ETC HM5117800J-6

HM5117800 Series
16 M FP DRAM (2-Mword × 8-bit)
2 k Refresh
ADE-203-632E (Z)
Rev. 5.0
Nov. 1997
Description
The Hitachi HM5117800 is a CMOS dynamic RAM organized 2,097,152-word × 8-bit. It employs the
most advanced CMOS technology for high performance and low power. The HM5117800 offers Fast Page
Mode as a high speed access mode. Multiplexed address input permits the HM5117800 to be packaged in
standard 28-pin plastic SOJ and 28-pin TSOP.
Features
•
•
•
•
•
•
•
•
Single 5 V (±10%)
High speed
Access time: 60 ns/70 ns (max)
Power dissipation
 Active mode: 550mW/495 mW (max)
 Standby mode : 11 mW (max)
: 0.83 mW (max) (L-version)
Fast page mode capability
Long refresh period
 2048 refresh cycles : 32 ms
: 128 ms (L-version)
4 variations of refresh
 RAS-only refresh
 CAS-before-RAS refresh
 Hidden refresh
 Self refresh (L-version)
Battery backup operation (L-version)
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HM5117800 Series
Ordering Information
Type No.
Access time
Package
HM5117800J-6
HM5117800J-7
60 ns
70 ns
400-mil 28-pin plastic SOJ (CP-28DA)
HM5117800LJ -6
HM5117800LJ -7
60 ns
70 ns
HM5117800S-6
HM5117800S-7
60 ns
70 ns
HM5117800LS-6
HM5117800LS-7
60 ns
70 ns
HM5117800TT-6
HM5117800TT-7
60 ns
70 ns
HM5117800LTT-6
HM5117800LTT-7
60 ns
70 ns
HM5117800TS-6
HM5117800TS-7
60 ns
70 ns
HM5117800LTS-6
HM5117800LTS-7
60 ns
70 ns
2
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300-mil 28-pin plastic SOJ (CP-28DNA)
400-mil 28-pin plastic TSOP II (TTP-28DA)
300-mil 28-pin plastic TSOP II (TTP-28DB)
HM5117800 Series
Pin Arrangement
HM5117800TT/LTT Series
HM5117800TS/LTS Series
HM5117800J/LJ Series
HM5117800S/LS Series
1
28
VSS
I/O0
2
27
I/O7
I/O6
I/O1
3
26
I/O6
25
I/O5
I/O2
4
25
I/O5
5
24
I/O4
I/O3
5
24
I/O4
WE
6
23
CAS
WE
6
23
CAS
RAS
7
22
OE
RAS
7
22
OE
NC
8
21
A9
NC
8
21
A9
A10
9
20
A8
A10
9
20
A8
A0
10
19
A7
A0
10
19
A7
A1
11
18
A6
A1
11
18
A6
A2
12
17
A5
A2
12
17
A5
A3
13
16
A4
A3
13
16
A4
14
15
VSS
14
15
VSS
VCC
1
28
VSS
I/O0
2
27
I/O7
I/O1
3
26
I/O2
4
I/O3
VCC
VCC
VCC
(Top view)
(Top view)
Pin Description
Pin name
Function
A0 to A10
Address input
•
Row/Refresh address A0 to A10
•
Column address
I/O0 to I/O7
Data input/data output
RAS
Row address strobe
CAS
Column address strobe
WE
Read/Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
NC
No connection
A0 to A9
3
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HM5117800 Series
Block Diagram
RAS
CAS
WE
OE
Timing and control
Column decoder
A0
Column
A1
to
•
•
•
2M array
address
2M array
buffers
A9
•
•
•
Row
address
buffers
A10
4
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Row decoder
2M array
2M array
2M array
2M array
2M array
2M array
I/O buffers
I/O0
to
I/O7
HM5117800 Series
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V SS
VT
–1.0 to +7.0
V
Supply voltage relative to VSS
VCC
–1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
Recommended DC Operating Conditions (Ta = 0 to +70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Note
Supply voltage
VCC
4.5
5.0
5.5
V
1
Input high voltage
VIH
2.4
—
6.5
V
1
Input low voltage
VIL
–1.0
—
0.8
V
1
Note:
