HM51W16400 Series HM51W17400 Series 4,194,304-word × 4-bit Dynamic RAM ADE-203-649C (Z) Rev. 3.0 Feb. 27, 1997 Description The Hitachi HM51W16400 Series, HM51W17400 Series are CMOS dynamic RAMs organized 4,194,304word × 4-bit. They employ the most advanced 0.5 µm CMOS technology for high performance and low power. The HM51W16400 Series, HM51W17400 Series offer Fast Page Mode as a high speed access mode. They have package variations of standard 300-mil 26-pin plastic SOJ and standard 300-mil 26-pin plastic TSOP. Features • • • • • Single 3.3 V (±0.3 V) Access time: 50 ns/60 ns/70 ns (max) Power dissipation Active mode : 324 mW/288mW/252 mW (max) (HM51W16400 Series) : 360 mW/324 mW/288 mW (max) (HM51W17400 Series) Standby mode : 7.2 mW (max) : 0.36 mW (max) (L-version) Fast page mode capability Long refresh period 4096 refresh cycles : 64 ms (HM51W16400 Series) : 128 ms (L-version) 2048 refresh cycles : 32 ms (HM51W17400 Series) : 128 ms (L-version) HM51W16400 Series, HM51W17400 Series • • • 4 variations of refresh RAS-only refresh CAS-before-RAS refresh Hidden refresh Self refresh (L-version) Battery backup operation (L-version) Test function 16-bit parallel test mode Ordering Information Type No. Access time Package HM51W16400S-5 HM51W16400S-6 HM51W16400S-7 50 ns 60 ns 70 ns 300-mil 26-pin plastic SOJ (CP-26/24DB) HM51W16400LS-5 HM51W16400LS-6 HM51W16400LS-7 50 ns 60 ns 70 ns HM51W17400S-5 HM51W17400S-6 HM51W17400S-7 50 ns 60 ns 70 ns HM51W17400LS-5 HM51W17400LS-6 HM51W17400LS-7 50 ns 60 ns 70 ns HM51W16400TS-5 HM51W16400TS-6 HM51W16400TS-7 50 ns 60 ns 70 ns HM51W16400LTS-5 HM51W16400LTS-6 HM51W16400LTS-7 50 ns 60 ns 70 ns HM51W17400TS-5 HM51W17400TS-6 HM51W17400TS-7 50 ns 60 ns 70 ns HM51W17400LTS-5 HM51W17400LTS-6 HM51W17400LTS-7 50 ns 60 ns 70 ns 2 300-mil 26-pin plastic TSOP II (TTP-26/24DA) HM51W16400 Series, HM51W17400 Series Pin Arrangement HM51W16400S/LS Series HM51W16400TS/LTS Series VCC 1 26 VSS VCC 1 26 VSS I/O1 2 25 I/O4 I/O1 2 25 I/O4 I/O2 3 24 I/O3 I/O2 3 24 I/O3 WE 4 23 CAS WE 4 23 CAS RAS 5 22 OE RAS 5 22 OE A11 6 21 A9 A11 6 21 A9 A10 8 19 A8 A10 8 19 A8 A0 9 18 A7 A0 9 18 A7 A1 10 17 A6 A1 10 17 A6 A2 11 16 A5 A2 11 16 A5 A3 12 15 A4 A3 12 15 A4 VCC 13 14 VSS VCC 13 14 VSS (Top view) (Top view) Pin Description Pin name Function A0 to A11 Address input — Row/Refresh address — Column address I/O1 to I/O4 Data input/Data output RAS Row address strobe CAS Column address strobe WE Read/Write enable OE Output enable VCC Power supply VSS Ground A0 to A11 A0 to A9 3 HM51W16400 Series, HM51W17400 Series Pin Arrangement HM51W17400S/LS Series HM51W17400TS/LTS Series VCC 1 26 VSS VCC 1 26 VSS I/O1 2 25 I/O4 I/O1 2 25 I/O4 I/O2 3 24 I/O3 I/O2 3 24 I/O3 WE 4 23 CAS WE 4 23 CAS RAS 5 22 OE RAS 5 22 OE NC 6 21 A9 NC 6 21 A9 A10 8 19 A8 A10 8 19 A8 A0 9 18 A7 A0 9 18 A7 A1 10 17 A6 A1 10 17 A6 A2 11 16 A5 A2 11 16 A5 A3 12 15 A4 A3 12 15 A4 VCC 13 14 VSS VCC 13 14 VSS (Top view) (Top view) Pin Description Pin name Function A0 to A10 Address input — Row/Refresh address — Column address I/O1 to I/O4 Data input/Data output RAS Row address strobe CAS Column address strobe WE Read/Write enable OE Output enable VCC Power supply VSS Ground NC No connection 4 A0 to A10 A0 to A10 HM51W16400 Series, HM51W17400 Series Block Diagram (HM51W16400 Series) RAS CAS WE OE Timing and control A0 Column decoder A1 to Column • • • 4M array address buffers A9 • • • Row address Row decoder 4M array I/O buffers 