAXIMUM RATINGS(NOTE)
Rating
Symbol
Value
Unit
Maximum Pressure (Backside)
Pmax
125
PSI
Storage Temperature
Tstg
--25 to +85
°C
Operating Temperature
TA
+15 to +40
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 6 Vdc, TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
POP
0
—
300
mmHg
VS
—
6.0
10
Vdc
Io
—
1.0
—
mAdc
Zero Pressure Offset
Voff
--0.75
—
0.75
mV
Sensitivity
—
4.95
5.0
5.05
µV/V/mmHg
VFSS
2.976
3.006
3.036
mV
Linearity + Hysteresis(2)
—
-- 1.5
—
1.5
%VFSS
Accuracy(9)
VS = 6 V, P = 101 to 200 mmHg
—
-- 1.5
—
1.5
%
Accuracy(9)
VS = 6 V, P = 201 to 300 mmHg
—
-- 3.0
—
3.0
%
Characteristics
Pressure Range
Supply
Voltage(7)
Supply Current
Full Scale Span(1)
Temperature Effect on Sensitivity
TCS
--0.1
—
+0.1
%/°C
TCVFSS
--0.1
—
+0.1
%/°C
TCVoff
--9.0
—
+9.0
µV/°C
Input Impedance
Zin
1800
—
4500
Ω
Output Impedance
Temperature Effect on Full Scale Span(3)
Temperature Effect on Offset(4)
Zout
270
—
330
Ω
kΩ)(8)
RCAL
97
100
103
mmHg
Time(5)
Response
(10% to 90%)
tR
—
1.0
—
ms
Temperature Error Band
—
0
—
85
°C
Stability(6)
—
—
±0.5
—
%VFSS
RCAL (150
NOTES:
1. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference
between full scale output and zero pressure offset.
2. Maximum deviation from end--point straight line fit at 0 and 200 mmHg.
3. Slope of end--point straight line fit to full scale span at 15°C and +40°C relative to +25°C.
4. Slope of end--point straight line fit to zero pressure offset at 15°C and +40°C relative to +25°C.
5. For a 0 to 300 mmHg pressure step change.
6. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10°C to +85°C after:
a. 1000 temperature cycles, --40°C to +125°C.
b. 1.5 million pressure cycles, 0 to 300 mmHg.
7. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may
induce additional error due to device self--heating.
8. Offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to VS and S+ output.
9. Accuracy is calculated using the following equation:
Errorp = {[Vp -- Offset)/(SensNom*VEX)]--P}/P
Where:
Vp = Actual output voltage at pressure P in microvolts (µV)
Offset = Voltage output at P = 0mmHg in microvolts (µV)
SensNom = Nominal sensitivity = 5.01 µV/V/mmHg
VEX = Excitation voltage
P = Pressure applied to the device
MPX2300DT1 MPX2301DT1
2
Sensor Device Data
Freescale Semiconductor
ORDERING INFORMATION
The MPX2300DT1/MPX2301DT1 silicon pressure sensors are available in tape and reel packaging.
Device Type/Order No.
Case No.
Device Description
Marking
MPX2300DT1
423A
Chip Pak, Full Gel
Date Code, Lot ID
MPX2301DT1
423A
Chip Pak, 1/3 Gel
Date Code, Lot ID
Packaging Information
Tape and Reel
Reel Size
Tape Width
Quantity
330 mm
24 mm
1000 pc/reel
PACKAGE DIMENSIONS
A
M
C
L
F
N
1
2 3
4
B
V
K
DETAIL A
--T--
D1
G
J
H
FRONT VIEW
E
END VIEW
AC
NOTES:
10. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
11. CONTROLLING DIMENSION: INCH.
F
AA
AB
AD
D2
DETAIL A
BACK VIEW
CASE 423A--03
ISSUE C
DIM
A
B
C
D1
D2
E
F
G
H
J
K
L
M
N
V
AA
AB
AC
AD
INCHES
MIN
MAX
0.240
0.260
0.350
0.370
0.140
0.150
0.012
0.020
0.014
0.022
0.088
0.102
0.123
0.128
0.045
0.055
0.037
0.047
0.007
0.011
0.120
0.140
0.095
0.105
0.165
0.175
0.223
0.239
0.105
0.115
0.095
0.107
0.015
0.035
0.120
0.175
0.100
0.115
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
6.10
6.60
8.89
9.40
3.56
3.81
0.30
0.51
0.36
0.56
2.24
2.59
3.12
3.25
1.14
1.40
0.94
1.19
0.18
0.28
3.05
3.56
2.41
2.67
4.19
4.45
5.66
6.07
2.67
2.92
2.41
2.72
0.38
0.89
3.05
4.45
2.54
2.92
VCC
+OUT
--OUT
GROUND
MPX2300DT1 MPX2301DT1
Sensor Device Data
Freescale Semiconductor
3
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© Freescale Semiconductor, Inc. 2004. All rights reserved.
MPX2300DT1
Rev. 6
10/2004
MPX2300DT1 MPX2301DT1
4
Sensor Device Data
Freescale Semiconductor