1. All voltage referred to VSS .
5
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HM5117800 Series
DC Characteristics (Ta = 0 to +70°C, VCC = 5 V ±10%, VSS = 0 V)
HM5117800
-6
Parameter
-7
Symbol
Min
Max
Min
Max
Unit
Test conditions
Operating current* , * 2
I CC1
—
100
—
90
mA
t RC = min
Standby current
I CC2
—
2
—
2
mA
TTL interface
RAS, CAS = VIH
Dout = High-Z
—
1
—
1
mA
CMOS interface
RAS, CAS ≥ VCC – 0.2V
Dout = High-Z
I CC2
—
150
—
150
µA
CMOS interface
RAS, CAS ≥ VCC – 0.2V
Dout = High-Z
I CC3
—
100
—
90
mA
t RC = min
Standby current*
I CC5
—
5
—
5
mA
RAS = VIH
CAS = VIL
Dout = enable
CAS-before-RAS refresh
current
I CC6
—
100
—
90
mA
t RC = min
Fast page mode current*1, * 3
I CC7
—
90
—
85
mA
t PC = min
Battery backup current
(Standby with CBR refresh)
(L-version)
I CC10
—
500
—
500
µA
CMOS interface
Dout = High-Z
CBR refresh: tRC = 62.5 µs
t RAS ≤ 0.3 µs
Self refresh mode current
(L-version)
I CC11
—
300
—
300
µA
CMOS interface
RAS, CAS ≤ 0.2V
Dout = High-Z
Input leakage current
I LI
–10
10
–10
10
µA
0 V ≤ Vin ≤ 7 V
Output leakage current
I LO
–10
10
–10
10
µA
0 V ≤ Vout ≤ 7 V
Dout = disable
Output high voltage
VOH
2.4
VCC
2.4
VCC
V
High Iout = –5 mA
Output low voltage
VOL
0
0.4
0
0.4
V
Low Iout = 4.2 mA
1
Standby current
(L-version)
RAS-only refresh current*2
1
Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less while CAS = VIH.
4. CAS = L (≤ 0.2 V) while RAS = L (≤ 0.2 V).
6
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HM5117800 Series
Capacitance (Ta = 25°C, VCC = 5 V ± 10%)
Parameter
Symbol
Typ
Max
Unit
Notes
Input capacitance (Address)
CI1
—
5
pF
1
Input capacitance (Clocks)
CI2
—
7
pF
1
Output capacitance (Data-in, Data-out)
CI/O
—
7
pF
1, 2
Notes: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. CAS = VIH to disable Dout.
AC Characteristics (Ta = 0 to +70°C, VCC = 5 V ± 10%, VSS = 0 V)*1, *2, *18
Test Conditions
• Input rise and fall time: 5 ns
• Input timing reference levels: 0.8 V, 2.4 V
• Output load: 2 TTL gate + C L (100 pF) (Including scope and jig)
7
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HM5117800 Series
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
HM5117800
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Random read or write cycle time
t RC
110
—
130
—
ns
RAS precharge time
t RP
40
—
50
—
ns
CAS precharge time
t CP
10
—
10
—
ns
RAS pulse width
t RAS
60
10000
70
10000
ns
CAS pulse width
t CAS
15
10000
18
10000
ns
Row address setup time
t ASR
0
—
0
—
ns
Row address hold time
t RAH
10
—
10
—
ns
Column address setup time
t ASC
0
—
0
—
ns
Column address hold time
t CAH
10
—
15
—
ns
RAS to CAS delay time
t RCD
20
45
20
52
ns
3
RAS to column address delay time
t RAD
15
30
15
35
ns
4
RAS hold time
t RSH
15
—
18
—
ns
CAS hold time
t CSH
60
—
70
—
ns
CAS to RAS precharge time
t CRP
5
—
5
—
ns
OE to Din delay time
t OED
15
—
18
—
ns
5
OE delay time from Din
t DZO
0
—
0
—
ns
6
CAS delay time from Din
t DZC
0
—
0
—
ns
6
Transition time (rise and fall)
tT
3
50
3
50
ns
7
8
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Notes
HM5117800 Series
Read Cycle
HM5117800
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Access time from RAS
t RAC
—
60
—
70
ns
8, 9
Access time from CAS
t CAC
—
15
—
18
ns
9, 10, 17
Access time from address
t AA
—
30
—
35
ns
9, 11, 17
Access time from OE
t OEA
—
15
—
18
ns
9
Read command setup time
t RCS
0
—
0
—
ns
Read command hold time to CAS
t RCH
0
—
0
—
ns
12
Read command hold time to RAS
t RRH
0
—
0
—
ns
12
Column address to RAS lead time
t RAL
30
—
35
—
ns