4M array I/O1 to I/O4 buffers A10 4M array A11 5 HM51W16400 Series, HM51W17400 Series Block Diagram (HM51W17400 Series) RAS CAS WE OE Timing and control A0 Column decoder A1 to Column • • • 4M array address buffers A10 • • • Row address Row decoder 4M array I/O buffers 4M array buffers 4M array 6 I/O1 to I/O4 HM51W16400 Series, HM51W17400 Series Absolute Maximum Ratings Parameter Symbol Value Unit Voltage on any pin relative to VSS VT –0.5 to VCC + 0.5 (≤ +4.6 V (max)) V Supply voltage relative to VSS VCC –0.5 to +4.6 V Short circuit output current Iout 50 mA Power dissipation PT 1.0 W Operating temperature Topr 0 to +70 °C Storage temperature Tstg –55 to +125 °C Recommended DC Operating Conditions (Ta = 0 to +70˚C) Parameter Symbol Min Typ Max Unit Notes Supply voltage VCC 3.0 3.3 3.6 V 1, 2 Input high voltage VIH 2.0 — VCC + 0.3 V 1 Input low voltage VIL –0.3 — 0.8 V 1 Note: 1. All voltage referred to VSS . 7 HM51W16400 Series, HM51W17400 Series DC Characteristics (Ta = 0 to +70˚C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM51W16400 Series) HM51W16400 -5 Parameter -6 -7 Symbol Min Max Min Max Min Max Unit Test conditions Operating current* , * ICC1 — 90 — 80 — 70 mA tRC = min Standby current ICC2 — 2 — 2 — 2 mA TTL interface RAS, CAS = VIH Dout = High-Z — 1 — 1 — 1 mA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z ICC2 — 100 — 100 — 100 µA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z ICC3 — 90 — 80 — 70 mA tRC = min ICC5 — 5 — 5 — 5 mA RAS = VIH CAS = VIL Dout = enable CAS-before-RAS refresh current ICC6 — 90 — 80 — 70 mA tRC = min Fast page mode current*1, *3 ICC7 — 80 — 70 — 60 mA tPC = min Battery backup current (Standby with CBR refresh) (L-version) ICC10 — 300 — 300 — 300 µA CMOS interface Dout = High-Z, CBR refresh: tRC = 31.3 µs tRAS ≤ 0.3 µs Self refresh mode current (L-version) ICC11 — 200 — 200 — 200 µA CMOS interface RAS, CAS ≤ 0.2 V Dout = High-Z Input leakage current ILI –10 10 –10 10 –10 10 µA 0 V ≤ Vin ≤ 4.6 V Output leakage current ILO –10 10 –10 10 –10 10 µA 0 V ≤ Vin ≤ 4.6 V Dout = disable Output high voltage VOH 2.4 VCC 2.4 VCC 2.4 VCC V High Iout = –2 mA Output low voltage VOL 0 0.4 0.4 0.4 V Low Iout = 2 mA 1 2 Standby current (L-version) RAS-only refresh current*2 Standby current* 1 0 0 Notes : 1. ICC depends on output load condition when the device is selected. ICC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Address can be changed once or less while CAS = VIH. 8 HM51W16400 Series, HM51W17400 Series DC Characteristics (Ta = 0 to +70˚C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM51W17400 Series) HM51W17400 -5 Parameter -6 -7 Symbol Min Max Min Max Min Max Unit Test conditions Operating current* , *2 ICC1 — 100 — 90 — 80 mA tRC = min Standby current ICC2 — 2 — 2 — 2 mA TTL interface RAS, CAS = VIH Dout = High-Z — 1 — 1 — 1 mA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z ICC2 — 100 — 100 — 100 µA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z ICC3 — 100 — 90 — 80 mA tRC = min ICC5 — 5 5 — 5 mA RAS = VIH CAS = VIL Dout = enable CAS-before-RAS refresh current ICC6 — 100 — 90 — 80 mA tRC = min Fast page mode current*1, *3 ICC7 — 90 80 — 70 mA tPC = min Battery backup current (Standby with CBR refresh) (L-version) ICC10 — 300 — 300 — 300 µA CMOS interface Dout = High-Z, CBR refresh: tRC = 62.5 µs tRAS ≤ 0.3 µs Self refresh mode current (L-version) ICC11 — 200 — 200 — 200 µA CMOS interface RAS, CAS ≤ 0.2 V Dout = High-Z Input leakage current ILI –10 10 –10 10 –10 10 µA 0 V ≤ Vin ≤ 4.6 V Output leakage current ILO –10 10 –10 10 –10 10 µA 0 V ≤ Vin ≤ 4.6 V Dout = disable Output high voltage VOH 2.4 VCC 2.4 VCC 2.4 VCC V High Iout = –2 mA Output low voltage VOL 0 0.4 0.4 0.4 V Low Iout = 2 mA 1 Standby current (L-version) RAS-only refresh current*2 Standby current* 1 — — 0 0 Notes : 1. ICC depends on output load condition when the device is selected. ICC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Address can be changed once or less while CAS = VIH. 9 HM51W16400 Series, HM51W17400 Series Capacitance (Ta = 25˚C, VCC = 3.3 V ± 0.3 V) Parameter Symbol Typ Max Unit Notes Input capacitance (Address) CI1 — 5 pF 1 Input capacitance (Clocks) CI2 — 7 pF 1 Output capacitance (Data-in, Data-out) CI/O — 7 pF 1, 2 Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. CAS = VIH to disable Dout. 10 HM51W16400 Series, HM51W17400 Series AC Characteristics (Ta = 0 to +70˚C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) *1, *2, *18, *19 Test Conditions • • • • Input rise and fall time: 5 ns Input timing reference levels: 0.8 V, 2.0 V Output timing reference levels: 0.8 V, 2.0 V Output load: 1 TTL gate + C L (100 pF) (Including scope and jig) Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters) HM51W16400/HM51W17400 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Notes Random read or write cycle time tRC 90 — 110 — 130 — ns RAS precharge time tRP 30 — 40 — 50 — ns CAS precharge time tCP 8 — 10 — 10 — ns RAS pulse width tRAS 50 10000 60 10000 70 10000 ns CAS pulse width tCAS 13 10000 15 10000 18 10000 ns Row address setup time tASR 0 — 0 — 0 — ns Row address hold time tRAH 8 — 10 — 10 — ns Column address setup time tASC 0 — 0 — 0 — ns Column address hold time tCAH 8 — 10 — 15 — ns RAS to CAS delay time tRCD 18 37 20 45 20 52 ns 3 RAS to column address delay time tRAD 13 25 15 30 15 35 ns 4 RAS hold time tRSH 13 — 15 — 18 — ns CAS hold time tCSH 50 — 60 — 70 — ns CAS to RAS precharge time tCRP 5 — 5 — 5 — ns OE to Din delay time tOED 13 — 15 — 18 — ns 5 OE delay time from Din tDZO 0 — 0 — 0 — ns 6 CAS delay time from Din tDZC 0 — 0 — 0 — ns 6 Transition time (rise and fall) tT 3 50 3 50 3 50 ns 7 11 HM51W16400 Series, HM51W17400 Series Read Cycle HM51W16400/HM51W17400 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Notes Access time from RAS tRAC — 50 — 60 — 70 ns 8, 9, 20 Access time from CAS tCAC — 13 — 15 — 18 ns 9, 10, 17, 20 Access time from address tAA — 25 — 30 — 35 ns 9, 11, 17, 20 Access time from OE tOEA — 13 — 15 — 18 ns 9, 20 Read command setup time tRCS 0 — 0 — 0 — ns Read command hold time to CAS tRCH 0 — 0 — 0 — ns 12 Read command hold time to RAS tRRH 0 — 0 — 0 — ns 12 Column address to RAS lead time tRAL 25 — 30 — 35 — ns Column address to CAS lead time tCAL 25 — 30 — 35 — ns CAS to output in low-Z tCLZ 0 — 0 — 0 — ns Output data hold time tOH 3 — 3 — 3 — ns Output data hold time from OE tOHO 3 — 3 — 3 — ns Output buffer turn-off time tOFF — 13 — 15 — 15 ns 13 Output buffer turn-off to OE tOEZ — 13 — 15 — 15 ns 13 CAS to Din delay time tCDD 13 — 15 — 18 — ns 5 Write Cycle HM51W16400/HM51W17400 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Notes Write command setup time tWCS 0 — 0 — 0 — ns 14 Write command hold time tWCH 8 — 10 — 15 — ns Write command pulse width tWP 8 — 10 — 10 — ns Write command to RAS lead time tRWL 13 — 15 — 18 — ns Write command to CAS lead