Freescale Semiconductor Technical Data MPX4101A Rev 6, 12/2006 Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX4101A MPXA4101A MPXH6101A SERIES The Freescale MPX4101A/MPXA4101A/MPXH6101A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the Freescale MAP sensor a logical and economical choice for automotive system designers. The MPX4101A/MPXA4101A/MPXH6101A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. INTEGRATED PRESSURE SENSOR 15 TO 102 kPA (2.18 TO 14.8 psi) 0.25 TO 4.95 V OUTPUT UNIBODY PACKAGE Features • 1.72% Maximum Error Over 0° to 85°C • Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems • Temperature Compensated Over –40°C to +125°C • Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Typical Applications • Manifold Sensing for Automotive Systems • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Also Ideal for Non-Automotive Applications MPX4101A CASE 867-O8 SMALL OUTLINE PACKAGE UNIBODY PACKAGE PIN NUMBERS(1) 1 VOUT 4 N/C 2 3 GND VS 5 6 N/C N/C MPXA4101AC6U CASE 482A-01 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. SMALL OUTLINE PACKAGE PIN NUMBERS(1) SUPER SMALL OUTLINE PACKAGE SUPER SMALL OUTLINE PACKAGE PIN NUMBERS(1) 1 2 N/C VS 5 6 N/C N/C 1 2 N/C VS 5 6 N/C N/C 3 4 GND VOUT 7 8 N/C N/C 3 4 GND VOUT 7 8 N/C N/C MPXH6101A6U/6T1 CASE 1317-04 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. ORDERING INFORMATION Device Type Options Case No. UNIBODY PACKAGE (MPX4101A SERIES) Basic Element Absolute, Element Only 867 SMALL OUTLINE PACKAGE (MPXA4101A SERIES) Ported Element Absolute, Axial Port 482A SUPER SMALL OUTLINE PACKAGE (MPXA6101A SERIES) Basic Element Absolute, Element Only 1317 Absolute, Element Only 1317 © Freescale Semiconductor, Inc., 2006. All rights reserved. MPX Series Order No. Packing Options MPX4101A — Device Marking MPX4101A MPXA4101AC6U Rails MPXA4101A MPXH6101A6U MPXH6101A6T1 Rails Tape and Reel MPXH6101A MPXH6101A VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Pins 4, 5, and 6 are NO CONNECTS for unibody devices. Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 400 kPa Storage Temperature TSTG Operating Temperature TA °C -40 to +125 -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX4101A 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range Symbol Min Typ Max Unit POP 15 — 102 kPa VS 4.85 5.1 5.35 Vdc Io — 7.0 10 mAdc (0 to 85°C) Voff 0.171 0.252 0.333 Vdc (0 to 85°C) VFSO 4.870 4.951 5.032 Vdc (0 to 85°C) VFSS — 4.7 — Vdc (0 to 85°C) — — — ±1.72 %VFSS (1) (2) Supply Voltage Supply Current Minimum Pressure Offset @ VS = 5.1 Volts Full Scale Output @ VS = 5.1 Volts Full Scale Span @ VS = 5.1 Volts (3) (4) (5) Accuracy(6) Sensitivity V/P — 54 —- mV/kPa Response Time(7) tR — 15 —- ms Output Source Current at Full Scale Output Io+ — 0.1 —- mAdc Warm-Up Time(8) — — 20 —- ms Offset Stability(9) — — ±0.5 —- %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX4101A Sensors Freescale Semiconductor 3 ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Figure 2 illustrates an absolute sensing chip in the super small outline package (Case 1317). Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C. The output will saturate outside of the specified pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4101A/ MPXA4101A/MPXH6101A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Die Fluoro Silicone Gel Die Coat Stainless Steel Cap P1 Thermoplastic Case Wire Bond Lead Frame Absolute Element Die Bond Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) 5.0 +5.1 V 4.5 4.0 MPXH6101A to ADC Vout Pin 4 100 nF GND Pin 3 47 pF 51 K Output (Volts) 3.5 VS Pin 2 3.0 2.5 Transfer Function: Vout = Vs* (PX0.01059*P-0.10941) ± Error VS = 5.1 Vdc Temperature = 0 to 85°C 20 kPa to 105 kPa MPX4101A TYP 2.0 1.5 1.0 MAX MIN 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 0 Pressure (ref: to sealed vacuum) in kPa Figure 3. Recommended Power Supply Decoupling and Output Filtering Figure 4. Output versus Absolute Pressure MPX4101A 4 Sensors Freescale Semiconductor Transfer Function (MPX4101A, MPXA4101A, MPXH6101A) Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.10941) ± (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4101A, MPXA4101A MPXH6101A SERIES 4.0 Temp 3.0 Temperature Error Factor Multiplier -40 0 to 85 +125 2.0 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 0 15 30 45 60 75 90 105 120 Pressure (in kPa) –1.0 –2.0 –3.0 Pressure Error (Max) 15 to 102 (kPa) ±1.5 (kPa) PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number MPX4101A Case Type 867 Pressure (P1) Side Identifier Stainless Steel Cap MPXA4101AC6U 482A Side with Port Attached MPXH6101A6U 1317 Stainless Steel Cap MPXH6101A6T1 1317 Stainless Steel Cap MPX4101A Sensors Freescale Semiconductor 5 INFORMATION FOR USING THE SMALL OUTLINE PACKAGES MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 inch mm 0.100 TYP 8X 2.54 SCALE 2:1 Figure 5. SOP Footprint (Case 482) 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case 1317) MPX4101A 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 4 0.25 (0.010) 5 N T B M S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -T- INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE PIN 1 IDENTIFIER M K DIM A B C D G H J K M N S V W CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.027 0.033 0.68 0.84 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 0.430 0.450 10.92 11.43 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N UNIBODY PACKAGE MPX4101A Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPX4101A 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPX4101A Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPX4101A 10 Sensors Freescale Semiconductor NOTES MPX4101A Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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