Column address to CAS lead time
t CAL
30
—
35
—
ns
CAS to output in low-Z
t CLZ
0
—
0
—
ns
Output data hold time
t OH
3
—
3
—
ns
Output data hold time from OE
t OHO
3
—
3
—
ns
Output buffer turn-off time
t OFF
—
15
—
15
ns
13
Output buffer turn-off to OE
t OEZ
—
15
—
15
ns
13
CAS to Din delay time
t CDD
15
—
18
—
ns
5
Write Cycle
HM5117800
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Write command setup time
t WCS
0
—
0
—
ns
14
Write command hold time
t WCH
10
—
15
—
ns
Write command pulse width
t WP
10
—
10
—
ns
Write command to RAS lead time
t RWL
15
—
18
—
ns
Write command to CAS lead time
t CWL
15
—
18
—
ns
Data-in setup time
t DS
0
—
0
—
ns
15
Data-in hold time
t DH
10
—
15
—
ns
15
9
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HM5117800 Series
Read-Modify-Write Cycle
HM5117800
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Read-modify-write cycle time
t RWC
155
—
181
—
ns
RAS to WE delay time
t RWD
85
—
98
—
ns
14
CAS to WE delay time
t CWD
40
—
46
—
ns
14
Column address to WE delay time
t AWD
55
—
63
—
ns
14
OE hold time from WE
t OEH
15
—
18
—
ns
Refresh Cycle
HM5117800
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
CAS setup time (CBR refresh cycle)
t CSR
5
—
5
—
ns
CAS hold time (CBR refresh cycle)
t CHR
10
—
10
—
ns
WE setup time (CBR refresh cycle)
t WRP
0
—
0
—
ns
WE hold time (CBR refresh cycle)
t WRH
10
—
10
—
ns
RAS precharge to CAS hold time
t RPC
5
—
5
—
ns
Notes
Fast Page Mode Cycle
HM5117800
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Fast page mode cycle time
t PC
40
—
45
—
ns
Fast page mode RAS pulse width
t RASP
—
100000 —
100000 ns
16
Access time from CAS precharge
t CPA
—
35
—
40
ns
9, 17
RAS hold time from CAS precharge
t CPRH
35
—
40
—
ns
10
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Notes
HM5117800 Series
Fast Page Mode Read-Modify-Write Cycle
HM5117800
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Fast page mode read-modify-write cycle
time
t PRWC
85
—
96
—
ns
WE delay time from CAS precharge
t CPW
60
—
68
—
ns
Notes
14
Refresh
Parameter
Symbol
Max
Unit
Note
Refresh period
t REF
32
ms
2048 cycles
Refresh period (L-version)
t REF
128
ms
2048 cycles
Self Refresh Mode (L-version)
HM5117800L
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
RAS pulse width (self refresh)
t RASS
100
—
100
—
µs
19, 20, 21,
22
RAS precharge time (self refresh)
t RPS
110
—
130
—
ns
CAS hold time (self refresh)
t CHS
–50
—
–50
—
ns
Notes: 1. AC measurements assume t T = 5 ns.
2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization
cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). If
the internal refresh counter is used, a minimum of eight CAS-before-RAS refresh cycles are
required.
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only; if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA .
5. Either t OED or tCDD must be satisfied.
6. Either t DZO or tDZC must be satisfied.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH (min) and VIL (max).
8. Assumes that t RCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
9. Measured with a load circuit equivalent to 2 TTL loads and 100 pF.
10. Assumes that t RCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA (max).
11. Assumes that t RAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA (max).
11
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HM5117800 Series
12. Either t RCH or tRRH must be satisfied for a read cycles.
13. t OFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition
and are not referred to output voltage levels.