time tCWL 13 — 15 — 18 — ns Data-in setup time tDS 0 — 0 — 0 — ns 15 Data-in hold time tDH 8 — 10 — 15 — ns 15 12 HM51W16400 Series, HM51W17400 Series Read-Modify-Write Cycle HM51W16400/HM51W17400 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Notes Read-modify-write cycle time tRWC 131 — 155 — 181 — ns RAS to WE delay time tRWD 73 — 85 — 98 — ns 14 CAS to WE delay time tCWD 36 — 40 — 46 — ns 14 Column address to WE delay time tAWD 48 — 55 — 63 — ns 14 OE hold time from WE tOEH 13 — 15 — 18 — ns Refresh Cycle HM51W16400/HM51W17400 -5 Parameter Symbol -6 -7 Min Max Min Max Min Max Unit CAS setup time (CBR refresh cycle) tCSR 5 — 5 — 5 — ns CAS hold time (CBR refresh cycle) tCHR 8 — 10 — 10 — ns WE setup time (CBR refresh cycle) tWRP 0 — 0 — 0 — ns WE hold time (CBR refresh cycle) tWRH 8 — 10 — 10 — ns RAS precharge to CAS hold time tRPC 5 — 5 — 5 — ns Notes Fast Page Mode Cycle HM51W16400/HM51W17400 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Fast page mode cycle time tPC 35 — 40 45 ns Fast page mode RAS pulse width tRASP — 100000 — 100000 — 100000 ns 16 Access time from CAS precharge tCPA — 30 — 35 — 40 ns 9, 17, 20 30 — 35 — 40 — ns RAS hold time from CAS precharge tCPRH — — Notes 13 HM51W16400 Series, HM51W17400 Series Fast Page Mode Read-Modify-Write Cycle HM51W16400/HM51W17400 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Fast page mode read-modify-write cycle time tPRWC 76 — 85 — 96 — ns 53 — 60 — 68 — ns 14 Notes WE delay time from CAS precharge tCPW Notes Test Mode Cycle *19 HM51W16400/HM51W17400 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Test mode WE setup time tWTS 0 — 0 — 0 — ns Test mode WE hold time tWTH 8 — 10 — 10 — ns Refresh (HM51W16400 Series) Parameter Symbol Max Unit Notes Refresh tREF 64 ms 4096 cycles Refresh (L-version) tREF 128 ms 4096 cycles Parameter Symbol Max Unit Notes Refresh period tREF 32 ms 2048 cycles Refresh period (L-version) tREF 128 ms 2048 cycles Refresh (HM51W17400 Series) 14 HM51W16400 Series, HM51W17400 Series Self Refresh Mode (L-version) HM51W16400L/HM51W17400L -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Notes RAS pulse width (self refresh) tRASS 100 — 100 — 100 — µs 21, 22, 23, 24 RAS precharge time (self refresh) tRPS 90 — 110 — 130 — ns CAS hold time (self refresh) tCHS –50 — –50 — –50 — ns Notes: 1. AC measurements assume tT = 5 ns. 2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). If the internal refresh counter is used, a minimum of eight CAS-before-RAS refresh cycles are required. 3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a reference point only; if tRCD is greater than the specified tRCD (max) limit, then access time is controlled exclusively by tCAC . 4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a reference point only; if tRAD is greater than the specified tRAD (max) limit, then access time is controlled exclusively by tAA . 5. Either tOED or tCDD must be satisfied. 6. Either tDZO or tDZC must be satisfied. 7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition times are measured between VIH (min) and VIL (max). 8. Assumes that tRCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC exceeds the value shown. 9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. (V OH = 2.0 V, VOL = 0.8 V) 10. Assumes that tRCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA (max). 11. Assumes that tRAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA (max). 