14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only; if t WCS ≥ tWCS (min), the cycle is an early write cycle
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD
≥ tRWD (min), tCWD ≥ tCWD (min), and tAWD ≥ tAWD (min), or tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥
t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the
selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out
(at access time) is indeterminate.
15. These parameters are referred to CAS leading edge in early write cycles and to WE leading
edge in delayed write or read-modify-write cycles.
16. t RASP defines RAS pulse width in Fast page mode cycles.
17. Access time is determined by the longest among tAA , t CAC and t CPA.
18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data
to the device.
19. Please do not use tRASS timing, 10 µs ≤ tRASS ≤ 100 µs. During this period, the device is in
transition state from normal operation mode to self refresh mode. If t RASS ≥ 100 µs, then RAS
precharge time should use tRPS instaed of tRP.
20. If you use RAS only refresh or CBR burst refresh mode in normal read/write cycles, 2048 cycles
of distributed CBR refresh with 15.6 µs interval should be executed within 32 ms immediately
after exiting from and before entering into the self refresh mode.
21. If you use distributed CBR refresh mode with 15.6 µs interval in normal read/write cycle, CBR
refresh should be executed within 15.6 µs immediately after exiting from and before entering
into self refresh mode.
22. Repetitive self refresh mode without refreshing all memory is not allowed. Once you exit from
self refresh mode, all memory cells need to be refreshed before re-entering the self refresh mode
again.
23. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max))
///////: Invalid Dout
When the address, clock and input pins are not described on timing waveforms, their pins must
be applied VIH or VIL.
12
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HM5117800 Series
Timing Waveforms*23
Read Cycle
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
CAS
t RAD
t ASR
Address
t RAH
t RAL
t ASC
t CAL
t CAH
Column
Row
t RRH
t RCH
t RCS
WE
t DZC
t CDD
High-Z
Din
t DZO
t OEA
t OED
OE
t OEZ
t CAC
t OHO
t AA
t OFF
t RAC
t CLZ
Dout
t OH
Dout
13
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HM5117800 Series
Early Write Cycle
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRCD
tRSH
tCAS
tT
CAS
tASR
Address
tRAH
Row
tASC
tCAH
Column
tWCS
tWCH
WE
tDS
Din
Dout
tDH
Din
High-Z*
* t WCS
Delayed Write Cycle*18
14
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t WCS (min)
HM5117800 Series
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
CAS
t ASR
Address
t RAH
t ASC
Row
t CAH
Column
t CWL
t RWL
t WP
t RCS
WE
t DZC
t DS
High-Z
Din
t DH
Din
t DZO
t OEH
t OED
OE
t OEZ
t CLZ
High-Z
Dout
Invalid Dout
Read-Modify-Write Cycle*18
15
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HM5117800 Series
t RWC
t RAS
t RP
RAS
tT
t RCD
t CAS
t CRP
CAS
t RAD
t ASR
Address
tRAH
t ASC
Row
t CAH
Column
t RCS
t CWD
tCWL
t AWD
t RWL
t RWD
t WP
WE
t DZC
t DH
t DS
High-Z
Din
Din
t OED
t DZO
t OEH
t OEA
OE
t CAC
t OEZ
t AA
t RAC
t OHO
Dout
Dout
t CLZ
16
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High-Z
HM5117800 Series
RAS-Only Refresh Cycle
t RC
t RAS
t RP
RAS
tT
t RPC
t CRP
t CRP
CAS
t ASR
Address
t RAH
Row
t OFF
Dout
High-Z
CAS-Before-RAS Refresh Cycle
17
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HM5117800 Series
t RC
t RP
t RAS
t RC
t RP
t RAS
t RP
RAS
t RPC
t CP
tT
t CSR
t CHR
t RPC
t CP
t CRP
t CSR
t CHR
CAS
t WRP t WRH
t WRP
WE
Address
t OFF
Dout
Hidden Refresh Cycle
18
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High-Z
t WRH
HM5117800 Series
t RC
t RAS
t RP
t RC
t RAS
t RC
t RP
t RAS
t RP
RAS
tT
t RSH
t CHR
t CRP
t RCD
CAS
t RAD
t ASR t RAH
Address
t RAL
t ASC
Row
t CAH
Column
t WRP
t RRH
t WRH
t WRP
t WRH
t RCS
WE
t DZC
t CDD
High-Z
Din
t DZO
t OED
t OEA
OE
t CAC
t AA
t RAC
t OFF
t OH
t CLZ
Dout
t OEZ
t OHO
Dout
19
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HM5117800 Series
Fast Page Mode Read Cycle
t RASP
t CPRH
t RP
RAS
tT
t CSH
t RCD
t PC
t CAS
t CP
t RSH
t CAS
t CP
t CRP
t CAS
CAS
t RAL
t RAD
t ASR t RAH
Address
Row
t CAL
t ASC t CAH
t CAL
t ASC t CAH
t CAL
t ASC t CAH
Column 1
Column 2
Column N
t RCS
t RCS
t RCH
t RCS
t RRH
t RCH
t RCH
WE
t DZC
Din
t DZO
t DZC
t DZC
t CDD
t CDD
High-Z
High-Z
t OED
t DZO t OED
t CDD
High-Z
t DZO
t OED
OE
t RAC
t AA
t OH
t OEA
Fast Page Mode Early Write Cycle
20
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t OHO
t OH
t OEA
t OFF t CAC
t OEZ t CLZ
t CAC
t CLZ
Dout
t CPA
t AA
Dout 1
t CPA
t AA
t OHO
t OFF
t OEZ
Dout 2
t OH
t OHO
t OEA
t CAC
t CLZ
t OFF
t OEZ
Dout N
HM5117800 Series
t RP
t RASP
RAS
tT
t CSH
t RCD
t CAS
t PC
t CP
t CAS
t CP
t RSH
t CAS
t CRP
CAS
Address
t ASR t RAH
t ASC t CAH
t ASC t CAH
t ASC t CAH
ROW
Column 1
Column 2
Column N
t WCS
t WCH
t WCS
t WCH
t WCS
t WCH
WE
t DS
Din
t DH
Din 1
Dout
t DS
t DH
Din 2
t DS
t DH
Din N
High-Z*
* t WCS
t WCS (min)
Fast Page Mode Delayed Write Cycle*18
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HM5117800 Series
t RASP
t RP
RAS
tT
t CP
t CSH
t CRP
t CP
t PC
t RCD
t CAS
t RSH
t CAS
t CAS
CAS
t RAD
t ASR
t ASC
t RAH
Address
t ASC
t CAH
Row
t ASC
t CAH
Column 1
t CAH
Column 2
t CWL
Column N
t CWL
t CWL
t RWL
t RCS
t RCS
t RCS
WE
t WP
t WP
t WP
t DZC t DS
t DZC t DS
t DZC t DS
t DH
t DH
Din
1
Din
t DZO
t DH
Din
2
t DZO
t OED
Din
N
t DZO
t OED
t OED
t OEH
t OEH
t OEH
OE
t CLZ
t CLZ
t OEZ
t CLZ
t OEZ
t OEZ
High-Z
Dout
Invalid Dout
Fast Page Mode Read-Modify-Write Cycle*18
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Invalid Dout
Invalid Dout
HM5117800 Series
t RASP
t RP
RAS
tT
t PRWC
t CP
t RCD
t RSH
t CP
t CAS
t CAS
t CRP
t CAS
CAS
t RAD
t ASR
Address
t ASC
t RAH
Row
t ASC
t CAH
t CAH
Column 1
t ASC
t CAH
Column 2
t RWD
t CWL
Column N
t CPW
t AWD
t CWL
t CPW
t AWD
t CWD
t RCS
t CWL
t AWD
t CWD
t RCS
t RWL
t CWD
WE
t RCS
t WP
t
t DZC DS
t WP
t
t DZC DS
t WP
t
t DZC DS
t DH
t DH
Din
1
Din
t DZO
t OED
t DH
Din
2
t OED
t DZO
t OED
t DZO
t OEH
t OEH
t OEH
Din
N
OE
t OHO
t OEA
t CAC
t OHO
t OEA
t CAC
t AA
t AA
t CPA
t RAC
t OEZ
t CLZ
t OHO
t OEA
t CAC
t AA
t CPA
t OEZ
t CLZ
t OEZ
t CLZ
High-Z
Dout
Dout 1
Dout 2
Dout N
Self Refresh Cycle (L-version)* 19, 20, 21, 22
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HM5117800 Series
t RASS
t RP
t RPS
RAS
t RPC
t CP
tT
t CRP
t CSR
t CHS
CAS
t WRP
t WRH
WE
t OFF
Dout
Package Dimensions