12. Either tRCH or tRRH must be satisfied for a read cycles. 13. tOFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. 14. tWCS , tRWD, tCWD, tAWD and tCPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only; if tWCS ≥ tWCS (min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD ≥ tRWD (min), tCWD ≥ tCWD (min), and tAWD ≥ tAWD (min), or tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥ tCPW (min), the cycle is a read-modify-write and the data output will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate. 15. These parameters are referred to CAS leading edge in early write cycles and to WE leading edge in delayed write or read-modify-write cycles. 16. tRASP defines RAS pulse width in Fast page mode cycles. 17. Access time is determined by the longest among tAA , tCAC and tCPA. 18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data to the device. 15 HM51W16400 Series, HM51W17400 Series 19. The 16M DRAM offers a 16-bit time saving parallel test mode. Address CA0 and CA1 for the 4M × 4 are don’t care during test mode. Test mode is set by performing a WE-and-CAS-before-RAS (WCBR) cycle. In 16-bit parallel test mode, data is written into 4 bits in parallel at each I/O (I/O1 to I/O4) and read out from each I/O. If 4 bits of each I/O are equal (all 1s or 0s), data output pin is a high state during test mode read cycle, then the device has passed. If they are not equal, data output pin is a low state, then the device has failed. Refresh during test mode operation can be performed by normal read cycles or by WCBR refresh cycles. To get out of test mode and enter a normal operation mode, perform either a regular CAS-beforeRAS refresh cycle or RAS-only refresh cycle. 20. In a test mode read cycle, the value of tRAC , tAA, tCAC and tCPA is delayed by 2 ns to 5 ns for the specified value. These parameters should be specified in test mode cycles by adding the above value to the specified value in this data sheet. 21. Please do not use tRASS timing, 10 µs ≤ tRASS ≤ 100 µs. During this period, the device is in transition state from normal operation mode to self refresh mode. If tRASS > 100 µs, then RAS precharge time should use tRPS instead of tRP. 22. If you use distributed CBR refresh mode with 15.6 µs interval in normal read/write cycle, CBR refresh should be executed with in 15.6 µs immediately after exiting from and before entering into self refresh mode. 23. If you use RAS only refresh or CBR burst refresh mode in normal read/write cycle, 4096 or 2048 cycles (4096 cycles: HM51W16400 Series, 2048 cycles: HM51W 17400 Series) of distributed CBR refresh with 15.6 µs interval should be executed with in 64 or 32 ms (64 ms: HM51W16400 Series, 32 ms: HM51W17400 Series) immediately after exiting from and before entering into the self refresh mode. 24. Repetitive self refresh mode without refreshing all memory is not allowed. Once you exit from self fresh mode, all memory cells need to be refreshed before re-entering the self refresh mode again. 25. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max)) ///////: Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL. 16 HM51W16400 Series, HM51W17400 Series Timing Waveforms*25 Read Cycle t RC t RAS t RP RAS t CSH t CRP t RCD t RSH t CAS tT CAS t RAD t ASR Address t RAH t RAL t ASC t CAL t CAH Column Row t RRH t RCH t RCS WE t DZC t CDD High-Z Din t DZO t OEA t OED OE t OEZ t CAC t OHO t AA t OFF t RAC t CLZ Dout t OH Dout 17 HM51W16400 Series, HM51W17400 Series Early Write Cycle t RC t RAS t RP RAS t CSH t RCD t CRP t RSH t CAS tT CAS t ASR Address t RAH Row t ASC t CAH Column t WCS t WCH WE t DS Din Dout t DH Din High-Z* * t WCS 18 t WCS (min) HM51W16400 Series, HM51W17400 Series Delayed Write Cycle *18 t RC t RAS t RP RAS t CSH t CRP t RCD t RSH t CAS tT CAS t ASR Address t RAH t ASC Row t CAH Column t CWL t RWL t WP t RCS WE t DZC Din t DS High-Z t DH Din t DZO t OEH t OED OE t OEZ t CLZ High-Z Dout Invalid Dout 19 HM51W16400 Series, HM51W17400 Series Read-Modify-Write Cycle*18 t RWC t RAS t RP RAS tT t RCD t CAS t CRP CAS t RAD t ASR Address t RAH t ASC Row t CAH Column t RCS t CWD t CWL t AWD t RWL t RWD t WP WE t DZC t DH t DS High-Z Din Din t OED t DZO t OEH t OEA OE t CAC t OEZ t AA t RAC t OHO Dout Dout t CLZ 20 High-Z HM51W16400 Series, HM51W17400 Series RAS-Only Refresh Cycle t RC t RAS t RP RAS tT t RPC t CRP # t CRP CAS t ASR Address t RAH Row t OFF Dout High-Z 21 HM51W16400 Series, HM51W17400 Series CAS-Before-RAS Refresh Cycle t RC t RP t RAS t RP RAS t CSR t CHR t RPC t CRP , t RPC tT CAS t CP t WRP t WRH t CP WE Address t OFF Dout 22 High-Z HM51W16400 Series, HM51W17400 Series Hidden Refresh Cycle t RC t RAS t RP t RC t RAS t RC t RP t RAS t RP RAS tT t RSH t CHR t CRP t RCD CAS t RAD t ASR t RAH Address t RAL t ASC Row t CAH Column t WRP t RRH t WRH t WRP t WRH t RCS WE t DZC t CDD High-Z Din t DZO t OED t OEA OE t CAC t AA t RAC t OFF t OH t CLZ Dout t OEZ t OHO Dout 23 HM51W16400 Series, HM51W17400 Series Fast Page Mode Read Cycle t RASP t CPRH t RP RAS tT t CSH t RCD t PC t CAS t CP t RSH t CAS t CP t CRP t CAS CAS t RAL t RAD Address t ASR t RAH t CAL t ASC t CAH t CAL t ASC t CAH t CAL t ASC t CAH Row Column 1 Column 2 Column N t RCS t RCS t RCH t RCS t RRH t RCH t RCH WE t DZC t DZC t CDD High-Z High-Z t CDD High-Z , Din t DZC t CDD t DZO t OED t DZO t OED t DZO t OED OE t RAC t AA t OH t OEA 24 t OHO t OH t OEA t OFF t CAC t OEZ t CLZ t CAC t CLZ Dout t CPA t AA Dout 1 t CPA t AA t OHO t OFF t OEZ Dout 2 t OH t OHO t OEA t CAC t CLZ t OFF t OEZ Dout N HM51W16400 Series, HM51W17400 Series Fast Page Mode Early Write Cycle t RP t RASP RAS tT t CSH t RCD t CAS t PC t CP t CAS t CP t RSH t CAS t CRP CAS Address t ASR t RAH t ASC t CAH t ASC t CAH t ASC t CAH ROW Column 1 Column 2 Column N t WCS t WCH t WCS t WCH t WCS t WCH WE t DS Din Dout t DH Din 1 t DS t DH Din 2 t DS t DH Din N High-Z* * t WCS t WCS (min) 25 HM51W16400 Series, HM51W17400 Series Fast Page Mode Delayed Write Cycle *18 t RASP t RP RAS tT t CP t CSH t RCD t CRP t CP t PC t CAS t RSH t CAS t CAS CAS t RAD t ASR t ASC t RAH Address t ASC t CAH Row t ASC t CAH Column 1 t CAH Column 2 t CWL Column N t CWL t CWL t RWL t RCS t RCS t RCS WE t WP t WP t WP t DZC t DS t DZC t DS t DZC t DS t DH t DH Din 1 Din t DZO t DH Din 2 t DZO t OED Din N t DZO t OED #* t OED t OEH t OEH t OEH OE t CLZ t CLZ t OEZ t CLZ t OEZ t OEZ High-Z Dout Invalid Dout 26 Invalid Dout Invalid Dout HM51W16400 Series, HM51W17400 Series Fast Page Mode Read-Modify-Write Cycle*18 t RASP t RP RAS tT t PRWC t CP t RCD t RSH t CP t CAS t CAS t CRP t CAS CAS t RAD t ASR Address t ASC t RAH Row t ASC t CAH t CAH Column 1 t ASC t CAH Column 2 t RWD t CWL Column N t CPW t AWD t CWL t CPW t AWD t CWD t RCS t CWL t AWD t CWD t RCS t RWL t CWD WE t RCS t WP t WP t DZC t DS t WP t DZC t DS t DZC t DS t DH t DH Din 1 Din t DZO t OED t DH Din 2 t OED t DZO t OED t DZO t OEH t OEH #* t OEH Din N OE t OHO t OEA t CAC t OHO t OEA t CAC t AA t AA t CPA t RAC t OEZ t CLZ t OHO t OEA t CAC t AA t CPA t OEZ t CLZ t OEZ t CLZ High-Z Dout Dout 1 Dout 2 Dout N 27 HM51W16400 Series, HM51W17400 Series Test Mode Cycle *19 Set Cycle** *,** Reset Cycle Test Mode Cycle Normal Mode RAS CAS WE * CBR or RAS-only refresh ** Address, Din, OE: H or L Test Mode Set Cycle t RC t RP t RAS t RP RAS t CSR t CHR tT , CAS t RPC t CP WE t WTS t WTH t CP Address t OFF Dout 28 t CRP A Á ÃC ,ÂÀB@ t RPC High-Z HM51W16400 Series, HM51W17400 Series Self Refresh Cycle (L-version)*21,*22,*23,*24 t RASS t RP t RPS RAS tT , , t RPC t CP t CRP t CSR t CHS CAS t WRP t WRH $%&+, WE t OFF Dout High-Z 29 HM51W16400 Series, HM51W17400 Series Package Dimensions HM51W16400S/LS Series HM51W17400S/LS Series (CP-26/24DB) 1.30 Max 0.43 ± 0.10 0.41 ± 0.08 1.27 2.54 2.65 ± 0.12 13 0.80 +0.25 –0.17 6 8 0.74 3.50 ± 0.26 1 8.51 ± 0.13 14 7.62 ± 0.13 26 16.90 17.27 Max 21 19 Unit: mm 6.71 ± 0.25 0.10 Hitachi Code JEDEC Code EIAJ Code Weight 30 CP-26/24DB MO-077-AA SC-632-A 0.8 g HM51W16400 Series, HM51W17400 Series HM51W16400TS/LTS Series HM51W17400TS/LTS Series (TTP-26/24DA) 14 7.62 26 17.14 17.54 Max 21 19 Unit: mm 6 8 1.27 0.42 ± 0.08 0.40 ± 0.06 0.21 M 13 0.80 9.22 ± 0.20 1.15 Max 0.13 ± 0.05 0.10 0.145 ± 0.05 0.125 ± 0.04 1.20 Max 0 – 5° 2.54 Hitachi Code JEDEC Code EIAJ Code Weight 0.50 ± 0.10 0.68 1 TTP-26/24DA MO-132AB — 0.30 g 31 HM51W16400 Series, HM51W17400 Series When using this document, keep the following in mind: 1. This document may, wholly or partially, be subject to change without notice. 2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without Hitachi’s permission. 3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other reasons during operation of the user’s unit according to this document. 4. Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual property claims or other problems that may result from applications based on the examples described herein. 5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd. 6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL APPLICATIONS. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 For further information write to: Hitachi America, Ltd. Semiconductor & IC Div. 2000 Sierra Point Parkway Brisbane, CA. 94005-1835 USA Tel: 415-589-8300 Fax: 415-583-4207 32 Hitachi Europe GmbH Electronic Components Group Continental Europe Dornacher Straße 3 D-85622 Feldkirchen München Tel: 089-9 91 80-0 Fax: 089-9 29 30 00 Hitachi Europe Ltd. Electronic Components Div. Northern Europe Headquarters Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA United Kingdom Tel: 0628-585000 Fax: 0628-778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 0104 Tel: 535-2100 Fax: 535-1533 Hitachi Asia (Hong Kong) Ltd. Unit 706, North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel: 27359218 Fax: 27306071 HM51W16400 Series, HM51W17400 Series Revision Record Rev. Date Contents of Modification Drawn by Approved by 1.0 Oct. 14, 1996 Initial issue Y. Kasama M. Mishima 2.0 Nov. 14, 1996 Addition of HM51W16400-5 Series Y. Kasama Y. Matsuno Addition of HM51W17400-5 Series Power dissipation (active) 396/360 mW(max) to 360/324/288 mW (max) (HM51W17400 Series) DC Characteristics (HM51W17400 Series) ICC1 max: 110/100 mA to 100/90/80 mA ICC3 max: 110/100 mA to 100/90/80 mA ICC6 max: 110/100 mA to 100/90/80 mA 3.0 Feb. 27, 1997 AC Characteristics tRRH min: 5/5/5 ns to 0/0/0 ns 33