HM5117800J/LJ Series (CP-28DA)
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High-Z
HM5117800 Series
Unit: mm
18.17
18.54 Max
10.16 ± 0.13
3.50 ± 0.26
1.30 Max
0.43 ± 0.10
0.41 ± 0.08
1.27
0.10
Dimension including the plating thickness
Base material dimension
2.85 ± 0.12
14
0.74
0.80 +0.25
–0.17
1
11.18 ± 0.13
15
28
9.40 ± 0.25
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
CP-28DA
Conforms
Conforms
1.16 g
HM5117800S/LS Series (CP-28DNA)
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HM5117800 Series
Unit: mm
18.41
18.84 Max
7.62 ± 0.12
3.50 ± 0.26
1.165 Max
0.43 ± 0.10
0.41 ± 0.08
6.79 ± 0.18
1.27
0.10
Dimension including the plating thickness
Base material dimension
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0.25
2.45 +– 0.36
14
0.74
0.90 ± 0.26
1
8.51 ± 0.12
15
28
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
CP-28DNA
—
—
0.95 g
HM5117800 Series
HM5117800TT/LTT Series (TTP-28DA)
Unit: mm
18.41
18.81 Max
15
10.16
28
1
0.42 ± 0.08
0.40 ± 0.06
1.27
0.21
14
0.80
M
11.76 ± 0.20
1.15 Max
Dimension including the plating thickness
Base material dimension
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
0.68
0.13 ± 0.05
0.10
0.145 ± 0.05
0.125 ± 0.04
1.20 Max
0° – 5°
TTP-28DA
Conforms
—
0.43 g
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HM5117800 Series
HM5117800TS/LTS Series (TTP-28DB)
Unit: mm
18.41
18.81 Max
15
7.62
28
0.42 ± 0.08
0.40 ± 0.06
1.27
14
0.21 M
0.80
9.22 ± 0.2
1.15 Max
0° – 5°
Dimension including the plating thickness
Base material dimension
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0.13 ± 0.05
0.10
0.145 ± 0.05
0.125 ± 0.04
1.20 Max
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-28DB
—
—
0.35 g
0.63
1
HM5117800 Series
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi Semiconductor
(America) Inc.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1897
USA
Tel: 800-285-1601
Fax:303-297-0447
Hitachi Europe GmbH
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 01628-585000
Fax: 01628-585160
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
29
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HM5117800 Series
Revision Record
Rev.
Date
Contents of Modification
Drawn by
Approved by
1.0
Sep. 30, 1996
Initial issue
Y. Kasama
M. Mishima
2.0
Dec. 5, 1996
Addition of HM5117800-5 Series
Y. Kasama
M. Mishima
Addition of HM5117800S/LS Series (CP-28DNA)
Addition of HM5117800TS/LTS Series (TTP-28DB)
Power dissipation (active)
660/605 mW(max) to 605/550/495 mW (max)
DC Characteristics
I CC1 max:
I CC3 max:
I CC6 max:
I CC7 max:
120/110 mA to 110/100/90 mA
120/110 mA to 110/100/90 mA
120/110 mA to 110/100/90 mA
100/90 mA to 100/90/85 mA
AC Characteristics
t RRH min: 0/0 ns to 5/5/5 ns
t RPC min: 0/0 ns to 5/5/5 ns
3.0
Feb. 24, 1997
AC Characteristics
t RRH min: 5/5/5 ns to 0/0/0 ns
Y. Kasama
Y. Matsuno
4.0
Jun. 20, 1997
Deletion of HM5117800-5 Series
Y. Kasama
Y. Matsuno
AC Characteristics
Notes 10: tRCD ≥ tRCD (max) and tRAD ≤ tRAD (max) to
t RCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA
(max)
Notes 11: tRCD ≤ tRCD (max) and tRAD ≥ tRAD (max) to
t RAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA
(max).
5.0
Nov. 1997
Change of Subtitle
30
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